2SC6082;中文规格书,Datasheet资料
EP2C8Q208C8中文资料(Altera)中文数据手册「EasyDatasheet - 矽搜」
Cyclone II器件手册,第1卷ii内容章修订日期............................................... ............................喜关于本手册............................................... .............................十三如何触点Altera ..........................................................................................................................十三印刷约定....................................................................................................................十三第一节Cyclone II器件系列数据表修订记录.................................................................................................................................... 1-1第1章简介简介............................................................................................................................................低成本嵌入式处理解决方案............................................ ......................................低成本DSP解决方案.................................................................................................................特征...................................................................................................................................................参考文献.........................................................................................................................文档修订历史记录.................................................................................................................1–1 1–1 1–1 1–2 1–9 1–9第2章Cyclone II架构功能说明.......................................................................................................................... 2-1逻辑元件....................................................................................................................................... 2-2LE操作模式........................................................................................................................ 2-4逻辑阵列模块................................................................................................................................ 2-7LAB互连............................................................................................................................ 2-8LAB控制信号......................................................................................................................... 2-8MultiTrack互联..................................................................................................................... 2-10行互连.......................................................................................................................... 2-10列互连.................................................................................................................... 2-12设备路由............................................................................................................................... 2-15全局时钟网络和锁相环.......................................... ..................................... 2-16专用时钟管脚..................................................................................................................... 2-20双用时钟引脚.............................................................................................................. 2-20全局时钟网络................................................................................................................... 2-21全局时钟网络分布.............................................. .............................................. 2-23锁相环.................................................................................................................................................. 2-25嵌入式存储器............................................................................................................................. 2-27内存模式............................................................................................................................... 2-30时钟模式.................................................................................................................................... 2-31M4K路由接口.................................................................................................................. 2-31iii内容嵌入式乘法器........................................................................................................................乘法器模式............................................................................................................................嵌入式乘法器路由接口.............................................. .......................................I / O结构及特点....................................................................................................................外部存储器接口.......................................................................................................可编程驱动强度.....................................................................................................漏极开路输出........................................................................................................................摆率控制...........................................................................................................................总线防护持..........................................................................................................................................可编程上拉电阻............................................. .................................................. ...高级I / O标准支持............................................ .................................................. ..高速差分接口............................................. .................................................系列片上端接.........................................................................................................I / O组........................................................................................................................................多电压I / O接口.................................................................................................................2–32 2–35 2–36 2–37 2–44 2–49 2–50 2–51 2–51 2–51 2–52 2–53 2–55 2–57 2–60第3章配置与测试IEEE标准. 1149.1(JTAG)边界扫描支持........................................... ..................................构造.........................................................................................................................................操作模式...................................................................................................................................配置计划......................................................................................................................... Cyclone II自动单粒子翻转检测........................................... ...........................定制电路....................................................................................................................软件界面.............................................................................................................................文档修订历史记录.................................................................................................................3–1 3–5 3–5 3–6 3–7 3–7 3–7 3–8第4章热插拔和上电复位简介............................................................................................................................................旋风II热插拔规格............................................ ................................................设备可以在电源时会驱动.......................................... ...........................................I / O引脚防护持三态电期间...................................... ......................................在Cyclone II器件热插拔功能实现......................................... ..............上电复位电路...................................................................................................................."唤醒"时间Cyclone II器件........................................ ...............................................结论..............................................................................................................................................文档修订历史记录.................................................................................................................4–1 4–1 4–2 4–2 4–3 4–5 4–5 4–7 4–7第5章直流特性和时序规范运行条件........................................................................................................................... 5-1单端I / O标准.......................................................................................................... 5-5差分I / O标准.............................................................................................................. 5-7DC特性不同针类型............................................ ......................................... 5-11片上端接规格............................................. .............................................. 5-12能量消耗........................................................................................................................... 5-13时序规格.......................................................................................................................... 5-14预,决赛时序规范............................................. ................................ 5-14演出.................................................................................................................................... 5-15 ivCyclone II器件手册,第1卷内容内部时序...............................................................................................................................Cyclone II时钟时序参数............................................. ..............................................时钟网络偏移加法器.......................................................................................................IOE可编程延迟.............................................................................................................不同I默认容性负载/ O标准......................................... .................I / O延迟.......................................................................................................................................最大输入和输出时钟频率............................................ ........................................高速I / O时序规格........................................... ............................................外部存储器接口规范.............................................. ....................................JTAG时序规范..........................................................................................................PLL时序规范............................................................................................................占空比失真.........................................................................................................................DCD测量技术............................................... .................................................. ..参考文献.......................................................................................................................文档修订历史记录...............................................................................................................5–18 5–23 5–29 5–30 5–31 5–33 5–46 5–55 5–63 5–64 5–66 5–67 5–68 5–74 5–74第6章参考和订购信息软体..................................................................................................................................................器件引脚输出.....................................................................................................................................订购信息...........................................................................................................................文档修订历史记录.................................................................................................................6–1 6–1 6–1 6–2第二节.时钟管理修订记录.................................................................................................................................... 6-1第7章锁相环在Cyclone II器件简介............................................................................................................................................ 7-1Cyclone II PLL硬件概述............................................. .................................................. ... 7-2PLL参考时钟产生.............................................. .................................................. ... 7-6时钟反馈模式....................................................................................................................... 7-10正常模式.................................................................................................................................. 7-10零延迟缓冲器模式................................................................................................................ 7-11无补偿模式............................................................................................................... 7-12源同步模式........................................................................................................... 7-13硬件特性.............................................................................................................................. 7-14时钟倍频和科.............................................. .................................................. .. 7-14可编程占空比........................................................................................................... 7-15移相实施.............................................. .................................................. .... 7-16控制信号................................................................................................................................ 7-17手动时钟切换............................................................................................................. 7-20时钟................................................................................................................................................ 7-21全局时钟网络................................................................................................................... 7-21时钟控制模块....................................................................................................................... 7-24全局时钟网络时钟源产生............................................ .......................... 7-26全局时钟网络掉电............................................. .............................................. 7-28vCyclone II器件手册,第1卷。
ETA6082 datasheet V1.1
Single Inductor, 3A Switch Mode Battery Charger, 2.1A USB OTG, and Fuel Gauge All-in-One SolutionDESCRIPTIONFEATURESETA6082 is a switching Li-Ion battery charger capable of delivering up to 3A of charging current to the battery and also capable of delivering up to 2.1A in boost OTG operation. It also includes an externally programmable fuel gauge system for power indication. For charging, it uses a proprietary control scheme that eliminates the current sense resistor for constant current control, thereby improving efficiency and reducing costs. It can also output a 5V voltage in the reversed direction by boosting from the battery. Therefore, it only needs a single inductor to provide power bi-directionally. Together with the build-in Micro-controller functions, such as push-button, auto load detection, and fuel gauging features, ETA6082 is truly an ideal all-in-one solution for battery charging and discharge applications, such as power banks, smart phones, and tablets with only one USB port that can be used for both charging battery and USB OTG function.ETA6082 is in QFN4x4-32 package.♦ Bi-Directional Power conversion with Single Inductor ♦ Switching Charger ♦ 5V Synchronous Boost ♦ Up to 95% Efficiency♦ Up to 3A Max charging current and 2.1A discharging ♦ No-Battery detection ♦ No External Sense resistor ♦NTC thermistor inputAPPLICATIONS♦ Tablet, MID ♦ Smart Phone ♦ Power BankORDERING INFORMATIONPARTPACKAGE TOP MARK ETA6082Q47QFN4x4-32ETA6082 YWW2TYPICAL APPLICATIONPIN CONFIGURATION ABSOLUTEMAXIMUM RATINGSQFN4x4-32(Note: Exceeding these limits may damage the device. Exposure to absolute maximum rating conditions for long periods may affect device reliability.)IN,OUT Voltage .........................................–0.3V to 6V INGT Voltage ...........................................–0.3V to 20V All Other Pin Voltage ..................V IN –0.3V to V IN +0.3 SW,IN,OUT to ground current …...Internally limited Operating Temperature Range ….…–40°C to 85°C Storage Temperature Range ……...–55°C to 150°C Thermal ResistanceθJAQFN4X4-32..............................................30 ........o C/W Lead Temperature (Soldering, 10ssec) ..........260°C ESD HBM (Human Body Mode) ................................2KV ESD MM (Machine Mode) .. (200V)ELECTRICAL CHACRACTERISTICS(V IN = 5V, unless otherwise specified. Typical values are at TA = 25oC.)PIN DESCRIPTIONTYPICAL CHARACTERISTICS(Vin=5V, T A =250C, unless otherwise specified)Output current in Boost modeEfficiency in Boost mode3A Charging Efficiency8000mAH Battery Charging CharacteristicsApplication SupportPlease contact local distributor or ETA solutions for detail engineering support.Package Outline Package: QFN4x4-32。
2SD882;中文规格书,Datasheet资料
October 2007Rev 31/82SD882NPN medium power transistorFeatures■High current■Low saturation voltage ■Complement to 2SB772Applications■Voltage regulation ■Relay driver ■Generic switch ■Audio power amplifier ■DC-DC converterDescriptionThe device is a NPN transistor manufactured by using planar technology resulting in rugged high performance devices. The complementary PNP type is 2SB772.Table 1.Device summaryOrder code Marking Package Packing 2SD882D882SOT -32T ubeAbsolute maximum ratings2SD882 1 Absolute maximum ratingsTable 2.Absolute maximum ratingSymbol Parameter Value UnitV CBO Collector-base voltage (I E = 0) 60VV CEO Collector-emitter voltage (I B = 0) 30VV EBO Collector-base voltage (I C = 0) 5VI C Collector current3AI CM Collector peak current (t P < 5ms)6AI B Base current1AI BM Base peak current (t P < 5ms)2AP TOT T otal dissipation at T c = 25°C12.5WT STG Storage temperature-65 to 150°CT J Max. operating junction temperature150°CTable 3.Thermal dataSymbol Parameter Value UnitR thJ-case Thermal resistance junction-case max10°C/W 2/83/82 Electrical characteristics(T CASE = 25°C; unless otherwise specified)Table 4.Electrical characteristicsSymbol ParameterTest conditions Min.Typ.Max.Unit I CES Collector cut-off current(V BE = 0)V CE = 60 V 10µA I CEO Collector cut-off current (I B = 0)V CE = 30 V 100µA I EBOEmitter cut-off current (I C = 0)V EB = 5 V10µAV (BR)CEO(1)Collector-emitter breakdownvoltage (I B = 0 )I C = 10 mA 30VV (BR)CBO Collector-base breakdownvoltage(I E = 0 )I C = 100 µA60VV (BR)EBO Emitter-base breakdownvoltage(I C = 0 )I E = 100 µA5V V CE(sat)(1)Collector-emitter saturationvoltageI C = 1 A I B = 50 mAI C = 2 A I B = 100 mAI C = 3 A I B = 150 mA 0.40.71.1V V V V BE(sat)(1)1.Pulsed duration = 300 ms, duty cycle ≤1.5%.Base-emitter saturation voltage I C = 2 A I B = 100 mA 1.2Vh FE DC current gain I C = 100 mA V CE = 2 V I C = 1 A V CE = 2 V I C = 3 A V CE = 2 V 1008030300f TTransition frequencyI C = 0.1 A V CE = 10 V100MHzcharacteristics (curves) 2.1 Typical4/82SD882Package mechanical data 3 Package mechanical dataIn order to meet environmental requirements, ST offers these devices in ECOPACK®packages. These packages have a Lead-free second level interconnect . The category ofsecond level interconnect is marked on the package and on the inner box label, incompliance with JEDEC Standard JESD97. The maximum ratings related to solderingconditions are also marked on the inner box label. ECOPACK is an ST trademark.ECOPACK specifications are available at: 5/8Package mechanical data2SD8826/82SD882Revision history7/84 Revision historyTable 5.Document revision historyDate RevisionChanges09-Sep-20052Final datasheet. New template 02-Oct-20073Updated mechanical data2SD8828/8Please Read Carefully:Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.All ST products are sold pursuant to ST’s terms and conditions of sale.Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.UNLESS O THERWISE SET FO RTH IN ST’S TERMS AND CO NDITIO NS O F SALE ST DISCLAIMS ANY EXPRESS O R IMPLIED WARRANTY WITH RESPECT TO THE USE AND/O R SALE O F ST PRO DUCTS INCLUDING WITHO UT LIMITATIO N IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPRO VED IN WRITING BY AN AUTHO RIZED ST REPRESENTATIVE, ST PRO DUCTS ARE NO T RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.ST and the ST logo are trademarks or registered trademarks of ST in various countries.Information in this document supersedes and replaces all information previously supplied.The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.© 2007 STMicroelectronics - All rights reservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America分销商库存信息: STM2SD882。
安森美三极管详细规格参数表(超全)
Product Datasheet Compliance Status12A02CH ENN7482/D (98.0kB)Pb-free ActiveNEW 15GN01CA15GN01CA/D (48.0kB)Pb-free ActiveNEW 2N2905A2N2905A/D (88.0kB)MIL-PRF-19500ActiveNEW 2N30192N3019/D (85.0kB)MIL-PRF-19500ActiveNEW 2N3019S2N3019S/D (86.0kB)MIL-PRF-19500ActiveNEW 2N37002N3700/D (86.0kB)MIL-PRF-19500ActiveNEW2SA14162SA1416/D (102.0kB)Pb-free ActiveNEW2SA14192SA1419/D (305.0kB)Pb-free ActiveNEW 2SA15932SA1593/D (45.0kB)Pb-free ActiveNEW 2SA17052SA1705/D (40.0kB)Pb-free ActiveNEW 2SA17062SA1706/D (42.0kB)Pb-free ActiveNEW 2SA17072SA1707/D (61.0kB)Pb-free ActiveNEW 2SA17092SA1709/D (49.0kB)Pb-free ActiveNEW 2SA18272SA1827/D (52.0kB)Pb-free ActiveNEW 2SA20122SA2012/D (98.0kB)Pb-free ActiveNEW 2SA20162SA2016/D (57.0kB)Pb-free ActiveNEW 2SA20992SA2099/D (76.0kB)Pb-free ActiveNEW 2SA21122SA2112/D (28.0kB)Pb-free ActiveNEW 2SA21242SA2124/D (91.0kB)Pb-free ActiveNEW2SA21252SA2125/D (59.0kB)Pb-freeHalide free ActiveNEW2SA21262SA2126/D (54.0kB)Pb-free ActiveNEW 2SA21532SA2153/D (35.0kB)Pb-free ActiveNEW 2SA21692SA2169/D (61.0kB)Pb-free ActiveNEW 2SA22022SA2202/D (58.0kB)Pb-free ActiveNEW 2SA22222SA2222/D (69.0kB)Pb-free ActiveNEW 2SB11222SB1122/D (89.0kB)Pb-free ActiveNEW2SB11432SB1143/D (60.0kB)Pb-free ActiveNEW 2SB12012SB1201/D (45.0kB)Pb-free ActiveNEW 2SB12152SB1215/D (60.0kB)Pb-free ActiveNEW 2SB13022SB1302/D (80.0kB)Pb-free ActiveNEW2SC36462SA1416/D (102.0kB)Pb-free ActiveNEW2SC36492SA1419/D (305.0kB)Pb-free ActiveNEW2SC4487ENN3093/D (61.0kB)Pb-free ActiveNEW2SC44882SA1708/D (68.0kB)Pb-free ActiveNEW2SC46142SA1770/D (60.0kB)Pb-free ActiveNEW 2SC47312SC4731/D (52.0kB)Pb-free ActiveNEW 2SC48372SA1855/D (61.0kB)Pb-free ActiveNEW 2SC5226A2SC5226A/D (75.0kB)Pb-free ActiveNEW2SC5227A2SC5227A/D (75.0kB)Pb-free ActiveNEW2SC5231A2SC5231A/D (65.0kB)Pb-free ActiveNEW 2SC5245A2SC5245A/D (58.0kB)Pb-free ActiveNEW 2SC5347A2SC5347A/D (67.0kB)Pb-free ActiveNEW 2SC5415A2SC5415A/D (92.0kB)Pb-free ActiveNEW2SC5488A2SC5488A/D (57.0kB)Pb-freeHalide free ActiveNEW2SC5501A2SC5501A/D (50.0kB)Pb-free ActiveNEW 2SC5551A2SC5551A/D (76.0kB)Pb-free ActiveNEW2SC57062SA2039/D (61.0kB)Pb-freeHalide free ActiveNEW2SC59942SC5994/D (36.0kB)Pb-free ActiveNEW 2SC60172SA2169/D (61.0kB)Pb-free ActiveNEW 2SC60432SC6043/D (30.0kB)Pb-free ActiveNEW 2SC60962SC6096/D (47.0kB)Pb-free ActiveNEW 2SC60972SC6097/D (51.0kB)Pb-free ActiveNEW 2SC61442SC6144/D (68.0kB)Pb-free ActiveNEW2SD12072SB892/D (62.0kB)Pb-free ActiveNEW 2SD16202SD1620/D (85.0kB)Pb-free ActiveNEW2SD16232SB1123/D (99.0kB)Pb-free ActiveNEW 2SD18012SD1801/D (45.0kB)Pb-free ActiveNEW 2SD18052SD1805/D (96.0kB)Pb-free ActiveNEW 2SD18152SB1215/D (60.0kB)Pb-free ActiveNEW 2SD18162SB1216/D (60.0kB)Pb-free ActiveNEW2SD18352SB1229/D (61.0kB)Pb-free ActiveNEW 30A02CH30A02CH/D (28.0kB)Pb-free ActiveNEW 30A02MH30A02MH/D (28.0kB)Pb-free ActiveNEW 30C02CH30C02CH/D (28.0kB)Pb-free ActiveNEW 50A02MH50A02MH/D (29.0kB)Pb-free ActiveNEW 55GN01CA55GN01CA/D (50.0kB)Pb-free ActiveNEWBC807-25W BC807-25W/D (105.0kB)AEC QualifiedPPAP CapablePb-freeHalide free ActiveNEWBC807-40W BC807-25W/D (105.0kB)AEC QualifiedPPAP CapablePb-freeHalide free ActiveNEWBCW66BCW66GLT1/D (110.0kB)Pb-freeHalide freeAEC QualifiedPPAP Capable ActiveNEWCPH3105CPH3105/D (39.0kB)Pb-free ActiveNEW CPH3106CPH3106/D (33.0kB)Pb-free ActiveNEW CPH3109CPH3109/D (55.0kB)Pb-free ActiveNEW CPH3115CPH3115/D (54.0kB)Pb-free ActiveNEW CPH3116CPH3116/D (46.0kB)Pb-free ActiveNEWCPH3121CPH3121/D (65.0kB)Pb-free ActiveNEW CPH3122CPH3122/D (58.0kB)Pb-free ActiveNEW CPH3123CPH3123/D (43.0kB)Pb-free ActiveNEW CPH3140CPH3140/D (37.0kB)Pb-free ActiveNEW CPH3145CPH3145/D (44.0kB)Pb-free ActiveNEW CPH3205CPH3205/D (39.0kB)Pb-free ActiveNEW CPH3209CPH3209/D (55.0kB)Pb-free ActiveNEW CPH3215CPH3215/D (54.0kB)Pb-free ActiveNEW CPH3216CPH3216/D (46.0kB)Pb-free ActiveNEW CPH3223CPH3223/D (43.0kB)Pb-free ActiveNEW CPH3240CPH3240/D (37.0kB)Pb-free ActiveNEW CPH3245CPH3245/D (44.0kB)Pb-free ActiveNEW CPH5504CPH5504/D (49.0kB)Pb-free ActiveNEW CPH5506CPH5506/D (74.0kB)Pb-free ActiveNEW CPH5517CPH5517/D (45.0kB)Pb-free ActiveNEW CPH5524CPH5524/D (72.0kB)Pb-free ActiveNEW CPH6001A CPH6001A/D (63.0kB)Pb-free ActiveNEW CPH6003A CPH6003A/D (58.0kB)Pb-free ActiveNEW CPH6020CPH6020/D (258.0kB)Pb-free ActiveNEWCPH6021ENA1910/D (372.0kB)Pb-freeHalide free ActiveNEWCPH6121CPH6121/D (47.0kB)Pb-free ActiveNEW CPH6122CPH6122/D (48.0kB)Pb-free ActiveNEW CPH6123CPH6123/D (55.0kB)Pb-free ActiveNEW CPH6153CPH6153/D (255.0kB)Pb-free ActiveNEW CPH6223CPH6123/D (55.0kB)Pb-free ActiveNEW CPH6501CPH6501/D (65.0kB)Pb-free ActiveNEWEC3H02BA EC3H02BA/D (283.0kB)Pb-freeHalide free ActiveNEWEC4H09C EC4H09C/D (52.0kB)Pb-freeHalide free ActiveNEWECH8501ECH8501/D (421.0kB)Pb-freeHalide free ActiveNEWMCH3007MCH3007/D (326.0kB)Pb-freeHalide free ActiveNEWMCH4014MCH4014/D (355.0kB)Pb-freeHalide free ActiveNEWMCH4015MCH4015/D (354.0kB)Pb-freeHalide free ActiveNEWMCH4016MCH4016/D (355.0kB)Pb-freeHalide free ActiveNEWMCH4017MCH4017/D (355.0kB)Pb-freeHalide free ActiveNEWMCH4020MCH4020/D (283.0kB)Pb-free ActiveNEW MCH4021MCH4021/D (283.0kB)Pb-free ActiveNEW MCH5541MCH5541/D (48.0kB)Pb-free ActiveNEW MCH6102MCH6102/D (39.0kB)Pb-free ActiveNEW MCH6202MCH6202/D (39.0kB)Pb-free ActiveNEW MCH6541MCH6541/D (65.0kB)Pb-free ActiveNEW MCH6542MCH6542/D (60.0kB)Pb-free ActiveNEW MCH6544MCH6544/D (57.0kB)Pb-free ActiveNEWMCH6545MCH6545/D (52.0kB)Pb-free ActiveNEWMSD1819A-R MSD1819A-RT1/D (209.0kB Pb-free Halide free AEC QualifiedPPAP CapableActiveNEW NSM6056MT1G NSM6056M/D (102.0kB)Pb-freeHalide freeActiveNEW NSM80100M NSM80100M/D (109.0kB)Pb-freeHalide freeActiveNEW NSM80101M NSM80101M/D (108.0kB)Pb-freeHalide freeActiveNEW PCP1103PCP1103/D (266.0kB)Pb-freeHalide freeActiveNEW PCP1203PCP1203/D (267.0kB)Pb-freeHalide free ActiveNEW15C02CH 15C02CH/D (44.0kB)Pb-free Active 2N2907A 2N2907A/D (89.0kB)MIL-PRF-19500Active 2N30552N3055/D (70.0kB)Pb-free Active 2N3055A 2N3055A/D (89.0kB)Pb-free Active 2N34422N3442/D (65.0kB)Pb-free Active 2N37712N3771/D (85.0kB)Pb-free Active 2N37722N3771/D (85.0kB)Pb-free Active 2N37732N3773/D (93.0kB)Pb-free Active 2N39042N3903/D (177.0kB)Pb-free Active 2N39062N3906/D (173.0kB)Pb-free Active 2N41242N4123/D (115.0kB)Pb-free Active 2N44012N4401/D (195.0kB)Pb-free Active 2N44032N4403/D (118.0kB)Pb-freeActive 2N49182N4918/D (117.0kB)Pb-freeHalide freeActive 2N49192N4918/D (117.0kB)Pb-freeHalide freeActive 2N49202N4918/D (117.0kB)Pb-freeHalide freeActive 2N49212N4921/D (90.0kB)Pb-freeHalide freeActive 2N49222N4921/D (90.0kB)Pb-freeHalide freeActive 2N49232N4921/D (90.0kB)Pb-freeHalide free Active 2N50382N5038/D (79.0kB)Pb-free Active 2N50872N5087/D (155.0kB)Pb-free Active 2N50882N5088/D (83.0kB)Pb-free Active 2N50892N5088/D (83.0kB)Pb-freeActive 2N51902N5191/D (84.0kB)Pb-freeHalide freeActive 2N51912N5191/D (84.0kB)Pb-freeHalide freeActive 2N51922N5191/D (84.0kB)Pb-freeHalide freeActive2N51942N5194/D (86.0kB)Pb-freeHalide free Active2N51952N5194/D (86.0kB)Pb-freeHalide free Active2N53022N5302/D 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ActiveMJE5851MJE5850/D (104.0kB)Pb-free Active MJE5852MJE5850/D (104.0kB)Pb-free Active MJF15030MJF15030/D (134.0kB)Pb-free Active MJF15031MJF15030/D (134.0kB)Pb-free Active MJF18004MJE18004/D (225.0kB)Pb-free Active MJF18008MJE18008/D (229.0kB)Pb-free Active MJF2955MJF3055/D (115.0kB)Pb-free Active MJF3055MJF3055/D (115.0kB)Pb-free Active MJF31C MJF31C/D (122.0kB)Pb-free Active MJF32C MJF31C/D (122.0kB)Pb-free Active MJF44H11MJF44H11/D (151.0kB)Pb-free Active MJF45H11MJF44H11/D (151.0kB)Pb-free Active MJF47MJF47/D (130.0kB)Pb-free Active MJW18020MJW18020/D (131.0kB)Pb-free Active MMBT2131MMBT2131T1/D (60.0kB)Pb-freeHalide freeActive MMBT2222AL MMBT2222LT1/D (126.0kB)Pb-freeHalide freeActive MMBT2222AM3MMBT2222AM3/D (168.0kB Pb-freeHalide freeActive MMBT2222AT MMBT2222ATT1/D (114.0kB Pb-freeHalide freeActive MMBT2222AW MMBT2222AWT1/D (121.0k Pb-freeHalide freeActive MMBT2222L MMBT2222LT1/D (126.0kB)Pb-freeHalide freeActive MMBT2369AL MMBT2369LT1/D (190.0kB)Pb-freeHalide freeActive MMBT2369L MMBT2369LT1/D (190.0kB)Pb-freeHalide freeActive MMBT2484L MMBT2484LT1/D (191.0kB)Pb-freeHalide freeActive MMBT2907AL MMBT2907ALT1/D (114.0kB Pb-freeHalide freeActive MMBT2907AM3T5G MMBT2907AM3/D (167.0kB Pb-freeHalide freeActive MMBT2907AW MMBT2907AWT1/D (83.0kB Pb-freeHalide freeActive MMBT3416L MMBT3416LT3/D (230.0kB)Pb-freeHalide freeActive MMBT3904L MMBT3904LT1/D (114.0kB)Pb-freeHalide freeActiveMMBT3904T MMBT3904TT1/D (102.0kB)Pb-free Halide free AEC QualifiedPPAP CapableActive MMBT3904W MMBT3904WT1/D (160.0kB Pb-freeHalide freeActive MMBT3906L MMBT3906LT1/D (120.0kB)Pb-freeHalide freeActiveMMBT3906T MMBT3906TT1/D (86.0kB)Pb-freeHalide freeActive MMBT3906W MMBT3904WT1/D (160.0kB Pb-freeHalide freeActive MMBT4124MMBT4124LT1/D (144.0kB)Pb-freeHalide freeActive MMBT4126LT1MMBT4126LT1/D (154.0kB)Pb-freeHalide freeActive MMBT4401L MMBT4401LT1/D (155.0kB)Pb-freeHalide freeActive MMBT4401M3T5G MMBT4401M3/D (125.0kB)Pb-freeHalide freeActive MMBT4401WT1MMBT4401WT1/D (180.0kB Pb-freeHalide freeActive MMBT4403L MMBT4403LT1/D (151.0kB)Pb-freeHalide freeActive MMBT4403M3T5G MMBT4403M3/D (125.0kB)Pb-freeHalide freeActive MMBT4403W MMBT4403WT1/D (178.0kB Pb-freeHalide freeActive MMBT489MMBT489LT1/D (121.0kB)Pb-freeHalide freeActive MMBT5087L MMBT5087LT1/D (231.0kB)Pb-freeHalide freeActive MMBT5088L MMBT5088LT1/D (192.0kB)Pb-freeHalide freeActive MMBT5089L MMBT5088LT1/D (192.0kB)Pb-freeHalide freeActive MMBT5401L MMBT5401LT1/D (115.0kB)Pb-freeHalide freeActive MMBT5550L MMBT5550LT1/D (121.0kB)Pb-freeHalide freeActive MMBT5551L MMBT5550LT1/D (121.0kB)Pb-freeHalide freeActive MMBT5551M3T5G MMBT5551M3/D (151.0kB)Pb-freeHalide freeActive MMBT6428L MMBT6428LT1/D (194.0kB)Pb-freeHalide freeActive MMBT6429L MMBT6428LT1/D (194.0kB)Pb-freeHalide freeActive MMBT6517L MMBT6517LT1/D (176.0kB)Pb-freeHalide freeActive MMBT6520L MMBT6520LT1/D (116.0kB)Pb-freeHalide freeActive MMBT6521L MMBT6521LT1/D (289.0kB)Pb-freeHalide freeActive MMBT8099L MMBT8099LT1/D (158.0kB)Pb-freeHalide freeActive MMBT918LMMBT918LT1/D (113.0kB)Pb-freeHalide freeActiveMMBTA05L MMBTA05LT1/D (103.0kB)Pb-freeHalide freeActive MMBTA06L MMBTA05LT1/D (103.0kB)Pb-freeHalide freeActive MMBTA06WT1MMBTA06WT1/D (133.0kB)Pb-freeHalide freeActive MMBTA42L MMBTA42LT1/D (89.0kB)Pb-freeHalide freeActive MMBTA55L MMBTA55LT1/D (103.0kB)Pb-freeHalide freeActive MMBTA56L MMBTA55LT1/D (103.0kB)Pb-freeHalide freeActive MMBTA56W MMBTA56WT1/D (132.0kB)Pb-freeHalide freeActive MMBTA70L MMBTA70LT1/D (240.0kB)Pb-freeHalide freeActive MMBTA92L MMBTA92LT1/D (105.0kB)Pb-freeHalide freeActive MMBTH10L MMBTH10LT1/D (123.0kB)Pb-freeHalide freeActive MMBTH10M3T5G MMBTH10M3/D (119.0kB)Pb-freeHalide freeActive MMJT350T1MMJT350T1/D (102.0kB)Pb-freeHalide free ActiveMPS2222MPS2222/D (90.0kB)Pb-free Active MPS2222A MPS2222/D (90.0kB)Pb-free Active MPS2907A MPS2907A/D (129.0kB)Pb-free Active MPS4124MPS4124/D (48.0kB)Pb-free Active MPS4250MPS4250/D (86.0kB)Pb-free Active MPS5172MPS5172/D (98.0kB)Pb-free Active MPS650MPS650/D (68.0kB)Pb-free Active MPS651MPS650/D (68.0kB)Pb-free Active MPS6652MPS6601/D (86.0kB)Pb-free Active MPS6726MPS6726/D (93.0kB)Pb-free Active MPS750MPS650/D (68.0kB)Pb-free Active MPS751MPS650/D (68.0kB)Pb-free Active MPS8099MPS8099/D (122.0kB)Pb-free Active MPSA05MPSA05/D (89.0kB)Pb-free Active MPSA06MPSA05/D (89.0kB)Pb-free Active MPSA18MPSA18/D (79.0kB)Pb-free Active MPSA42MPSA42/D (102.0kB)Pb-free Active MPSA44MPSA44/D (66.0kB)Pb-free Active MPSA55MPSA05/D (89.0kB)Pb-free Active MPSA56MPSA05/D (89.0kB)Pb-free Active MPSA92MPSA92/D (104.0kB)Pb-free Active MPSH10MPSH10/D (82.0kB)Pb-free Active MPSW01MPSW01/D (95.0kB)Pb-free Active MPSW01A MPSW01/D (95.0kB)Pb-free Active MPSW05MPSW05/D (96.0kB)Pb-free Active MPSW06MPSW05/D (96.0kB)Pb-free Active MPSW42MPSW42/D (96.0kB)Pb-freeActiveMPSW51MPSW51/D (96.0kB)Pb-free ActiveMPSW55MPSW55/D (97.0kB)Pb-free Active MPSW56MPSW55/D (97.0kB)Pb-free Active MPSW92MPSW92/D (98.0kB)Pb-free Active MSA1162MSA1162GT1/D (41.0kB)Pb-freeHalide freeActive MSB1218A-RT1MSB1218A-RT1/D (117.0kB Pb-freeHalide freeActive MSB709-RT1MSB709-RT1/D (42.0kB)Pb-freeHalide freeActive MSB92MSB92T1G/D (73.0kB)Pb-freeHalide freeActive MSB92A MSB92ASWT1/D (85.0kB)Pb-freeHalide freeActive MSB92AW MSB92WT1/D (117.0kB)Pb-freeHalide freeActive MSB92W MSB92WT1/D (117.0kB)Pb-freeHalide freeActive MSC2712GT1MSC2712GT1/D (31.0kB)Pb-freeHalide freeActive MSD1328-RT1MSD1328-RT1/D (30.0kB)Pb-freeHalide freeActive MSD42SW MSD42SWT1/D (102.0kB)Pb-freeHalide freeActive MSD42W MSD42WT1/D (125.0kB)Pb-freeHalide freeActive MSD601-R MSD601-RT1/D (42.0kB)Pb-freeHalide freeActive MSD602-RT1MSD602-RT1/D (42.0kB)Pb-freeHalide freeActive NJD1718NJD1718/D (100.0kB)Pb-freeHalide freeActive NJD2873NJD2873T4/D (93.0kB)Pb-freeHalide freeActive NJT4030P NJT4030P/D (274.0kB)Pb-freeHalide freeActive NJT4031NT1G NJT4031N/D (104.0kB)Pb-freeHalide free Active NJW0302NJW0281/D (74.0kB)Pb-free Active NJW1302NJW3281/D (83.0kB)Pb-free Active NJW21194NJW21193/D (90.0kB)Pb-freeActive NJX1675P NJX1675P/D (380.0kB)Pb-freeHalide freeActive NS2029M3NS2029M3/D (69.0kB)Pb-freeHalide freeActive NSS1C200NSS1C200MZ4/D (100.0kB)Pb-freeHalide freeActive NSS40300NSS40300MZ4/D (109.0kB)Pb-freeHalide freeActive。
2SC1846中文资料
MSM60802资料
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
元器件交易网
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元器件交易网
元器件交易网ຫໍສະໝຸດ 元器件交易网元器件交易网
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元器件交易网
2SC5658中文资料(rohm)中文数据手册「EasyDatasheet - 矽搜」
2SC2412K / 2SC4081 / 2SC4617 / 2SC5658
数据表
Features 1.低科夫.玉米棒= 2.0pF(典型值)穗轴= 2.0pF(典型值). 2.补充了2SA1037AK / 2SA1576A /
2SA1774H / 2SA2029.
(3)
0. 8
0. 2
1.0 1.6 0.5 0.5
1. 6 0. 15
0.1Min.
0~0.1
0.55 0.7
2SC5658
1. 2 0.2 0.8 0.2
1.2 0.32
(3)
0. 5
(2)
0. 8
0.4 0.4
(1)
0. 22
0.130~ 0.1 0.15Max.
Absolute 最大
(Ta=25 C)
电压与集电极电流
2/3
2014.10 - Rev.E
芯片中文手册,看全文,戳
2SC2412K / 2SC4081 / 2SC4617 / 2SC5658
(V) 0.5
CE(sat)
0.2
0.1 0.05
Ta=100°C
25°C −55°C
IC /IB =10
0.02 COLLECTOR SATURATION VOLTAGE : V
1
0.2 0.5 1 2
5 10 20 50
COLLECTOR TO BASE VOLTAGE : V EMITTER TO BASE VOLTAGE
Fig.10 集电极输出电容主场迎战 集电极 - 基极电压
发射器的输入电容主场迎战
发射极 - 基极电压
CB (V) : V EB (V)
LMC6082中文资料
LMC6082Precision CMOS Dual Operational AmplifierGeneral DescriptionThe LMC6082is a precision dual low offset voltage opera-tional amplifier,capable of single supply operation.Perfor-mance characteristics include ultra low input bias current,high voltage gain,rail-to-rail output swing,and an input com-mon mode voltage range that includes ground.These fea-tures,plus its low offset voltage,make the LMC6082ideally suited for precision circuit applications.Other applications using the LMC6082include precision full-wave rectifiers,integrators,references,and sample-and-hold circuits.This device is built with National’s advanced Double-Poly Silicon-Gate CMOS process.For designs with more critical power demands,see the LMC6062precision dual micropower operational amplifier.PATENT PENDINGFeatures(Typical unless otherwise stated)n Low offset voltage:150µVn Operates from 4.5V to 15V single supply n Ultra low input bias current:10fAn Output swing to within 20mV of supply rail,100k load n Input common-mode range includes V −n High voltage gain:130dB n Improved latchup immunityApplicationsn Instrumentation amplifiern Photodiode and infrared detector preamplifier n Transducer amplifiers n Medical instrumentation n D/A converternCharge amplifier for piezoelectric transducersConnection DiagramOrdering InformationPackageTemperature Range NSC DrawingTransport MediaMilitary Industrial −55˚C to +125˚C−40˚C to +85˚C 8-Pin LMC6082AMNLMC6082AIN N08ERailMolded DIP LMC6082IN 8-Pin LMC6082AIM M08ARail Small OutlineLMC6082IMTape and ReelFor MIL-STD-883C qualified products,please contact your local National Semiconductor Sales Office or Distributor for availability and specification information.8-Pin DIP/SODS011297-1Top ViewDecember 1994LMC6082Precision CMOS Dual Operational Amplifier©1999National Semiconductor Corporation Absolute Maximum Ratings (Note 1)If Military/Aerospace specified devices are required,please contact the National Semiconductor Sales Office/Distributors for availability and specifications.Differential Input Voltage ±Supply VoltageVoltage at Input/Output Pin (V +)+0.3V,(V −)−0.3VSupply Voltage (V +−V −)16V Output Short Circuit to V +(Note 11)Output Short Circuit to V −(Note 2)Lead Temperature (Soldering,10Sec.)260˚CStorage Temp.Range −65˚C to +150˚CJunction Temperature 150˚C ESD Tolerance (Note 4)2kVCurrent at Input Pin ±10mA Current at Output Pin±30mACurrent at Power Supply Pin 40mA Power Dissipation(Note 3)Operating Ratings (Note 1)Temperature Range LMC6082AM−55˚C ≤T J ≤+125˚C LMC6082AI,LMC6082I −40˚C ≤T J ≤+85˚C Supply Voltage4.5V ≤V +≤15.5VThermal Resistance (θJA )(Note 12)8-Pin Molded DIP 115˚C/W 8-Pin SO193˚C/W Power Dissipation(Note 10)DC Electrical CharacteristicsUnless otherwise specified,all limits guaranteed for T J =25˚C.Boldface limits apply at the temperature extremes.V +=5V,V −=0V,V CM =1.5V,V O =2.5V and R L >1M unless otherwise specified.TypLMC6082AMLMC6082AILMC6082I Symbol Parameter Conditions (Note 5)Limit Limit Limit Units(Note 6)(Note 6)(Note 6)V OS Input Offset Voltage 150350350800µV 10008001300Max TCV OS Input Offset Voltage 1.0µV/˚C Average Drift I B Input Bias Current 0.010pA 10044Max I OS Input Offset Current 0.005pA 10022Max R IN Input Resistance >10Tera ΩCMRR Common Mode 0V ≤V CM ≤12.0V 85757566dB Rejection Ratio V +=15V 727263Min +PSRR Positive Power Supply 5V ≤V +≤15V 85757566dB Rejection Ratio V O =2.5V 727263Min −PSRR Negative Power Supply 0V ≤V −≤−10V94848474dB Rejection Ratio 818171Min V CMInput Common-Mode V +=5V and 15V −0.4−0.1−0.1−0.1V Voltage Rangefor CMRR ≥60dB000Max V +−1.9V +−2.3V +−2.3V +−2.3V V +−2.6V +−2.5V +−2.5Min A VLarge Signal R L =2k ΩSourcing1400400400300V/mV Voltage Gain(Note 7)300300200Min Sinking35018018090V/mV 7010060Min R L =600ΩSourcing1200400400200V/mV (Note 7)15015080Min Sinking15010010070V/mV 355035Min 2DC Electrical Characteristics(Continued)Unless otherwise specified,all limits guaranteed for T J =25˚C.Boldface limits apply at the temperature extremes.V +=5V,V −=0V,V CM =1.5V,V O =2.5V and R L >1M unless otherwise specified.TypLMC6082AMLMC6082AILMC6082I Symbol Parameter Conditions (Note 5)Limit Limit Limit Units(Note 6)(Note 6)(Note 6)V OOutput SwingV +=5V4.87 4.80 4.80 4.75V R L =2k Ωto 2.5V4.70 4.73 4.67Min 0.100.130.130.20V 0.190.170.24Max V +=5V4.61 4.50 4.50 4.40V R L =600Ωto 2.5V4.24 4.31 4.21Min 0.300.400.400.50V 0.630.500.63Max V +=15V14.6314.5014.5014.37V R L =2k Ωto 7.5V14.3014.3414.25Min 0.260.350.350.44V 0.480.450.56Max V +=15V13.9013.3513.3512.92V R L =600Ωto 7.5V12.8012.8612.44Min 0.791.16 1.16 1.33V 1.42 1.32 1.58Max I OOutput Current Sourcing,V O =0V 22161613mA V +=5V8108Min Sinking,V O =5V21161613mA 111310Min I OOutput Current Sourcing,V O =0V 30282823mA V +=15V182218Min Sinking,V O =13V 34282823mA (Note 11)192218Min I S Supply CurrentBoth Amplifiers0.9 1.5 1.5 1.5mA V +=+5V,V O =1.5V 1.8 1.8 1.8Max Both Amplifiers1.11.7 1.7 1.7mA V +=+15V,V O =7.5V222Max 3AC Electrical CharacteristicsUnless otherwise specified,all limits guaranteed for T J =25˚C,Boldface limits apply at the temperature extremes.V +=5V,V −=0V,V CM =1.5V,V O =2.5V and R L >1M unless otherwise specified.TypLMC6082AMLMC6082AI LMC6082I Symbol ParameterConditions(Note 5)Limit Limit Limit Units(Note 6)(Note 6)(Note 6)SR Slew Rate(Note 8)1.50.80.80.8V/µs 0.50.60.6Min GBW Gain-Bandwidth Product 1.3MHz φm Phase Margin 50Deg Amp-to-Amp Isolation (Note 9)140dB enInput-Referred Voltage NoiseF =1kHz22Typical Performance CharacteristicsV S =±7.5V,T A =25˚C,Unless otherwise specifiedDistribution of LMC6082Input Offset Voltage (T A =+25˚C)DS011297-15Distribution of LMC6082Input Offset Voltage (T A =−55˚C)DS011297-16Distribution of LMC6082Input Offset Voltage (T A =+125˚C)DS011297-17Input Bias Current vs Temperature DS011297-18Supply Current vs Supply Voltage DS011297-19Input Voltagevs Output VoltageDS011297-20Common Mode Rejection Ratio vs FrequencyDS011297-21Power Supply Rejection Ratio vs Frequency DS011297-22Input Voltage Noise vs FrequencyDS011297-235Typical Performance CharacteristicsV S =±7.5V,T A =25˚C,Unless otherwisespecified (Continued)Output Characteristics Sourcing CurrentDS011297-24Output Characteristics Sinking CurrentDS011297-25Gain and Phase Response vs Temperature (−55˚C to +125˚C)DS011297-26Gain and PhaseResponse vs Capacitive Load with R L =600ΩDS011297-27Gain and PhaseResponse vs Capacitive Load with R L =500k ΩDS011297-28Open LoopFrequency ResponseDS011297-29Inverting Small Signal Pulse Response DS011297-30Inverting Large Signal Pulse Response DS011297-31Non-Inverting Small Signal Pulse ResponseDS011297-32 6Typical Performance CharacteristicsV S =±7.5V,T A =25˚C,Unless otherwisespecified (Continued)Applications HintsAMPLIFIER TOPOLOGYThe LMC6082incorporates a novel op-amp design topology that enables it to maintain rail to rail output swing even when driving a large load.Instead of relying on a push-pull unity gain output buffer stage,the output stage is taken directly from the internal integrator,which provides both low output impedance and large gain.Special feed-forward compensa-tion design techniques are incorporated to maintain stability over a wider range of operating conditions than traditional micropower op-amps.These features make the LMC6082both easier to design with,and provide higher speed than products typically found in this ultra-low power PENSATING FOR INPUT CAPACITANCEIt is quite common to use large values of feedback resis-tance for amplifiers with ultra-low input current,like the LMC6082.Although the LMC6082is highly stable over a wide range of operating conditions,certain precautions must be met to achieve the desired pulse response when a large feedback resistor is rge feedback resistors and even small values of input capacitance,due to transducers,photo-diodes,and circuit board parasitics,reduce phase margins.When high input impedances are demanded,guarding of the LMC6082is suggested.Guarding input lines will not only re-duce leakage,but lowers stray input capacitance as well.(See Printed-Circuit-Board Layout for High Impedance Work).The effect of input capacitance can be compensated for by adding a capacitor,C f ,around the feedback resistors (as in Figure 1)such that:orR 1C IN ≤R 2C fSince it is often difficult to know the exact value of C IN ,C f can be experimentally adjusted so that the desired pulse re-sponse is achieved.Refer to the LMC660and LMC662for a more detailed discussion on compensating for input capacitance.Non-Inverting Large Signal Pulse ResponseDS011297-33Crosstalk Rejection vs FrequencyDS011297-34Stability vs Capacitive Load,R L =600ΩDS011297-35Stability vs Capacitive Load R L =1M ΩDS011297-367Applications Hints(Continued)CAPACITIVE LOAD TOLERANCEAll rail-to-rail output swing operational amplifiers have volt-age gain in the output stage.A compensation capacitor is normally included in this integrator stage.The frequency lo-cation of the dominant pole is affected by the resistive load on the amplifier.Capacitive load driving capability can be op-timized by using an appropriate resistive load in parallel with the capacitive load (see typical curves).Direct capacitive loading will reduce the phase margin of many op-amps.A pole in the feedback loop is created by the combination of the op-amp’s output impedance and the ca-pacitive load.This pole induces phase lag at the unity-gain crossover frequency of the amplifier resulting in either an os-cillatory or underdamped pulse response.With a few exter-nal components,op amps can easily indirectly drive capaci-tive loads,as shown in Figure 2.In the circuit of Figure 2,R1and C1serve to counteract the loss of phase margin by feeding the high frequency compo-nent of the output signal back to the amplifier’s inverting in-put,thereby preserving phase margin in the overall feedback loop.Capacitive load driving capability is enhanced by using a pull up resistor to V +Figure 3.Typically a pull up resistor conducting 500µA or more will significantly improve capaci-tive load responses.The value of the pull up resistor must be determined based on the current sinking capability of theamplifier with respect to the desired output swing.Open loop gain of the amplifier can also be affected by the pull up resis-tor (see Electrical Characteristics).PRINTED-CIRCUIT-BOARD LAYOUT FOR HIGH-IMPEDANCE WORKIt is generally recognized that any circuit which must operate with less than 1000pA of leakage current requires special layout of the PC board.When one wishes to take advantage of the ultra-low bias current of the LMC6082,typically less than 10fA,it is essential to have an excellent layout.Fortu-nately,the techniques of obtaining low leakages are quite simple.First,the user must not ignore the surface leakage of the PC board,even though it may sometimes appear accept-ably low,because under conditions of high humidity or dust or contamination,the surface leakage will be appreciable.To minimize the effect of any surface leakage,lay out a ring of foil completely surrounding the LMC6082’s inputs and the terminals of capacitors,diodes,conductors,resistors,relay terminals,etc.connected to the op-amp’s inputs,as in Fig-ure 4.To have a significant effect,guard rings should be placed on both the top and bottom of the PC board.This PC foil must then be connected to a voltage which is at the same voltage as the amplifier inputs,since no leakage current can flow between two points at the same potential.For example,a PC board trace-to-pad resistance of 1012Ω,which is nor-mally considered a very large resistance,could leak 5pA if the trace were a 5V bus adjacent to the pad of the input.This would cause a 100times degradation from the LMC6082’s actual performance.However,if a guard ring is held within 5mV of the inputs,then even a resistance of 1011Ωwould cause only 0.05pA of leakage current.See Figure 5for typi-cal connections of guard rings for standard op-amp configurations.DS011297-4FIGURE 1.Cancelling the Effect of Input Capacitance DS011297-5FIGURE 2.LMC6082Noninverting Gain of 10Amplifier,Compensated to Handle Capacitive Loads DS011297-14FIGURE pensating for Large Capacitive Loadswith a Pull Up ResistorDS011297-6FIGURE 4.Example of Guard Ring in P .C.BoardLayout8Applications Hints(Continued)The designer should be aware that when it is inappropriate to lay out a PC board for the sake of just a few circuits,there is another technique which is even better than a guard ring on a PC board:Don’t insert the amplifier’s input pin into the board at all,but bend it up in the air and use only air as an in-sulator.Air is an excellent insulator.In this case you may have to forego some of the advantages of PC board con-struction,but the advantages are sometimes well worth the effort of using point-to-point up-in-the-air wiring.See tchupCMOS devices tend to be susceptible to latchup due to their internal parasitic SCR effects.The(I/O)input and output pins look similar to the gate of the SCR.There is a minimum cur-rent required to trigger the SCR gate lead.The LMC6062 and LMC6082are designed to withstand100mA surge cur-rent on the I/O pins.Some resistive method should be used to isolate any capacitance from supplying excess current to the I/O pins.In addition,like an SCR,there is a minimum holding current for any latchup mode.Limiting current to the supply pins will also inhibit latchup susceptibility.Typical Single-Supply Applications (V+=5.0V DC)The extremely high input impedance,and low power con-sumption,of the LMC6082make it ideal for applications that require battery-powered instrumentation amplifiers.Ex-amples of these types of applications are hand-held pH probes,analytic medical instruments,magnetic field detec-tors,gas detectors,and silicon based pressure transducers. Figure7shows an instrumentation amplifier that features high differential and common mode input resistance (>1014Ω),0.01%gain accuracy at A V=1000,excellent CMRR with1kΩimbalance in bridge source resistance.In-put current is less than100fA and offset drift is less than 2.5µV/˚C.R2provides a simple means of adjusting gain over a wide range without degrading CMRR.R7is an initial trim used to maximize CMRR without using super precision matched resistors.For good CMRR over temperature,low drift resistors should be used.DS011297-7 Inverting AmplifierDS011297-8 Non-Inverting AmplifierDS011297-9FollowerFIGURE5.Typical Connections of Guard RingsDS011297-10 (Input pins are lifted out of PC board and soldered directly to components.All other pins connected to PC board).FIGURE6.Air Wiring 9Typical Single-Supply Applications(Continued)Typical Single-Supply Applications(V +=5.0V DC )DS011297-11If R 1=R 5,R 3=R 6,and R 4=R 7;then∴A V ≈100for circuit shown (R 2=9.822k).FIGURE 7.Instrumentation AmplifierDS011297-12FIGURE 8.Low-Leakage Sample and HoldDS011297-13FIGURE 9.1Hz Square Wave Oscillator 10Physical Dimensions inches(millimeters)unless otherwise noted8-Pin Small Outline PackageOrder Number LMC6082AIM or LMC6082IMNS Package Number M08A8-Pin Molded Dual-In-Line PackageOrder Number LMC6082AIN,LMC6082AMN or LMC6082INNS Package Number N08E11LIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DE-VICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMI-CONDUCTOR CORPORATION.As used herein:1.Life support devices or systems are devices or sys-tems which,(a)are intended for surgical implant intothe body,or (b)support or sustain life,and whose fail-ure to perform when properly used in accordancewith instructions for use provided in the labeling,can be reasonably expected to result in a significant injury to the user.2.A critical component is any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system,or to affect its safety or effectiveness.National Semiconductor Corporation AmericasTel:1-800-272-9959Fax:1-800-737-7018Email:support@National Semiconductor EuropeFax:+49(0)180-5308586Email:europe.support@Deutsch Tel:+49(0)180-5308585English Tel:+49(0)180-5327832Français Tel:+49(0)180-5329358Italiano Tel:+49(0)180-5341680National Semiconductor Asia Pacific Customer Response Group Tel:65-2544466Fax:65-2504466Email:sea.support@National Semiconductor Japan Ltd.Tel:81-3-5639-7560Fax:81-3-5639-7507L M C 6082P r e c i s i o n C M O S D u a l O p e r a t i o n a l A m p l i f i e rNational does not assume any responsibility for use of any circuitry described,no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.。
BC-6082AB规格书V2.1(13-07-10)
产品规格书产品型号:BC-6082广州科城计算机科技有限公司V2.1 2013年6月2日目录注意事项 (3)A. 概要 (3)B.参数 (3)1.物理特性 (3)2. 电气特性 (4)3.性能(测试条件: UPC, 10mil, PCS 0.9) (4)4. 环境要求 (5)C.结构设计与电路设计注意事项 (5)D. 扫描图 (10)E.时序特性 (10)F.可靠性 (12)1、数据帧格式....................................................................................... 错误!未定义书签。
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A. 概要LS-6082AB条形码扫描仪是一款特别依客户端使用需求所设计的激光条形码扫描模组。
Z-6082全方位激光扫描平台用户手册说明书
Z-6082全方位激光扫描平台用户手册注意:此激光平台有时会产生无线电射频能量,如果没有按照本手册的指南进行安装和使用,有可能会造成对无线电通信的干扰。
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版本号:2007-01■目录介绍 (1)拆包 (2)外观及说明 (2)电源连接 (3)扫描测试 (3)固定安装 (5)连接到PC/POS (6)如何扫描 (8)扫描方法 (8)指示灯 (8)蜂鸣器指示 (8)休眠 (9)通过主机控制激光平台 (10)激光平台维护 (10)激光安全 (11)附录A:接线与脚位定义 (12)附录B:规格及尺寸 (13)附录C:问题解析 (15)附录D:激光平台产品基本设定 (16)附录E:激光扫描平台条码设定 (18)一.恢复出厂设置 (18)二.显示产品信息 (19)三.接口的设定 (19)四.串口参数设定 (23)五.条码数据后附加参数 (25)六.开放与关闭不同码制 (30)七.声音设定 (39)八.休眠时间设定 (42)九.同一条码扫描时间间隔 (46)十.给条码加标识符 (47)十一.设定读码长度范围 (49)十二. 条码加载前缀或后缀 (53)十三.截除条码字符 (55)附录F Full ASCLL码 (57)Z-6082采用了ZEBEX公司2004年研制的Dual-Laser技术和Z-SCAN ASIC芯片。
2SC4208资料
2.3±0.2
(1.27)
(1.27)
Publication date: February 2003
1
This product complies with the RoHS Directive (EU 2002/95/EC).
2SC4208, 2SC4208A
PC Ta
1.2
1
Ta = 75°C 25°C −25°C
150
100
0.1
0.1
50
0.01 0.01
0.1
1
10
0.01 0.01
0.1
1
10
0 0.01
0.1
1
10
Collector current IC (A)
Collector current IC (A)
Collector current IC (A)
fT I E
80
4
40
2
0 −1
−10
−100
0
1
10
100
0
1
10
100
1 000
Emitter current IE (mA)
Collector-base voltage VCB (V)
Base-emitter resistance RBE (kΩ)
2
SJC00153BED
This product complies with the RoHS Directive (EU 2002/95/EC).
1.0
Collector current IC (mA)
600 500
Collector current IC (mA)
6082_aluminum_alloy_extrusions
Effects of the aging time and temperature on the microstructures and mechanical properties of 6082 aluminum alloy extrusionsTao Wu1, Xianfei Ding1, Jing Sun2, Weidong Zhang*1,Dongbai Sun1, LichenWang31. National Center for Materials Service Safety, University of Science and Technology Beijing,Beijing 100083, China2. Tangshan Railway Vehicle Co. Ltd., Tangshan 063035, China3. Jilin Midas Aluminum Industries Co. Ltd., Liaoyuan 136200, ChinaKeywords: 6082 aluminum alloy; aging; microstructure; mechanical propertiesAbstract: The main task of this work was to study the effects of aging time and aging temperature on the microstructure and mechanical properties of 6082 aluminum alloy extrusions. Artificial aging was performed on the alloy extrusions at the temperatures of 150, 175 and 200 ℃ for the aging times of 4, 8 and 12 h. The microstructure evolution of the aluminum alloy extrusions with increase of the aging time and temperature was investigated by Field Emission Scanning Electron Microscope (FESEM). For the purpose of how the aging process affected the mechanical properties, tensile tests were performed. The results showed that the optimum aging treatment was 175 ℃/4 h. Under this condition, the tensile strength (Rm) and the yield strength (Rp) in the longitudinal direction of the extrusions reached the maximum value more than 350MPa and 320MPa, respectively, and the tensile elongation (A) was more than 15%.Introduction6082 is an important aluminum alloy for the high-speed train, subway and urban light rail vehicle bodies because of its low cost, moderate strength, excellent extrudability, good weldability and corrosion resistance [1-3]. Currently, there are more than 30,000 aluminum urban rail vehicles and railway transport vehicles having been put into operation[4], and the increased mechanical properties of 6082 aluminum alloys have great significance to the train safety. So its age-hardening response can be very important, leading to remarkable improvement of strength after an appropriate heat treatment. Therefore, as the key material of aluminum alloy train body, the mechanical properties of 6082 aluminum alloy forming products are of great industrial interest for product optimization.For the heat treatable alloys which can be heat-treated to produce precipitation to various degrees, such as 6082 alloys, a proper process of aging treatment is important to achieve excellent performance. In order to achieve optimum age hardening, the precipitation plays an important role. In recent years, it has been attained a satisfactory agreement on phase evolution during aging Foundation item: Project (No.2009BAG12A07-B01-2) supported by the National Key Technology R&D Program of China. Corresponding author: ZHANG Wei-dong; Associate researcher; Tel: +86-10-82377225; Fax: +86-10-62329915; Email: zwd@process in the alloys. For example, Edwards et al. [11]has developed the following sequences of precipitations in Al-Mg-Si alloys: Al (solid solution) →﹛clusters of Si atoms + clusters of Mg atoms﹜→﹛dissolution of Mg clusters﹜→﹛formation of Mg/Si co-clusters﹜→﹛small precipitates of unknown structure﹜→﹛β″ precipitates﹜→﹛β″and β′ precipitates﹜→﹛β-Mg2Si precipitates﹜. Among these, the β″precipitates are considered to give the main strengthening contribution and hence they are mostly responsible for the maximum age-hardening effect. Furthermore, as a member of Al-Mg-Si alloys group, the critical nucleus size, number, composition, and the aggregation and growth rate of the precipitation phases in 6082 are varied with the aging temperature [7, 8]. Short-term aging process with a single stage can reduce the production cycle and costs, which is most widely used in industry applications. In previous, a great number of studies in 6082 aluminum alloys are mainly focused on the composition optimization, extrusion process, quenching sensitivity and the welding process [5, 6, 9], however, the aging process, particularly the aging in short term with a single stage, has not been paid much attention at present.In this paper, we focus on the 6082 aluminum alloy extrusions after online quenching. Through the comparison of the room temperature microstructure and tensile properties after different artificial aging processes in short term with a single stage, the effects of aging temperature and time on the microstructures and mechanical properties are investigated, which provided a basis for practical aging manufacturing process development and optimization, and promoted the development of extrusions.Material and experimentalThe 6082 aluminum alloy in the form of extruded profiles with 18 mm thickness was provided by Jilin Midas Aluminum Industries Co. Ltd. The extruded profiles were obtained after on-line solid solution and quenching processes. The extrusion coefficient 15-20, the extrusion speed 1.3-1.8 m/min, the solution temperature 520-540 ℃and online air cooling quenching were adopted during the processes. The chemical composition of the 6082 alloys was indicated in Table 1. It contained the appropriate amount of Mn and Cr,and Mg, Si content was relatively high.Table 1 The standard composition of 6082 aluminum alloy and the chemical composition of the experimentalalloy (wt. %)Si Fe Cu Mn Mg Cr Zn Ti Al Standard Alloy0.70-1.3 0.50 0.100 0.40-1.0 0.60-1.20 0.250 0.200 0.100 Bal.Experimental Alloy 0.94 0.18 <0.01 0.68 0.80 0.033 <0.01 0.036 Bal.The samples were heated up in furnace to temperature 150/175/200 ℃ holding for 4/8/12h, and then cooled in the air (as shown in Fig. 1). The aged extrusion profiles were cut along the cross sections for microstructure observation, and along the longitudinal directions for the mechanical properties tests. The microstructure of the 6082 alloy extrusions after heat aging treatment had been studied by the Zeiss SUPRA 55 Field Emission Scanning Electron Microscope (FESEM), and the composition of the precipitated phase had been measured by Energy Dispersive X-ray Spectrum (EDS). Tensile properties were tested by the static tensile machine. Tensile specimens in size of Φ17 × 220 mm with the gauge section of Φ12.5 × 70 mm were prepared by low stress grinding and polishing with 2000 grit emery papers.Fig. 1 Aging treatment process of 6082 aluminum alloy extrusionsResults and discussionMicrostructureThe microstructures of 6082 aluminum alloy extrusions after different aging processes is given in Fig. 2(a)~(i). As shown in Fig. 2, with increase of the aging temperature and time, the grain sizes do not change obviously. A large number of fibrous structures exist along the extrusion longitudinal direction. There are about 2-4% (volume fraction) coarse particles in irregular shapes in the microstructures. And the volume fraction decreases slightly with the increase of aging time and temperature. The black grey points in the images should be the holes where the particles were fallen off. The size of the particles is inhomogeneous and a maximum size is about 6-7 μm , and the particles coarsen further when the aging temperature is 200 ℃. The Eds composition analysis result shows that, as illustrated in Table 2, the particles are mainly (Al(Fe, Cr)Si) and also a small amount of (AlFeSi) precipitates.Fig. 2 Microstructures in cross section of the 6082 aluminum alloy extrusions after different aging processes: (a) 150℃/4h, (b) 150℃/8h, (c) 150℃/12h, (d) 175℃/4h, (e) 175℃/8h, (f) 175℃/12h, (g) 200℃/4h, (h) 200℃/8h, (i)200℃/12hTable 2 Eds composition of the coarse particles in 6082 aluminum alloy after agingElementLineWeight % Weight % Error Norm. Wt.% Atom % Atom % Error Al K81.37 +/- 0.43 81.37 83.05 +/- 0.43 Si K15.88 +/- 1.01 15.88 15.57 +/- 0.99 Cr K0.69 +/- 0.10 0.69 0.36 +/- 0.05 Fe K2.06 +/- 1.01 2.06 1.02 +/- 0.49 Total 100.00 100.00 100.00The coarse particles sized greater than 3 μm are usually formed in the extrusion process, which are consist of Fe-containing inclusions, such as (AlFeSi) and (Al(Fe, Cr)Si) [9]. With the aging time and temperature increasing, the particle size as well as the morphology of the coarse inclusions could be changed slightly by the thermal diffusion at the phase interface. The supersaturated solid solution is developed gradually to microstructures with the lowest energy. And it will gradually reach to the lowest energy balance of microstructure development during the aging treatment . Furthermore, in the aluminum alloys, there are a lot dislocations and dislocation tangles formed by extrusion, as shown in Fig. 3, which lead to the fibrous structure along the extrusion longitudinal direction. Therefore, after aging treatment, there also exist the coarse particles, which are mainly the (Al(Fe, Cr)Si) and a small amount of (AlFeSi), and a large number of fibrous structures along the extrusion longitudinal direction.Fig. 3 Microstructures in cross section of the 6082 aluminum alloy extrusions after different aging processes: (a) 150℃/4h, (b) 150℃/8h, (c) 150℃/12h, (d) 175℃/4h, (e) 175℃/8h, (f) 175℃/12h, (g) 200℃/4h, (h) 200℃/8h, (i)200℃/12hFig. 3(a)~(i) shows the cross-section microstructures (×10K SEM) of 6082 aluminum after different aging process. As shown in Fig. 3, the quantity of the submicron precipitated particles, which has a positive influence on the strength and a negative influence on the plastic of alloys, at aging temperature 175 ℃is more than that at 150 ℃. When the aging temperature increases to 200 ℃, the (AlFeSi) particles in size of about 1-3 μm are precipitated at the grain boundaries. Compared with the aging temperature, the precipitated particles do not change obviously with increase of aging time.The major strengthening elements in the Al-Mg-Si alloys are Mg and Si, the strengthening phase is Mg2Si. In the sedimentation process, the best enhanced role is mainly the needle β〞phase with the matrix lattice [7]. And the strengthen phases precipitated in 6082 alloys after the peak aging are the β', β'' and Si-containing phases, which become the greater barriers of the dislocation motion. Furthermore, the aging kinetics is controlled by the diffusion of the solute atoms, which is strongly dependent on the aging time and temperature. When the temperature exceeds a certain threshold, the precipitated particles are easily nucleated and grown, especially at the relatively high-energy grain boundaries and dislocations [12]. That is possibly the reason why the larger (AlFeSi) particles precipitate at grain boundaries shown in Fig. 3(f), (g) and (h). With the increase of aging temperature, the diffusion process becomes faster, which leads to the larger volume fraction of the precipitated particles. When it increases to 200 ℃, the alloys are over-aged and there are coarse particles precipitated at the grain boundaries, thus the quantities of submicron precipitated particles are decreased. Therefore, because of the diffusion process, the quantities of submicron precipitated particles, which have the strength effects, are larger at 175 ℃than at 150 ℃and 200 ℃. Mechanical propertiesFig. 4(a)~(f) shows room temperature (RT) tensile curves of the 6082 aluminum alloy extrusions in longitudinal direction after aging treatment under conditions of 150-200℃/4-12h. As seen from Fig. 4(a), (b) and (c), under the conditions of same time and different temperature aging treatment, thecurves in the tensile yield, strengthening and necking stages are significantly different, but under the conditions of same temperature and different time, as shown in Fig. 4(d), (e) and (f), the curve profiles are consistent with each other. These results suggest that RT mechanical properties of the extrusions are more sensitive to the aging temperature than to the aging time. In addition, when the aging temperature is 175℃, the strength and plastic does not changed obviously.Fig. 4 RT tensile curves in longitudinal direction of the 6082 aluminum alloy extrusions after different aging processes: (a) 150-200℃/4h, (b) 150-200℃/8h, (c) 150-200℃/12h, (d) 150℃/4-12h, (e) 175℃/4-12h, (f)200℃/4-12hFig. 5 shows the dependences of the RT tensile property parameters of the 6082 aluminum alloy extrusions on the aging temperatures. As can be seen from Fig. 5, at the aging temperature of 175 ℃, the tensile and yield strength reaches the maximum values more than 330 MPa and 300 MPa, respectively. The tensile elongation decreases with increase of the aging temperature. When the aging time is 4h, the yield and tensile strength also reach maximum values at the aging temperature of 175 ℃.Fig. 5 Dependences of the RT tensile property parameters of the 6082 aluminum alloy extrusions on the aging temperatures after aging times of 4/8/12h: the tensile strength Rm (a), the yield strength Rp (b) and the tensileelongation A (c)Dependences of the RT tensile property parameters of the 6082 aluminum alloy extrusions on the aging time are summarized in Fig. 6. As shown in Fig. 6, at the aging temperature of 150 ℃, with increase of the aging time, the tensile strength, the yield strength and the tensile elongation are all increased. At aging temperature of 200℃, the tensile and yield strength firstly reduces obviously and then increases slightly with increase of the aging time. At aging temperature of 175℃, the tensile and yield strength decreases slightly with the increase of aging time. And the plastic is highest at 150℃.Fig. 6 Dependences of the RT tensile property parameters of the 6082 aluminum alloy extrusions on the aging time at aging temperatures of 150/175/200℃: the tensile strength Rm (a), the yield strength Rp (b) and the tensileelongation A (c)The microstructure and precipitated particles have great influences on the mechanical properties. As indicated in Fig. 5 and 6, the aluminum alloy is under-aged after aging process of 150 ℃/4-12 h. it reaches the better peak-aging strengthening at the aging treatment of 175 ℃/4 h, and the volume fraction of the submicron precipitated particles is larger under this condition, as shown in Fig. 3. In the experimental aging time, the quantity of precipitated submicron particles at 175 ℃is more than that at 150 ℃, which leads to the highest plasticity at 150 ℃. The plasticity at 200 ℃ is much lower than others and some of the precipitated particles are oversize, so it is supposed that the alloys have been the over-aged after 200 ℃ aging treatment, especially for the aging time more than 4h.It is shown from the Fig. 2 and Fig. 3 that the microstructure of the alloys is homogeneous and the volume fraction of the precipitated submicron phases is larger at 175 ℃. The second phase particles precipitated from the supersaturated solid solution is evenly distributed in matrix, and they can impede the dislocation movement, so the alloys will be strengthen [10]. Just as the discussion above, because of the quantity and the size of the precipitated particles, the strength and plasticity of the alloy extrusions varies with the aging time and temperature, and the optimal aging treatment is 175 ℃/4 h. Other researches [9, 14] show that the β'' phase is coherent with the matrix lattice and the dislocations go through the particles following the shearing mechanism. The strength increases with the growth of the precipitated particles. After it reaches to the peak strengthen, the sizes of precipitated particles will become larger and gradually change to the β'and βphase, and on the other hand the volume fraction of precipitated particles becomes smaller, which will reduce the strength of alloys. Therefore, with the increase of aging temperature, due to the changes of precipitated particles, the strength firstly increases and then reduces, and the highest value is at 175 ℃. Furthermore, because volume fraction of the precipitated particles does not change obviously with the aging time increasing, but oppositely it changes apparently with the temperature increasing (as shown in Fig. 3), the RT mechanical properties of the extrusions are less sensitive to the aging time than to the aging temperature.In general, due to the microstructure evolution and mechanical properties of 6082 aluminum extrusions, the optimum aging treatment is 175 ℃ aging temperature and 4h aging time, and under this condition (175 ℃/4 h), tensile strength (Rm) and yield strength (Rp) are more than 350MPa and 320MPa, the tensile elongation (A) is more than 15%.ConclusionsEffects of aging time and temperature on the microstructure and mechanical properties of 6082 aluminum alloy extrusions has been carried out. The following conclusions can be drawn from this work:(1) There are a large number of fibrous structures along the extrusion longitudinal direction and about 2-4% (volume fraction) coarse particles in the aged microstructures. The volume fraction of the submicron precipitated particles reaches the maximum value at the 175 ℃aging temperature. Compared with the aging temperature, the precipitated particles do not change obviously with increase of aging time.(2) The RT mechanical properties of the extrusions are more sensitive to the aging temperature than to the aging time. The optimum aging process is 175 ℃/4 h. Under this condition, the tensile strength (Rm) and the yield strength (Rp) in the longitudinal direction of the extrusions are more than 350MPa and 330MPa, respectively, and the tensile elongation (A) is more than 15%. References[1] Ye Pengfei, Wang Y u, et al. Production process of aluminum extrusions for high-speed train body [J]. Aluminum processing technology, 2009, 37(3): 40-43. (in Chinese)[2] Ugur Malayoglu, Kadir C. Tekin, Ufuk Malayoglu, Suman Shrestha. An investigation into the mechanical and tribological properties of plasma electrolytic oxidation and hard-anodized coatings on 6082 aluminum alloy [J]. Material Science and Engineering, 2011, 528: 7451-7460.[3] A.M. Pereira, J.M. Ferreira, F.V. Antunes, P.J. Bartolo. Study on the fatigue strength of AA6082-T6 adhesive lap joints [J]. International Journal of Adhesion & Adhesives, 2009, 29: 633-638.[4] Wang Yanjin, Ding Guohua, Wang Junjiu. Development status and prospects of aluminum alloy train body manufacturing technology in China [J]. Welding, 2004, 10: 5-7. (in Chinese)[5] Chen Hui, Huang Zhiqi, Liu Zhiming, et al. Effect of Stay Time after Quenching on Tensile Strength of 6082-T6 Aluminum Alloy Profiles [J]. Aluminum Fabrication, 2007, 6: 25-27. (in Chinese)[6] Luo Jun, Ni Xi. Research on production technology of 6082A alloy extrusion sectional bar [J]. Metallurgical Collections, 2007, 4(8): 4-5. (in Chinese)[7] Zhang Guopeng. Influence of heat treatment on the new 6XXX series aluminum alloy microstructure and properties [M]. Central South University, 2010. (in Chinese)[8] Grazyna Mrowka-Nowotnik, Jan Sieniawski. Influence of heat treatment on the microstructure and mechanical properties of 6005 and 6082 aluminium alloys [J]. Journal of Materials Processing Technology, 2005, 162-163: 367-372.[9] He Lizi. Microstructures and mechanical properties of the Al-Mg-Si alloys [D]. Northeastern University, 2001. (in Chinese)[10] Yang Wangyue, Qiang Wenjiang. Mechanical Behavior of Materials. Beijing: Chemical Industry Press, 2009: 212-218. (in Chinese)[11] G.A. Edwards, K. Stiller, G.L Dunlop, M.J. Couper. The precipitation sequence in Al-Mg-Si alloys [J]. Acta Materialia, 1998, 46(11): 3893-3904.[12] Jin Man, Liu Likun, Shao Guangjie. The effect of heat treatment on the microstructure and property of the 6082 Al-Mg-Si alloy [J]. Ninth heat treatment of the General Assembly, 2007, 9: 160-163. (in Chinese)。
2SC2883 PDF规格书
Base-emitter voltage
VBE
(V)
Safe Operating Area
5000 3000 IC max (pulse)*
PC – Ta
10 ms* 100 ms* 1 ms* 1.2
PC (W)
IC max (continuous)
(mA)
1000 500 300
1.0
(1)
(1) Mounted on a ceramic substrate (250 mm2 × 0.8 t) (2) No heat sink
h FE –C I
IC (A)
Collector current
0.8
3 2
DC current gain
4
hFE
1.2
5
300
30 Common emitter VCE = 2 V
0.4 IB = 1 mA 0 4 8 12 16
0 0
10 1 3 10 30 100 300 10 00
Collector-emitter voltage
■ Classification of hfe
Marking Rank Range GO* O 100-200 GY* Y 160-320
2SC2883 NPN Transistors
■ Typical Characterisitics
IC – VCE
1.6 10 8 6 Common emitter Ta = 25°C 500 Ta = 100°C 25 −25 100 1000
0.5 0.3
(mA)
1.2 Ta = 100°C 0.8 25 −25
0.1 Ta = 100°C 0.05 0.03 25 −25
LMC6082IN,LMC6082INNOPB系列规格书,Datasheet 资料
LMC6082LMC6082 Precision CMOS Dual Operational AmplifierLiterature Number: SNOS630C 芯天下--/LMC6082Precision CMOS Dual Operational AmplifierGeneral DescriptionThe LMC6082is a precision dual low offset voltage opera-tional amplifier,capable of single supply operation.Perfor-mance characteristics include ultra low input bias current,high voltage gain,rail-to-rail output swing,and an input common mode voltage range that includes ground.These features,plus its low offset voltage,make the LMC6082ideally suited for precision circuit applications.Other applications using the LMC6082include precision full-wave rectifiers,integrators,references,and sample-and-hold circuits.This device is built with National’s advanced Double-Poly Silicon-Gate CMOS process.For designs with more critical power demands,see the LMC6062precision dual micropower operational amplifier.PATENT PENDINGFeatures(Typical unless otherwise stated)n Low offset voltage:150µVn Operates from 4.5V to 15V single supply n Ultra low input bias current:10fAn Output swing to within 20mV of supply rail,100k load n Input common-mode range includes V −n High voltage gain:130dB n Improved latchup immunityApplicationsn Instrumentation amplifiern Photodiode and infrared detector preamplifier n Transducer amplifiers n Medical instrumentation n D/A converternCharge amplifier for piezoelectric transducersConnection Diagram8-Pin DIP/SO01129701Top ViewInput Bias Current vs Temperature01129718August 2000LMC6082Precision CMOS Dual Operational Amplifier©2004National Semiconductor Corporation Absolute Maximum Ratings (Note 1)If Military/Aerospace specified devices are required,please contact the National Semiconductor Sales Office/Distributors for availability and specifications.Differential Input Voltage ±Supply VoltageVoltage at Input/Output Pin (V +)+0.3V,(V −)−0.3VSupply Voltage (V +−V −)16V Output Short Circuit to V +(Note 11)Output Short Circuit to V −(Note 2)Lead Temperature (Soldering,10Sec.)260˚CStorage Temp.Range −65˚C to +150˚CJunction Temperature 150˚C ESD Tolerance (Note 4)2kVCurrent at Input Pin±10mACurrent at Output Pin ±30mACurrent at Power Supply Pin 40mA Power Dissipation(Note 3)Operating Ratings (Note 1)Temperature Range LMC6082AM−55˚C ≤T J ≤+125˚CLMC6082AI,LMC6082I −40˚C ≤T J ≤+85˚C Supply Voltage4.5V ≤V +≤15.5VThermal Resistance (θJA )(Note 12)8-Pin Molded DIP 115˚C/W 8-Pin SO 193˚C/W Power Dissipation(Note 10)DC Electrical CharacteristicsUnless otherwise specified,all limits guaranteed for T J =25˚C.Boldface limits apply at the temperature extremes.V +=5V,V −=0V,V CM =1.5V,V O =2.5V and R L >1M unless otherwise specified.TypLMC6082AMLMC6082AI LMC6082I Symbol ParameterConditions (Note 5)Limit Limit Limit Units(Note 6)(Note 6)(Note 6)V OS Input Offset Voltage 150350350800µV 10008001300Max TCV OS Input Offset Voltage 1.0µV/˚C Average Drift I B Input Bias Current 0.010pA 10044Max I OS Input Offset Current 0.005pA 10022Max R IN Input Resistance >10Tera ΩCMRR Common Mode 0V ≤V CM ≤12.0V 85757566dB Rejection Ratio V +=15V 727263Min +PSRR Positive Power Supply 5V ≤V +≤15V 85757566dB Rejection Ratio V O =2.5V 727263Min −PSRR Negative Power Supply 0V ≤V −≤−10V94848474dB Rejection Ratio 818171Min V CMInput Common-Mode V +=5V and 15V −0.4−0.1−0.1−0.1V Voltage Rangefor CMRR ≥60dB000Max V +−1.9V +−2.3V +−2.3V +−2.3V V +−2.6V +−2.5V +−2.5Min A VLarge Signal R L =2k ΩSourcing1400400400300V/mV Voltage Gain(Note 7)300300200Min Sinking35018018090V/mV 7010060Min R L =600ΩSourcing1200400400200V/mV (Note 7)15015080Min Sinking15010010070V/mV 355035MinL M C 6082 2Typ LMC6082AM LMC6082AI LMC6082ISymbol Parameter Conditions(Note5)Limit Limit Limit Units(Note6)(Note6)(Note6)V O Output Swing V+=5V 4.87 4.80 4.80 4.75VR L=2kΩto2.5V 4.70 4.73 4.67Min0.100.130.130.20V0.190.170.24MaxV+=5V 4.61 4.50 4.50 4.40VR L=600Ωto2.5V 4.24 4.31 4.21Min0.300.400.400.50V0.630.500.63MaxV+=15V14.6314.5014.5014.37VR L=2kΩto7.5V14.3014.3414.25Min0.260.350.350.44V0.480.450.56MaxV+=15V13.9013.3513.3512.92VR L=600Ωto7.5V12.8012.8612.44Min0.79 1.16 1.16 1.33V1.42 1.32 1.58MaxI O Output Current Sourcing,V O=0V22161613mAV+=5V8108MinSinking,V O=5V21161613mA111310MinI O Output Current Sourcing,V O=0V30282823mAV+=15V182218MinSinking,V O=13V34282823mA(Note11)192218MinI S Supply Current Both Amplifiers0.9 1.5 1.5 1.5mAV+=+5V,V O=1.5V 1.8 1.8 1.8MaxBoth Amplifiers 1.1 1.7 1.7 1.7mAV+=+15V,V O=7.5V222Max3CM O L TypLMC6082AMLMC6082AI LMC6082I Symbol ParameterConditions(Note 5)Limit Limit Limit Units(Note 6)(Note 6)(Note 6)SR Slew Rate(Note 8)1.50.80.80.8V/µs 0.50.60.6Min GBW Gain-Bandwidth Product 1.3MHz φm Phase Margin 50Deg Amp-to-Amp Isolation (Note 9)140dB e n Input-Referred Voltage Noise F =1kHz 22i n Input-Referred Current Noise F =1kHz0.0002T.H.D.Total Harmonic DistortionF =10kHz,A V =−10R L =2k Ω,V O =8V PP0.01%±5V SupplyNote 1:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.Operating Ratings indicate conditions for which the device is intended to be functional,but do not guarantee specific performance limits.For guaranteed specifications and test conditions,see the Electrical Characteristics.The guaranteed specifications apply only for the test conditions listed.Note 2:Applies to both single-supply and split-supply operation.Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150˚C.Output currents in excess of ±30mA over long term may adversely affect reliability.Note 3:The maximum power dissipation is a function of T J(Max),θJA ,and T A .The maximum allowable power dissipation at any ambient temperature is P D =(T J(Max)−T A )/θJA .Note 4:Human body model,1.5k Ωin series with 100pF.Note 5:Typical values represent the most likely parametric norm.Note 6:All limits are guaranteed by testing or statistical analysis.Note 7:V +=15V,V CM =7.5V and R L connected to 7.5V.For Sourcing tests,7.5V ≤V O ≤11.5V.For Sinking tests,2.5V ≤V O ≤7.5V.Note 8:V +=15V.Connected as Voltage Follower with 10V step input.Number specified is the slower of the positive and negative slew rates.Note 9:Input referred V +=15V and R L =100k Ωconnected to 7.5V.Each amp excited in turm with 1kHz to produce V O =12V PP .Note 10:For operating at elevated temperatures the device must be derated based on the thermal resistance θJA with P D =(T J −T A )/θJA .All numbers apply for packages soldered directly into a PC board.Note 11:Do not connect output to V +,when V +is greater than 13V or reliability will be adversely affected.Note 12:All numbers apply for packages soldered directly into a PC board.L 4Typical Performance CharacteristicsV S =±7.5V,T A =25˚C,Unless otherwise specifiedDistribution of LMC6082Input Offset Voltage(T A =+25˚C)Distribution of LMC6082Input Offset Voltage(T A =−55˚C)0112971501129716Distribution of LMC6082Input Offset Voltage(T A =+125˚C)Input Bias Current vs Temperature0112971701129718Supply Current vs Supply Voltage Input Voltage vs Output Voltage0112971901129720LMC60825Typical Performance Characteristics V S =±7.5V,T A =25˚C,Unless otherwisespecified (Continued)Common Mode Rejection Ratio vs FrequencyPower Supply Rejection Ratio vs Frequency0112972101129722Input Voltage Noise vs Frequency Output Characteristics Sourcing Current0112972301129724Output CharacteristicsSinking CurrentGain and Phase Responsevs Temperature (−55˚C to +125˚C)0112972501129726L M C 6082 6Typical Performance Characteristics VS=±7.5V,T A=25˚C,Unless otherwise specified(Continued)Gain and Phase Response vs Capacitive Load with R L=600ΩGain and PhaseResponse vs Capacitive Loadwith R L=500kΩ0112972701129728Open Loop Frequency ResponseInverting Small SignalPulse Response 0112972901129730Inverting Large Signal Pulse ResponseNon-Inverting SmallSignal Pulse Response0112973101129732LMC60827Typical Performance Characteristics V S =±7.5V,T A =25˚C,Unless otherwisespecified (Continued)Non-Inverting Large Signal Pulse ResponseCrosstalk Rejection vs Frequency0112973301129734Stability vs Capacitive Load,R L =600ΩStability vs CapacitiveLoad R L =1M Ω0112973501129736Applications HintsAMPLIFIER TOPOLOGYThe LMC6082incorporates a novel op-amp design topology that enables it to maintain rail to rail output swing even when driving a large load.Instead of relying on a push-pull unity gain output buffer stage,the output stage is taken directly from the internal integrator,which provides both low output impedance and large gain.Special feed-forward compensa-tion design techniques are incorporated to maintain stability over a wider range of operating conditions than traditional micropower op-amps.These features make the LMC6082both easier to design with,and provide higher speed than products typically found in this ultra-low power PENSATING FOR INPUT CAPACITANCEIt is quite common to use large values of feedback resis-tance for amplifiers with ultra-low input current,like the LMC6082.Although the LMC6082is highly stable over a wide range of operating conditions,certain precautions must be met to achieve the desired pulse response when a large feedback resistor is rge feedback resistors and even small values of input capacitance,due to transducers,photo-diodes,and circuit board parasitics,reduce phase margins.When high input impedances are demanded,guarding of the LMC6082is suggested.Guarding input lines will not only reduce leakage,but lowers stray input capacitance as well.(See Printed-Circuit-Board Layout for High Impedance Work).The effect of input capacitance can be compensated for by adding a capacitor,C f ,around the feedback resistors (as in Figure 1)such that:orR 1C IN ≤R 2C fSince it is often difficult to know the exact value of C IN ,C f can be experimentally adjusted so that the desired pulse re-sponse is achieved.Refer to the LMC660and LMC662for a more detailed discussion on compensating for input capaci-tance.L M C 60828Applications Hints(Continued)CAPACITIVE LOAD TOLERANCEAll rail-to-rail output swing operational amplifiers have volt-age gain in the output stage.A compensation capacitor isnormally included in this integrator stage.The frequencylocation of the dominant pole is affected by the resistive loadon the amplifier.Capacitive load driving capability can beoptimized by using an appropriate resistive load in parallelwith the capacitive load(see typical curves).Direct capacitive loading will reduce the phase margin ofmany op-amps.A pole in the feedback loop is created by thecombination of the op-amp’s output impedance and the ca-pacitive load.This pole induces phase lag at the unity-gaincrossover frequency of the amplifier resulting in either anoscillatory or underdamped pulse response.With a few ex-ternal components,op amps can easily indirectly drive ca-pacitive loads,as shown in Figure2.In the circuit of Figure2,R1and C1serve to counteract theloss of phase margin by feeding the high frequency compo-nent of the output signal back to the amplifier’s invertinginput,thereby preserving phase margin in the overall feed-back loop.Capacitive load driving capability is enhanced by using apull up resistor to V+Figure3.Typically a pull up resistorconducting500µA or more will significantly improve capaci-tive load responses.The value of the pull up resistor must bedetermined based on the current sinking capability of theamplifier with respect to the desired output swing.Open loopgain of the amplifier can also be affected by the pull upresistor(see Electrical Characteristics).PRINTED-CIRCUIT-BOARD LAYOUTFOR HIGH-IMPEDANCE WORKIt is generally recognized that any circuit which must operatewith less than1000pA of leakage current requires speciallayout of the PC board.When one wishes to take advantageof the ultra-low bias current of the LMC6082,typically lessthan10fA,it is essential to have an excellent layout.Fortu-nately,the techniques of obtaining low leakages are quitesimple.First,the user must not ignore the surface leakage ofthe PC board,even though it may sometimes appear accept-ably low,because under conditions of high humidity or dustor contamination,the surface leakage will be appreciable.To minimize the effect of any surface leakage,lay out a ringof foil completely surrounding the LMC6082’s inputs and theterminals of capacitors,diodes,conductors,resistors,relayterminals,etc.connected to the op-amp’s inputs,as in Fig-ure4.To have a significant effect,guard rings should beplaced on both the top and bottom of the PC board.This PCfoil must then be connected to a voltage which is at the samevoltage as the amplifier inputs,since no leakage current canflow between two points at the same potential.For example,a PC board trace-to-pad resistance of1012Ω,which is nor-mally considered a very large resistance,could leak5pA ifthe trace were a5V bus adjacent to the pad of the input.Thiswould cause a100times degradation from the LMC6082’sactual performance.However,if a guard ring is held within5mV of the inputs,then even a resistance of1011Ωwouldcause only0.05pA of leakage current.See Figure5fortypical connections of guard rings for standard op-amp con-figurations.01129704FIGURE1.Cancelling the Effect of Input Capacitance01129705FIGURE2.LMC6082Noninverting Gain of10Amplifier,Compensated to Handle Capacitive Loads01129714pensating for Large Capacitive Loadswith a Pull Up ResistorLMC60829Applications Hints(Continued)The designer should be aware that when it is inappropriate to lay out a PC board for the sake of just a few circuits,thereis another technique which is even better than a guard ring on a PC board:Don’t insert the amplifier’s input pin into the board at all,but bend it up in the air and use only air as an insulator.Air is an excellent insulator.In this case you may have to forego some of the advantages of PC board con-struction,but the advantages are sometimes well worth the effort of using point-to-point up-in-the-air wiring.See Figure 6.LatchupCMOS devices tend to be susceptible to latchup due to their internal parasitic SCR effects.The (I/O)input and output pins look similar to the gate of the SCR.There is a minimum current required to trigger the SCR gate lead.The LMC6062and LMC6082are designed to withstand 100mA surge current on the I/O pins.Some resistive method should be used to isolate any capacitance from supplying excess cur-rent to the I/O pins.In addition,like an SCR,there is a minimum holding current for any latchup mode.Limiting current to the supply pins will also inhibit latchup suscepti-bility.Typical Single-Supply Applications(V +=5.0V DC )The extremely high input impedance,and low power con-sumption,of the LMC6082make it ideal for applications that require battery-powered instrumentation amplifiers.Ex-amples of these types of applications are hand-held pH probes,analytic medical instruments,magnetic field detec-tors,gas detectors,and silicon based pressure transducers.Figure 7shows an instrumentation amplifier that features high differential and common mode input resistance (>1014Ω),0.01%gain accuracy at A V =1000,excellent CMRR with 1k Ωimbalance in bridge source resistance.Input current is less than 100fA and offset drift is less than 2.5µV/˚C.R 2provides a simple means of adjusting gain over a wide range without degrading CMRR.R 7is an initial trim used to maximize CMRR without using super precision matched resistors.For good CMRR over temperature,low drift resistors should be used.01129706FIGURE 4.Example of Guard Ring in P .C.BoardLayout01129707Inverting Amplifier01129708Non-Inverting Amplifier01129709FollowerFIGURE 5.Typical Connections of Guard Rings 01129710(Input pins are lifted out of PC board and soldered directly to components.All other pins connected to PC board).FIGURE 6.Air WiringL M C 6082 10Typical Single-Supply Applications(Continued)Typical Single-Supply Applications(V +=5.0V DC )01129711If R 1=R 5,R 3=R 6,and R 4=R 7;then∴A V ≈100for circuit shown (R 2=9.822k).FIGURE 7.Instrumentation Amplifier01129712FIGURE 8.Low-Leakage Sample and HoldLMC608211Typical Single-Supply Applications (V +=5.0V DC )(Continued)Ordering InformationPackageTemperature Range NSC DrawingTransport MediaMilitary Industrial −55˚C to +125˚C−40˚C to +85˚C 8-Pin LMC6082AIN N08ERailMolded DIP LMC6082IN 8-Pin LMC6082AIM,LMC6082AIMX,M08ARail Small OutlineLMC6082IM,LMC6082IMXTape and ReelFor MIL-STD-883C qualified products,please contact your local National Semiconductor Sales Office or Distributor for availability and specification information.01129713FIGURE 9.1Hz Square Wave OscillatorL M C 6082 12Physical Dimensionsinches (millimeters)unless otherwise noted8-Pin Small Outline PackageOrder Number LMC6082AIM,LMC6082AIMX,LMC6082IM or LMC6082IMXNS Package Number M08A8-Pin Molded Dual-In-Line Package Order Number LMC6082AIN or LMC6082INNS Package Number N08ELMC608213NotesNational does not assume any responsibility for use of any circuitry described,no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.For the most current product information visit us at .LIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION.As used herein:1.Life support devices or systems are devices or systems which,(a)are intended for surgical implant into the body,or (b)support or sustain life,and whose failure to perform when properly used in accordance with instructions for use provided in the labeling,can be reasonably expected to result in a significant injury to the user.2.A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system,or to affect its safety or effectiveness.BANNED SUBSTANCE COMPLIANCENational Semiconductor certifies that the products and 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2SC5632资料
Marking Symbol: 2R
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter Collector-base voltage (Emitter open) Emitter-base cutoff current (Collector open) Forward current transfer ratio hFE ratio * Collector-emitter saturation voltage Transition frequency Collector output capacitance (Common base, input open circuited) Symbol VCBO IEBO hFE ∆hFE VCE(sat) fT Cob Conditions IC = 100 µA, IE = 0 VEB = 2 V, IC = 0 VCE = 4 V, IC = 2 mA hFE2: VCE = 4 V, IC = 100 µA hFE1: VCE = 4 V, IC = 2 mA IC = 20 mA, IB = 4 mA VCE = 5 V, IC = 15 mA, f = 200 MHz VCB = 10 V, IE = 0, f = 1 MHz 0.6 1.1 1.0 1.6 0.1 V GHz pF 100 0.6 Min 15 2 350 1.5 Typ Max Unit V µA
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: ∆hFE = hFE2 / hFE1
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No. A0279-1/7
Applications • High-speed switching applications (switching regulator, driver circuit)
Features
• Adoption of MBIT process
•
Large current capacitance • Low collector-to-emitter saturation voltage • High-speed switching
Speci fi cations
Absolute Maximum Ratings
at Ta=25°C
Parameter
Symbol Conditions
Ratings
Unit Collector-to-Base Voltage V CBO
60V Collector-to-Emitter Voltage V CES 60V V CEO 50V Emitter-to-Base Voltage V EBO 6V Collector Current I C 15A Collector Current (Pulse)I CP PW ≤10μs, duty cycle ≤1%
20A Base Current I B 3A Collector Dissipation P C 2
W Tc=25°C
23W Junction Temperature Tj 150
°C Storage Temperature
Tstg
--55 to +150
°C
Package Dimensions
unit : mm (typ)7529-002
60612 TKIM/12512 TKIM TC-00002709/72606/31506FA MSIM TB-000020892SC6082
NPN Epitaxial Planar Silicon Transistor
50V / 15A High-Speed Switching Applications
Product & Package Information
• Package : TO-220F-3SG • JEITA, JEDEC : SC-67• Minimum Packing Quantity : 50 pcs./magazine
Marking
Electrical Connection
C6082
LOT No.
Electrical Characteristics
at Ta=25°C
Parameter
Symbol Conditions
Ratings
Unit min
typ
max
Collector Cutoff Current I CBO V CB =40V , I E =0A 10μA Emitter Cutoff Current I EBO V EB =4V , I C =0A 10μA
DC Current Gain h FE 1V CE =2V , I C =330mA 200560
h FE 2V CE =2V , I C =10A 50
Gain-Bandwidth Product f T V CE =10V , I C
=2A
195MHz Output Capacitance
Cob V CB =10V , f=1MHz 85pF Collector-to-Emitter Saturation Voltage V CE (sat)I C =7.5A, I B =375mA 200
400mV Base-to-Emitter Saturation Voltage V BE (sat)I C =7.5A, I B =375mA 1.2
V Collector-to-Base Breakdown Voltage V (BR)CBO I C =100μA, I E =0A 60V Collector-to-Emitter Breakdown Voltage V (BR)CES I C =100μA, R BE =0Ω60V V (BR)CEO I C =1mA, R BE =∞50V Emitter-to-Base Breakdown Voltage V (BR)EBO I E =100μA, I C =0A 6
V Turn-On Time t on See speci fi ed Test Circuit
52ns Storage Time t stg 560ns Fall Time
t f
37
ns
Switching Time Test Circuit
Ordering Information
Device
Package Shipping
memo
2SC6082-1E
TO-220F-3SG
50pcs./magazine Pb Free
CC I C =20I B1= --20I B2=5A
PW=20μs
D.C.≤1%
Collector-to-Emitter V oltage, V CE -- V
C o l l e c t o r C u r r e n t , I C -- A
Collector-to-Emitter V oltage, V CE -- V
C o l l e c t o r C u r r e n t , I C -- A
IT10574
IT10575
1001000
100.01
0.1
1.0
10
0.01
0.1
1.0
101001000
101001000
101001000
10Collector Current, I C -- A
D C C u r r e n t G a i n , h F E
Collector Current, I C
-- A
D C C u r r e n t G a i n , h F E
Base-to-Emitter V oltage, V BE -- V
C o l l e c t o r C u r r e n t , I C -- A
Collector-to-Base V oltage, V CB -- V
O u t p u t C a p a c i t a n c e , C o b -- p F
Collector Current, I C -- A
C o l l e c t o r -t o -E m i t t e r S a t u r a t i o n V o l t a g e , V C E (s a t ) -- V
G a i n -B a n d w i d t h P r o d u c t , f T -- M H z
Collector Current, I C -- A
IT10576
IT10577
IT10578
IT10581
IT10580
0.10.01IT10579
C o l l e c t o r -t o -E m i t t e r S a t u r a t i o n V o l t a g e , V C E (s a t ) -- V
Collector Current, I C -- A
Collector Current, I C -- A
B a s e -t o -E m i t t e r S a t u r a t i o n V o l t a g e , V B E (s a t ) -- V
IT10582
3
2
1.02
375
IT10583
0.10.01
Collector-to-Emitter V oltage, V CE -- V
C o l l e c t o r C u r r e n t , I C -- A
Ambient Temperature, Ta -- °C
C o l l e c t o r
D i s s i p a t i o n , P C -- W
Case Temperature, Tc -- °C
C o l l e c t o r
D i s s i p a t i o n , P C -- W
IT16711
0.01
0.11.010100IT16709
IT16710
Magazine Specifi cation 2SC6082-1E
Outline Drawing
2SC6082-1E
Mass (g)Unit
1.8
mm
* For reference
This catalog provides information as of June, 2012. Specifi cations and information herein are subject to change without notice.
分销商库存信息: ONSEMI
2SC6082。