Multiple Eigenspaces for Hardware Accelerated Image Based Rendering
NVIDIA Jetson AGX Orin系列产品数据手册说明书
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P3701 | NVIDIA JETSON AGX ORIN SERIESDATASHEETDiscover the most powerful AI computer for energy-efficient autonomous machines.NVIDIA ® Jetson AGX Orin ™ series modules deliver up to 275 TOPS of AI performance with power configurable between 15W and 60W. This gives you more than 8X theperformance of Jetson AGX Xavier ™ in the same compact form-factor for robotics and other autonomous machine use cases.These system-on-modules support multiple concurrent AI application pipelines with an NVIDIA Ampere architecture GPU, next-generation deep learning and visionaccelerators, high-speed IO, and fast memory bandwidth. Now, you can develop solutions using your largest and most complex AI models to solve problems such as natural language understanding, 3D perception, and multi-sensor fusion.Jetson runs the NVIDIA AI software stack, and use case-specific application frameworks are available, including NVIDIA Isaac ™ for robotics, DeepStream for vision AI, and Riva for conversational AI. You can also save significant time with NVIDIA Omniverse ™ Replicator for synthetic data generation (SDG), and with NVIDIA TAO Toolkit for fine-tuning pretrained AI models from the NGC ™ catalog.Jetson ecosystem partners offer additional AI and system software, developer tools, and custom software development. They can also help with cameras and other sensors, as well as carrier boards and design services for your product.Jetson Orin modules are unmatched in performance and efficiency for robots and other autonomous machines, and they give you the flexibility to create the next generation of AI solutions with the latest NVIDIA GPU technology. Together with the world-standard NVIDIA AI software stack and an ecosystem of services and products, your road to market has never been faster.Jetson AGX Orin 32GB>1792-core NVIDIA Ampere architecture GPU with 56 tensor cores >2x NVDLA v2.0>8-core Arm® Cortex®-A78AE v8.2 64-bit CPU>32GB 256-bit LPDDR5 >64GB eMMC 5.1 >PVA v2.0Power>Voltage input 5V, 7V-20V >Module Power: 15W - 40WKey FeaturesJetson AGX Orin 64GB>2048-core NVIDIA Ampere architecture GPU with 64 tensor cores >2x NVDLA v2.0>12-core Arm® Cortex®-A78AE v8.2 64-bit CPU>64GB 256-bit LPDDR5 >64GB eMMC 5.1 >PVA v2.0Power>Voltage input 5V, 7V-20V >Module Power: 15W - 60WNVIDIA JETSON AGX ORIN SERIES MODULES TECHNICAL SPECIFICATIONS* Virtual channel-related camera information for Jetson AGX Orin is not final and subject to change.Refer to the Software Features section of the latest NVIDIA Jetson Linux Developer Guide for a list of supportedfeatures.。
NuMicro N9H30系列开发板用户手册说明书
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NuMicro®FamilyArm® ARM926EJ-S BasedNuMaker-HMI-N9H30User ManualEvaluation Board for NuMicro® N9H30 SeriesNUMAKER-HMI-N9H30 USER MANUALThe information described in this document is the exclusive intellectual property ofNuvoton Technology Corporation and shall not be reproduced without permission from Nuvoton.Nuvoton is providing this document only for reference purposes of NuMicro microcontroller andmicroprocessor based system design. Nuvoton assumes no responsibility for errors or omissions.All data and specifications are subject to change without notice.For additional information or questions, please contact: Nuvoton Technology Corporation.Table of Contents1OVERVIEW (5)1.1Features (7)1.1.1NuMaker-N9H30 Main Board Features (7)1.1.2NuDesign-TFT-LCD7 Extension Board Features (7)1.2Supporting Resources (8)2NUMAKER-HMI-N9H30 HARDWARE CONFIGURATION (9)2.1NuMaker-N9H30 Board - Front View (9)2.2NuMaker-N9H30 Board - Rear View (14)2.3NuDesign-TFT-LCD7 - Front View (20)2.4NuDesign-TFT-LCD7 - Rear View (21)2.5NuMaker-N9H30 and NuDesign-TFT-LCD7 PCB Placement (22)3NUMAKER-N9H30 AND NUDESIGN-TFT-LCD7 SCHEMATICS (24)3.1NuMaker-N9H30 - GPIO List Circuit (24)3.2NuMaker-N9H30 - System Block Circuit (25)3.3NuMaker-N9H30 - Power Circuit (26)3.4NuMaker-N9H30 - N9H30F61IEC Circuit (27)3.5NuMaker-N9H30 - Setting, ICE, RS-232_0, Key Circuit (28)NUMAKER-HMI-N9H30 USER MANUAL3.6NuMaker-N9H30 - Memory Circuit (29)3.7NuMaker-N9H30 - I2S, I2C_0, RS-485_6 Circuit (30)3.8NuMaker-N9H30 - RS-232_2 Circuit (31)3.9NuMaker-N9H30 - LCD Circuit (32)3.10NuMaker-N9H30 - CMOS Sensor, I2C_1, CAN_0 Circuit (33)3.11NuMaker-N9H30 - RMII_0_PF Circuit (34)3.12NuMaker-N9H30 - RMII_1_PE Circuit (35)3.13NuMaker-N9H30 - USB Circuit (36)3.14NuDesign-TFT-LCD7 - TFT-LCD7 Circuit (37)4REVISION HISTORY (38)List of FiguresFigure 1-1 Front View of NuMaker-HMI-N9H30 Evaluation Board (5)Figure 1-2 Rear View of NuMaker-HMI-N9H30 Evaluation Board (6)Figure 2-1 Front View of NuMaker-N9H30 Board (9)Figure 2-2 Rear View of NuMaker-N9H30 Board (14)Figure 2-3 Front View of NuDesign-TFT-LCD7 Board (20)Figure 2-4 Rear View of NuDesign-TFT-LCD7 Board (21)Figure 2-5 Front View of NuMaker-N9H30 PCB Placement (22)Figure 2-6 Rear View of NuMaker-N9H30 PCB Placement (22)Figure 2-7 Front View of NuDesign-TFT-LCD7 PCB Placement (23)Figure 2-8 Rear View of NuDesign-TFT-LCD7 PCB Placement (23)Figure 3-1 GPIO List Circuit (24)Figure 3-2 System Block Circuit (25)Figure 3-3 Power Circuit (26)Figure 3-4 N9H30F61IEC Circuit (27)Figure 3-5 Setting, ICE, RS-232_0, Key Circuit (28)Figure 3-6 Memory Circuit (29)Figure 3-7 I2S, I2C_0, RS-486_6 Circuit (30)Figure 3-8 RS-232_2 Circuit (31)Figure 3-9 LCD Circuit (32)NUMAKER-HMI-N9H30 USER MANUAL Figure 3-10 CMOS Sensor, I2C_1, CAN_0 Circuit (33)Figure 3-11 RMII_0_PF Circuit (34)Figure 3-12 RMII_1_PE Circuit (35)Figure 3-13 USB Circuit (36)Figure 3-14 TFT-LCD7 Circuit (37)List of TablesTable 2-1 LCD Panel Combination Connector (CON8) Pin Function (11)Table 2-2 Three Sets of Indication LED Functions (12)Table 2-3 Six Sets of User SW, Key Matrix Functions (12)Table 2-4 CMOS Sensor Connector (CON10) Function (13)Table 2-5 JTAG ICE Interface (J2) Function (14)Table 2-6 Expand Port (CON7) Function (16)Table 2-7 UART0 (J3) Function (16)Table 2-8 UART2 (J6) Function (16)Table 2-9 RS-485_6 (SW6~8) Function (17)Table 2-10 Power on Setting (SW4) Function (17)Table 2-11 Power on Setting (S2) Function (17)Table 2-12 Power on Setting (S3) Function (17)Table 2-13 Power on Setting (S4) Function (17)Table 2-14 Power on Setting (S5) Function (17)Table 2-15 Power on Setting (S7/S6) Function (18)Table 2-16 Power on Setting (S9/S8) Function (18)Table 2-17 CMOS Sensor Connector (CON9) Function (19)Table 2-18 CAN_0 (SW9~10) Function (19)NUMAKER-HMI-N9H30 USER MANUAL1 OVERVIEWThe NuMaker-HMI-N9H30 is an evaluation board for GUI application development. The NuMaker-HMI-N9H30 consists of two parts: a NuMaker-N9H30 main board and a NuDesign-TFT-LCD7 extensionboard. The NuMaker-HMI-N9H30 is designed for project evaluation, prototype development andvalidation with HMI (Human Machine Interface) function.The NuMaker-HMI-N9H30 integrates touchscreen display, voice input/output, rich serial port serviceand I/O interface, providing multiple external storage methods.The NuDesign-TFT-LCD7 can be plugged into the main board via the DIN_32x2 extension connector.The NuDesign-TFT-LCD7 includes one 7” LCD which the resolution is 800x480 with RGB-24bits andembedded the 4-wires resistive type touch panel.Figure 1-1 Front View of NuMaker-HMI-N9H30 Evaluation BoardNUMAKER-HMI-N9H30 USER MANUAL Figure 1-2 Rear View of NuMaker-HMI-N9H30 Evaluation Board1.1 Features1.1.1 NuMaker-N9H30 Main Board Features●N9H30F61IEC chip: LQFP216 pin MCP package with DDR (64 MB)●SPI Flash using W25Q256JVEQ (32 MB) booting with quad mode or storage memory●NAND Flash using W29N01HVSINA (128 MB) booting or storage memory●One Micro-SD/TF card slot served either as a SD memory card for data storage or SDIO(Wi-Fi) device●Two sets of COM ports:–One DB9 RS-232 port with UART_0 used 75C3232E transceiver chip can be servedfor function debug and system development.–One DB9 RS-232 port with UART_2 used 75C3232E transceiver chip for userapplication●22 GPIO expansion ports, including seven sets of UART functions●JTAG interface provided for software development●Microphone input and Earphone/Speaker output with 24-bit stereo audio codec(NAU88C22) for I2S interfaces●Six sets of user-configurable push button keys●Three sets of LEDs for status indication●Provides SN65HVD230 transceiver chip for CAN bus communication●Provides MAX3485 transceiver chip for RS-485 device connection●One buzzer device for program applicationNUMAKER-HMI-N9H30 USER MANUAL●Two sets of RJ45 ports with Ethernet 10/100 Mbps MAC used IP101GR PHY chip●USB_0 that can be used as Device/HOST and USB_1 that can be used as HOSTsupports pen drives, keyboards, mouse and printers●Provides over-voltage and over current protection used APL3211A chip●Retain RTC battery socket for CR2032 type and ADC0 detect battery voltage●System power could be supplied by DC-5V adaptor or USB VBUS1.1.2 NuDesign-TFT-LCD7 Extension Board Features●7” resolution 800x480 4-wire resistive touch panel for 24-bits RGB888 interface●DIN_32x2 extension connector1.2 Supporting ResourcesFor sample codes and introduction about NuMaker-N9H30, please refer to N9H30 BSP:https:///products/gui-solution/gui-platform/numaker-hmi-n9h30/?group=Software&tab=2Visit NuForum for further discussion about the NuMaker-HMI-N9H30:/viewforum.php?f=31 NUMAKER-HMI-N9H30 USER MANUALNUMAKER-HMI-N9H30 USER MANUAL2 NUMAKER-HMI-N9H30 HARDWARE CONFIGURATION2.1 NuMaker-N9H30 Board - Front View Combination Connector (CON8)6 set User SWs (K1~6)3set Indication LEDs (LED1~3)Power Supply Switch (SW_POWER1)Audio Codec(U10)Microphone(M1)NAND Flash(U9)RS-232 Transceiver(U6, U12)RS-485 Transceiver(U11)CAN Transceiver (U13)Figure 2-1 Front View of NuMaker-N9H30 BoardFigure 2-1 shows the main components and connectors from the front side of NuMaker-N9H30 board. The following lists components and connectors from the front view:NuMaker-N9H30 board and NuDesign-TFT-LCD7 board combination connector (CON8). This panel connector supports 4-/5-wire resistive touch or capacitance touch panel for 24-bits RGB888 interface.Connector GPIO pin of N9H30 FunctionCON8.1 - Power 3.3VCON8.2 - Power 3.3VCON8.3 GPD7 LCD_CSCON8.4 GPH3 LCD_BLENCON8.5 GPG9 LCD_DENCON8.7 GPG7 LCD_HSYNCCON8.8 GPG6 LCD_CLKCON8.9 GPD15 LCD_D23(R7)CON8.10 GPD14 LCD_D22(R6)CON8.11 GPD13 LCD_D21(R5)CON8.12 GPD12 LCD_D20(R4)CON8.13 GPD11 LCD_D19(R3)CON8.14 GPD10 LCD_D18(R2)CON8.15 GPD9 LCD_D17(R1)CON8.16 GPD8 LCD_D16(R0)CON8.17 GPA15 LCD_D15(G7)CON8.18 GPA14 LCD_D14(G6)CON8.19 GPA13 LCD_D13(G5)CON8.20 GPA12 LCD_D12(G4)CON8.21 GPA11 LCD_D11(G3)CON8.22 GPA10 LCD_D10(G2)CON8.23 GPA9 LCD_D9(G1) NUMAKER-HMI-N9H30 USER MANUALCON8.24 GPA8 LCD_D8(G0)CON8.25 GPA7 LCD_D7(B7)CON8.26 GPA6 LCD_D6(B6)CON8.27 GPA5 LCD_D5(B5)CON8.28 GPA4 LCD_D4(B4)CON8.29 GPA3 LCD_D3(B3)CON8.30 GPA2 LCD_D2(B2)CON8.31 GPA1 LCD_D1(B1)CON8.32 GPA0 LCD_D0(B0)CON8.33 - -CON8.34 - -CON8.35 - -CON8.36 - -CON8.37 GPB2 LCD_PWMCON8.39 - VSSCON8.40 - VSSCON8.41 ADC7 XPCON8.42 ADC3 VsenCON8.43 ADC6 XMCON8.44 ADC4 YMCON8.45 - -CON8.46 ADC5 YPCON8.47 - VSSCON8.48 - VSSCON8.49 GPG0 I2C0_CCON8.50 GPG1 I2C0_DCON8.51 GPG5 TOUCH_INTCON8.52 - -CON8.53 - -CON8.54 - -CON8.55 - -NUMAKER-HMI-N9H30 USER MANUAL CON8.56 - -CON8.57 - -CON8.58 - -CON8.59 - VSSCON8.60 - VSSCON8.61 - -CON8.62 - -CON8.63 - Power 5VCON8.64 - Power 5VTable 2-1 LCD Panel Combination Connector (CON8) Pin Function●Power supply switch (SW_POWER1): System will be powered on if the SW_POWER1button is pressed●Three sets of indication LEDs:LED Color DescriptionsLED1 Red The system power will beterminated and LED1 lightingwhen the input voltage exceeds5.7V or the current exceeds 2A.LED2 Green Power normal state.LED3 Green Controlled by GPH2 pin Table 2-2 Three Sets of Indication LED Functions●Six sets of user SW, Key Matrix for user definitionKey GPIO pin of N9H30 FunctionK1 GPF10 Row0 GPB4 Col0K2 GPF10 Row0 GPB5 Col1K3 GPE15 Row1 GPB4 Col0K4 GPE15 Row1 GPB5 Col1K5 GPE14 Row2 GPB4 Col0K6GPE14 Row2GPB5 Col1 Table 2-3 Six Sets of User SW, Key Matrix Functions●NAND Flash (128 MB) with Winbond W29N01HVS1NA (U9)●Microphone (M1): Through Nuvoton NAU88C22 chip sound input●Audio CODEC chip (U10): Nuvoton NAU88C22 chip connected to N9H30 using I2Sinterface–SW6/SW7/SW8: 1-2 short for RS-485_6 function and connected to 2P terminal (CON5and J5)–SW6/SW7/SW8: 2-3 short for I2S function and connected to NAU88C22 (U10).●CMOS Sensor connector (CON10, SW9~10)–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11)–SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensorconnector (CON10)Connector GPIO pin of N9H30 FunctionCON10.1 - VSSCON10.2 - VSSNUMAKER-HMI-N9H30 USER MANUALCON10.3 - Power 3.3VCON10.4 - Power 3.3VCON10.5 - -CON10.6 - -CON10.7 GPI4 S_PCLKCON10.8 GPI3 S_CLKCON10.9 GPI8 S_D0CON10.10 GPI9 S_D1CON10.11 GPI10 S_D2CON10.12 GPI11 S_D3CON10.13 GPI12 S_D4CON10.14 GPI13 S_D5CON10.15 GPI14 S_D6CON10.16 GPI15 S_D7CON10.17 GPI6 S_VSYNCCON10.18 GPI5 S_HSYNCCON10.19 GPI0 S_PWDNNUMAKER-HMI-N9H30 USER MANUAL CON10.20 GPI7 S_nRSTCON10.21 GPG2 I2C1_CCON10.22 GPG3 I2C1_DCON10.23 - VSSCON10.24 - VSSTable 2-4 CMOS Sensor Connector (CON10) FunctionNUMAKER-HMI-N9H30 USER MANUAL2.2NuMaker-N9H30 Board - Rear View5V In (CON1)RS-232 DB9 (CON2,CON6)Expand Port (CON7)Speaker Output (J4)Earphone Output (CON4)Buzzer (BZ1)System ResetSW (SW5)SPI Flash (U7,U8)JTAG ICE (J2)Power ProtectionIC (U1)N9H30F61IEC (U5)Micro SD Slot (CON3)RJ45 (CON12, CON13)USB1 HOST (CON15)USB0 Device/Host (CON14)CAN_0 Terminal (CON11)CMOS Sensor Connector (CON9)Power On Setting(SW4, S2~S9)RS-485_6 Terminal (CON5)RTC Battery(BT1)RMII PHY (U14,U16)Figure 2-2 Rear View of NuMaker-N9H30 BoardFigure 2-2 shows the main components and connectors from the rear side of NuMaker-N9H30 board. The following lists components and connectors from the rear view:● +5V In (CON1): Power adaptor 5V input ●JTAG ICE interface (J2) ConnectorGPIO pin of N9H30Function J2.1 - Power 3.3V J2.2 GPJ4 nTRST J2.3 GPJ2 TDI J2.4 GPJ1 TMS J2.5 GPJ0 TCK J2.6 - VSS J2.7 GPJ3 TD0 J2.8-RESETTable 2-5 JTAG ICE Interface (J2) Function●SPI Flash (32 MB) with Winbond W25Q256JVEQ (U7); only one (U7 or U8) SPI Flashcan be used●System Reset (SW5): System will be reset if the SW5 button is pressed●Buzzer (BZ1): Control by GPB3 pin of N9H30●Speaker output (J4): Through the NAU88C22 chip sound output●Earphone output (CON4): Through the NAU88C22 chip sound output●Expand port for user use (CON7):Connector GPIO pin of N9H30 FunctionCON7.1 - Power 3.3VCON7.2 - Power 3.3VCON7.3 GPE12 UART3_TXDCON7.4 GPH4 UART1_TXDCON7.5 GPE13 UART3_RXDCON7.6 GPH5 UART1_RXDCON7.7 GPB0 UART5_TXDCON7.8 GPH6 UART1_RTSCON7.9 GPB1 UART5_RXDCON7.10 GPH7 UART1_CTSCON7.11 GPI1 UART7_TXDNUMAKER-HMI-N9H30 USER MANUAL CON7.12 GPH8 UART4_TXDCON7.13 GPI2 UART7_RXDCON7.14 GPH9 UART4_RXDCON7.15 - -CON7.16 GPH10 UART4_RTSCON7.17 - -CON7.18 GPH11 UART4_CTSCON7.19 - VSSCON7.20 - VSSCON7.21 GPB12 UART10_TXDCON7.22 GPH12 UART8_TXDCON7.23 GPB13 UART10_RXDCON7.24 GPH13 UART8_RXDCON7.25 GPB14 UART10_RTSCON7.26 GPH14 UART8_RTSCON7.27 GPB15 UART10_CTSCON7.28 GPH15 UART8_CTSCON7.29 - Power 5VCON7.30 - Power 5VTable 2-6 Expand Port (CON7) Function●UART0 selection (CON2, J3):–RS-232_0 function and connected to DB9 female (CON2) for debug message output.–GPE0/GPE1 connected to 2P terminal (J3).Connector GPIO pin of N9H30 Function J3.1 GPE1 UART0_RXDJ3.2 GPE0 UART0_TXDTable 2-7 UART0 (J3) Function●UART2 selection (CON6, J6):–RS-232_2 function and connected to DB9 female (CON6) for debug message output –GPF11~14 connected to 4P terminal (J6)Connector GPIO pin of N9H30 Function J6.1 GPF11 UART2_TXDJ6.2 GPF12 UART2_RXDJ6.3 GPF13 UART2_RTSJ6.4 GPF14 UART2_CTSTable 2-8 UART2 (J6) Function●RS-485_6 selection (CON5, J5, SW6~8):–SW6~8: 1-2 short for RS-485_6 function and connected to 2P terminal (CON5 and J5) –SW6~8: 2-3 short for I2S function and connected to NAU88C22 (U10)Connector GPIO pin of N9H30 FunctionSW6:1-2 shortGPG11 RS-485_6_DISW6:2-3 short I2S_DOSW7:1-2 shortGPG12 RS-485_6_ROSW7:2-3 short I2S_DISW8:1-2 shortGPG13 RS-485_6_ENBSW8:2-3 short I2S_BCLKNUMAKER-HMI-N9H30 USER MANUALTable 2-9 RS-485_6 (SW6~8) FunctionPower on setting (SW4, S2~9).SW State FunctionSW4.2/SW4.1 ON/ON Boot from USB SW4.2/SW4.1 ON/OFF Boot from eMMC SW4.2/SW4.1 OFF/ON Boot from NAND Flash SW4.2/SW4.1 OFF/OFF Boot from SPI Flash Table 2-10 Power on Setting (SW4) FunctionSW State FunctionS2 Short System clock from 12MHzcrystalS2 Open System clock from UPLL output Table 2-11 Power on Setting (S2) FunctionSW State FunctionS3 Short Watchdog Timer OFFS3 Open Watchdog Timer ON Table 2-12 Power on Setting (S3) FunctionSW State FunctionS4 Short GPJ[4:0] used as GPIO pinS4Open GPJ[4:0] used as JTAG ICEinterfaceTable 2-13 Power on Setting (S4) FunctionSW State FunctionS5 Short UART0 debug message ONS5 Open UART0 debug message OFFTable 2-14 Power on Setting (S5) FunctionSW State FunctionS7/S6 Short/Short NAND Flash page size 2KBS7/S6 Short/Open NAND Flash page size 4KBS7/S6 Open/Short NAND Flash page size 8KBNUMAKER-HMI-N9H30 USER MANUALS7/S6 Open/Open IgnoreTable 2-15 Power on Setting (S7/S6) FunctionSW State FunctionS9/S8 Short/Short NAND Flash ECC type BCH T12S9/S8 Short/Open NAND Flash ECC type BCH T15S9/S8 Open/Short NAND Flash ECC type BCH T24S9/S8 Open/Open IgnoreTable 2-16 Power on Setting (S9/S8) FunctionCMOS Sensor connector (CON9, SW9~10)–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11).–SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensorconnector (CON9).Connector GPIO pin of N9H30 FunctionCON9.1 - VSSCON9.2 - VSSCON9.3 - Power 3.3VCON9.4 - Power 3.3V NUMAKER-HMI-N9H30 USER MANUALCON9.5 - -CON9.6 - -CON9.7 GPI4 S_PCLKCON9.8 GPI3 S_CLKCON9.9 GPI8 S_D0CON9.10 GPI9 S_D1CON9.11 GPI10 S_D2CON9.12 GPI11 S_D3CON9.13 GPI12 S_D4CON9.14 GPI13 S_D5CON9.15 GPI14 S_D6CON9.16 GPI15 S_D7CON9.17 GPI6 S_VSYNCCON9.18 GPI5 S_HSYNCCON9.19 GPI0 S_PWDNCON9.20 GPI7 S_nRSTCON9.21 GPG2 I2C1_CCON9.22 GPG3 I2C1_DCON9.23 - VSSCON9.24 - VSSTable 2-17 CMOS Sensor Connector (CON9) Function●CAN_0 Selection (CON11, SW9~10):–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11) –SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensor connector (CON9, CON10)SW GPIO pin of N9H30 FunctionSW9:1-2 shortGPI3 CAN_0_RXDSW9:2-3 short S_CLKSW10:1-2 shortGPI4 CAN_0_TXDSW10:2-3 short S_PCLKTable 2-18 CAN_0 (SW9~10) Function●USB0 Device/HOST Micro-AB connector (CON14), where CON14 pin4 ID=1 is Device,ID=0 is HOST●USB1 for USB HOST with Type-A connector (CON15)●RJ45_0 connector with LED indicator (CON12), RMII PHY with IP101GR (U14)●RJ45_1 connector with LED indicator (CON13), RMII PHY with IP101GR (U16)●Micro-SD/TF card slot (CON3)●SOC CPU: Nuvoton N9H30F61IEC (U5)●Battery power for RTC 3.3V powered (BT1, J1), can detect voltage by ADC0●RTC power has 3 sources:–Share with 3.3V I/O power–Battery socket for CR2032 (BT1)–External connector (J1)●Board version 2.1NUMAKER-HMI-N9H30 USER MANUAL2.3 NuDesign-TFT-LCD7 -Front ViewFigure 2-3 Front View of NuDesign-TFT-LCD7 BoardFigure 2-3 shows the main components and connectors from the Front side of NuDesign-TFT-LCD7board.7” resolution 800x480 4-W resistive touch panel for 24-bits RGB888 interface2.4 NuDesign-TFT-LCD7 -Rear ViewFigure 2-4 Rear View of NuDesign-TFT-LCD7 BoardFigure 2-4 shows the main components and connectors from the rear side of NuDesign-TFT-LCD7board.NuMaker-N9H30 and NuDesign-TFT-LCD7 combination connector (CON1).NUMAKER-HMI-N9H30 USER MANUAL 2.5 NuMaker-N9H30 and NuDesign-TFT-LCD7 PCB PlacementFigure 2-5 Front View of NuMaker-N9H30 PCB PlacementFigure 2-6 Rear View of NuMaker-N9H30 PCB PlacementNUMAKER-HMI-N9H30 USER MANUALFigure 2-7 Front View of NuDesign-TFT-LCD7 PCB PlacementFigure 2-8 Rear View of NuDesign-TFT-LCD7 PCB Placement3 NUMAKER-N9H30 AND NUDESIGN-TFT-LCD7 SCHEMATICS3.1 NuMaker-N9H30 - GPIO List CircuitFigure 3-1 shows the N9H30F61IEC GPIO list circuit.Figure 3-1 GPIO List Circuit NUMAKER-HMI-N9H30 USER MANUAL3.2 NuMaker-N9H30 - System Block CircuitFigure 3-2 shows the System Block Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-2 System Block Circuit3.3 NuMaker-N9H30 - Power CircuitFigure 3-3 shows the Power Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-3 Power Circuit3.4 NuMaker-N9H30 - N9H30F61IEC CircuitFigure 3-4 shows the N9H30F61IEC Circuit.Figure 3-4 N9H30F61IEC CircuitNUMAKER-HMI-N9H30 USER MANUAL3.5 NuMaker-N9H30 - Setting, ICE, RS-232_0, Key CircuitFigure 3-5 shows the Setting, ICE, RS-232_0, Key Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-5 Setting, ICE, RS-232_0, Key Circuit3.6 NuMaker-N9H30 - Memory CircuitFigure 3-6 shows the Memory Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-6 Memory Circuit3.7 NuMaker-N9H30 - I2S, I2C_0, RS-485_6 CircuitFigure 3-7 shows the I2S, I2C_0, RS-486_6 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-7 I2S, I2C_0, RS-486_6 Circuit3.8 NuMaker-N9H30 - RS-232_2 CircuitFigure 3-8 shows the RS-232_2 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-8 RS-232_2 Circuit3.9 NuMaker-N9H30 - LCD CircuitFigure 3-9 shows the LCD Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-9 LCD Circuit3.10 NuMaker-N9H30 - CMOS Sensor, I2C_1, CAN_0 CircuitFigure 3-10 shows the CMOS Sensor,I2C_1, CAN_0 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-10 CMOS Sensor, I2C_1, CAN_0 Circuit3.11 NuMaker-N9H30 - RMII_0_PF CircuitFigure 3-11 shows the RMII_0_RF Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-11 RMII_0_PF Circuit3.12 NuMaker-N9H30 - RMII_1_PE CircuitFigure 3-12 shows the RMII_1_PE Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-12 RMII_1_PE Circuit3.13 NuMaker-N9H30 - USB CircuitFigure 3-13 shows the USB Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-13 USB Circuit3.14 NuDesign-TFT-LCD7 - TFT-LCD7 CircuitFigure 3-14 shows the TFT-LCD7 Circuit.Figure 3-14 TFT-LCD7 CircuitNUMAKER-HMI-N9H30 USER MANUAL4 REVISION HISTORYDate Revision Description2022.03.24 1.00 Initial version NUMAKER-HMI-N9H30 USER MANUALNUMAKER-HMI-N9H30 USER MANUALImportant NoticeNuvoton Products are neither intended nor warranted for usage in systems or equipment, anymalfunction or failure of which may cause loss of human life, bodily injury or severe propertydamage. Such applications are deemed, “Insecure Usage”.Insecure usage includes, but is not limited to: equipment for surgical implementation, atomicenergy control instruments, airplane or spaceship instruments, the control or operation ofdynamic, brake or safety systems designed for vehicular use, traffic signal instruments, all typesof safety devices, and other applications intended to support or sustain life.All Insecure Usage shall be made at customer’s risk, and in the event that third parties lay claimsto Nuvoton as a result of customer’s Insecure Usage, custome r shall indemnify the damagesand liabilities thus incurred by Nuvoton.。
二维不规则零件排样问题的遗传算法求解
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原稿收到日期: 2001-04-17; 修改稿收到日期: 2001-08-24. 本课题得到四川省科学技术研 究项目( 00B038) 经费和四川大学 2002 年度青年 基金( G 02075) 资助. 贾志欣, 女, 1970 年生, 硕士, 讲师, 主要从事 C A D/ CA M 方面研究. 殷国富, 男, 1956 年生, 博士, 教授, 博士生导师, 主要从 事 CA D / C A M , CIM S 、工程专家系统等方面的研究. 罗 阳, 男, 1969 年生, 博士, 副教授, 主要从事 CA D / CA M 方面的研究.
5期
贾志欣等: 二维不规则零件排样问题的遗传算法求解
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2. 4 适应度函数
遗传算法对 一个解的好坏用适 应度函数评价, 适应度越 大, 解的质量越好. 对排样问题, 自然的想法是取 排样图的最 大高 度的倒数 . 但 若两个 排样图具 有相同 的高度, 适应 度值 相同, 仍 有好坏之 分. 如图 6 所 示, 从 余料再 利用的 角度 看, 图 6 b 优 于 图 6 a. 本 文 采 用 如下 的 适 应 度 函数: f ( P ) = A rea/ A r ea1, 其 中 A r ea 是排入矩 形件的总 面积, A r ea1 是排 样图高度轮廓线以下的板材面积. 这样, 适应度值 最高为 1.
由 于该方法 在排入 零件时 总是先 查询排 样图的 高度轮 廓线的最低水 平线, 故称 之为 “最 低水平 线法”. 显然, “最低 水平线法”同样满足 BL 条件. 对于图 1 所示的排样图写出其 对应的编码为 P = { - 1, 2, - 3, 4, - 5, 7, 6, 8} .
图 5 显示了“最低 水平 线法”与 “下 台阶”算法 排放 过程 中的差异.
报错解决——精选推荐
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报错解决V ASP⾃旋轨道耦合计算错误汇总静态计算时,报错:VERY BAD NEWS! Internal内部error in subroutine⼦程序IBZKPT:Reciprocal倒数的lattice and k-lattice belong to different class of lattices. Often results are still useful (48)INCAR参数设置:对策:根据所⽤集群,修改INCAR中NPAR。
将NPAR=4变成NPAR=1,已解决!错误:sub space matrix类错误报错:静态和能带计算中出现警告:W ARNING: Sub-Space-Matrix is not hermitian共轭in DA V结构优化出现错误:WARNING: Sub-Space-Matrix is not hermitian in DA V 4 -4.681828688433112E-002对策:通过将默认AMIX=0.4,修改成AMIX=0.2(或0.3),问题得以解决。
以下是类似的错误:WARNING: Sub-Space-Matrix is not hermitian in rmm -3.00000000000000RMM: 22 -0.167633596124E+02 -0.57393E+00 -0.44312E-01 1326 0.221E+00BRMIX:very serious problems the old and the new charge density differ old charge density: 28.00003 new 28.06093 0.111E+00错误:WARNING: Sub-Space-Matrix is not hermitian in rmm -42.5000000000000ERROR FEXCP: supplied Exchange-correletion table is too small, maximal index : 4794错误:结构优化Bi2Te3时,log⽂件:WARNING in EDDIAG: sub space matrix is not hermitian 1 -0.199E+01RMM: 200 0.179366581305E+01 -0.10588E-01 -0.14220E+00 718 0.261E-01BRMIX: very serious problems the old and the new charge density differ old charge density: 56.00230 new 124.70394 66 F= 0.17936658E+01 E0= 0.18295246E+01 d E =0.557217E-02curvature: 0.00 expect dE= 0.000E+00 dE for cont linesearch 0.000E+00ZBRENT: fatal error in bracketingplease rerun with smaller EDIFF, or copy CONTCAR to POSCAR and continue但是,将CONTCAR拷贝成POSCAR,接着算静态没有报错,这样算出来的结果有问题吗?对策1:⽤这个CONTCAR拷贝成POSCAR重新做⼀次结构优化,看是否达到优化精度!对策2:⽤这个CONTCAR拷贝成POSCAR,并且修改EDIFF(⽬前参数EDIFF=1E-6),默认为10-4错误:WARNING: Sub-Space-Matrix is not hermitian in DA V 1 -7.626640664998020E-003⽹上参考解决⽅案:对策1:减⼩POTIM: IBRION=0,标准分⼦动⼒学模拟。
IC芯片的电磁兼容性设计方案
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IC芯片的电磁兼容性设计方案2011-12-19 22:48:43| 分类:EMC/EMI | 标签:|字号大中小订阅IC芯片的电磁兼容性设计方案论述了芯片级电磁兼容性的设计方法。
最后给出了芯片级电磁兼容性研究中存在的问题及未来的研究重点1、分析和解决电磁兼容性的一般方法随着科学技术的发展,系统越来越复杂,使用的频谱越来越宽,根据电磁兼容性学科中多年的研究可知,分析和解决设备、子系统或系统间的电磁兼容性问题一般有3种方法,他们分别为问题解决法(ProlemSolvingApproach)、规范法(SpecificationApproach)和系统法(SystemsApproach)。
1.1问题解决法问题解决法主要指在建立系统前并不专门考虑电磁兼容性问题,待系统建成后再设法解决在调试过程中出现的电磁兼容性问题的方法。
系统内或系统间存在的干扰问题有三要素,即干扰源、接受器和干扰的传播路径。
因此用问题解决法解决系统内或系统间的电磁兼容性问题时,首先必须正确地确定干扰源。
为了做到这一点,从事电磁兼容性方面工作的工程师要比较全面地熟悉各种干扰源的特性。
在确定干扰源后再确定干扰的耦合路径是辐射耦合模式还是传导耦合模式,最终决定消除干扰的方法。
1.2规范法为了满足电磁兼容性的要求,各国政府和工业部门尤其是军方都制订了很多强制执行的标准和规范,例如美国军用标准MIL-STD-461.所谓规范法是指在采购系统的设备和设计建立子系统时必须满足已制订的规范。
规范法预期达到的效果就是:如果组成系统的每个部件都满足规范要求,则系统的电磁兼容性就能保证。
1.3系统法系统法集中了电磁兼容性方面的研究成果,从系统的设计阶段的最初就用分析程序来预测在系统中将要遇到的那些电磁干扰问题,以便在系统设计过程中作为基本问题来解决。
目前有下列几种已广泛使用的大规模电磁干扰分析程序:系统和电磁兼容性分析程序(SEMCAP);系统和电磁兼容性分析程序;干扰预测程序IPP-1;系统内部分析程序IAP;共场地分析模型程序COSAM等。
二阶锁相环的完整仿真代码-概述说明以及解释
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二阶锁相环的完整仿真代码-概述说明以及解释1.引言1.1 概述引言部分是文章开头的部分,用于引入文章的主题和背景。
在概述部分,可以介绍以下内容:概述:二阶锁相环是一种常见的控制系统,用于追踪和维持输入信号与参考信号之间的相位差。
它的应用十分广泛,包括通信系统、数字信号处理、测量仪器等领域。
通过对输入信号进行反馈和调节,在一定条件下可以实现对输入信号的同步跟踪和稳定控制。
本文将详细介绍二阶锁相环的原理和基本模块,并给出其完整的仿真代码。
通过仿真代码的模拟运行,我们可以更好地理解二阶锁相环的工作原理和特性。
文章结构:本文主要分为三个部分。
第一部分是引言部分,介绍了二阶锁相环的概述和本文的结构。
第二部分是正文部分,包括二阶锁相环的原理和基本模块的详细介绍。
第三部分是结论部分,对整篇文章进行总结并展望未来二阶锁相环的发展。
目的:本文的目的在于全面而系统地介绍二阶锁相环的原理和基本模块,并给出其完整的仿真代码。
通过本文的学习,读者可以深入了解二阶锁相环的工作原理,并且能够通过仿真代码进行实际的仿真运行,进一步加深理解。
同时,本文还对二阶锁相环的未来发展进行了展望,为读者提供了一定的参考和思考。
通过上述内容的介绍,读者可以对本文的内容和结构有一个初步的了解,为接下来的阅读打下基础。
接下来的章节将进一步详细介绍二阶锁相环的原理和基本模块,带领读者逐步深入了解这一重要的控制系统。
文章结构部分的内容如下所示:1.2 文章结构本文主要以二阶锁相环的完整仿真代码为主题,旨在介绍二阶锁相环的原理和基本模块,并通过编写完整的仿真代码实现其功能。
文章结构如下:1. 引言1.1 概述在这个部分,我们将简要介绍二阶锁相环的背景和应用领域。
我们将解释二阶锁相环的基本工作原理,并探讨它在通信和控制系统中的重要性。
1.2 文章结构在这个部分,我们将概述整篇文章的结构,并说明每个部分的内容和目的。
1.3 目的我们将解释选择这个主题的原因,并讨论本文的目标和预期结果。
IMS测厚仪合金补偿
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.Operating Instructions Alloy Editor.Operating Instructions - Alloy Editor200428\108622Manufacturer: IMS Messsysteme GmbH Dieselstra ße 55 42579 Heiligenhaus Tel.: +49 (0) 2056 / 975-0 Fax: +49 (0) 2056 / 975-140 E-Mail: info@ims-gmbh.de www.ims-gmbh.de (c) IMS Messsysteme GmbH. All rights reserved. All parts of this documentation are protected under copyright. Any distribution and duplication requires the written consent of IMS Messsysteme GmbH. Any names of companies and products contained in this document may be registered trademarks..200428\108622Operating Instructions - Alloy EditorContents 1 Installation........................................................................................................................ 4 Requirements .................................................................................................................... 4 Installation Procedure........................................................................................................ 4 1.1 1.2 2 Input Reference Material................................................................................................. 5 Reference Material Name.................................................................................................. 5 Composition....................................................................................................................... 6 Thickness and Reduction Correction Factor Curves......................................................... 7 Dilatometer Curve.............................................................................................................. 8 Parameters ........................................................................................................................ 9 Assigning Materials to the Reference Material................................................................ 10 2.1 2.2 2.3 2.4 2.5 2.6 3 Editing Data.................................................................................................................... 11 Editing the Gauge Name ................................................................................................. 12 Editing the Dilatometer Curve.......................................................................................... 13 3.1 3.2 4 Entering New Additional Data ...................................................................................... 14 New Gauge...................................................................................................................... 14 New Parameters.............................................................................................................. 15 New Dilatometer Curve ................................................................................................... 16 4.1 4.2 4.3 5 Theoretical Calculation ................................................................................................. 17 6 Importing Material Data................................................................................................. 18 Table Structure - Requirements ...................................................................................... 18 Minimum Requirements for the Table ............................................................................. 18 Optional Values ............................................................................................................... 18 Procedure ........................................................................................................................ 19 6.1 6.2 6.3 6.4 7 Further Functions.......................................................................................................... 20 Language Change ........................................................................................................... 20 Database Connection ...................................................................................................... 20 Display of Data . (21)7.1 7.2 7.3 8 Help-File (21).Operating Instructions - Alloy Editor200428\1086221 Installation 1.1 Requirements The following requirements must be fulfilled to install the “Alloy code Editor ”: SQL Server running and database created “Windows NT ” or “Windows 2000” installed as operating system with access rights to SQL Server on the M-Server. ) The SQL Server must be set up on the M-Server on delivery of MEVInet. 1.2 Installation Procedure Copy the installation folder (“f:\install\AlloycodeEditor\”) from the M-Server on to the local computer. Start “Setup.exe ”. Follow the installation instructions. Follow the connection data to the SQL database: - open the file “AlloycodeEditor.ini ” in the folder selected during installation - enter an appropriate server name, database name, user name and password or: start “Programs ”->”AlloycodeEditor ”->”AlloycodeEditor ”: the window “Data Link o select “Microsoft OLE DB Provider for SQL-Server ” under “Provider ” enter “suitable connection data ” under “Connection ” Properties ” appears (after approx. 20 s) click “OK ” and confirm “Password ”: the program then runs after a new start..200428\108622Operating Instructions - Alloy Editor2 Input Reference Material 2.1 Reference Material Name Select “Reference Material ”->”New Material ” in the menu bar. The window “New Reference Material Data ” is opened. Enter the data on the reference material..Operating Instructions - Alloy Editor200428\1086222.2 Composition Select “Reference Material ”->”New Material ” in the menu bar. The window “New ReferenceMaterial Data ” is opened. Select “Composition ”: the following menu appears. Activate the required element in the left-hand column of the tab “Composition ”: the selected element is shown in the right-hand column. Click on the right-hand column with the mouse. Enter the alloying components of the respective element in percent..200428\108622Operating Instructions - Alloy Editor2.3 Thickness and Reduction Correction Factor Curves Select “Reference Material ”->”New Material ” in the menu bar. The window “New Reference Material Data ” is opened. Select “Curve ”: the following menu appears. Select the relevant gauge in the box “Gauge Name ” in the tab “Curve ”. Select between Thickness Curve and Reduction Curve at “Curve Type ”: the selected curve type is shown to the right. Enter the set points in the table of coordinates and activate with the checkbox. Enter the degree of polynomial in the box “Polynom Grad ”. Click the button “Save ” or “Cancel ”: the parameters are saved or rejected respectively. ) The button “Save ” is only enabled when at least one curve has been selected..Operating Instructions - Alloy Editor200428\1086222.4 Dilatometer Curve Select “Reference Material ”->”New Material ” in the menu bar. Select “Curve ”. Click the button “Add Dilatometer Curve ”. The following menu appears. Select the relevant dilatometer curve in the curve list. Click the button “Add to ”..200428\108622Operating Instructions - Alloy Editor2.5 Parameters Select “Reference Material ”->”New Material ” in the menu bar. Select “Parameter ”. The following menu appears. Activate the required parameter: the parameter is shown at the right. Click on the values in the right-hand table with the mouse. Change the values if necessary. Click the button “Save ”: the reference material data is saved. ) The following parameters are always selected: AbsLimitMax, AbsLimitMin, RelLimitMax, RelLimitMin..Operating Instructions - Alloy Editor200428\1086222.6 Assigning Materials to the Reference Material This function is used to assign materials to a reference material. Select the menu “Assignment Table ”. The following window is opened: Enter the current material in the column on the left. Select the name of the reference material in the dropdown menu “Reference Material Name ”. Fill in the associated fields. Click the button “Save ”.3 Editing DataSelect the menu “Reference Material” -> “Load All Material Data”. The data is loaded: ChangingSelect the data with the dropdown menus “Gauge Name” and “Reference Material”: the values are shown in the tables and charts.Click on the field that is to be changed with the mouse.Change the value.Select the menu “Reference Material” -> “Save Change”: the values are saved.DeletingSelect the required reference material with the dropdown menus “Gauge Name” and “Reference Material Name”.Select the menu “Reference Material” -> “Delete current reference Material”. Click on “Yes“: the reference material is deleted.) If the reference material belongs to a group, the grouping must first be deleted before thereference material can be deleted. (See the chapter “Assignment/Grouping“.)3.1 Editing the Gauge NameSelect the menu “Raw Data Overview“ -> “Gauges“. The following window is opened.Click on the table with the mouse.Enter the new name.Click the button “Save Change”.Select the menu “Reference Material” -> “Load All Material Data”: the name change is updated in the Alloy Editor.3.2 Editing the Dilatometer CurveSelect the menu “Raw Data Overview“ -> “Edit Dilatometer Curve“. The following window is opened.ChangingSelect the dilatometer curve in the dropdown box "Curve List". Click on the field that is to be changed with the mouse. Change the value.Click the button “Save”.DeletingSelect the dilatometer curve in the dropdown box "Curve List".Click on the field that is to be deleted with the mouse.Delete the value.Click the button “Save”.Select the menu “Reference Material” -> “Load All Material Data”: the change is updated in the Alloy Editor.) Dilatometer curves that are connected to a reference material cannot be deleted. The reference material must be deleted first and then the dilatometer curve.4 Entering New Additional Data4.1 New GaugeSelect the menu “Reference Material” -> “New Gauge”. The following menu appears.Enter the name of the new gauge at "Gauge Name".Click the button “Save”.Select the menu “Reference Material” -> “Load All Material Data”: the new gauge is available.4.2 New ParametersSelect the menu “Reference Material” -> “New Gauge”. The following menu appears.Enter the name of the parameter at "Parameter Name".Enter a value type (real, Boolean, string) at "Value Type".Click the button “Save”.Select the menu “Reference Material” -> “Load All Material Data”: the parameters are available.4.3 New Dilatometer CurveSelect the menu “Raw Data Overview“ -> “New Dilatometer Curve“. The following window is opened.Enter the name of the curve at "Curve Name".Enter the set points of the curve in the table andactivate.Click the button “Save”.Select the menu “Reference Material” -> “Load All Material Data”: the parameters are available.5 Theoretical Calculation Select the menu "Theoretical Calculation". The following window is opened.Enter the required values under "Settings". Calculation with Current Reference Material Activate "Current Material": the composition is shown in the table on the left. Edit the values in the table. Calculation with Existing Reference Material Activate "Reference Material": the composition is shown in the table on the left. The values cannot be edited. Total Correction Activate "Current Material" and "Reference Material": the correction factor is shown under "Total Correction". ) The values can be converted from weight data to volume data by clicking the button "Weight -> Volume".6 Importing Material DataIt is possible to import the analytical data, correction values and limit values of reference materials intothe alloy database from a table.Launching in Alloy Editor: Select the point CSV Import in the menu Reference Material.6.1 Table Structure - RequirementsThe table must be written in ASCII format. The columns must be separated by a delimiter (not a periodor comma). It is then possible to import CSV files from Excel.The weights of the elements must be entered in the table as percentages. The correction and limit values for the absolute correction value and post correction should each be contained in a column. Periods or commas are accepted as decimal delimiters. Every column represents an element and every line a reference material.6.2 Minimum Requirements for the Table- - The reference material names must be listed in a column.The element names must be contained in the first line (irrelevant whether in upper or lower case letters).- The element columns must lie directly next to each other.6.3 Optional ValuesThe following values can also be imported:- - Customer material corresponding to the reference material.Correction values for thickness and density correction curves.If only one column per curve is specified, a horizontal correction curve is created automatically. Ifmore than one point is specified, the column head must contain the X-value of the curve. If three or more curve points are imported, it is also necessary to specify the polynomial degree that is tobe used to calculate the curve from the points.- Upper and lower limit values for absolute and post correction values.If the column index for one of these values is set on "0", this value is notimported.6.4 ProcedureEnter the column delimiter (default= ;).Load the table.Connect the database. A standard ODBC dialog appears in which the server and database must be entered.Enter the base material (default = Fe).In the table "Material Data for System:" select the systems for which the material is valid.Select the columns.To select a column, define the required column index.Alternatively: Click in the required column and then click on the numerical field with the columnindex.Start importing with [Import].At the end of importing acknowledge the message of completed import with [OK] and close the window.7 Further Functions 7.1 Language Change Select the menu "Language". Select the required language. ) The language that is loaded on starting the Alloy Editor is defined in the INI file. 7.2 Database Connection Select the menu "Database". The following window is opened. Enter the server name under 1. If the user name for logging into the database is not the same as the user name for logging into Windows, "Use a specific user name and password" must be activated in 2. Enter the user name and password. To save the password, activate "Allow saving password". Select the required database under 3. The database connection can be tested with the button "Test Connection". A successful connection is reported. The time after which an attempt to establish a database connection is aborted can be defined in the tab "Advanced".). Word 资料200428\108622Operating Instructions - Alloy Editor7.3 Display of Data Select the menu "Raw Data". The following window is opened. View the corresponding data. ) The data cannot be changed and new data cannot be entered (Except gauge names) 8 Help-File Select the menu “Help “. Search in the file for the solution of the problem.21202 Vers.: 16.03.2006 21/21。
惠普彩色激光打印机 Pro M454 和惠普彩色激光多功能一体机 Pro M479 维修手册说明书
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Table -1 Revision history Revision number 1
Revision date 6/2019
Revision notes HP LaserJet Pro M454 HP LaserJet Pro MFP M479 Repair manual initial release
Additional service and support for HP internal personnel HP internal personnel, go to one of the following Web-based Interactive Search Engine (WISE) sites: Americas (AMS) – https:///wise/home/ams-enWISE - English – https:///wise/home/ams-esWISE - Spanish – https:///wise/home/ams-ptWISE - Portuguese – https:///wise/home/ams-frWISE - French Asia Pacific / Japan (APJ) ○ https:///wise/home/apj-enWISE - English ○ https:///wise/home/apj-jaWISE - Japanese ○ https:///wise/home/apj-koWISE - Korean ○ https:///wise/home/apj-zh-HansWISE - Chinese (simplified)
Find information about the following topics ● Service manuals ● Service advisories ● Up-to-date control panel message (CPMD) troubleshooting ● Install and configure ● Printer specifications ● Solutions for printer issues and emerging issues ● Remove and replace part instructions and videos ● Warranty and regulatory information
AUTOSAR多核操作系统时序监控系统设计
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AUTOSAR多核操作系统时序监控系统设计姚宇航,吴志红,朱元,王恩东,杜展志(同济大学汽车学院,上海201804)摘要:AUTOSAR多核操作系统遵循汽车嵌入式软件开发的标准,在快速增加的软件负载下需要保证系统的安全性、实时性要求。
仅依靠软件开发人员的经验进行配置常会存在操作系统运行时序上的种种问题,因此需要一种对OS进行监控的方法在开发初期阶段及时发现可能存在的时序错误。
针对上述难点,文章提出了一种OS时序的监控方法,并搭建了一套以Infineon AURIX TC397芯片和Vector Davinci工具链为软硬件平台的时序监控系,同时监控系统还包含上位机端软件进行监控数据处理并构建可视化窗口实时还原核内任务运行时序。
关键词:AUTOSAR;多核操作系统;时序监控;可视化中图分类号:TP311文献标识码:B文章编号:2096-9759(2023)03-0001-04Design of AUTOSAR multi-core operating system timing monitoring systemYAO Yuhang,WU Zhihong,ZHU Yuan,WANG Endong,DU Zhanzhi(Tongji University Automotive Institute,Shanghai201804)Abstract:The AUTOSAR multi-core operating system follows the standards of automotive embedded software development, and needs to ensure the security and real-time requirements of the system under the rapidly increasing software load.Only re-lying on the experience of software developers for configuration may cause various problems in timing of the operating system. In view of the above difficulties,this paper proposes an OS timing monitoring method and builds a timing monitoring system with Infineon AURIX TC397chip and Vector Davinci tool chain as software and hardware platform.The monitoring system also includes the upper computer software to process the monitoring data and construct a visual window to restore the running time sequence of tasks in the kernel in real time.Key words:AUTOSAR;multi-core operating system;Time sequence monitoring;Visualization0引言进入21世纪以来,得益于科学技术的不断进步,尤其是电子技术的发展,极大地提高了汽车的安全性和舒适性。
ADF4351_中文pdf数据手册
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ADI中文版数据手册是英文版数据手册的译文,敬请谅解翻译中可能存在的语言组织或翻译错误,ADI不对翻译中存在的差异或由此产生的错误负责。如需确认任何词语的准确性,请参考ADI提供 的最新英文版数据手册。
09800-001
ADF4351
ADF4351ຫໍສະໝຸດ 目录特性 ..................................................................................................... 1 应用 ..................................................................................................... 1 概述 ..................................................................................................... 1 功能框图 ............................................................................................ 1 修订历史 ............................................................................................ 2 技术规格 ............................................................................................ 3 时序特性...................................
多芯片组件的热三维有限元模拟与分析
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多芯片组件的热三维有限元模拟与分析作者:秦向南杨平沈才俊廖宁波多芯片组件(MCM)是将多个半导体集成电路元件以裸芯片的状态搭载在不同类型的布线板上,并实现整体封装的一种封装技术。
与单芯片封装相比。
MCM可提高单位体积内电路的集成度,有利于电子整机向高速化、多功能化和小型化方向发展,随着MCM 集成度的提高和体积的缩小,尤其是对于集成了大功率芯片的MCM,其内部具有多个热源,热源之间的热糯合作用较强,单位体积内的功耗很大,由此带来的芯片热失效和热退化现象突出。
有资料表明,器件的工作温度每升高10℃,其失效率增加l倍。
因此,准确模拟大功率MCM 模块的三维温场分布,并分析掌握其热特性,有利于指导MCM 热设计方案的选择,对提高大功率MCM 的可靠性具有重要意义。
笔者以ATMEL公司生产的MCM的内部结构、尺寸和材料为基础,对该MCM在典型工作模式和自然对流的环境下的内部和封装表面温度场分布情况进行了模拟,并分析了该MCM 工作时各部分散热比例情况和MCM各部分材料的热导率对内部温度的影响。
1 计算模型1.1 MCM 实际结构图1描述了ATMEL 公司生产的某型号MCM 的内部结构。
该MCM 内部有三个芯片以倒装焊方式置于Al203 基板上(芯片和基板之间有层厚度为0.29mm 的粘结剂),其中左边的一块是CPU,它的尺寸为8.5mm x 7.62mm x O.65mm。
右边为两块大小相等的存储器,它们的尺寸为9.5mm x 6.82mm x 6.5mm。
基板的尺寸为25mm x 21mm x 2.2mm,其背面通过阵列排列的255个焊球与PCB相连,焊球直径为0.8 mm,焊球中心距离为1.27mm。
PCB 的尺寸为90mm x 50mm x 1.5mm。
1.2 有限元模型为了便于计算分析,先对模型作如下简化和假设:(1)MCM工作时其内部功率器件处于热平衡状态,且其结温分布是稳定的。
(2)MCM内部的CPU 和存储器是主要热源,忽略电流流过电阻和连续时产生的焦耳热。
3GPP TS 36.331 V13.2.0 (2016-06)
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3GPP TS 36.331 V13.2.0 (2016-06)Technical Specification3rd Generation Partnership Project;Technical Specification Group Radio Access Network;Evolved Universal Terrestrial Radio Access (E-UTRA);Radio Resource Control (RRC);Protocol specification(Release 13)The present document has been developed within the 3rd Generation Partnership Project (3GPP TM) and may be further elaborated for the purposes of 3GPP. The present document has not been subject to any approval process by the 3GPP Organizational Partners and shall not be implemented.This Specification is provided for future development work within 3GPP only. The Organizational Partners accept no liability for any use of this Specification. Specifications and reports for implementation of the 3GPP TM system should be obtained via the 3GPP Organizational Partners' Publications Offices.KeywordsUMTS, radio3GPPPostal address3GPP support office address650 Route des Lucioles - Sophia AntipolisValbonne - FRANCETel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16InternetCopyright NotificationNo part may be reproduced except as authorized by written permission.The copyright and the foregoing restriction extend to reproduction in all media.© 2016, 3GPP Organizational Partners (ARIB, ATIS, CCSA, ETSI, TSDSI, TTA, TTC).All rights reserved.UMTS™ is a Trade Mark of ETSI registered for the benefit of its members3GPP™ is a Trade Mark of ETSI registered for the benefit of its Members and of the 3GPP Organizational PartnersLTE™ is a Trade Mark of ETSI currently being registered for the benefit of its Members and of the 3GPP Organizational Partners GSM® and the GSM logo are registered and owned by the GSM AssociationBluetooth® is a Trade Mark of the Bluetooth SIG registered for the benefit of its membersContentsForeword (18)1Scope (19)2References (19)3Definitions, symbols and abbreviations (22)3.1Definitions (22)3.2Abbreviations (24)4General (27)4.1Introduction (27)4.2Architecture (28)4.2.1UE states and state transitions including inter RAT (28)4.2.2Signalling radio bearers (29)4.3Services (30)4.3.1Services provided to upper layers (30)4.3.2Services expected from lower layers (30)4.4Functions (30)5Procedures (32)5.1General (32)5.1.1Introduction (32)5.1.2General requirements (32)5.2System information (33)5.2.1Introduction (33)5.2.1.1General (33)5.2.1.2Scheduling (34)5.2.1.2a Scheduling for NB-IoT (34)5.2.1.3System information validity and notification of changes (35)5.2.1.4Indication of ETWS notification (36)5.2.1.5Indication of CMAS notification (37)5.2.1.6Notification of EAB parameters change (37)5.2.1.7Access Barring parameters change in NB-IoT (37)5.2.2System information acquisition (38)5.2.2.1General (38)5.2.2.2Initiation (38)5.2.2.3System information required by the UE (38)5.2.2.4System information acquisition by the UE (39)5.2.2.5Essential system information missing (42)5.2.2.6Actions upon reception of the MasterInformationBlock message (42)5.2.2.7Actions upon reception of the SystemInformationBlockType1 message (42)5.2.2.8Actions upon reception of SystemInformation messages (44)5.2.2.9Actions upon reception of SystemInformationBlockType2 (44)5.2.2.10Actions upon reception of SystemInformationBlockType3 (45)5.2.2.11Actions upon reception of SystemInformationBlockType4 (45)5.2.2.12Actions upon reception of SystemInformationBlockType5 (45)5.2.2.13Actions upon reception of SystemInformationBlockType6 (45)5.2.2.14Actions upon reception of SystemInformationBlockType7 (45)5.2.2.15Actions upon reception of SystemInformationBlockType8 (45)5.2.2.16Actions upon reception of SystemInformationBlockType9 (46)5.2.2.17Actions upon reception of SystemInformationBlockType10 (46)5.2.2.18Actions upon reception of SystemInformationBlockType11 (46)5.2.2.19Actions upon reception of SystemInformationBlockType12 (47)5.2.2.20Actions upon reception of SystemInformationBlockType13 (48)5.2.2.21Actions upon reception of SystemInformationBlockType14 (48)5.2.2.22Actions upon reception of SystemInformationBlockType15 (48)5.2.2.23Actions upon reception of SystemInformationBlockType16 (48)5.2.2.24Actions upon reception of SystemInformationBlockType17 (48)5.2.2.25Actions upon reception of SystemInformationBlockType18 (48)5.2.2.26Actions upon reception of SystemInformationBlockType19 (49)5.2.3Acquisition of an SI message (49)5.2.3a Acquisition of an SI message by BL UE or UE in CE or a NB-IoT UE (50)5.3Connection control (50)5.3.1Introduction (50)5.3.1.1RRC connection control (50)5.3.1.2Security (52)5.3.1.2a RN security (53)5.3.1.3Connected mode mobility (53)5.3.1.4Connection control in NB-IoT (54)5.3.2Paging (55)5.3.2.1General (55)5.3.2.2Initiation (55)5.3.2.3Reception of the Paging message by the UE (55)5.3.3RRC connection establishment (56)5.3.3.1General (56)5.3.3.1a Conditions for establishing RRC Connection for sidelink communication/ discovery (58)5.3.3.2Initiation (59)5.3.3.3Actions related to transmission of RRCConnectionRequest message (63)5.3.3.3a Actions related to transmission of RRCConnectionResumeRequest message (64)5.3.3.4Reception of the RRCConnectionSetup by the UE (64)5.3.3.4a Reception of the RRCConnectionResume by the UE (66)5.3.3.5Cell re-selection while T300, T302, T303, T305, T306, or T308 is running (68)5.3.3.6T300 expiry (68)5.3.3.7T302, T303, T305, T306, or T308 expiry or stop (69)5.3.3.8Reception of the RRCConnectionReject by the UE (70)5.3.3.9Abortion of RRC connection establishment (71)5.3.3.10Handling of SSAC related parameters (71)5.3.3.11Access barring check (72)5.3.3.12EAB check (73)5.3.3.13Access barring check for ACDC (73)5.3.3.14Access Barring check for NB-IoT (74)5.3.4Initial security activation (75)5.3.4.1General (75)5.3.4.2Initiation (76)5.3.4.3Reception of the SecurityModeCommand by the UE (76)5.3.5RRC connection reconfiguration (77)5.3.5.1General (77)5.3.5.2Initiation (77)5.3.5.3Reception of an RRCConnectionReconfiguration not including the mobilityControlInfo by theUE (77)5.3.5.4Reception of an RRCConnectionReconfiguration including the mobilityControlInfo by the UE(handover) (79)5.3.5.5Reconfiguration failure (83)5.3.5.6T304 expiry (handover failure) (83)5.3.5.7Void (84)5.3.5.7a T307 expiry (SCG change failure) (84)5.3.5.8Radio Configuration involving full configuration option (84)5.3.6Counter check (86)5.3.6.1General (86)5.3.6.2Initiation (86)5.3.6.3Reception of the CounterCheck message by the UE (86)5.3.7RRC connection re-establishment (87)5.3.7.1General (87)5.3.7.2Initiation (87)5.3.7.3Actions following cell selection while T311 is running (88)5.3.7.4Actions related to transmission of RRCConnectionReestablishmentRequest message (89)5.3.7.5Reception of the RRCConnectionReestablishment by the UE (89)5.3.7.6T311 expiry (91)5.3.7.7T301 expiry or selected cell no longer suitable (91)5.3.7.8Reception of RRCConnectionReestablishmentReject by the UE (91)5.3.8RRC connection release (92)5.3.8.1General (92)5.3.8.2Initiation (92)5.3.8.3Reception of the RRCConnectionRelease by the UE (92)5.3.8.4T320 expiry (93)5.3.9RRC connection release requested by upper layers (93)5.3.9.1General (93)5.3.9.2Initiation (93)5.3.10Radio resource configuration (93)5.3.10.0General (93)5.3.10.1SRB addition/ modification (94)5.3.10.2DRB release (95)5.3.10.3DRB addition/ modification (95)5.3.10.3a1DC specific DRB addition or reconfiguration (96)5.3.10.3a2LWA specific DRB addition or reconfiguration (98)5.3.10.3a3LWIP specific DRB addition or reconfiguration (98)5.3.10.3a SCell release (99)5.3.10.3b SCell addition/ modification (99)5.3.10.3c PSCell addition or modification (99)5.3.10.4MAC main reconfiguration (99)5.3.10.5Semi-persistent scheduling reconfiguration (100)5.3.10.6Physical channel reconfiguration (100)5.3.10.7Radio Link Failure Timers and Constants reconfiguration (101)5.3.10.8Time domain measurement resource restriction for serving cell (101)5.3.10.9Other configuration (102)5.3.10.10SCG reconfiguration (103)5.3.10.11SCG dedicated resource configuration (104)5.3.10.12Reconfiguration SCG or split DRB by drb-ToAddModList (105)5.3.10.13Neighbour cell information reconfiguration (105)5.3.10.14Void (105)5.3.10.15Sidelink dedicated configuration (105)5.3.10.16T370 expiry (106)5.3.11Radio link failure related actions (107)5.3.11.1Detection of physical layer problems in RRC_CONNECTED (107)5.3.11.2Recovery of physical layer problems (107)5.3.11.3Detection of radio link failure (107)5.3.12UE actions upon leaving RRC_CONNECTED (109)5.3.13UE actions upon PUCCH/ SRS release request (110)5.3.14Proximity indication (110)5.3.14.1General (110)5.3.14.2Initiation (111)5.3.14.3Actions related to transmission of ProximityIndication message (111)5.3.15Void (111)5.4Inter-RAT mobility (111)5.4.1Introduction (111)5.4.2Handover to E-UTRA (112)5.4.2.1General (112)5.4.2.2Initiation (112)5.4.2.3Reception of the RRCConnectionReconfiguration by the UE (112)5.4.2.4Reconfiguration failure (114)5.4.2.5T304 expiry (handover to E-UTRA failure) (114)5.4.3Mobility from E-UTRA (114)5.4.3.1General (114)5.4.3.2Initiation (115)5.4.3.3Reception of the MobilityFromEUTRACommand by the UE (115)5.4.3.4Successful completion of the mobility from E-UTRA (116)5.4.3.5Mobility from E-UTRA failure (117)5.4.4Handover from E-UTRA preparation request (CDMA2000) (117)5.4.4.1General (117)5.4.4.2Initiation (118)5.4.4.3Reception of the HandoverFromEUTRAPreparationRequest by the UE (118)5.4.5UL handover preparation transfer (CDMA2000) (118)5.4.5.1General (118)5.4.5.2Initiation (118)5.4.5.3Actions related to transmission of the ULHandoverPreparationTransfer message (119)5.4.5.4Failure to deliver the ULHandoverPreparationTransfer message (119)5.4.6Inter-RAT cell change order to E-UTRAN (119)5.4.6.1General (119)5.4.6.2Initiation (119)5.4.6.3UE fails to complete an inter-RAT cell change order (119)5.5Measurements (120)5.5.1Introduction (120)5.5.2Measurement configuration (121)5.5.2.1General (121)5.5.2.2Measurement identity removal (122)5.5.2.2a Measurement identity autonomous removal (122)5.5.2.3Measurement identity addition/ modification (123)5.5.2.4Measurement object removal (124)5.5.2.5Measurement object addition/ modification (124)5.5.2.6Reporting configuration removal (126)5.5.2.7Reporting configuration addition/ modification (127)5.5.2.8Quantity configuration (127)5.5.2.9Measurement gap configuration (127)5.5.2.10Discovery signals measurement timing configuration (128)5.5.2.11RSSI measurement timing configuration (128)5.5.3Performing measurements (128)5.5.3.1General (128)5.5.3.2Layer 3 filtering (131)5.5.4Measurement report triggering (131)5.5.4.1General (131)5.5.4.2Event A1 (Serving becomes better than threshold) (135)5.5.4.3Event A2 (Serving becomes worse than threshold) (136)5.5.4.4Event A3 (Neighbour becomes offset better than PCell/ PSCell) (136)5.5.4.5Event A4 (Neighbour becomes better than threshold) (137)5.5.4.6Event A5 (PCell/ PSCell becomes worse than threshold1 and neighbour becomes better thanthreshold2) (138)5.5.4.6a Event A6 (Neighbour becomes offset better than SCell) (139)5.5.4.7Event B1 (Inter RAT neighbour becomes better than threshold) (139)5.5.4.8Event B2 (PCell becomes worse than threshold1 and inter RAT neighbour becomes better thanthreshold2) (140)5.5.4.9Event C1 (CSI-RS resource becomes better than threshold) (141)5.5.4.10Event C2 (CSI-RS resource becomes offset better than reference CSI-RS resource) (141)5.5.4.11Event W1 (WLAN becomes better than a threshold) (142)5.5.4.12Event W2 (All WLAN inside WLAN mobility set becomes worse than threshold1 and a WLANoutside WLAN mobility set becomes better than threshold2) (142)5.5.4.13Event W3 (All WLAN inside WLAN mobility set becomes worse than a threshold) (143)5.5.5Measurement reporting (144)5.5.6Measurement related actions (148)5.5.6.1Actions upon handover and re-establishment (148)5.5.6.2Speed dependant scaling of measurement related parameters (149)5.5.7Inter-frequency RSTD measurement indication (149)5.5.7.1General (149)5.5.7.2Initiation (150)5.5.7.3Actions related to transmission of InterFreqRSTDMeasurementIndication message (150)5.6Other (150)5.6.0General (150)5.6.1DL information transfer (151)5.6.1.1General (151)5.6.1.2Initiation (151)5.6.1.3Reception of the DLInformationTransfer by the UE (151)5.6.2UL information transfer (151)5.6.2.1General (151)5.6.2.2Initiation (151)5.6.2.3Actions related to transmission of ULInformationTransfer message (152)5.6.2.4Failure to deliver ULInformationTransfer message (152)5.6.3UE capability transfer (152)5.6.3.1General (152)5.6.3.2Initiation (153)5.6.3.3Reception of the UECapabilityEnquiry by the UE (153)5.6.4CSFB to 1x Parameter transfer (157)5.6.4.1General (157)5.6.4.2Initiation (157)5.6.4.3Actions related to transmission of CSFBParametersRequestCDMA2000 message (157)5.6.4.4Reception of the CSFBParametersResponseCDMA2000 message (157)5.6.5UE Information (158)5.6.5.1General (158)5.6.5.2Initiation (158)5.6.5.3Reception of the UEInformationRequest message (158)5.6.6 Logged Measurement Configuration (159)5.6.6.1General (159)5.6.6.2Initiation (160)5.6.6.3Reception of the LoggedMeasurementConfiguration by the UE (160)5.6.6.4T330 expiry (160)5.6.7 Release of Logged Measurement Configuration (160)5.6.7.1General (160)5.6.7.2Initiation (160)5.6.8 Measurements logging (161)5.6.8.1General (161)5.6.8.2Initiation (161)5.6.9In-device coexistence indication (163)5.6.9.1General (163)5.6.9.2Initiation (164)5.6.9.3Actions related to transmission of InDeviceCoexIndication message (164)5.6.10UE Assistance Information (165)5.6.10.1General (165)5.6.10.2Initiation (166)5.6.10.3Actions related to transmission of UEAssistanceInformation message (166)5.6.11 Mobility history information (166)5.6.11.1General (166)5.6.11.2Initiation (166)5.6.12RAN-assisted WLAN interworking (167)5.6.12.1General (167)5.6.12.2Dedicated WLAN offload configuration (167)5.6.12.3WLAN offload RAN evaluation (167)5.6.12.4T350 expiry or stop (167)5.6.12.5Cell selection/ re-selection while T350 is running (168)5.6.13SCG failure information (168)5.6.13.1General (168)5.6.13.2Initiation (168)5.6.13.3Actions related to transmission of SCGFailureInformation message (168)5.6.14LTE-WLAN Aggregation (169)5.6.14.1Introduction (169)5.6.14.2Reception of LWA configuration (169)5.6.14.3Release of LWA configuration (170)5.6.15WLAN connection management (170)5.6.15.1Introduction (170)5.6.15.2WLAN connection status reporting (170)5.6.15.2.1General (170)5.6.15.2.2Initiation (171)5.6.15.2.3Actions related to transmission of WLANConnectionStatusReport message (171)5.6.15.3T351 Expiry (WLAN connection attempt timeout) (171)5.6.15.4WLAN status monitoring (171)5.6.16RAN controlled LTE-WLAN interworking (172)5.6.16.1General (172)5.6.16.2WLAN traffic steering command (172)5.6.17LTE-WLAN aggregation with IPsec tunnel (173)5.6.17.1General (173)5.7Generic error handling (174)5.7.1General (174)5.7.2ASN.1 violation or encoding error (174)5.7.3Field set to a not comprehended value (174)5.7.4Mandatory field missing (174)5.7.5Not comprehended field (176)5.8MBMS (176)5.8.1Introduction (176)5.8.1.1General (176)5.8.1.2Scheduling (176)5.8.1.3MCCH information validity and notification of changes (176)5.8.2MCCH information acquisition (178)5.8.2.1General (178)5.8.2.2Initiation (178)5.8.2.3MCCH information acquisition by the UE (178)5.8.2.4Actions upon reception of the MBSFNAreaConfiguration message (178)5.8.2.5Actions upon reception of the MBMSCountingRequest message (179)5.8.3MBMS PTM radio bearer configuration (179)5.8.3.1General (179)5.8.3.2Initiation (179)5.8.3.3MRB establishment (179)5.8.3.4MRB release (179)5.8.4MBMS Counting Procedure (179)5.8.4.1General (179)5.8.4.2Initiation (180)5.8.4.3Reception of the MBMSCountingRequest message by the UE (180)5.8.5MBMS interest indication (181)5.8.5.1General (181)5.8.5.2Initiation (181)5.8.5.3Determine MBMS frequencies of interest (182)5.8.5.4Actions related to transmission of MBMSInterestIndication message (183)5.8a SC-PTM (183)5.8a.1Introduction (183)5.8a.1.1General (183)5.8a.1.2SC-MCCH scheduling (183)5.8a.1.3SC-MCCH information validity and notification of changes (183)5.8a.1.4Procedures (184)5.8a.2SC-MCCH information acquisition (184)5.8a.2.1General (184)5.8a.2.2Initiation (184)5.8a.2.3SC-MCCH information acquisition by the UE (184)5.8a.2.4Actions upon reception of the SCPTMConfiguration message (185)5.8a.3SC-PTM radio bearer configuration (185)5.8a.3.1General (185)5.8a.3.2Initiation (185)5.8a.3.3SC-MRB establishment (185)5.8a.3.4SC-MRB release (185)5.9RN procedures (186)5.9.1RN reconfiguration (186)5.9.1.1General (186)5.9.1.2Initiation (186)5.9.1.3Reception of the RNReconfiguration by the RN (186)5.10Sidelink (186)5.10.1Introduction (186)5.10.1a Conditions for sidelink communication operation (187)5.10.2Sidelink UE information (188)5.10.2.1General (188)5.10.2.2Initiation (189)5.10.2.3Actions related to transmission of SidelinkUEInformation message (193)5.10.3Sidelink communication monitoring (195)5.10.6Sidelink discovery announcement (198)5.10.6a Sidelink discovery announcement pool selection (201)5.10.6b Sidelink discovery announcement reference carrier selection (201)5.10.7Sidelink synchronisation information transmission (202)5.10.7.1General (202)5.10.7.2Initiation (203)5.10.7.3Transmission of SLSS (204)5.10.7.4Transmission of MasterInformationBlock-SL message (205)5.10.7.5Void (206)5.10.8Sidelink synchronisation reference (206)5.10.8.1General (206)5.10.8.2Selection and reselection of synchronisation reference UE (SyncRef UE) (206)5.10.9Sidelink common control information (207)5.10.9.1General (207)5.10.9.2Actions related to reception of MasterInformationBlock-SL message (207)5.10.10Sidelink relay UE operation (207)5.10.10.1General (207)5.10.10.2AS-conditions for relay related sidelink communication transmission by sidelink relay UE (207)5.10.10.3AS-conditions for relay PS related sidelink discovery transmission by sidelink relay UE (208)5.10.10.4Sidelink relay UE threshold conditions (208)5.10.11Sidelink remote UE operation (208)5.10.11.1General (208)5.10.11.2AS-conditions for relay related sidelink communication transmission by sidelink remote UE (208)5.10.11.3AS-conditions for relay PS related sidelink discovery transmission by sidelink remote UE (209)5.10.11.4Selection and reselection of sidelink relay UE (209)5.10.11.5Sidelink remote UE threshold conditions (210)6Protocol data units, formats and parameters (tabular & ASN.1) (210)6.1General (210)6.2RRC messages (212)6.2.1General message structure (212)–EUTRA-RRC-Definitions (212)–BCCH-BCH-Message (212)–BCCH-DL-SCH-Message (212)–BCCH-DL-SCH-Message-BR (213)–MCCH-Message (213)–PCCH-Message (213)–DL-CCCH-Message (214)–DL-DCCH-Message (214)–UL-CCCH-Message (214)–UL-DCCH-Message (215)–SC-MCCH-Message (215)6.2.2Message definitions (216)–CounterCheck (216)–CounterCheckResponse (217)–CSFBParametersRequestCDMA2000 (217)–CSFBParametersResponseCDMA2000 (218)–DLInformationTransfer (218)–HandoverFromEUTRAPreparationRequest (CDMA2000) (219)–InDeviceCoexIndication (220)–InterFreqRSTDMeasurementIndication (222)–LoggedMeasurementConfiguration (223)–MasterInformationBlock (225)–MBMSCountingRequest (226)–MBMSCountingResponse (226)–MBMSInterestIndication (227)–MBSFNAreaConfiguration (228)–MeasurementReport (228)–MobilityFromEUTRACommand (229)–Paging (232)–ProximityIndication (233)–RNReconfiguration (234)–RNReconfigurationComplete (234)–RRCConnectionReconfiguration (235)–RRCConnectionReconfigurationComplete (240)–RRCConnectionReestablishment (241)–RRCConnectionReestablishmentComplete (241)–RRCConnectionReestablishmentReject (242)–RRCConnectionReestablishmentRequest (243)–RRCConnectionReject (243)–RRCConnectionRelease (244)–RRCConnectionResume (248)–RRCConnectionResumeComplete (249)–RRCConnectionResumeRequest (250)–RRCConnectionRequest (250)–RRCConnectionSetup (251)–RRCConnectionSetupComplete (252)–SCGFailureInformation (253)–SCPTMConfiguration (254)–SecurityModeCommand (255)–SecurityModeComplete (255)–SecurityModeFailure (256)–SidelinkUEInformation (256)–SystemInformation (258)–SystemInformationBlockType1 (259)–UEAssistanceInformation (264)–UECapabilityEnquiry (265)–UECapabilityInformation (266)–UEInformationRequest (267)–UEInformationResponse (267)–ULHandoverPreparationTransfer (CDMA2000) (273)–ULInformationTransfer (274)–WLANConnectionStatusReport (274)6.3RRC information elements (275)6.3.1System information blocks (275)–SystemInformationBlockType2 (275)–SystemInformationBlockType3 (279)–SystemInformationBlockType4 (282)–SystemInformationBlockType5 (283)–SystemInformationBlockType6 (287)–SystemInformationBlockType7 (289)–SystemInformationBlockType8 (290)–SystemInformationBlockType9 (295)–SystemInformationBlockType10 (295)–SystemInformationBlockType11 (296)–SystemInformationBlockType12 (297)–SystemInformationBlockType13 (297)–SystemInformationBlockType14 (298)–SystemInformationBlockType15 (298)–SystemInformationBlockType16 (299)–SystemInformationBlockType17 (300)–SystemInformationBlockType18 (301)–SystemInformationBlockType19 (301)–SystemInformationBlockType20 (304)6.3.2Radio resource control information elements (304)–AntennaInfo (304)–AntennaInfoUL (306)–CQI-ReportConfig (307)–CQI-ReportPeriodicProcExtId (314)–CrossCarrierSchedulingConfig (314)–CSI-IM-Config (315)–CSI-IM-ConfigId (315)–CSI-RS-Config (317)–CSI-RS-ConfigEMIMO (318)–CSI-RS-ConfigNZP (319)–CSI-RS-ConfigNZPId (320)–CSI-RS-ConfigZP (321)–CSI-RS-ConfigZPId (321)–DMRS-Config (321)–DRB-Identity (322)–EPDCCH-Config (322)–EIMTA-MainConfig (324)–LogicalChannelConfig (325)–LWA-Configuration (326)–LWIP-Configuration (326)–RCLWI-Configuration (327)–MAC-MainConfig (327)–P-C-AndCBSR (332)–PDCCH-ConfigSCell (333)–PDCP-Config (334)–PDSCH-Config (337)–PDSCH-RE-MappingQCL-ConfigId (339)–PHICH-Config (339)–PhysicalConfigDedicated (339)–P-Max (344)–PRACH-Config (344)–PresenceAntennaPort1 (346)–PUCCH-Config (347)–PUSCH-Config (351)–RACH-ConfigCommon (355)–RACH-ConfigDedicated (357)–RadioResourceConfigCommon (358)–RadioResourceConfigDedicated (362)–RLC-Config (367)–RLF-TimersAndConstants (369)–RN-SubframeConfig (370)–SchedulingRequestConfig (371)–SoundingRS-UL-Config (372)–SPS-Config (375)–TDD-Config (376)–TimeAlignmentTimer (377)–TPC-PDCCH-Config (377)–TunnelConfigLWIP (378)–UplinkPowerControl (379)–WLAN-Id-List (382)–WLAN-MobilityConfig (382)6.3.3Security control information elements (382)–NextHopChainingCount (382)–SecurityAlgorithmConfig (383)–ShortMAC-I (383)6.3.4Mobility control information elements (383)–AdditionalSpectrumEmission (383)–ARFCN-ValueCDMA2000 (383)–ARFCN-ValueEUTRA (384)–ARFCN-ValueGERAN (384)–ARFCN-ValueUTRA (384)–BandclassCDMA2000 (384)–BandIndicatorGERAN (385)–CarrierFreqCDMA2000 (385)–CarrierFreqGERAN (385)–CellIndexList (387)–CellReselectionPriority (387)–CellSelectionInfoCE (387)–CellReselectionSubPriority (388)–CSFB-RegistrationParam1XRTT (388)–CellGlobalIdEUTRA (389)–CellGlobalIdUTRA (389)–CellGlobalIdGERAN (390)–CellGlobalIdCDMA2000 (390)–CellSelectionInfoNFreq (391)–CSG-Identity (391)–FreqBandIndicator (391)–MobilityControlInfo (391)–MobilityParametersCDMA2000 (1xRTT) (393)–MobilityStateParameters (394)–MultiBandInfoList (394)–NS-PmaxList (394)–PhysCellId (395)–PhysCellIdRange (395)–PhysCellIdRangeUTRA-FDDList (395)–PhysCellIdCDMA2000 (396)–PhysCellIdGERAN (396)–PhysCellIdUTRA-FDD (396)–PhysCellIdUTRA-TDD (396)–PLMN-Identity (397)–PLMN-IdentityList3 (397)–PreRegistrationInfoHRPD (397)–Q-QualMin (398)–Q-RxLevMin (398)–Q-OffsetRange (398)–Q-OffsetRangeInterRAT (399)–ReselectionThreshold (399)–ReselectionThresholdQ (399)–SCellIndex (399)–ServCellIndex (400)–SpeedStateScaleFactors (400)–SystemInfoListGERAN (400)–SystemTimeInfoCDMA2000 (401)–TrackingAreaCode (401)–T-Reselection (402)–T-ReselectionEUTRA-CE (402)6.3.5Measurement information elements (402)–AllowedMeasBandwidth (402)–CSI-RSRP-Range (402)–Hysteresis (402)–LocationInfo (403)–MBSFN-RSRQ-Range (403)–MeasConfig (404)–MeasDS-Config (405)–MeasGapConfig (406)–MeasId (407)–MeasIdToAddModList (407)–MeasObjectCDMA2000 (408)–MeasObjectEUTRA (408)–MeasObjectGERAN (412)–MeasObjectId (412)–MeasObjectToAddModList (412)–MeasObjectUTRA (413)–ReportConfigEUTRA (422)–ReportConfigId (425)–ReportConfigInterRAT (425)–ReportConfigToAddModList (428)–ReportInterval (429)–RSRP-Range (429)–RSRQ-Range (430)–RSRQ-Type (430)–RS-SINR-Range (430)–RSSI-Range-r13 (431)–TimeToTrigger (431)–UL-DelayConfig (431)–WLAN-CarrierInfo (431)–WLAN-RSSI-Range (432)–WLAN-Status (432)6.3.6Other information elements (433)–AbsoluteTimeInfo (433)–AreaConfiguration (433)–C-RNTI (433)–DedicatedInfoCDMA2000 (434)–DedicatedInfoNAS (434)–FilterCoefficient (434)–LoggingDuration (434)–LoggingInterval (435)–MeasSubframePattern (435)–MMEC (435)–NeighCellConfig (435)–OtherConfig (436)–RAND-CDMA2000 (1xRTT) (437)–RAT-Type (437)–ResumeIdentity (437)–RRC-TransactionIdentifier (438)–S-TMSI (438)–TraceReference (438)–UE-CapabilityRAT-ContainerList (438)–UE-EUTRA-Capability (439)–UE-RadioPagingInfo (469)–UE-TimersAndConstants (469)–VisitedCellInfoList (470)–WLAN-OffloadConfig (470)6.3.7MBMS information elements (472)–MBMS-NotificationConfig (472)–MBMS-ServiceList (473)–MBSFN-AreaId (473)–MBSFN-AreaInfoList (473)–MBSFN-SubframeConfig (474)–PMCH-InfoList (475)6.3.7a SC-PTM information elements (476)–SC-MTCH-InfoList (476)–SCPTM-NeighbourCellList (478)6.3.8Sidelink information elements (478)–SL-CommConfig (478)–SL-CommResourcePool (479)–SL-CP-Len (480)–SL-DiscConfig (481)–SL-DiscResourcePool (483)–SL-DiscTxPowerInfo (485)–SL-GapConfig (485)。
keil错误总结
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KEIL编译错误信息表错误代码及错误信息错误释义error 1: Out of memory 内存溢出error 2: Identifier expected 缺标识符error 3: Unknown identifier 未定义的标识符error 4: Duplicate identifier 重复定义的标识符error 5: Syntax error 语法错误error 6: Error in real constant 实型常量错误error 7: Error in integer constant 整型常量错误error 8: String constant exceeds line 字符串常量超过一行error 10: Unexpected end of file 文件非正常结束error 11: Line too long 行太长error 12: Type identifier expected 未定义的类型标识符error 13: Too many open files 打开文件太多error 14: Invalid file name 无效的文件名error 15: File not found 文件未找到error 16: Disk full 磁盘满error 17: Invalid compiler directive 无效的编译命令error 18: Too many files 文件太多error 19: Undefined type in pointer def 指针定义中未定义类型error 20: Variable identifier expected 缺变量标识符error 21: Error in type 类型错误error 22: Structure too large 结构类型太长error 23: Set base type out of range 集合基类型越界error 24: File components may not be files or objectsfile分量不能是文件或对象error 25: Invalid string length 无效的字符串长度error 26: Type mismatch 类型不匹配error 27:error 27:Invalid subrange base type 无效的子界基类型error 28:Lower bound greater than upper bound 下界超过上界error 29:Ordinal type expected 缺有序类型error 30:Integer constant expected 缺整型常量error 31:Constant expected 缺常量error 32:Integer or real constant expected 缺整型或实型常量error 33:Pointer Type identifier expected 缺指针类型标识符error 34:Invalid function result type 无效的函数结果类型error 35:Label identifier expected 缺标号标识符error 36:BEGIN expected 缺BEGINerror 37:END expected 缺ENDerror 38:Integer expression expected 缺整型表达式error 39:Ordinal expression expected 缺有序类型表达式error 40:Boolean expression expected 缺布尔表达式error 41:Operand types do not match 操作数类型不匹配error 42:Error in expression 表达式错误error 43:Illegal assignment 非法赋值error 44:Field identifier expected 缺域标识符error 45:Object file too large 目标文件太大error 46:Undefined external 未定义的外部过程与函数error 47:Invalid object file record 无效的OBJ文件格式error 48:Code segment too large 代码段太长error 49:Data segment too large 数据段太长error 50:DO expected 缺DOerror 51:Invalid PUBLIC definition 无效的PUBLIC定义error 52:Invalid EXTRN definition 无效的EXTRN定义error 53: Too many EXTRN definitions 太多的EXTRN定义error 54:OF expected 缺OFerror 55:INTERFACE expected 缺INTERFACEerror 56:Invalid relocatable reference 无效的可重定位引用error 57:THEN expected 缺THENerror 58:TO or DOWNTO expected 缺TO或DOWNTOerror 59:Undefined forward 提前引用未经定义的说明error 61:Invalid typecast 无效的类型转换error 62:Division by zero 被零除error 63:Invalid file type 无效的文件类型error 64:Cannot read or write variables of this type 不能读写此类型变量error 65:Pointer variable expected 缺指针类型变量error 66:String variable expected 缺字符串变量error 67:String expression expected 缺字符串表达式error 68:Circular unit reference 单元UNIT部件循环引用error 69:Unit name mismatch 单元名不匹配error 70:Unit version mismatch 单元版本不匹配error 71:Internal stack overflow 内部堆栈溢出error 72:Unit file format error 单元文件格式错误error 73:IMPLEMENTATION expected 缺IMPLEMENTATIONerror 74:Constant and case types do not match 常量和CASE类型不匹配error 75:Record or object variable expected 缺记录或对象变量error 76:Constant out of range 常量越界error 77:File variable expected 缺文件变量error 78:Pointer expression expected 缺指针表达式error 79:Integer or real expression expected 缺整型或实型表达式error 80:Label not within current block 标号不在当前块内error 81:Label already defined 标号已定义error 82:Undefined label in preceding statement part 在前面未定义标号error 83:Invalid @ argument 无效的@参数error 84:UNIT expected 缺UNITerror 85: ";" expected 缺“;”error 86:":" expected 缺“:”error 87:"," expected 缺“,”error 88:"(" expected 缺“(”error 89:")" expected 缺“)”error 90:"=" expected 缺“=”error 91:":=" expected 缺“:=”error 92:"[" or "(." Expected 缺“[”或“(.”error 93: "]" or ".)" expected 缺“]”或“.)”error 94:"." expected 缺“.”error 95: ".." expected 缺“..”error 96:Too many variables 变量太多error 97:Invalid FOR control variable 无效的FOR循环控制变量error 98:Integer variable expected 缺整型变量error 99:Files and procedure types are not allowed here 该处不允许文件和过程类型error 100:String length mismatch 字符串长度不匹配error 101:Invalid ordering of fields 无效域顺序error 102:String constant expected 缺字符串常量error 103:Integer or real variable expected 缺整型或实型变量error 104:Ordinal variable expected 缺有序类型变量error 105:INLINE error INLINE错误error 106:Character expression expected 缺字符表达式error 107:Too many relocation items 重定位项太多error 108:Overflow in arithmetic operation 算术运算溢出error 112:CASE constant out of range CASE常量越界error 113:Error in statement 表达式错误error 114:Cannot call an interrupt procedure 不能调用中断过程error 116:Must be in 8087 mode to compile this 必须在8087模式编译error 117:Target address not found 找不到目标地址error 118:Include files are not allowed here 该处不允许INCLUDE文件error 119:No inherited methods are accessible here 该处继承方法不可访问error 121:Invalid qualifier 无效的限定符error 122:Invalid variable reference 无效的变量引用error 123:Too many symbols 符号太多error 124:Statement part too large 语句体太长error 126:Files must be var parameters 文件必须是变量形参error 127:Too many conditional symbols 条件符号太多error 128:Misplaced conditional directive 条件指令错位error 129:ENDIF directive missing 缺ENDIF指令error 130:Error in initial conditional defines 初始条件定义错误error 131:Header does not match previous definition 和前面定义的过程或函数不匹配error 133:Cannot evaluate this expression 不能计算该表达式error 134:Expression incorrectly terminated 表达式错误结束error 135:Invalid format specifier 无效格式说明符error 136:Invalid indirect reference 无效的间接引用error 137:Structured variables are not allowed here 该处不允许结构变量error 138:Cannot evaluate without System unit 没有System单元不能计算error 139:Cannot access this symbol 不能存取符号error 140:Invalid floating point operation 无效的符号运算error 141:Cannot compile overlays to memory 不能编译覆盖模块至内存error 142:Pointer or procedural variable expected 缺指针或过程变量error 143:Invalid procedure or function reference 无效的过程或函数调用error 144:Cannot overlay this unit 不能覆盖该单元error 146:File access denied 不允许文件访问error 147:Object type expected 缺对象类型error 148:Local object types are not allowed 不允许局部对象类型error 149:VIRTUAL expected 缺VIRTUALerror 150: Method identifier expected 缺方法标识符error 151:Virtual constructors are not allowed 不允许虚构造函数error 152:Constructor identifier expected 缺构造函数标识符error 153:Destructor identifier expected 缺析构函数标识符error 154:Fail only allowed within constructors 只能在构造函数内使用Fail标准过程error 155:Invalid combination of opcode and operands 操作数与操作符无效组合error 156:Memory reference expected 缺内存引用指针error 157:Cannot add or subtract relocatable symbols 不能加减可重定位符号error 158:Invalid register combination 无效寄存器组合error 159:286/287 instructions are not enabled 未激活286/287指令error 160:Invalid symbol reference 无效符号指针error 161:Code generation error 代码生成错误error 162:ASM expected 缺ASMerror 166:Procedure or function identifier expected 缺过程或函数标识符error 167:Cannot export this symbol 不能输出该符号error 168:Duplicate export name 外部文件名重复error 169:Executable file header too large 可执行文件头太长error 170:Too many segments 段太多一、运行错误信息运行错误分为四类:1-99为DOS错误;100-149为I/O错误,发生I/O后,如果使用了编译开关{$I+},程序将终止执行,否则编译开关为{$I-},程序继续执行,并由IOResult函数返回错误信息;150-199为严重错误,200-255为致命错误,致命错误将立即终止程序执行。
无人机目标检测量子多模式识别优化算法
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无人机目标检测量子多模式识别优化算法侯旋1,2,薛飞3,陈涛41.西北政法大学新闻传播学院,西安7101222.空军工程大学航空工程学院,西安7100383.空军研究院航空兵研究所,北京1000764.电子科技大学电子科学技术学院,成都611731摘要:研究了现阶段无人机雷达探测技术的难点与方法,分析了量子多模式识别网络模型与算法,根据Grover 算法优化理论,提出了基于相位旋转的量子多模式识别算法(PRQMPRA )。
优化算法避免了在带冗余项的量子多模式识别算法(RQMPRA )中两个相位旋转均为π会导致搜索成功概率降低的缺陷。
利用三种数据集对误差反向传播算法(EBPA )、基于交叉熵函数的深层自编码器学习算法(CDAA )以及RQMPRA 与PRQMPRA 进行模式识别能力分析,结果表明在确定限定误差的情况下PRQMPRA 具有更高的识别率与相对较快的运算速度。
提出了一种基于量子多模式识别算法的雷达目标检测方法,通过模式分类的方法研究目标检测问题。
利用上述四种算法进行无人机目标检测实验,研究结果表明PRQMPRA 具有更高的检测精度,在低信噪比的情况下可保持较高的发现概率。
关键词:目标检测;无人机;量子计算;模式识别文献标志码:A中图分类号:TP183doi :10.3778/j.issn.1002-8331.2001-0143UAV Target Detection on Quantum Multi-pattern Recognition Optimization AlgorithmHOU Xuan 1,2,XUE Fei 3,CHEN Tao 41.School of Journalism and Communication,Northwest University of Politics and Law,Xi ’an 710122,China2.College of Aeronautics Engineering,Air Force Engineering University,Xi ’an 710038,China3.Aviation Institute,Air Force Research Institute,Beijing 100076,China4.College of Electronic Science and Technology,University of Electronic Science and Technology of China,Chengdu 611731,ChinaAbstract :The difficulties and methods of unmanned aerial vehicle radar detection technology are studied.It analyzes the model and algorithms of Quantum multi-Pattern Recognition Network (QPRN ).By Grover introducing algorithm optimi-zation theory,Phase Rotation Quantum Multi-Pattern Recognition Algorithm (PRQMPRA )is proposed.The optimization algorithm avoids the defect that both phase rotations are πin the Redundancy Quantum Multi-Pattern Recognition Algo-rithm (RQMPRA ),which will lead to a decrease in the probability of successful search.Three types of data sets are used to analyze the pattern recognition ability of Error Back Propagation Algorithm (EBPA ),Cross-entropy function-Deep Autoencoder learning Algorithm (CDAA ),RQMPRA and PRQMPRA.In the case of determining the limit error,the results show that PRQMPRA has higher recognition rate and relatively faster operation speed.A multi-pattern recognition algorithm based radar target detection method is proposed to study the target detection problem by pattern ing the above four algorithms for UAV target detection experiments,the results show that PRQMPRA has higher detection accuracy and can maintain a higher discovery probability in the case of low Signal to Noise Ratio (SNR ).Key words :target detection;Unmanned Aerial Vehicle (UAV );quantum computing;pattern recognition基金项目:国家自然科学基金(51507186)。
诺瓦科技LED发送卡MCTRL660 PRO用户手册英文版
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MCTRL660 PROIndependent ControllerProduct Version:V1.0.0Document Number: NS110100560User ManualXI 'AN N OVA S T AR T EC HCO .,L T D.Copyright © 2018 Xi’an NovaStar Tech Co., Ltd. All Rights Reserved.No part of this document may be copied, reproduced, extracted or transmitted in any form or by any means without the prior written consent of Xi’an NovaStar Tech Co., Ltd.Trademarkis a trademark of Xi’an No vaStar Tech Co., Ltd.StatementYou are welcome to use the product of Xi’an NovaStar Tech Co., Ltd. (hereinafter referred to as NovaStar). This document is intended to help you understand and use the product. For accuracy and reliability, NovaStar may make improvements and/or changes to this document at any time and without notice. If you experience any problems in use or have any suggestions, please contact us via contact info given in document. We will do our best to solve any issues, as well as evaluate and implement any suggestions.X I'A NN OV AS TA RT EC HC O.,LT D.User Manual Change HistoryChange HistoryX I'A NN OV AS TA RT EC HC O.,LTContentsChange History (ii)1 Safety (1)Storage and Transport Safety (1)Installation and Use Safety (1)2 Overview (2)3 Features (3)Features (3)Video Source Features (3)4 Applications (5)5 Cascading Devices (7)6 Hardware Structure (8)Appearance (8)6.1.1 Front Panel (8)6.1.2 Rear Panel (8)Dimensions (9)7 Home Screen (10)Sending Card Mode (10)Fiber Converter Mode (11)8 Menu Operations (13)Quick Screen Configuration (13)8.1.1 Step 1 Setting Input Source (13)8.1.2 Step 2 Setting Input Resolution (14)8.1.3 Step 3 Quickly Configuring Screen (14)Brightness Adjustment (15)Screen Settings (16)8.3.1 Quick Configuration (16)8.3.2 Advanced Configuration (16)8.3.3 Auto Configuration (17)8.3.4 Image Offset (18)Input Settings (18)Display Control (18)X I'A NN OV AS TA RT EC HC O.,LT D.Image Mirroring (19)Backup and Restore (21)Advanced Settings (21)8.8.1 Mapping Function ................................................................................................................................... 22 8.8.2 Loading RCFG Files ............................................................................................................................... 22 8.8.3 Alarm Threshold Settings........................................................................................................................ 23 8.8.4 Image Settings ........................................................................................................................................ 23 8.8.5 Saving to RV Card .................................................................................................................................. 23 8.8.6 Redundancy ............................................................................................................................................ 23 8.8.7 Presets .................................................................................................................................................... 23 8.8.8 Inputs Backup ......................................................................................................................................... 24 8.8.9 Low Latency ............................................................................................................................................ 24 8.8.10 Color Depth ........................................................................................................................................... 24 System Settings .. (25)Communication Settings (25)Working Mode (26)Language (27)9 Operations on PC (28)Individual Gamma Adjustment for RGB (28)Operations on Web Page (29)9.2.1 Environment Configuration ..................................................................................................................... 29 9.2.2 Applications ............................................................................................................................................. 29 Software Operations on PC .. (30)9.3.1 NovaLCT ................................................................................................................................................. 30 9.3.2 SmartLCT ............................................................................................................................................... 31 Firmware Update (31)9.4.1 NovaLCT ................................................................................................................................................. 31 9.4.2 SmartLCT .. (31)10 Specifications (32)XI 'AN NOVA S T AR T EC HCO .,L T D.User Manual 1 Safety1 SafetyThis chapter illustrates safety of the MCTRL660 PRO independent controller toensure the product’s storage, transport, installation and use safety.Safety instructions are applicable to all personnel who come into contact with or usethe product. Please pay attention to following points.●Read through the instructions.●Retain all instructions.●Comply with all instructions.Storage and Transport Safety●Pay attention to dust and water prevention.●Avoid long-term direct sunlight.●Do not place the product in a position near fire and heat.●Do not place the product in an area containing explosive materials.●Do not place the product in a strong electromagnetic environment.●Place the product in a stable position to prevent damage or personal injurycaused by dropping.●Save the packing box and materials for future storage and shipping of product.For maximum protection during storage and shipping, repack the product as itwas originally packed at the factory.Installation and Use Safety●Only trained professionals may install the product.●Plugging and unplugging operations are prohibited when the power is on.●Ensure safe grounding of the product.●Beware of electric shock hazards.●Always wear a wrist band and insulating gloves.●Do not place the product in an area that is frequently or strongly shaken.●Perform regular dust removal.●Rather than having the product disassembled and maintained by non-certifiedprofessionals, please contact NovaStar for maintenance at any time.●Replace faulty parts only with the spare parts supplied by NovaStar.X I'A NN OV AS TA RT EC HC O.,LT D.User Manual2 Overview2OverviewThe MCTRL660 PRO is a professional controller developed by NovaStar. A single MCTRL660 PRO has a loading capacity of up to 1920×1200@60Hz. It allows users to customize resolutions to configure ultra-large screens with ultra-width or ultra-height.The MCTRL660 PRO has various video connectors:● Input connectors: 1 × 3G-SDI, 1 × HDMI 1.4a, 1 × single-link DVI ● Output connectors: 6 × Gigabit Ethernet ports, 2 × 10G optical ports ●Loop output connectors: 1 × 3G-SDI LOOP , 1 × HDMI 1.4a LOOP , 1 × DVI LOOPThe MCTRL660 PRO has many industry-leading advanced technologies:●Input of ultra-high color depths, such as 10-bit/12-bit 4:4:4, with input resolutions up to 1920×1080@60Hz, increasing color expression capabilities by 4096 times compared to 8-bit inputs, and presenting images with rich and delicate colors, smoother transitions, as well as clearer details● Individual Gamma adjustment for RGB, effectively controlling image non-uniformity under low grayscale and white balance offset to improve image quality ●A low latency of less than 1 frame (≤ 10 lines)● Dual working modes: working as sending card and fiber converter● One-click backup and recovery, quickly recovering previous screenconfigurations to deal with sudden on-site failure.●Image mirroring, allowing for more cool and dazzling stage effectsThe MCTRL660 PRO is mainly used for the rental and fixed fields, such as concerts, live events, security monitoring centers, Olympic Games and various sports centers.XI 'AN N OVA S T AR T EC HCO .,L T D.3FeaturesFeatures● Supports inputs of 10-bit/12-bit 4:4:4 ultra-high color depths and resolutions up to 1920×1080@60Hz.● A low latency of less than 1 frame (≤ 10 lines) ● Auto LED screen configuration ● Web control ● Image mirror● Dual working modes: working as sending card and fiber converter ● Pixel level brightness and chroma calibration● Independent Gamma adjustment of RGB (Only the A8s receiving card supports this function) ● Monitoring of inputs● One-click backup and recovery●Multiple MCTRL660 PRO units can be cascaded.Video Source FeaturesO VA S T AR T EC HCO .,L T D.X I'A NN OV AS TA RT EC HC O.,LTUser Manual4 Applications4ApplicationsThe MCTRL660 PRO can work as a sending card or fiber converter, meeting multiple application needs.Scenario 1: Application of Sending Card ModeOn the OLED menu screen, choose Working Mode > Sending Card . This mode uses the optical ports or Gigabit Ethernet ports to output video signals.Figure 4-1 Application of sending card modeScenario 2: Application of Fiber Converter ModeSet the working mode for the two devices respectively, as shown in Figure 4-2. Device 2 uses the optical ports (for input/output) and Gigabit Ethernet ports (for output/input) to realize optical and electric signal conversion, which allows for long-distance signal transmission.XI 'AN N OVA S T AR T EC HCO .,L T D.User Manual 4 Applications Figure 4-2 Application of fiber converter modeScenario 3: Application of Dual-Output Working ModeSet the working mode for the two devices respectively, as shown in Figure 4-3.Device 1 uses the optical ports and Gigabit Ethernet ports to output video signals atthe same time.Figure 4-3 Application of dual-output working modeX I'A NN OV AS TA RT EC HC O.,LT D.User Manual 5 Cascading Devices5 Cascading Devices●The control computer needs to control multiple MCTRL660 PRO devices.Cascade devices via USB IN and USB OUT ports of the MCTRL660 PROdevices. Up to 8 devices can be cascaded.●Multiple MCTRL660 PRO devices need to be genlocked.Cascade devices via GENLOCK IN and GENLOCK LOOP connectors of theMCTRL660 PRO devices. Up to 8 devices can be cascaded.X I'ANN OV AS TA RT EC HC O.,LT D.6Hardware StructureAppearance6.1.1 Front Panel6.1.2 Rear PanelXI 'AEC HCO .,L T D.DimensionsUnit: mmXI 'AN N OVA S T AR T EC7Home ScreenSending Card ModeIn the sending card mode, the home screen of the MCTRL660 Pro is shown below./The system configuration file is backed up/not backed up. XI 'AOVA T AR T EC HCO .,L T D.//Voltage alarm / Temperature alarm / Voltage and temperature alarms(When there are no such alarms, the backup status is displayed here.)1–2Optical port connection status:●●///Connection status of control ports: Not connected / USB connected / Ethernet connected / GENLOCK connectedWhen USB port, Ethernet port and GENLOCK connector are all connected to the control computer, their priority in control is GENLOCK > USB >ETHERNET.7LED screen brightness/Buttons on the front panel are locked/unlocked.Fiber Converter Mode In the fiber converter mode, the home screen of the MCTRL660 Pro is shown below.XI 'A N N O V A S T A7///Normal voltage and temperature / Voltage alarm / Temperature alarm / Voltage and temperature alarms//Connection status of control ports:Not connected / USB connected / Ethernet connected When both USB and Ethernet ports are connected to the control computer, USB port has the priority in control./Buttons on the front panel are locked/unlocked.X I'AN OV AS T8Menu OperationsThe MCTRL660 PRO is powerful and easy to use. You can quickly configure the LED screen to light it up and display the entire input source following steps in 8.1 Quick Screen Configuration . With other menu settings, you can further improve the LED screen display effect.Instruction on knob operations:● Press the knob to enter a menu page or confirm an operation. ● Rotate the knob to select a menu item or adjust a menu parameter.●Hold the knob and BACK button simultaneously for 5 seconds to lock or unlockall the buttons.Quick Screen ConfigurationFollowing the steps below, namely Setting Input Source > Setting InputResolution > Quickly Configuring Screen , you can quickly light up the LED screen to display the entire input source.8.1.1 Step 1 Setting Input SourceSupported input sources include 3G-SDI, Single-Link DVI and HDMI 1.4a. Select an input source that matches the type of the inputted external video source. Constraints on input sources:● Only one video input source can be selected at the same time. ● Interlaced SDI video sources do not support low latency. ●SDI video sources do not support the following functions:− Color depth adjustment − Image mirroring−Contrast, saturation and hue adjustmentXI 'AN N OVA S T AR T EC HCO .,L T D.Figure 8-1 Input source settingsStep 1 On the home screen, press the knob to enter the menu. Step 2 Chose Input Settings > Input Source to enter its submenu. Step 3 Select the target video source and press the knob to enable it.8.1.2 Step 2 Setting Input ResolutionNote: SDI input sources do not support input resolution settings.The input resolution can be set through either of the following methods.Method 1: Selecting a Preset ResolutionSelect an appropriate preset resolution and refresh rate as the input resolution.Step 1 On the home screen, press the knob to enter the menu.Step 2 Choose Input Settings > Preset Resolution to enter its submenu.Step 3 Select a resolution and a refresh rate, and press the knob to apply them respectively.The MCTRL660 PRO supports the following preset resolutions.● 1024×768@(24/30/48/50/60/72/75/85/100/120)Hz ● 1280×1024@(24/30/48/50/60/72/75/85)Hz ● 1366×768@(24/30/48/50/60/72/75/85/100)Hz ● 1440×900@(24/30/48/50/60/72/75/85)Hz ● 1600×1200@(24/30/48/50/60)Hz ● 1920×1080@(24/30/48/50/60)Hz ● 1920×1200@(24/30/48/50/60)Hz ● 2560×960@(24/30/48/50)Hz ●2560×1600@(24/30)HzMethod 2: Customizing a ResolutionCustomize a resolution by setting a custom width, height and refresh rate.Step 1 On the home screen, press the knob to enter the menu.Step 2 Choose Input Settings > Custom Resolution to enter its submenu and set thescreen width, height and refresh rate. Step 3 Select Apply and press the knob to apply the custom resolution.8.1.3 Step 3 Quickly Configuring ScreenThis function is used to quickly configure a screen.XI 'AN N OVA S T AR T EC HCO .,L T D.Figure 8-2 Quick configurationStep 1 On the home screen, press the knob to enter the menu. Step 2 Choose Screen Settings > Quick Config to enter its submenu. Step 3 Enable Quick Config and set the parameters.● Set Cabinet Row Qty and Cabinet Column Qty (number of cabinet rows and columns to be loaded).●Set Port 1 Cabinet Qty (number of cabinets loaded by Ethernet port 1). The device has restrictions on the number of cabinets loaded by the Ethernet ports. For details, see Note a).●Set Data Flow of the screen. For details, see Note c), d), and e).Brightness AdjustmentAdjust the LED screen brightness value based on the current ambient brightness andeye comfort. Appropriate brightness can extend life of LEDs in LED screen.XI 'AO .,L T D.Figure 8-3 Brightness adjustmentStep 1 On the home screen, press the knob to enter the menu.Step 2 Select Brightness and press the knob to enter the adjustment status.Step 3 Rotate the knob to adjust the brightness value. The LED screen displays theadjustment effect in real time. Press the knob to apply the brightness value.Screen SettingsConfigure the LED screen to ensure the screen can display the whole imagenormally.Screen configuration methods include quick, advanced and auto configurations.There are constrains on these methods, explained as below.●The three methods cannot be used at the same time.●When you are configuring screen in NovaLCT, the three configuration methodson The MCTRL 660 PRO are disabled.8.3.1 Quick ConfigurationConfigure the whole LED screen uniformly and quickly. For details, see 8.1.3 Step 3Quickly Configuring Screen.8.3.2 Advanced ConfigurationSet parameters for each Ethernet port, including number of cabinet rows andcolumns (Cabinet Row Qty and Cabinet Column Qty), horizontal offset (Start X),vertical offset (Start Y), and data flow.Figure 8-4 Advanced configurationStep 1 On the home screen, press the knob to enter the menu.Step 2 Choose Screen Settings > Advanced Config to enter its submenu.Step 3 Enable Advance Configand set the parameters.X I'A NN OV AS TA RT EC HC O.,LT D.8.3.3 Auto ConfigurationNote: Each Ethernet port must load only a whole row or column of cabinets. Figure 8-5 Each Ethernet port loading only one row of cabinetsFigure 8-6 Each Ethernet port loading only one column of cabinetsFigure 8-7 Auto configurationStep 1 On the home screen, press the knob to enter the menu. Step 2 Choose Screen Settings > Auto Config to enter its submenu. Step 3 Enable Auto Config and select a data flow.XI 'AN N OVA S T AR T EC HCO .,L T D.8.3.4 Image OffsetAfter configuring the screen, adjust the horizontal and vertical offsets (Start X and Start Y ) of the overall displayed image to ensure it is displayed in the target position. Figure 8-8 Image offsetStep 1 On the home screen, press the knob to enter the menu. Step 2 Choose Screen Settings > Image Offset to enter its submenu. Step 3 Set the Start X and Start Yvalues.Input SettingsSet the input source and input resolution.Input Source SettingsOn the OLED menu screen, select an input source that matches the type of the inputted external video source. Only one video input source can be selected at the same time. For details, see 8.1.1 Step 1 Setting Input Source .Input Resolution SettingsSet a preset or custom resolution for the selected input source. For details, see 8.1.2 Step 2 Setting Input Resolution.Display ControlControl the status of display on the LED screen. Figure 8-9 Display controlNormal : The LED screen displays the current input source normally.Black Out : The LED screen goes black and does not display input source still being played in the background.Freeze : The LED screen always displays the frame when frozen. The input source is still being played in the background.Test Pattern : Test patterns are used to check the display effect and pixel operating status. There are 8 test patterns, including pure colors and line patterns.XI 'AN N OVA S T AR T EC HCO .,L T D.Step 1 On the home screen, press the knob to enter the menu. Step 2 Choose Display Control to enter its submenu. Step 3Select a control mode and press the knob to apply it.Image MirroringMirror images displayed on the LED screen. You can disable mirroring, mirror the image from left to right or from top to bottom. The image mirroring is based on the entire output image.Constrain: Image mirroring and low latency cannot be enabled at the same time. Figure 8-10 Image mirroringStep 1 On the home screen, press the knob to enter the menu. Step 2 Select Mirror and press the knob to enter its submenu.Step 3 Set the mirroring mode for the image loaded by current Ethernet port.Step 4 (Optional) Select Apply to All Ports and press the knob. The mirroring settings willtake effect on all other Ethernet ports automatically.The mirroring effects are illustrated in the following figures.Figure 8-11 Left-right mirroring of the image loaded by Ethernet port 1As shown above, after you set the mirroring mode as left-right for Ethernet port 1, the image displayed in the Ethernet port 1 area changed to the left-right mirrored image of the image loaded by Ethernet port 4. That is to say, the entire image is mirrored horizontally, but only the Ethernet port 1 area displays the partial mirrored image.XI 'AN N OVA S T AR T EC HCO .,L T D.Figure 8-12 Left-right mirroring of images loaded by Ethernet port 1 and 2As shown above, after you set the mirroring mode as left-right for Ethernet ports 1-2, the images displayed in the areas of Ethernet ports 1-2 changed to the left-rightmirrored images of the images loaded by Ethernet ports 3-4. That is to say, the entire image is mirrored horizontally, but only the areas of Ethernet ports 1-2 display the partial mirrored images.Figure 8-13 Left-right mirroring of the entire imageAs shown above, after you set the mirroring mode as left-right for Ethernet ports 1-4, the entire image is mirrored horizontally.Figure 8-14 T op-bottom mirroring of the image loaded by Ethernet port 1As shown above, after you set the mirroring mode as top-bottom for Ethernet port 1, the image loaded by Ethernet port 1 will be mirrored vertically. That is to say, the entire image is mirrored vertically, but only the Ethernet port 1 area displays thepartial mirrored image.XI 'AN N OVA S T AR T EC HCO .,L T D.Figure 8-15 T op-bottom mirroring of the entire imageAs shown above, after you set the mirroring mode as top-bottom for Ethernet ports 1-4, the entire image is mirrored vertically.Backup and RestoreFigure 8-16 Backup and restore●Back up the system configuration to the controller.●Restore the system configuration from the controller.●Restore the receiving card configuration from the controller.●Restore the sending card configuration from the controller.System configuration includes configuration files of the sending card (namely thecontroller) and receiving cards.Advanced SettingsFigure 8-17 Advanced settingsX I'A NN OV AS TA RT EC HC O.,LT D.8.8.1 Mapping FunctionWhen mapping function is enabled, each of the cabinets will display its cabinet No.and the No. of the Ethernet port that loads the cabinet.Note: Receiving cards used by the system must support mapping function.Figure 8-18 Illustration of mapping functionExample: P: 01 indicates the Ethernet port No. #001 indicates the cabinet No.8.8.2 Loading RCFG FilesBefore you begin: Save the cabinet configuration file (*.rcfgx or *.rcfg) to the local PC.Note: Configuration files of irregular cabinets are not supported.Step 1 Run NovaLCT and choose Tools > Controller Cabinet Configuration File Import.Step 2 On the displayed page, select the currently used serial port or Ethernet port, click Add Configuration File to select and add a cabinet configuration file.Step 3 Click Save the Change to HW to save the change to the controller.X I'A NN OV AS TA RT EC HC O.,LT D.8.8.3 Alarm Threshold SettingsSet the alarm thresholds for device temperature and voltage. When a threshold is exceeded, its corresponding icon will be flashing, instead of displaying the value.● : Voltage alarm, icon flashing. Voltage threshold range: 3.5 V –7.5 V). ●: Temperature alarm, icon flashing. Temperature threshold range: -20°C –85°C). ●: Voltage and temperature alarms at the same time, icon flashing.Note: When there are no temperature or voltage alarms, the home screen will display the backup status.8.8.4 Image SettingsAdjust the color of parameters of the output image on the LED screen.Table 8-1 Image parameters8.8.5 Saving to RV CardSend and save the configuration parameters of the controller to the receiving cards and those parameters will not be lost after the controller is powered off.8.8.6 Redundancy Set the controller as the primary or backup device. When the controller works as abackup device, set the data flow direction as opposite to that of the primary device.If the controller is set as the backup device, when the primary device fails, the backup device will immediately take over the work of the primary device, that is, the backup takes effect. After the backup takes effect, the target Ethernet port icons on the home screen will have marks on top flashing once every 1 second.8.8.7 PresetsChoose Advanced Settings > Presettings to save current settings as a template. Up to 10 presets can be saved.●Save : Save current parameters as a preset.XI 'A N N ,L T D.● Load : Read back the parameters from the saved preset. ●Delete : Delete the parameters saved in the preset.8.8.8 Inputs BackupSet a backup video source for each primary video source. Other input video sources supported by the controller can be set as backup video sources.After a backup video source takes effect, the video source selection is irreversible. Table 8-2 Video source backup8.8.9 Low LatencyLow latency is used to reduce the time delay between the input of video signal to the controller and the corresponding output. To enable low latency, you need to set the horizontal resolution loaded by a single Ethernet port less than or equal to 512 pixels. Low latency cannot be enabled with any of the following functions at the same time.● Image mirroring ● Input of interlaced SDI video sources●GENLOCK8.8.10 Color DepthSet the color depth of input source, including 8 bit, 10 bit and 12 bit.Constraints: SDI video sources do not support adjustment of input color depth. Figure 8-19 Color depthTable 8-3 Input color depth adjustmentXI 'AN N OVA S T AR T EC HVideo sources with different color depths support different input resolutions. Fordetails, see 3.2 Video Source Features.Deep Color Loop Mode AdjustWhen multiple MCTRL660 PRO units are cascaded, if the color depth of the outputvideo source on current device does not match the color depth of the video sourceinputted from the previous device, you can select this function on the previous deviceto adjust the loop output.System SettingsFigure 8-20 System settingsFactory ResetReset the controller to factory settings.Go Homepage (s)Set the time of staying on the current screen before going back to the homepagewhen no action is performed. The time range is 30s to 3600s.OLED BrightnessAdjust the brightness of the OLED menu screen on the front panel.Hardware VersionCheck the hardware version of the controller. If a new version is released, you canupdate the firmware programs in NovaLCT or SmartLCT.Communication SettingsSet the communication mode and network parameters of the MCTRL660 PRO. X I'A NN OV AS TA RT EC HC O.,LT D.。
An Efficient FPGA Implementation of The OS-CFAR Process
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In this paper, we propose a parallel structure for an efficient Field Programmable Gate Array, FPGA, implementation of the order statistics CFAR detector, based on the (N-K+1) maximum direct determination.
E-mail: b_magaz@, boualem.magaz@.dz, mohamed.bencheikh@.dz
稀疏矩阵向量乘的访存分析和优化
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稀疏矩阵向量乘的访存分析和优化Memory Accessing Analysis of Sparse Matrix Vector Multiplication and OptimizationAbstract: Sparse Matrix Vector multiplication (SpMV) is one of the most important kernel in computing science. Both theoretical analysis and practices demonstrate that SpMV is a memory-intensive application. However state-of-the-art compilers cannot make full use of the modern processors’ characters, the usage ratio of SpMV bandwidth is only about 10%. In this paper, based on the memory access characters of current processors, we optimize memory access in SpMV instruction pipeline using SIMD instruction. The experimental results show that there are 63% and 89% performance improvement on Intel Nehalem and Sandy Bridge, 30% and 36% improvement on AMD Opteron 6168 and Opteron 8374 compared with the standard SpMV implementation. As for matrices in real applications, there are 10% performance gained on Nehalem and Sandy Bridge, nevertheless little performance gain is achieved on the two AMD Opteron platforms.Key words: sparse matrix vector multiplication; SpMV; pipeline; SIMD; Memory Access摘 要: 稀疏矩阵向量乘(SpMV)是科学计算中最重要的核心算法之一。
可编程动态自重构三维阵列芯片体系结构关键技术
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可编程动态自重构三维阵列芯片体系结构关键技术1. 引言1.1 研究背景随着信息技术的发展和智能化设备的广泛应用,对于芯片的性能和功能要求也日益提高。
传统的二维芯片往往存在性能局限和布线难题,限制了其在复杂场景下的应用。
而三维集成技术因其具有较高的集成度和更短的信号传输距离,成为了解决这些问题的有效途径之一。
可编程动态自重构三维阵列芯片体系结构是一种创新的设计理念,利用先进的硬件与软件协同设计技术,实现了芯片内部功能的自动重构和动态调整。
这种芯片不仅具有高度的智能化和自适应性,还能够满足多样化的应用需求,为智能化设备和系统提供了更广阔的发展空间。
在当前智能化浪潮下,可编程动态自重构三维阵列芯片技术具有重要的应用前景和市场需求。
通过深入研究其关键技术和应用场景,我们可以更好地把握未来芯片设计的发展方向,推动我国在信息技术领域的创新与发展。
1.2 研究意义可编程动态自重构三维阵列芯片是当前数字电路设计领域的一个热门研究方向。
其具有动态重构电路结构、降低功耗、提高性能等优点,对于推动数字电路设计技术的发展具有重要意义。
可编程动态自重构三维阵列芯片能够实现动态调整电路结构,使芯片具有更灵活的功能实现能力。
通过智能动态重构,可以根据不同的应用需求灵活调整电路连接方式,实现对多种功能的支持,提高芯片的通用性和适应性。
动态重构技术可以有效降低电路功耗。
在传统的固定电路结构下,往往存在电路冗余和闲置的问题,导致功耗浪费严重。
而可编程动态自重构三维阵列芯片可以根据实际需求关闭或开启不同的电路部分,实现动态功耗管理,有效提高芯片的能效比。
通过对可编程动态自重构三维阵列芯片的研究,可以拓展数字电路设计的新思路和方法,推动数字电路设计技术的进步。
该技术还可以为未来数字电路在人工智能、物联网、云计算等领域的应用提供更好的支持,具有重要的应用前景和产业化推动力。
1.3 研究目的本文旨在探讨可编程动态自重构三维阵列芯片体系结构关键技术,并深入分析其在实际应用中的优势和挑战。
基于多目标模板匹配的晶圆芯片检测方法
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基于多目标模板匹配的晶圆芯片检测方法晶圆芯片检测是半导体制造工艺中的重要环节之一,主要用于检查芯片表面的缺陷和污染。
然而,由于晶圆芯片的尺寸较小且复杂,传统的图像匹配方法在检测过程中存在准确度低、计算量大的问题。
为了提高晶圆芯片检测的效率和准确性,本文提出了一种基于多目标模板匹配的晶圆芯片检测方法。
1. 方法介绍本方法首先通过高分辨率显微镜对晶圆芯片进行图像采集,然后使用图像处理技术提取出感兴趣区域(ROI)的图像。
接下来,利用多目标模板匹配方法对ROI图像进行检测和分析,以判断芯片表面是否存在缺陷和污染。
2. 多目标模板匹配多目标模板匹配是一种常用的目标检测技术,它可以根据已有的模板对输入图像进行匹配,并找出最佳匹配位置。
在晶圆芯片检测中,我们可以根据不同的缺陷和污染模式构建多个模板,然后通过模板匹配来确定芯片表面的问题。
3. 模板构建在构建模板之前,我们需要进行图像预处理,包括图像增强、噪声去除等步骤,以提高后续检测的准确性。
然后,根据不同的缺陷和污染类型,我们可以采用不同的方法构建模板。
例如,对于晶圆表面的缺陷,我们可以将正常晶圆芯片的图像与有缺陷的图像进行差异化比较,从而得到缺陷的模板。
4. 模板匹配在模板匹配过程中,我们将构建好的多个模板与感兴趣区域的图像进行逐一匹配。
对于每个模板,我们可以通过计算匹配程度来判断其是否与图像相匹配,以及匹配的位置。
通过遍历所有模板,我们可以得到对晶圆芯片表面进行缺陷和污染检测的结果。
5. 检测结果分析根据模板匹配的结果,我们可以获得晶圆芯片表面各个区域的缺陷和污染情况。
根据这些信息,我们可以进一步分析晶圆芯片的制造工艺是否合格,以及是否需要进行后续的清洗或修复操作。
同时,我们还可以将检测结果与历史数据进行比对,以便发现和预防潜在的生产问题。
6. 实验与结果为了验证本方法的有效性,我们进行了一系列的实验。
实验结果表明,基于多目标模板匹配的晶圆芯片检测方法在准确性和效率上都具备优势。
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Multiple Eigenspaces for Hardware Accelerated ImageBased RenderingMarkus Grabner1,Horst Bischof1,Christopher Zach2,Andrej Ferko11ICG,TU Graz,Austria,2VRVis Research Center,Graz,Austria {grabner,bischof,zach,ferko}@icg.tu-graz.ac.atAbstract:We present a novel hardware accelerated method for rendering images of a3D scene.The method uses the recently proposed multiple eigenspace method to obtain an efficient represen-tation of rotated objects that can be easily implemented on modern graphics cards using their fragment shader capabilities.Due to the restrictions of current graphics hardware(which are discussed in detail),the multiple eigenspaces method(originally proposed for the purpose of object recognition)has to be slightly modified.We use the Stanford Bunny model to evaluate our method.Our experiments demonstrate the excellent performance of hardware-based image reconstruction.1IntroductionA variety of so-called image-based rendering(IBR[9])techniques has been developed to solve the problem of photorealistic rendering.The basic idea is to replace complex geometry and illumination by an image of the surface(or,more recently,multiple images).These images can be precomputed using sophisticated rendering techniques with almost no restriction in computational complexity.Alternatively,images of an object can be taken directly in its natural environment(or under laboratory conditions for better control of illumination),thus bypassing the3D reconstruction stage entirely.If the user should be allowed to view the scene from any position and direction,the complete five-dimensional plenoptic function[9]needs to be sampled(and properly reconstructed for rendering).In the absence of obstructions,this function can be reduced to a four-dimensional function,called Lumigraph[6]or lightfield[8].A much simpler approach is the billboard concept[3].It uses a single two-dimensional image that is rotated(with one or two degrees of freedom)to be always oriented towards the viewpoint.Billboards are only suitable for objects that are almost rotationally symmetric(such as trees and similar objects).This technique is implemented in the wide-spread VRML language[11].As an intermediate solution between the billboard concept and sophisticated approximations of the plenoptic function,we present a technique that captures the object’s appearance with one degree of freedom(i.e.,a rotation around the vertical axis).Thus a three-dimensional function f(x,y,ϕ)is created,whereϕis the angle of rotation.To reduce the amount of data, compression is done in our method by multiple eigenspaces decomposition[7]of the different views of the object.Thefinal image is composited by graphics hardware,such as recent boards by NVidia and ATI.The fragment shader capabilities of these boards are accessed by the language“Cg”[1].This allows almost platform-independent code.Moreover,we expect our method tofit nicely and efficiently into a polygonal rendering environment.This paper is organized as follows.Related methods are shortly reviewed in Section2.Details on our method are given in Section3,experimental results are presented in Section4.The paper is concluded in Section5.2Related work2.1Multiple eigenspacesA correlated set of images can be compressed by using eigenspaces[10].The obtained compres-sion will be quite good if the whole set of images is highly correlated.However,if the object to be compressed has a different appearance from various view-points,the obtained compression is not optimal.To alleviate that problem,a novel self-organizing framework to construct mul-tiple,low-dimensional eigenspaces from a set of training images has recently been proposed[7]. Grouping of images is systematically and robustly performed via eigenspace-growing in terms of low-dimensional eigenspaces.To further increase the robustness,the eigenspace-growing is initiated independently with many seeds(small groups of images).All these grown eigenspaces are treated as hypotheses that are subject to a selection procedure eigenspace-selection,based on the minimum description length principle(MDL),which selects thefinal resulting set of eigenspaces as an efficient representation of the training set,taking into account the number of images encompassed by the eigenspaces,their dimensions,and their corresponding residual errors.In this framework each image x can then be represented as a linear combination of eigenimages forming an eigenspace:x i= m j=1I(i)j d j k=1c(i)jk e jk,m is the number of all eigenspaces,d j is the dimension of the j-th eigenspace,I(i)j is a variable which is1for the j-th eigenspace which encodes the image x i and0otherwise,and c jk and e jk are the corresponding coefficients and eigenimages,respectively.All the required parameters are found completely automatically.2.2Image-based renderingPlenoptic modeling[9]has been introduced as a general framework for image-based rendering. The authors state that the goal of any image-based rendering system is the generation of a continuous representation of the plenoptic function,given a set of discrete samples.An informed survey on IBR can be found in[4].If we are only interested in a single object without obstructions,a four-dimensional represen-tation of the lightflow is sufficient,as it was independently presented by Gortler[6]and Levoy [8]at the same conference.Both authors state a huge amount of data required to represent even the reduced four-dimensional light distribution function.Although compression ratios of better than1:100have been reported[6,8],the resulting data sets(several megabytes in size)are still prohibitive for remote visualization purposes over any network except high-speed LANs.In the dynamic textures approach[5],small details on a(polygonal)surface are captured by principal component analysis.While the coarse geometry is rendered traditionally,surface details are applied by image based rendering.A hardware implementation of the algorithm using texture blending is proposed.The method requires up to100texture bases,in contrast to the rather small eigenspace dimension in our method.3Our Method3.1Eigenspaces constructionInput images are assigned to eigenspaces by performing the calculations with scaled down color images.Once the assignment is determined,the computation is done in full resolution.In order to use multiple eigenspaces on graphics card we have to take into account the limited number of texture buffers available.In addition we require that all eigenspaces have a similar reconstruction error(i.e.,in order to reduce annoying visualization artifacts when moving from one eigenspace to another).These requirements can be easily incorporated in the eigenspace growing process.3.2Hardware-based image reconstructionGraphics adapters offering at least some limited programmability of their fragment creation stage have become commonplace during the past years.However,theflexibility largely differs between graphics cards from different vendors and even between different models of the same vendor.The“Cg”language was designed by NVidia to overcome these problems[1].It(a)eigenimage3/1(b)histogram of1(a)(c)eigenimage5/1(d)histogram of1(c)Figure1:Eigenimages(256×256pixels,green channel)scaled to the range of texture images and the corresponding histogramsis a high-level language(similar to the popular“C”programming language)to encapsulate hardware details in a platform-specific compiler back-end.However,to achieve optimal results, the programmer should be aware of limitations of the target platform.The following discussion refers to NVidia’s GeForce4since it fulfills the minimum requirements for image reconstruction from multiple eigenspaces.Eigenimages and the mean image have to be stored as texture images with an integer range from0to255.Numeric operations in the fragment shaders are performed infixed point registers of eight bits plus one sign bit. Mapping the input range from[0;255]to[−1;+1]is supported in hardware without additional computation time.Similar considerations apply to the coefficients,which are passed as the RGBA components of a color register.The number of texture images that can be processed simultaneously is limited to four on the GeForce4.Now let us examine how the image reconstruction equationy=Ni=0c i x i(1)for a single eigenspace will be processed in hardware.Note that for uniformity we consider the mean image to be given by x o with a constant coefficient c0=1.The remaining coefficients c i for the eigenimages x i are linearly interpolated between the values computed for the input orientations.Equation1cannot be calculated exactly for two reasons.First,the number of texture images that can be processed in a single render pass is limited to four,therefore only the mean image and three eigenimages can be used(we define M=min(N,3)in our case).It is straightforward to incorporate this limitation into the multiple eigenspaces framework by using a maximum eigenspace dimension in the growing step of the algorithm as indicated in Section3.1.Second, due to the limited number of bits,calculations are performed with quantized values˜c i=c i+q i#include"structs.h"float4main(VertexOut In,uniform sampler2D img0,uniform sampler2D img1,uniform sampler2D img2,uniform sampler2D img3):COLOR{return4*(In.coeffs[0]-0.5)*(tex2D(img0,In.texCoord0.xy)-0.5)+4*(In.coeffs[1]-0.5)*(tex2D(img1,In.texCoord1.xy)-0.5)+4*(In.coeffs[2]-0.5)*(tex2D(img2,In.texCoord2.xy)-0.5)+2*(In.coeffs[3]-0.5)*tex2D(img3,In.texCoord3.xy);}Figure2:Cg code for fragment shader(optimized for NVidia GeForce4cards)and˜x i=x i+r i instead of the exact values c i and x i.The quantized output image is then computed as˜y=Mi=0˜c i˜x i+s=Mi=0(c i+q i)(x i+r i)+s=y+Mi=0(q i x i+c i r i)A+Mi=0q r iB+s≈y.(2)The quantization errors q i and r i are small compared to the values of c i and x i,respectively, if the available range is used appropriately.This is the case in Figures1(a)and1(b),and to some extent in Figures1(c)and1(d).Therefore the term B in Equation2can clearly be neglected.The term s amounts to truncating the computation result due to the limited color resolution of the display device.Since the human eye can only resolve approximately 100different values of each color channel within the dynamic range of a monitor,s does not introduce any visible error and can also be neglected.Finally,since the quantization errors are not correlated with each other,they tend to cancel out each other,making the term A also negligible.We therefore conclude that quantization due to hardware limitations has no serious impact on image reconstruction.The resulting image is rendered in a plane that always faces the viewer(much like a billboard[3]).The Cg code evaluating Equation2and performing the necessary range transformations is shown in Figure2(see[1]for full details on the Cg language).The method also works for ATI’s Radeon9700boards.However,ATI’s moreflexible hardware(up to16floating point textures processed in a single pass)could be used to almost entirely eliminate quantization effects(except for thefinal result).This is left as future work.(a)0◦(b)60◦(c)120◦(d)180◦(e)240◦(f)300◦Figure3:Bunny model reconstructed for different orientations4ResultsWe have performed experiments with several objects.Depending on the complexity of the object we get a different number of eigenspaces.For example Figure3shows several recon-structions of the Stanford Bunny.From72views used for training the algorithm created5 eigenspaces with dimension3each.A high-frequency texture has been applied to the model to be able to better observe reconstruction errors.Figure4illustrates eigenspace construction for the Bunny model.During the growing phase, 35eigenspaces are taken into account(Figure4(a)),while only5eigenspaces remain after the selection phase(Figure4(b)).4.1AppearanceSome of the reconstructed images appear clean and(almost)sharp(Figures3(a),3(b),and 3(f)),while others are quite heavily blurred(Figure3(d)).The reason for the blurred images is the limited number of texture units(i.e.,truncating Equation1after a few terms).E i g e n s p a c e4.2extremely putation of the reconstruction (Equation 2)takes 560µs for the Bunny model (Figure 3)at full resolution on a GeForce4Ti4200.A scene consisting of 1000instances of the eigenspace Bunny could be rendered at interactive rates (i.e.,10to 15frames per second).5Conclusions and future workWe presented an image reconstruction method that uses current graphics hardware to calculate the linear combination of eigenimages.The method meets the high expectations regarding rendering performance.While our test platform,the NVidia GeForce4graphics card,fulfills the basic requirements,there is some room for improvements.The most annoying artefact is the clearly visible popping that occurs when switching between different eigenspaces.For proper blending,the system must be capable of interpolating between the eigenimages of two eigenspaces,which requires roughly twice the number of texture units.Therefore we expect these problems to be reduced when using more powerful hardware (e.g.,ATI Radeon 9700).Another solution could be multipass rendering,which has not yet been implemented in this context.Similar to other image-based rendering systems,the resolution of the final image is limited to the resolution of the input images in our method.For a close-up view of a highly detailed model it is therefore required to switch to a polygonal representation.However,as indicated in Section 4.2,our method is well suited for rendering a large number of objects at a small or medium scale.We would also like to note that an eigenspace dimension suitable for robust image recognition might not be sufficient for generating high-quality images.This has to be taken into account when preparing eigenspaces for the use with image-based rendering methods.Eigenspaces are computed independently for each image channel(except thefixed assign-ment of input images to eigenspaces).Providing a foreground/background mask in the alpha channel would improve our method’s compatibility with polygonal models without increas-ing computation time.Moreover,the method can be put into a real-time rendering frame-work featuring multiresolution and progressive transmission.This involves compression of the eigenimages(e.g.,using the wavelet capabilities of JPEG2000[2])and a budget rendering mechanism to optimally utilize available resources.References[1]The NVIDIA Cg Compiler–C for Graphics.Technical Report TB-00511-001-v01,NVidia Corporation,June2002.[2]Michael D.Adams.The JPEG-2000still image compression standard,December2002.ISO/IEC JTC1/SC29/WG1N2412.[3]Tomas Akenine-M¨o ller and Eric Haines.Real-time rendering.A K Peters,Ltd.,63South Avenue,Natick,MA01760,second edition,2002.ISBN1-56881-182-9.[4]Daniel G.Aliaga,Thomas Funkhouser,Dimah Yanovsky,and Ingrid Carlbom.Sea 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