日本电气化学(Denka)散热铝基板中文介绍

DENKI KAGAKU KOGYO K.K.
日本电气化学工业有限公司
DENKA
The field suitable for Hybrid IC
适用与混合集成电路领域
Classification of printed circuit board 印刷线路板的分类
Flexiuble substrate 柔性基板
Ceramic substrate 陶瓷基片
Insulated Metal Substrate 绝缘金属基材
Substrate with thick film circuit.厚膜陶瓷线路板
Substrate with thin circuit.薄膜陶瓷线路板 Substrate Multi-layer 多层陶瓷线路板 Metal Base Substrate ( Al, Cu, Fe) 金属基材(铝,铜,铁)
Metal Core Substrate (Al, Cu, Fe)金属芯基材(铝,铜,铁)
Metal Base Substrate with Multi-Layer (FR-4)多层环氧树脂金属基材
Paper based material (phenol) 纸基板(酚基材)
Glass cloth based material (epoxy, polyimide)玻璃基材（环氧树脂，聚酰亚胺）
Rigid substrate 刚性基板
Organic substrate 有机基板
Composite (combination with different materials)复合材料（与不同的材料结合）
Thermoplastic resin 热塑性树脂
Film material (polyimide, polyester)薄膜材料（聚酰亚胺，聚酯）
Comparison of properties with each substrate 每种基材的性能对照
*Al base type基本类型
Typical structure of IMS 标准层的典型结构
Conductor (Cu foil, etc.) 导体（铜箔等）
Insulator绝缘层Metal Base（Al, Cu, Fe, etc.)
金属基材（铝，铜，铁等）
Typical structure of HIC 典型的混合集成电路结构
Ni plating 镍层
Al wire铝丝
Plastic case塑胶外壳Semiconductor
半导体Chip resistance
贴片电阻Resin树脂
Lead terminal
引线端子
Insulator
绝缘层Aluminum board 铝板IMS 标准层
Development performance of IMS 标准层的发展方向
Improvement of Insulator 绝缘层的改善
→Higher thermal conductivity, higher reliability and higher heat resistance.
更高的导热系数，高可靠性和高耐热性.
R a t e d v o l t a g e (V )额定电压
Field of each substrate 每种基材的领域 K-1 一般型
性型
TH-1高耐热高导型
B-1超高导热型
Industrial machine 工业机器
Air conditioner
500
空调设备
HITT PLATE(IMS)
高导热铝基板
Alumina substrate 氧化铝层
AlN substrate 氮化铝层
Audio 音频
50
100
Rated current(A)
额定电流
Market request 市场需求
Cost down, down sizing and Higher thermal conductivity 低成本小型化高导热系数
Thermal 2W/mK conductivity 导热系数
4W/mK
8W/mK
T h e r m a l c o n d u c t i v i t y (W /m K ) 导热系数
Lineup of HITT PLATE’s insulator 绝缘高导热铝基板的应用范围
Heat cycle reliability 长期可靠性
T h e r m a l r e s i s t a n c e ºC /W 热变电阻
Comparison of HITT PLATE 高导热铝基板对照
1.2 1 0.8 0.6 0.4 0.2
Alumina substrate
氧化铝层
50 100 150 200 600 650
Thickness of insulator 绝缘层厚度
The results of thermal resistance by thermal viewer
IMS B-1(8W/mK) type IMS B-1类型
(0.125mmt) 热变电阻耐热测试的结果
Alumina DBC氧化铝合基板
(0.635mm)
Test sample
测试样品
基材substrate
TO-220
Low低High高（2SC2233) Max.temp.最高温度
℃℃
Typical properties of super high thermally conductive type典型的超高导热类型性能
DENKA HITT PLATE in Automotive 日本电气化学公司高导热铝基板在汽车上的应用
DC/DC converter 直流/直流转化器
ECU
电气转化装置
Generator
发动机
ＨＩＴＴPLATE 高导热铝基板EPS应急电源
Suspension controller
悬浮控制器
Technical trend of EPS应急电池的技术趋势
Replace to EPS应急电源的替代Fuel efficient will be better
3% compared with
hydromechanical power steering
与流体动力转向相比较燃烧性提高了3% Rapid diffusion to 1000cc ~ 2000cc car迅速提高了1000cc-2000cc卡路里
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High thermal conductivity
High heat resistance高导热系数高耐热性Large current 大电流reliability against solder crac k可靠性防焊裂
Improvement to decrease solder cracks of bear chip改善了芯片的焊裂
A shape of substrate under heat cycle test 基材热循环测试的模拟
Case of cool down在容器中冷却
Chip resistor贴片电阻Solder 焊盘
Aluminum plate铝板Case of heat up在容器中加热
Aluminum plate铝板
Solder crack //Close up 焊盘开裂//断路
Solder crack焊盘开裂
Chip resistor贴片电阻Solder焊盘
Cu foil铜箔
Chip resistor贴片电阻Solder焊盘
Solder crack焊盘开裂
Insulator绝缘层
Al base plate铝基
Glass transition point ( C) TMA method or DMA method 165(TMA)
ａｔ 25 ℃
在25度下 : Step by step increasing 96 hrs after PCT 压力锅煮（121 ℃,2atm ） treatment 96小时（121℃,2大气压）情况下 8.2
Glass transition point (℃)玻璃化温度(℃)
Typical properties of high heat cycle reliability type ”EL -1”耐焊裂型“EL-1”高热循环典型性测试
Revised 修订 : 08/23/'01
Items 项目
Thermal conductivity (W/mK )导热系数
Measurement condition, etc.
测量条件等
TMA method or DMA method 机械方法和动态力学方法
高导热高耐热
TH-1
4.0
一般型 K-1
2.0 耐焊裂型 EL-1
2.4-2.7 104(TMA) 57(DMA) Volume resistivity (Ohm cm)体积电阻率
Dielectric constant 介电常数 Dielectric loss tangent 介电损耗
Thickness of dielectric layer (um) 介电层厚度
Thermal resistance (℃/W) 热变电阻
ａｔ 1MHz 在1兆赫兹 ａｔ 1MHz 在1兆赫兹
SEM 扫描式电子显微镜 Denka method 便携式PH 分析仪
4.5 X 1016 7.2 0.004 125(Y type) 0.50
4.3 X 1015 7.0 0.004 100(Y type) 0.64 1.0ｘ 1015 7.4 0.024 110 0.51-0.55 Peeling strength (N/cm) 剥离强度 Normal condition ：Based on JIS C6481 正常状态：基于日本工业标准C6481 22.1
25.2 19.6 Dielectric breakdown voltage （KV ）
Normal condition 正常状态
8.3
6.8 3.5*1
voltage method 介质击穿电压KV 逐步增加电压 1000hrs after 85℃,85%RH,DC100V treatment 1000个小时85℃,85湿度直流电压100V% 5.7*1
1000hrs after 150℃,DC100V treatment 在150℃，电压100V 情况下1000小时后
5.0
5.5 5.7*1 4.2*1 3.8*1 4.0*1 3.7*1 Crack at solder after heat-cycle
焊盘开裂在焊后加热 Liquid-Liquid 液液层分析 -40℃(7min.) +125℃（7min.)
500 cycles 500个循环， Rate of Grade-C,D(%) 比率和等级 1000 cycles 1000个循环， － －
63 100
31
2125 chip resistor mounted 2125贴片电阻安装
All figures in the tables are typical values.所有的表格里是平均值
*1 Measured with comb-shaped pattern. 测量都是用梳型模式
*2 50hrs after PCT treatment. 压力锅煮实验50小时后
Rate of Grade-C,D(%) 比率和等级
Temperature measurementTO-220 (2SC2233)温度测量
Grade-A A 等级的没有开裂 No crack
2125 Tip resisto r 2125小电阻
Grade-B B 等级 芯片和焊盘连接处开裂
Crack at connection between chip and solder.
Silicone grease 硅层
Heatsink （Water-cooled ） 散热器(水冷)
Dielectric layer 介电层 Al plate 铝板
Eutectic solder 共熔焊接
Grade-C Grade-D Crack extending from the connection between chip and solder
C 等级 从芯片和焊盘连接处延伸出去开裂.
Crack 开裂
Broken electrical conductivity .D 等级 导电破坏
Crack 开裂
Crack 开裂
Fig.1 Measurement for thermal conductivity 引1:测量导电率
Size of Cu land under Tr. : 10 X 15mm,铜面的尺寸:10×15mm Size of substrate : 30 X 30mm,基材的尺寸: 30×30mm
Fig.2 Grade of cracks after heat cycle 引2.在热循环之后开裂的等级
I n c i d e n c e o f s o l d e r c r a c k (%) 焊裂的发生率
Comparison of solder crack property 焊盘开裂的性能比较
: -40℃–125℃
1000
Number of heat cycle 热循环次数
Items 项目Maximam Operating Temperture（℃）
by UL 在紫外线烘烤下,最大操作温度
High heat resistant type
M-2高耐热型(Under developing显影后）
1) 155
Traditional Type
K-1一般型115
High heat resistant type “M-2”高耐热型”M-2”
Table.MOT of the dielectric layers 介电层的表单数值
1.E+05
1.E+04
1.E+03
1)It is a recognition acquisition schedule in June-2005.
在2005年六月测试识别进度表
1.E+02
250 200 150 100
Oven Temperture烤箱温度
Fig1．Heat resistant test 引1.耐热测试
(Dielectric Strength)绝缘强度
New substrate has the high MOT(UL specification) and the excellent reliability.
新的基材有很高的关键性(UL规格下)和卓越的可靠性
High heat resistant type “M-2”高耐热型M-2
Table 1. Characteristics of the dielectric layers
表一 . 介电层的特性
Samples AL base plate: 1.5mm,Cu foil: 70um,dielectric layer: 150 um
铝基板样品:1.5毫米, 铜箔: 70微米, 介电层: 150微米
1)It is a recognition acquisition schedule in June-2005
在2005年六月测试识别进度表
D E N K A
High heat resistant type “M-2”高耐热型M-2
Table 2. Durability test result (typical values)
1)Measured with Φ20mm circle pattern. In accordance with JIS C2110.根据日本工业标准C2110用Φ20mm测量.
2)In accordance with JIS C6481.依据日本工业标准C6481.
D E N K A。