半导体词典

Abrupt junction 突变结Accelerated testing 加速实验

Acceptor 受主Acceptor atom 受主原子

Accumulation 积累、堆积Accumulating contact 积累接触

Accumulation region 积累区Accumulation layer 积累层

Active region 有源区Active component 有源元

Active device 有源器件Activation 激活

Activation energy 激活能Active region 有源（放大）区

Admittance 导纳Allowed band 允带

Alloy-junction device合金结器件Aluminum(Aluminium) 铝

Aluminum – oxide 铝氧化物Aluminum passivation 铝钝化

Ambipolar 双极的Ambient temperature 环境温度

Amorphous 无定形的，非晶体的Amplifier 功放扩音器放大器

Analogue(Analog) comparator 模拟比较器Angstrom 埃

Anneal 退火Anisotropic 各向异性的

Anode 阳极Arsenic (AS) 砷

Auger 俄歇Auger process 俄歇过程

Avalanche 雪崩Avalanche breakdown 雪崩击穿

Avalanche excitation雪崩激发

Background carrier 本底载流子Background doping 本底掺杂

Backward 反向Backward bias 反向偏置

Ballasting resistor 整流电阻Ball bond 球形键合

Band 能带Band gap 能带间隙

Barrier 势垒Barrier layer 势垒层

Barrier width 势垒宽度Base 基极

Base contact 基区接触Base stretching 基区扩展效应

Base transit time 基区渡越时间Base transport efficiency基区输运系数

Base-width modulation基区宽度调制Basis vector 基矢

Bias 偏置Bilateral switch 双向开关

Binary code 二进制代码Binary compound semiconductor 二元化合物半导体Bipolar 双极性的Bipolar Junction Transistor (BJT)双极晶体管

Bloch 布洛赫Blocking band 阻挡能带

Blocking contact 阻挡接触Body - centered 体心立方

Body-centred cubic structure 体立心结构Boltzmann 波尔兹曼

Bond 键、键合Bonding electron 价电子

Bonding pad 键合点Bootstrap circuit 自举电路

Bootstrapped emitter follower 自举射极跟随器Boron 硼

Borosilicate glass 硼硅玻璃Boundary condition 边界条件

Bound electron 束缚电子Breadboard 模拟板、实验板

Break down 击穿Break over 转折

Brillouin 布里渊Brillouin zone 布里渊区

Built-in 内建的Build-in electric field 内建电场

Bulk 体/体内Bulk absorption 体吸收

Bulk generation 体产生Bulk recombination 体复合

Burn - in 老化Burn out 烧毁

Buried channel 埋沟Buried diffusion region 隐埋扩散区

Can 外壳Capacitance 电容

Capture cross section 俘获截面Capture carrier 俘获载流子

Carrier 载流子、载波Carry bit 进位位

Carry-in bit 进位输入Carry-out bit 进位输出

Cascade 级联Case 管壳

Cathode 阴极Center 中心

Ceramic 陶瓷（的）Channel 沟道

Channel breakdown 沟道击穿Channel current 沟道电流

Channel doping 沟道掺杂Channel shortening 沟道缩短

Channel width 沟道宽度Characteristic impedance 特征阻抗

Charge 电荷、充电Charge-compensation effects 电荷补偿效应

Charge conservation 电荷守恒Charge neutrality condition 电中性条件

Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储

Chemmical etching 化学腐蚀法Chemically-Polish 化学抛光

Chemmically-Mechanically Polish (CMP) 化学机械抛光Chip 芯片

Chip yield 芯片成品率Clamped 箝位

Clamping diode 箝位二极管Cleavage plane 解理面

Clock rate 时钟频率Clock generator 时钟发生器

Clock flip-flop 时钟触发器Close-packed structure 密堆积结构

Close-loop gain 闭环增益Collector 集电极

Collision 碰撞Compensated OP-AMP 补偿运放

Common-base/collector/emitter connection 共基极/集电极/发射极连接

Common-gate/drain/source connection 共栅/漏/源连接

Common-mode gain 共模增益Common-mode input 共模输入

Common-mode rejection ratio (CMRR) 共模抑制比

Compatibility 兼容性Compensation 补偿

Compensated impurities 补偿杂质Compensated semiconductor 补偿半导体Complementary Darlington circuit 互补达林顿电路

Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS)

互补金属氧化物半导体场效应晶体管

Complementary error function 余误差函数

Computer-aided design (CAD)/test(CAT)/manufacture(CAM) 计算机辅助设计/ 测试/制造

Compound Semiconductor 化合物半导体Conductance 电导