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A a
A.O.I(Automatic Optical Inspection)自动光学检查Acceptable quality level (AQL)可接受质量水平Accuracy精确度Activating活化
Active carbon treatment活性碳处理After Pressed Thickness压板后之厚度Alignment校直,结盟Annular ring锡圈
Anti-Static Bag静电胶袋Apparatus设备,仪器Area面积
Artwork菲林
Artwork Drawing菲林图形Artwork Film原装菲林Artwork Modification菲林修改Artwork No.菲林编号Assembly组装,装配Axis轴
B b
Backplane背板
Back-up垫板
Baking 烘板
Ball Grid Array (BGA)球栅阵列
Bare board裸板
Base Copper底铜
Base material基材
Bevelling斜边
Black Oxide黑氧化
Blind via hole盲孔Blistering起泡/水泡Board Cutting开料
Board Thickness板厚
Bottom side底层Breakaway tab打断点Brushing磨刷
Build-up积层
Bullet pad子弹盘
Buried hole埋孔
C c
C/M(Component Marking)元件字符Carbon ink碳油
Carrier带板Ceramic substrate陶瓷Certificate of Compliance合格证书Chamfer倒角Chemical cleaning化学清洗Chemical corrosion化学腐蚀Chip Scale Package (CSP)晶片比例包装Circuit线路Clearance间距/间隙Color颜色Component Side(C/S)元件面Composite layers复合层Computer Aided Design (CAD)电脑辅助设计Computer Aided Manufacturing (CAM)电脑辅助制作Computer Numerical Control (CNC)数控Conductor导体Conductor width/space导体线宽/线隙Contact接点
Copper area铜面积Copper clad铜箔
Copper foil铜箔
Copper plating0电镀铜Corner角线
Corner mark板角记号Corner REG.Hole角位对位孔Cracking裂缝Creasing皱折Criterion规格,标准Crossection area切面
Cu/Sn Plating镀铜锡Current efficiency电流效率Customer客户Customer Drilling File客户钻孔资料Customer P/N客户产品编号D d
D/F Registration Hole干菲林对位孔D/F(Dry Film)干膜
Date Code日期代号Datum hole基准参考孔Daughter board子板Deburring去毛刺Defect缺陷Definition定义Delamination分层
Delay耽搁Delivery交货Densitomefer透光度计Density密度Department部门Description说明
Design origin设计原点Desmear去钻污,除胶Dessicant防潮珠Developer显影液,显影机Diamond钻石
Diazo film重氮片Dielectric breakdown介电击穿Dielectric constant介电常数Dielectric Thickness介电层厚度Dielectric Voltage Test绝缘测试Dimension尺寸Dimensional stability尺寸稳定性Direct/indirect直接/间接Distribution发放Document type文件种类Documentation Control文件控制Double sided board双面板
Drill bit钻咀
Drilling钻孔
Drilling Roughness钻孔粗糙度Dry Film 干菲林
Dry Film-Pattern干膜线路Dynamic动态
E e
ECN(Engineering Change Notification)工程更改通知Effective date有效期Electrical Test Fixture电测试 针床Electro migration漏电Electroconductive paste导电胶Electroless无电沉Electroless copper无电沉铜Electroless Ni无电沉镍Electroless Gold/Au无电沉金Engineering drawing工程图纸
Entek有机涂覆Epoxy glass substrate环氧玻璃基板Epoxy resin环氧基树脂Etch蚀刻
Etchback凹蚀
Etching蚀刻
E-Test Marking电测试标记
E-Test(Electrical Test)电测试Exposure曝光
External layer外层
F f
Fiducial mark基准点
Filling填充
Film Fabrication菲林制作
Final QC最终检查Finish Overall Board Thickness成品总板厚度Fixture夹具Flammability可燃性
Flash Gold薄金
Flexible易曲的,能变形的Flux助焊剂
G g
General information一般资料Ghost image重影
Glass transition temperature玻璃化湿度Gold Finger(G/F)金手指
Golden board金板
Grid网格
Ground plane地线层
H h
HAL(Hot Air Leveling)热风整平Hand Rout手锣Hardness硬度
Heat Sealed热密封Heat Shrink-warp热收缩Holding time停留时间Hole孔
Hole breakout破环
Hole density孔的密度Hole Diameter孔径
Hole location孔位
Hole Location Chart孔位座标表Hole Position Tolerance孔位误差Hole size孔尺寸
Hot Air Leveling(HAL)热风整平Humidity湿度
I
Identification标识,指标Image影像Imaging transfer图形转移Impedance阻抗Impedance Test阻抗测试Inner copper foil 内层铜箔Inspection检验Insulation resistance Test绝缘测试Inter Plane Separation内层分离Interleave Paper隔纸Internal layer内层Internal stress内应力Ionic cleanliness离子清洁度Isolation孤立Isolation Resistance绝缘电阻Item项目
K k
KEY board按键盘
Key slot槽孔
Kraft paper牛皮纸
L l
Laminate板材
Laminate Thickness材料厚度
Lamination void 层间空洞
Landless hole破孔
Laser plotter激光绘图机
Laser plotting激光绘图
Laser via hole激光穿孔
Layup层压配本
Lay-up Instruction压板指示
Legend字符
Legend Width字符宽度
Length长度
Lifted Lands残铜
Line Width线宽
Liquid液体
Location位置
Logic diagram逻辑图形
Logo唛头,标记
Lot size批卡
M m
Mark标记
Master drawing菲林图形
Material Thickness材料厚度
Material Type材料类型
Max. X-out坏板上限
Max.Board Thickness After Plating电镀后总板厚度之上限Measling白斑
Mech Drawing No.图纸编号Mechanical cleaning机械清洗
Metal金属
Method方法
MI(Manufacturing Instruction)生产制作指示Microstrip微条线
Min Conductor Copper Thickness最小线路铜厚
Min Hole Wall Copper Thickness最小孔壁铜厚
Min. Gold Plating Thickness最小金厚
Min. Nickel Thickness最小镍厚
Min. Tin-Lead Thickness (After HAL)(喷锡后)最小锡厚Min.Annular Ring最小环宽
Min.Spacing between Line to Line线与线之间的最小距离Min.Spacing between Line to Pad线与焊盘之间的最小距离Min.Spacing between Pad to Pad焊盘与焊盘之间的最小距离Minimum 最小
Mirroring镜像
Missing 缺少
Model No.产品名称
Molded模塑
Mother board主板
Moulding模房
Mounting hole安装孔
Multilayer多层板
Multi-layer Laminate多层板材料
N n
Negative反面的
Net list网络表
Network网络
Nick缺口
No. of holes孔数
No.of Array/Panel每个拼板套板数
No.of Panel per Stack每叠板数
No.of Panel/Sheet每张大料拼板数
No.of Pcs Per Bag每包数量
No.of Unit/Array每套单元数
Normal value标准值
O o
Oblong椭圆形的
Offset 偏移
Open/short开路/短路
Optimization(design)最佳化(设计)
Organic Solerability Peservatives(OSP)有机保护剂
Originator原作者
Outer copper foil外层铜箔
Outline外形
P p
Packing包装
Packing包装
Pad焊盘
Panel Area拼板面积
Panel Plated Crack板镀缺口
Panel plating整板电镀
Panel Size拼板尺寸
Panel Size After Outerlayer Cutting外层切板后拼板尺寸Panel Utilization拼板利用率
Pass rate通过率Passivation钝化
Pattern线路
Pattern Inspection线路检查
Pattern plating图形电镀
PCB(Printed Circuit Board)印制线路板
Peck drilling啄钻
Peel strength 剥离强度
Peelable可剥性
Peelable 剥离强度
Peelable Mask可脱油
Peeling剥离
Permanent永久性
PH value PH值
Photo plotting图形输出
Photo via hole菲林过孔Photographers照片靶标Photoplotler光绘机
Physical物理的
Pin hole销定孔
Pink ring粉红环
Pinning hole钻孔管位
Pitch间距
Placement放置
Plated Though Hole(PTH)沉铜
Plating电镀
Plating Crack电镀裂缝
Plating line电镀线
Plating rack电镀架
Plating Void电镀针孔
Plug Hole塞孔
Polymer聚合体
Porosity孔隙率
Positive绝对的
Power plane电源层
Prepreg半固化片Primary side首面
Print印刷
Probe point针床测点Process工序
Process flow工序流程Product Planning Dept.生产计划部Production生产板
Profile外形
Profiling 外形加工Profiling Process外形加工
Project No.产品编号
PTH Thermal Seress Test PTH热冲击测试PTH(Plating Through Hole)沉铜
Pull away拉离
Punch啤模
Punching冲切
Punching Mould Drawing啤模图形
Q q
QA Audit品质审计
QA(Quanlity Assurance)品质部
Quad Palt Pack (QFP)四边扁平林整器件Quality质量
Quantity数量
R r
Raw Material Utilization原材料利用率Recall回收
Rectifier整流器
Register mark对位点Registration重合点
Remark备注
Resin树脂
Resin Recession流胶
Resist抗蚀剂Resolution分辨率
Rigid精密的
Roller coating涂覆Roughening粗化
Round pad圆盘
Routing外形加工,铣板S s
S/M Material绿油物料
S/M(Solder Mask)阻焊
Sales 销售
Sample样板
Sampling inspection抽样检验Scaling factor缩放比例因素Scope范围
Scoring刻槽
Scratch划痕Secondary side第二面
Section Code组别代号Section Code Change组别代号更改Segment部分,片段Separated分离Sequence顺序
Sets套
Sheet Size大料尺寸Shematic diagram原理图
Shiny有光泽的,发光的Silk screen丝印
Silver film银盐片
Single/double单层/双面
Slot 槽,坑
Smear污点
Solder Mask阻焊
Solder mask on bare copper (smobc)裸铜覆盖阻焊膜Solder side焊接面
Solder Side C/M阻焊面字符Solder Side Cir.焊接面线路Solder Side Circuit焊接面
Solder Side S/M焊接面阻焊Solderability可焊性Solvent Test可溶性测试Spacing线距
Special requirement 特殊要求Specification详细说明,规范Spindle主轴
Split裂片
Square pad方块
Standard标准值
Static静态
Stencial网版
Step drilling分布钻
Step scale光梯尺
Store货仓
Supplier供应商Supported hole支撑点Surface表面
Surface mount technology表面组装技术Swimming滑移
T t
Tack堆起
Tape Programming铬带制作
Tape Test胶带测试Target Hole目标孔Teardrop 泪珠Template天平
Tenting封孔
Test测试
Test coupon图样
Test Parameter测试参数
Test Pattern测试孔Testing Voltage电压
Thermal shock热冲击Thermal stress热应力Thickness厚度
Tin Content锡含量
Tin/Lead Stripping退铅锡
Tin-lead plating电镀铅锡
Tolerance公差
Top side板面
Touch up修理(执漏) Training训练Transmission传输线Transmittance传送
Trim line修剪
U u
Ultrasonic cleaning超声波清洗Undercut侧蚀
Unit Arrangement单元排版
Unit Layout Per Panel单元拼板图
Uv-blocking 阻挡紫外线
V v
Vacunm Pack真空包装Vacuum lamination真空压制
V-Cut V- 坑
View From…观察方向由…Visual & Warpage可视性和翘曲度Visual inspection目检
Voltage 电压
W w
W/F(Wet Film)湿膜
Warp & Twist翘曲和弯曲Wet Film湿模
Width宽度
Wiring线路。