PCB制程设计PCBA制程改善 DFM,DFT, Process, PCBA process_en.ppt
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1.1, Why we need to do DFx (DFM/DFT) analysis for PCB checking before we finalize the Gerber files?
First, the PCBs or PCBAs we design should match with PCB or PCBA supplier capability.
A,Small issue: no UL logo and PCB supplier information on the PCB. Actually, these words were printed under heatsink.
B,Balanced trace can prevent tombstone issue.
*1 Closed
Gerber out
6
26/06/2020
1.4,DFM/DFT check Item
DFM check Item including: Tooling hole Mounting hole Fiducial marks PTH, NPTH size Solder side clearance Component clearance Copper connection Silkscreen Solder mask color UL logo/PCB vendor Board size Post assembly issue
2.1,Supplies
ANSI Type
Tg (℃)
NP-180
High Tg, GA-180 High Td IT-180TC
UP-170
High Tg, Low Td
NP-170 GA-170
NPG-TL
Low Tg, High Td
DFT check Item including: Test coverage Test points on bottom/top side Test point style Test points need to added or modified
7
26/06/2020
2, PCB Process and Material
1.2, DFx Benefits
Improved design Decrease the time-to-market Decrease product cost Increase market share and profitability
5
26/06/2020
1.3,How to implement DFx process
This is HAT PCB Panelization Due to limited G PCB capabilities, 5mm clearance are required. But L PCB supplier can accept 2mm.
3
26/06/2020
Second, find some potential issues, In order to sure to avoid problems for PCB or product assembly.
PCBA Presentation
1
26/06/2020
Content Structure
1, DFM/DFT Introduction 2,PCB Process and Material 3, PCBA Process and SAC305 4, ICT Testing
2
26/06/2020
1, DFM/DFT Introduction
IT-155GTC IT-140GTC GA-HF14
GA-HF
GA-150
Low Tg , Low Td
GA-140 NP-140 UP-001TC
IT-140TC
Nanya Grace ITEQ Uniplus Nanya Grace Nanya ITEQ ITEQ Grace Grace Grace Grace Nanya Uniplus ITEQ
C, Thermal relief for PTH (Plated Through Hole) components insufficient solder issue.
D,Critical issue: H component can’t be located in the center of magnetic Core. It affects PCBA assembly. We’re thinking of some methods to fix it.
4
26/06/2020
Draw a conclusion:
It’s necessary to do DFx analysis before Gerber out. The value of DFx in PCBA design and manufacturing can be factored directly into the cost to produce a printed circuit board or assembly. If the PCB/PCBA is manufactured with defects, the manufacturers or LEM will have to bear the high cost for defects and repairs. The only way those defects can be identified is by tests or assembly.
R&D release Gerber files Flex receive data Flex run DFx
No
Meet DFx
Yes
Guidelin
Confirm DFx issue
e
LXX
Draw a conclusion
DFx Review
Meet DFx
Yes
Guideline
No
Arbitrate for Non-conform issue
First, the PCBs or PCBAs we design should match with PCB or PCBA supplier capability.
A,Small issue: no UL logo and PCB supplier information on the PCB. Actually, these words were printed under heatsink.
B,Balanced trace can prevent tombstone issue.
*1 Closed
Gerber out
6
26/06/2020
1.4,DFM/DFT check Item
DFM check Item including: Tooling hole Mounting hole Fiducial marks PTH, NPTH size Solder side clearance Component clearance Copper connection Silkscreen Solder mask color UL logo/PCB vendor Board size Post assembly issue
2.1,Supplies
ANSI Type
Tg (℃)
NP-180
High Tg, GA-180 High Td IT-180TC
UP-170
High Tg, Low Td
NP-170 GA-170
NPG-TL
Low Tg, High Td
DFT check Item including: Test coverage Test points on bottom/top side Test point style Test points need to added or modified
7
26/06/2020
2, PCB Process and Material
1.2, DFx Benefits
Improved design Decrease the time-to-market Decrease product cost Increase market share and profitability
5
26/06/2020
1.3,How to implement DFx process
This is HAT PCB Panelization Due to limited G PCB capabilities, 5mm clearance are required. But L PCB supplier can accept 2mm.
3
26/06/2020
Second, find some potential issues, In order to sure to avoid problems for PCB or product assembly.
PCBA Presentation
1
26/06/2020
Content Structure
1, DFM/DFT Introduction 2,PCB Process and Material 3, PCBA Process and SAC305 4, ICT Testing
2
26/06/2020
1, DFM/DFT Introduction
IT-155GTC IT-140GTC GA-HF14
GA-HF
GA-150
Low Tg , Low Td
GA-140 NP-140 UP-001TC
IT-140TC
Nanya Grace ITEQ Uniplus Nanya Grace Nanya ITEQ ITEQ Grace Grace Grace Grace Nanya Uniplus ITEQ
C, Thermal relief for PTH (Plated Through Hole) components insufficient solder issue.
D,Critical issue: H component can’t be located in the center of magnetic Core. It affects PCBA assembly. We’re thinking of some methods to fix it.
4
26/06/2020
Draw a conclusion:
It’s necessary to do DFx analysis before Gerber out. The value of DFx in PCBA design and manufacturing can be factored directly into the cost to produce a printed circuit board or assembly. If the PCB/PCBA is manufactured with defects, the manufacturers or LEM will have to bear the high cost for defects and repairs. The only way those defects can be identified is by tests or assembly.
R&D release Gerber files Flex receive data Flex run DFx
No
Meet DFx
Yes
Guidelin
Confirm DFx issue
e
LXX
Draw a conclusion
DFx Review
Meet DFx
Yes
Guideline
No
Arbitrate for Non-conform issue