客户审厂问题

Doc 3.1 There is no evidence engineer carefully check the customer specification/drawing VS actual engineering capability before production; (没有证据显 示在生产前工程师有对客户的制作要求和资料与我们公司 的实际工艺能力做详细对比)----工程
来自百度文库原因分析
改善措施
2.1.3 It was the scrubbing trace of inner layer preptreat process were out of WI requirement, but still accept by operator(WI: 10-15mm; Act: 8, 9 etc.)(内 层工序的磨痕测试结果未能达到WI的要求范围,但生产仍 然判定为合格(WI要求10-15mm,而实际记录为8,9mm)--内层 2.2 It was found some PCBs stored on inner layer pretreat shelf over half year, but the photo-sensitivity ink still not stripped to protect the quality of Laminate;(在内层工序发现有PCB已经存放超过半年,但 上面的油墨仍没被洗掉以保护板料 )------内层control;(内 2.3 Very poor inner layer dry film process 层干菲林工序整体管控不好) 2.3.1 It was found many oxidized PCBs waiting print photo-sensitivity ink;(待丝印的板有很多已经氧 化)----内层 2.3.2 It was found the PCB oxidized, but time card shown it was just scrubbed, it shown the scrubbing process is not stable or the environment control of clean room is not good;(在内层工序发现一些氧化的板, 而时间标识显示却是刚磨进来的,这表明前处理磨板机不 稳定或者是无尘室的环境控制的不好)--------内层 2.3.3 There is no stickiness test for photosensitivity ink;(湿膜未做粘度测试)----内层 2.3.4 There is no thickness test of photosensitivity ink;(丝印后的板对湿膜厚度未做测量)-------内层 2.3.5 The particle count control only is 100k, but EMR require is 10K;(无尘室控制为百万级,但客户要求做 到十万级)-----内层 2.3.6 It was found much dust on the printed PCBs and some PCBs already scratched after printing, it will seriously effect on the quality; (已经丝印好的和磨 好待丝印的板上有很多垃圾,严重影响品质)------内层 2.4 There is no evidence that inpector did test the space and trace after inner layer etching;(没有证据显 示在内层蚀刻后测试了线宽线距)------内层 2.5 No allow to repair for open/nick;(内层不允许修理开 /短路)----AOI 2.6 There is no AOI failure data analyse;(AOI一次合格 率低于目标值时无分析改善报告)-----AOI 2.7 There is no evidence that operator did re-do the temperature curve when it is not met WI requirement, (WI: 1,5-2.5 C; Act: 1.5-3.0)(在实际生产时升温速率与WI 不同,没有记录显示生产有做调整(WI要求1.5-2.5,实际为 1.5-3.0))------压合 2.8 The WI did define the minimum vacumm degree during pressing;(WI未规定真空度的最低值)------压合/工 艺
问题点原因分析及改善措施
IQC and Warehouse(IQC和仓库） 1.1 It was found one box prepreg in cool store was wetted by water, Prepreg is sensitive material of RH and T, So it will seriously effect on the quality; （PP是 一种对温度和湿度要求非常严格的物料，但在冷冻仓库发 现一箱PP被水打湿，严重影响其品质）---仓库 1.2 It was found storage temperature of photosensitivity ink is 20-25C and LM600 soldermask is 20-30C, but the WI require is 16-20C, it is not meet the requirement of materials;（干膜要求的储存温度为 20-25C,LM600的绿油油墨要求的储存温度为20-30C,但 WI 16-20C, 与物料的要求不相 1.3上规定的储存温度要求都为 There is no IQC inspection for Prepreg incoming;(来料PP没有经过IQC检查)---品质 1.4 There is no evidence that the remain laminates was verified by IQC or IPQC before returning warehouse; remain laminate manage is poor in warehouse and Cutting area;(边料在退仓前没有经过 IQC或IPQC检查确认;仓库和开料区对边料的管理缺乏好 的方法 )---品质 /仓库 has no production date on it for 1.5 Some laminates shelf-life control and FIFO control;(仓库内有些板料没 有来料日期,无法对板料的有效使用期进行管控,做到先进 先出.)----仓库 1.6 There is no evidence the laminate of S1000(Lot: 922022310) has inspected by IQC;(没有检查记录显示 IQC对S1000(LOT: 922022310)板料进行过检查)-----品质 1.7 The laminate supplier of Shengyi has highlighted the shelf-life only 2years, but Jove control is 3years;(生益板材保质期最大是2年,而中富的控制却为3 年)----仓库 Process(制程) 2.1 Some operators were not clearly known the WI requirements;(有些员工对WI的要求不是很清楚) 2.1.1 The FAI report requested record the copper thickness by OZ, but actully,some records is um;(首件 检查报告上要求铜厚测量单位是OZ,但实际记录单位为 um)-----2.1.2 品质 The Peel strength requested the standard is 3LB/in, but actual is 6LB or 8LB etc, and the actual test values were not met it, but still accepted;(棕化膜 的剥离强度要求标准是3LB/in,但实际记录为6LB/in 或 8LB/in,并且有些测试的实际值并未达到要求仍然判定合 格)---物理实验室)-------品质
2.9 There is no automatic or melding machine to combine the core laminates to ensure the registeration of layers;(没有自动熔胶机和自动铆钉机来 保证层间的对准度)------压合 2.10 Much metal residue on the combination desk, It will cause short issue after pressing;(压合的桌子上有 很多金属碎片,容易导致短路)----压合 2.11 Operater didn't used the same brand of prepreg with laminate supplier;(压合使用的PP与板材不是同一 供应商)----压合 2.12 No MTO control for Au tank and nickel corrosion test;(金缸MTO控制和镍腐蚀测试未做)------沉金/工艺 2.13 The P% didn’t define in WI clearly;(WI未对沉金线 金缸的磷含量做出界定)------沉金/工艺 2.14 There is no evidence that inpector has had re-do FAI when the x-ray inspection result failure; and the misalignment of hole issue frequenctly caused over near one month(没有记录显示使用X-RAY进行钻孔首件 检查不合格后有重做首件,并且偏孔情况已经持续超过一 个月而无原因分析和改善措施 )--品质 2.15 The temperature setting of immersion Cu didn't meet WI(WI:30-34 C; act: 35 C);(沉铜线铜缸设定温度与 WI上要求不一致(WI 要求30-34C,而实际设定35C)----湿区 2.16 It was found much dust on the silkscreen, shelf and ground, it will contaminated the soldermask;(阻 焊工序的网板,架子,地面有很多灰尘,会影响丝印)----绿油 2.17 There is no the critical disension test of hole to edge after routing;(锣板后未对关键位置的孔到边的距离 进行管控)---品质 2.18 Operator didn't input the work-life of routing to automatic control;（操作员没有输入锣刀锣程，无法有 效控制锣刀寿命）----外形 2.19 Need control the DI water quality;（需要控制DI水 的水质）----------工艺