不良项目中英文对照
各种不良的中英文对照表
Visiable line at material joint area due to release of internal stress. Gloss different due to internal stress releasing after painting at gate area, weld line, etc.
Remark
Remark
Rg Code Name Defect Name 201 Color Different/色差 202 Gloss Different/光泽差 Matting/麻点 203 Orange peel/橘皮 204 205 Runs/挂流 206 Miss Painting/漏喷 207 Over Painting/过喷 208 Air Bubble/气泡 Impurity/杂质 209 210 Scratch/划伤 Shiny Mark/亮斑 211
Defect Description A moderate depression on the surface of a part. The part is bent, twisted. Excess material not supposed to be on the part. Injection of the part is not complete. Line of joining of material Colour tone differences by the injection point. Colour tone differences in the surface. Blackened and burnt areas Colour tone stripes or dots in the surface Abrasion, groove on the surface. deviations appearing as shiny areas from the defined roughness of the surface. Air bubble on the surface Color deviation from target color Deviation from defined surface texture. Visible particles in or on the surface such as black dot, white dot, dust, grease, etc. Bump on the surface due to ejecting the part. A recess on the surface Ink was washed on the printing Caused by label is bigger than cavity Caused by label is smaller than cavity Handling Issue Logo, artwork position deviation Damage due to handling, transportation or packaging. The transparency on lens is not good. Missing material step due to slide not at the same level.
产品不良名称中英文对照
PC膜 不良
少切 Under cut 过切 Over Cut 剥离 Delamination 波纹 Wrinkle 压伤 Breaking 原物料不良 Material NG
刮伤 Scratch 透光 Dead Color, Transparency 黑点 Black Dot 起苍 Silver Streak 剥离 Delamination 冲墨 Wash out IMD冲膜 Wash out 缩水 Shrinkage 变形 Transfingeration / Deform 缺料 Void 折痕 Silver Break 脏污 Dirty / Contamination 偏位 Offset 凹点 Dented / Concave
Dirty / Contamination Scratch Distressed / Breaking Dented / Concave Convex Offset Deform Void Silver Break Split Abrade,grind
透光 Dead Color, Transparency
不良项中英文对照
制程
不良项
刮伤 Scratch 手痕 Finger Print
毛屑 Fiber
印刷点 Printing Dot
透光 Dead Color, Transparency
偏位 Biased, Offset
锯齿 Saw, Zigzag
色差 Discoloration
气泡 Bubble
折痕 Silver Break
模 Sticking 过火 BOuvrenr Size / Dimension out of 尺寸不符 spec. 压伤 Breaking 刮伤 Scratch 透光 Dead Color,Transparency 偏位 Deform 脏污 Dirty/Contamination 残胶 Adhensive Out/Glue Residual 溢胶 Glue Smear/Over Glue
不良中英文对照表
不良现象中英文对照表1.缺件(missing parts)2.错件(wrong parts)3.多件(excessive parts)4.短路(short)5.断路(open)6.线短(wire short)7.线长(wire long)8.拐线(wire poor ddress)9.冷焊(cold solder)10.包焊(excess solder)11.空焊(missing solder)12.锡尖(solder icicle)13.锡渣(solder splash)14.锡裂(soder crack)15.锡洞(pin hole)16.锡球(solder ball)17.锡桥(solder bridge)18.滑牙(screw loose)19.氧化(rust)20.异物(foreigner material)21.溢胶(excessive glue)22.锡短路(solder bridge)23.锡不足(solder insufficient)24.极性反(wrong polarity)25.脚未入(pin unseated)26.脚未出(pin unvisible)27.脚未剪(pin no cut)28.脚未弯(pin not bent)29.缺盖章(missing stamp)30.缺标签(missing label)31.缺序号(missing s/n)32.序号错(wrong s/n)33.标签错(wrong label)34.标示错(wrong mark)35.脚太短(pin short)36.j1不洁(j1 dirty)37.锡凹陷(solder scooped)38.线序错(w/l of wire)39.未测试(no test) 40.vr变形(vr deformed)43.零件沾胶(glue on parts)41.pcb翘皮(pcb peeling)42.pcb弯曲(pcb twist)44.零件脚长(parts pin long)45.浮件(parts lift)46.零件歪斜(parts tilt)47.零件相触(parts touch)48.零件变形(parts deformed)49.零件损坏(parts damaged)50.零件脚脏(pin dirty)51.零件多装(parts excess)52.零件沾锡(solder on parts)53.零件偏移(parts shift)54.包装错误(wrong packing)55.印章错误(wrong stamps)56.尺寸错误(dimension wrong)57.二极管坏(diode ng)58.晶体管坏(transistor ng)59.振荡器坏(x’tl ng)60.管装错误(tubes wrong)61.阻值错误(impedance wrong)62.版本错误(rev wrong)63.电测不良(test failure)64.版本未标(non rev lebel)65.包装损坏(packing damaged)66.印章模糊(stamps defective)67.标签歪斜(label tilt)68.外箱损坏(carton damaged)69.点胶不良(poor glue)70.ic座氧化(socket rust)71.缺ul标签(missing ul label)72.线材不良(wire failure)73.零件脚损坏(pin damaged)74.金手指沾锡(solder on golden fingers)75.包装文件错(racking doc wrong)76.包装数量错(packing q’ty wrong)77.零件未定位(parts unseated)78.金手指沾胶(glue on golden fingers)79.垫片安装不良(washer unseated)80.线材安装不良(wire unseated)81.立碑(tombstone)。
SMT常见不良中英文对照
SMT常见不良中英文对照1.缺件(MISSING PARTS)2.错件(WRONG PARTS)3.多件(EXCESSIVE PARTS)4.短路(SHORT)5.断路(OPEN)6.线短(WIRE SHORT)7.线长(WIRE LONG)8.拐线(WIREPOORDDRESS)9.冷焊(COLD SOLDER)10.包焊(EXCESSSOLDER)11.空焊(MISSING SOLDER)12.锡尖(SOLDER ICICLE)13.锡渣(SOLDER SPLASH)14.锡裂(SODER CRACK)15.锡洞(PINHOLE)16.锡球(SOLDER BALL)17.锡桥(SOLDER BRIDGE)18.滑牙(SCREWLOOSE)19.氧化(RUST)20.异物(FOREIGNER MATERIAL)21.溢胶(EXCESSIVEGLUE)22.锡短路(SOLDER BRIDGE)24.极性反(WRONG POLARITY)25.脚未入(PINUNSEATED)27.脚未剪(PINNOCUT)28脚未弯(PINNOTBENT)29.缺盖章(MISSINGSTAMP)31.缺序号(MISSINGS/N)32.序号错(WRONGS/N)34.标示错(WRONGMARK)35.脚太短(PINSHORT)36.J1不洁(J1DIRTY)37.锡凹陷(SOLDERSCOOPED)38.线序错(W/LOFWIRE)39.未测试(NOTEST)40.VR变形(VRDEFORMED)41.PCB翘皮(PCB PEELING)42.PCB弯曲(PCB TWIST)43.零件沾胶(GLUEONPARTS)44.零件脚长(PARTSPINLONG)45.浮件(PART SLIFT)46.零件歪斜(PARTSTILT)47.零件相触(PARTSTOUCH)48.零件变形(PARTSDEFORMED)49.零件损坏(PARTSDAMAGED)50.零件脚脏(PINDIRTY)51.零件多装(PARTSEXCESS)52.零件沾锡(SOLDERONPARTS)53.零件偏移(PARTSSHIFT)54.包装错误(WRONGPACKING)55.印章错误(WRONGSTAMPS)56.尺寸错误(DIMENSIONWRONG)57.二极管坏(DIODENG)58.晶体管坏(TRANSISTORNG)59.振荡器坏(X’TLNG)60.管装错误(TUBESWRONG)61.阻值错误(IMPEDANCEWRONG)62.版本错误(REVWRONG)63.电测不良(TESTFAILURE)64.版本未标(NONREVLEBEL)65.包装损坏(PACKINGDAMAGED)66.印章模糊(STAMPSDEFECTIVE)67.卷标歪斜(LABELTILT)68.外箱损坏(CARTONDAMAGED)69.点胶不良(POORGLUE)70.IC座氧化(SOCKETRUST)71.缺UL卷标(MISSINGULLABEL)72.线材不良(WIREFAILURE)73.零件脚损坏(PINDAMAGED)74.金手指沾锡(SOLDERONGOLDENFINGERS)76.包装数量错(PACKINGQ’TYWRONG)77.零件未定位(PARTSUNSEATED)79.垫片安装不良(WASHERUNSEATED)80.线材安装不良(WIREUNSEATED)。
不良项目中英文对照_
1>Abrasion: A surface imperfection that removes ordisplaces material characterized by its largewidth and length relative to its depth.中译: 擦破/磨损一个表面的瑕疵。
移动材料时造成较大的宽度、长度、深度之特徵。
2>Bleeding: This defect is the discoloration created by thediffusion of coloring material through anapplied coating from the substrate to thesurface of the coating.中译: 渗出染料扩散,自底层到表层,造成表面上的瑕疵。
3>Blemish: The change in the surface appearance due to aflaw or cosmetic defect.中译: 污损/污点因为一个瑕疵或外观不良而改变表面外部4>Blister: The raised bumps in the surface, caused by airor solvent vapors forming within or under thecoating.中译: 水泡由於来自烤漆内部或表面的空气或溶剂气体造成表面隆起突出。
5>Blush: Discoloration or change in gloss, generally appearing at the gates, abrupt thicknesschanges or other structures along flow pat.中译: 异色通常发生在射出进料口、肉厚突然缩减、或流道交错之处6>Bubble: A gas pocket in a plastic molded part. For acoating, it is the same as blister.中译: 气泡一个气体包覆(中空)在塑胶件上,对烤漆来说,与blister意义相同7>Burn Mark: A condition where supper-heated trapped air inthe cavity heats or burns the surface of theplastic part.中译: 焦痕8>Burr:This defect appears as a rough or sharp edgeon metal after it has been cast, cut, drilled,stamped, and so forth. Burrs will usually snagor tear a cleaning cloth.中译: 毛边(头) 在材料经过铸造、切割、钻孔、冲压等等外观形成一个粗糙或锐利边缘,毛边总是会刺穿或扯裂整齐的衣物。
不良描述中英文对照
不良描述中英文对照Goods Supplement补货1.Plastic parts 塑胶部件Abrasion/划痕、Bubbles/气泡、Burrs/毛刺、Bad Plating/电镀不良、Contamination/杂质、Crack/爆裂、Combine Lines/结合线、Deformation/变形、Flow Marks/流痕、GreasyDirt/油污、Haze/雾状、Jelly/泠胶、Mold Marks/模痕、Melange Color/混色、Oppilation Hole/盲孔、Pull White/拉白、Pour Hole uneven/浇口不平、Wrong Stamping/字麦不符、Short Shots/缺料、Shrinkage/缩水、Stripped Screw/螺丝滑牙、Top White/顶白、Weld Lines/夹水纹、Wrong Dimension/尺寸不符、Wrong Texture/纹理错误、Light/发亮,Gaps裂缝、Steps 披峰、表面有手指印Surface finger prints、丝印错误Wrong printing、丝印偏移Printing slanted、丝印重影Printing double image、丝印有污点,拖尾Printing smearing、丝印不平坦(多油或少油)Printing uneven ( thin / thick )、丝印对于中心偏位Printing off centre、压痕或凹痕Press mark 或dented mark、反光或毛刺Flashing 或 burr、镜片有针孔Pin hole on lens.光泽luster/白点white dot、黑点black dot、装配不合格assembled NG、缺口Nick裂split2.Metal Parts 五金部件Abrasion/划痕、Bad Weld/焊接不良、Burrs/毛刺、Bad Plating/电镀不良、Bend angle/折弯角度、Contamination/杂质、Crack/爆裂、Deformation/变形、Dents/凹痕、Greasy Dirt/油污、Mold Marks/模痕、Missing Stamp/漏冲压、Oppilation Hole/盲孔、Pressing Marks/压痕、Rust/生锈、Wrong Stamping/字麦错误、Short Shots/缺料、Stripped Screw/螺丝滑牙、Pits/疤痕、Specks/斑点、Wrong Texture/纹理错误、Wrong Dimension/尺寸不符3.Painting partsSilkScreen parts 喷油/丝印部件Inspection Points /检查要点 :Bleeding/渗色 ,Bad Painting/喷油不良 ,Contamination/杂质 ,deviate position/偏位 ,Flow Marks/流痕 ,Missing paint/漏喷,Over Paint/肥油 ,Pits/疤痕 ,Poor Adhesion/附着力差 ,Print Words Leans/印刷字体倾斜 ,Pooring Paint/薄油,Silkscreen Haze/丝印模糊 ,Silkscreen Stamping Inconsistency/丝印字样不一致 , Scratch/划伤 ,Speck/斑点 ,Uneven Surface Oil/表面油层不均匀 ,Words Break Off/字体断开 ,Wrong Color/错误颜色 ,Wrong Texture/纹理错误 ;4.PCB 印制线路板Open/开路;Short/短路;Weave Texture/板料席纹;Foreign Residue/外来杂物;Delamination/爆板,分层;Dent/凹陷;Dent on G/F/金手指凹陷;Scratch/擦花;Misregistration/对位不正;Board Damage/板子损坏;C/M Illegible/白字不清;C/M on pad/白字上垫;Copper expoure/露铜;Solder Mask on Pad/绿油上垫;Uneven Solder Mask/绿油不平均;Solder Mask peeling off/绿油脱落;Missing Hole/漏孔;Excess Hole/多孔;Wrong Hole Size/孔径错误;Hole Breakout/崩孔;Nick Trace/线路缺口;Void on Trace/线路铜穿;Diskdown/线路不良/狗牙;Solder Mask inside hole/绿油入孔; Discolouration under Solder Mask/绿油颜色不良; Foreign matter under Solder Mask/绿油下杂物; Solder Mask skipping/不过油;Solder on Gold Finger/金手指上锡;Poor Bevelling/斜边不良;Gold Finger burrs/金手指损坏;Ping Ring/粉红圈5.Electronic parts 电子元件No AVL/没AVL;not on AVL/不在AVL上;Mfg/Mfg P/N dis-match AVL/ 与AVL不符;D/C overdue/ D/C 过期;无D/C;wrong part/错料;no reel/无卷轴;bulk packing for chip/ 散装;No dry packing(HIC change color)/ 无真空包装(防潮卡变色); No ESD packing/无防静电包装;illegible marking/印字不清,wrong marking/印字错;deformation/变型 ;micro crack/裂料;damaged part/ 烂料 ;Lead bent(PTH/SMT)/脚弯;Solder balls damaged/锡球坏wrong lead form/脚型错;wrong pitch/脚距不符;coplanar problem/平整度不良;pad(lead) oxidization/锡垫(引脚)氧化;wrong direction in tape(tray)/带中(盘中)方向错;short pins/引脚短;failed in solderability/ 焊锡不良;size(dimensions) out of specification/ 尺寸超标;function fail/ 功能不良;no tolerance/无误差范围;contamination/杂质;wrong identification for pin1/ 第1脚标识错.Broker Buy/炒料;(巻装物料)巻带前无空余巻带No blank cover tape for feeder loading 巻带粘力不足Not enough adhesive for the cover tape. 料盘变形Reel Deforming/卷带变型.。
产品不良名称中英文对照
缺料 折痕 拉裂 擦伤 透光 少切 过切 剥离 波纹 压伤
组装
残胶 溢胶
PC膜 不良
原物料不良 Material NG
刮伤 透光 黑点 起苍 剥离 冲墨 缩水 变形 缺料 折痕 脏污 偏位 凹点 流痕 雾面 凸点
Scratch Dead Color, Transparency Black Dot Silver Streak Delamination Wash out Shrinkage Transfingeration / Deform Void Silver Break Dirty / Contamination Offset Dented / Concave Flow Mark Cloudy / Haze Convex Flash / Fiber Parting Line Flash / Flash Finger Print Others
不良项中英文对照
制程
刮伤 手痕 毛屑 印刷点 透光 偏位 锯齿 色差 气泡 折痕 收缩 溢墨 缺印 断线 鬼影 不全 污秽 字体 边缘裂 银点 缺墨 脏污 阴影 虚线 针孔 视窗偏位 视窗变形 凸点
不良项
Scratch Finger Print Fiber Printing Dot Dead Color, Transparency Biased, Offset Saw, Zigzag Discoloration Bubble Silver Break Shrinkage Wash out Lose Print Dot Line Double print Void Stain Word Problem Edge Crack Sliver Dot Lose Printing / Void Contamination Doule Print / Shadow Mark Dot Line Acicular Hole Window offset Window deform Convex
不良中英文对照
Wrong printing
印刷字體(圖案)與樣品不符/錯印
Mixing color
料紋
Smear
印刷字體(或圖案)模糊/飞油
Moisture/Silver mark
水氣
Wrong Location
印刷位置與樣品不符
Hole blocked
孔位堵塞(針斷無孔或有批峰)引起其他部件不正常工作
Uncompleted printing
斷字
Undercut
水口位高出、剪水口不平、(或穿孔)、(使用時用手感覺到的)
Double printing/excess painting
重影/肥油
Dent mark
壓缺//碰傷
Shortage
裝箱數量不符
Bubble
氣泡
Broken
部品破裂/崩損/折斷
Haze
透明產品透光程度不清晰(如鏡片)
Crack
裂痕
Mixed material
混料
Weld line
夾水紋
Wrinkle
皺紋
Over cut
修缺
Shining mark
反光(或發亮)
Ejector mark
發白或頂白
Flow mark
流痕
Warpage/ Deformation
變形(彎曲)
Uneven painting
噴油不均
Discoloration
變色(色差)
Rough Surrt molding
不滿膠
uneven printing
印刷字體(或圖案)有粗細
Gas mark
不良清单Annex: Defect Code List
不良品项目定义中英文对照版
和深度相對於寬度長,下的留件表面零刮傷﹕受尖銳硬物划踫而在S01度較長的線狀痕跡S02 毛刺﹕產品沖裁后留在零件剪切邊的批鋒S03 模痕﹕模具在成形零件過程中造成的均勻類似刮痕現象S04 壓傷﹕由于模具表面有異物﹐使產品在沖壓成形過程中受壓力作用在表面留下塊狀的下凹的現象S05 切邊不齊﹕產品沖裁后零件剪切邊呈現出不整齊的現象S06 晃動:由于產品平面度超出spec﹐而呈現出凹凸不平的現象S07 尺寸超差﹕產品的尺寸超出SpecS08 材料外觀不良﹕原材料本身就具有的一些如白斑﹐黑點 ,麻點﹐發黑﹐白灰﹐刮傷﹐氧化等方面的不良S09 抽牙不良﹕抽牙尺寸超出Spec﹐或是出現抽牙抽歪﹐抽牙抽裂的現象S10 攻牙不良﹕攻牙孔攻歪﹐通規不通﹐止規不止﹐或是出現實配螺絲打不進, 實配螺絲滑牙的現象S11 鉚合不良﹕鐵件鉚合后﹐鐵件與鐵件間間隙超Spec﹐或鉚合孔偏位﹐鉚合不牢固之現象S12 凸包/拱橋沖裂﹕受模具﹐沖床壓力﹐或材料硬度的影響﹐產品在成形過程中凸包/拱橋表面產生明顯的裂紋﹐或完全開裂的現象S13 少工程﹕產品成形的工程數少于作業文件所規定的工程數的現象S14 變形﹕由于受外力作用﹐產品失去其本身所應具有的形狀的現象S15 生鏽﹕基體材料表面或切邊呈現經色﹐發生化學氧化的現象S16 不潔﹕產品表面附著除油污﹐毛刺以外的其它異物S17 油污﹕粘附於零件表面能擦除的呈塊狀或膜狀的油脂或變色異物S18 碰刮傷﹕受尖銳硬物刮踫而在零件表面留下的﹐長度相對於寬度和深度較長的表面斑痕S19 包裝不良﹕產品的包裝方式未完全按照相應的作業文件來執行﹐可能會造成品質隱患的現象S20 混料﹕兩種或兩種以上的產品同時放置在某單一產品所存放的區域S21 點焊不良﹕產品點焊后鐵件與鐵件間連接不牢固﹐拉力測試超Spec.存在點焊點錯位﹐漏焊,虛焊,燒穿,焊渣等缺陷的現象S22 字模不清/殘缺/錯誤﹕Mark 字體不完整﹐模糊不清﹐字模的位置﹐式樣等未完全按作業文件要求作業的現象5.2.2 涂裝不良項目定義P01 雜質:由于烤漆面粘附有雜質﹐烤漆后在表面形成一種凸起的可剝落的塊狀或點狀漆的現象P02 刮傷/掉漆﹕烤漆表面在外力(碰撞﹐擦刮)作用下﹐漆層呈點狀﹐塊狀或成線狀(刮傷)破壞﹐可見或不可見底材的不良現象P03 凝漆﹕由于霧化不良或油漆未完全溶解造成在烤漆表面形成凸包狀漆塊的現象P04 發白﹕烤漆面受手指或包材碰擦﹐目視烤漆面有不同于烤漆本體顏色的白色痕跡P05 噴漆不良均勻﹕烤漆面油漆形成高低不平﹐或膜厚不一致的現象P06 少噴漆﹕產品的烤漆區域少于作業文件所規定的烤漆區域﹐或烤漆的膜厚太低﹐未達到所規定的標准P07 溢漆﹕烤漆時油漆霧化到非烤漆區域的現象P08 漆層剝落﹕由于油漆著力太差﹐膜厚過厚﹐油漆未充分烤干造成油漆剝離素材的現象P09 凹痕﹕由于烤漆素材表面有下陷不平﹐造成烤漆后表面有下凹的痕跡的現象P10 凸點﹕由于烤漆素材表面有凸包﹐造成烤漆后表面有上凸的現象P11 磨痕:素材表面被打磨過所留下的長度及寬度相對大於其深度之表面缺失P12 桔皮﹕由于油漆流平性不佳﹐或涂裝過厚使烤漆面形成類似于桔子皮的現象P13 膜厚超規格﹕烤漆層厚度超出QII 所規定的范圍P14 色差﹕烤漆的顏色超出SPC﹐與標准色板比對存在明顯顏色差異P15 酒精擦拭NG﹕使用98%以上純度無水乙醇和棉布﹐1kgf 的力在烤漆表面來回擦拭20~50 次后,目視烤漆面有明顯變化﹐或油漆有遷移到棉布上的現象P16 百格測試NG﹕用百格刀在烤漆表面划出見底材的1mm*1mm*100格﹐用3M膠帶緊緊粘住百格區域1 分鐘﹐將膠帶撕去﹐用4 倍的放大鏡觀察百格區域﹐脫漆面積大于總面積的5%的現象P17 沖擊測試NG﹕使用檢驗文件所規定的沖頭直徑和重錘下落高度﹐對烤漆件進行正沖和反沖后﹐烤漆件出現漆層剝落或龜裂的現象P18 表面發黑/發黃:產品前處理后表面鍍層顏色出現偏黑/偏黃的現象P19 皮膜發白:前處理后產品表面有白灰,或是表面鍍層顏色與正常產品相比偏白的現象規則的白色或暗色部份狀不后在產品表面形理前處: 水漬P20P21 包裝不良﹕產品的包裝方式未完全按照相應的作業文件來執行,可能會造成品質隱患的現象P22 混料﹕兩種或兩種以上的產品同時放置在某單一產品所存放的區域P23 咬花不良﹕咬花形狀與規格不符﹐或咬花表面分布不均勻的現象P24 油點﹕烤漆面存在類似于油漬點狀的現象P25 針孔﹕由于油漆粘度或烤漆爐溫過高﹐使產品在烤漆過程中形成氣泡破裂在烤漆表面呈現針孔狀的現象P26 異色點﹕烤漆表面存在不同于烤漆本體顏色的色點P27 殘漆粉﹕由于作業不良導致的在產品非噴漆區域出現油漆的不良現象P28 光澤過高/過低:噴漆產品光澤度測試超出或低于標准5.2.3 組裝不良項目定義A01 少件﹕組裝后產品零部件個數少于文件規定所應有個數A01 多件﹕組裝后產品零部件個數多于文件規定所應有個數。
不良现象中英文对照表(2)
41.PCB翘⽪(PCB PEELING) 42.PCB弯曲(PCB TWIST) 43.零件沾胶(GLUE ON PARTS) 44.零件脚长(PARTS PIN LONG) 45.浮件(PARTS LIFT) 46.零件歪斜(PARTS TILT) 47.零件相触(PARTS TOUCH) 48.零件变形(PARTS DEFORMED) 49.零件损坏(PARTS DAMAGED) 50.零件脚脏(PIN DIRTY) 51.零件多装(PARTS EXCESS) 52.零件沾锡(SOLDER ON PARTS) 53.零件偏移(PARTS SHIFT) 54.包装错误(WRONG PACKING) 55.印章错误(WRONG STAMPS) 56.尺⼨错误(DIMENSION WRONG) 57.⼆极管坏(DIODE NG) 58.晶体管坏(TRANSISTOR NG) 59.振荡器坏(X'TL NG) 60.管装错误(TUBES WRONG) 61.阻值错误(IMPEDANCE WRONG) 62.版本错误(REV WRONG) 63.电测不良(TEST FAILURE) 64.版本未标(NON REV LEBEL) 65.包装损坏(PACKING DAMAGED) 66.印章模糊(STAMPS DEFECTIVE) 67.标签歪斜(LABEL TILT) 68.外箱损坏(CARTON DAMAGED) 69.点胶不良(POOR GLUE) 70.IC座氧化(SOCKET RUST) 71.缺UL标签(MISSING UL LABEL) 72.线材不良(WIRE FAILURE) 73.零件脚损坏(PIN DAMAGED) 74.⾦⼿指沾锡(SOLDER ON GOLDEN FINGERS) 75.包装⽂件错(RACKING DOC WRONG) 76.包装数量错(PACKING Q'TY WRONG) 77.零件未定位(PARTS UNSEATED) 78.⾦⼿指沾胶(GLUE ON GOLDEN FINGERS) 79.垫⽚安装不良(WASHER UNSEATED) 80.线材安装不良(WIRE UNSEATED) 81.⽴碑(TOMBSTONE)。
不良现象中英文对照表
不良現象中英文對照表1.缺件(MISSING PARTS) 28.腳未彎(PIN NOT BENT) 55.印章錯誤(WRONG STAMPS)2.錯件(WRONG PARTS) 29.缺蓋章(MISSING STAMP) 56.尺寸錯誤(DIMENSION WRONG)3.多件(EXCESSIVE PARTS) 30.缺標籤(MISSING LABEL) 57.二極體壞(DIODE NG)4.短路(SHORT) 31.缺序號(MISSING S/N) 58.電晶體壞(TRANSISTOR NG)5.斷路(OPEN) 32.序號錯(WRONG S/N) 59.振盪器壞(X’TL NG)6.線短(WIRE SHORT) 33.標籤錯(WRONG LABEL) 60.管裝錯誤(TUBES WRONG)7.線長(WIRE LONG) 34.標示錯(WRONG MARK) 61.阻值錯誤(IMPEDANCE WRONG)8.拐線(WIRE POOR DDRESS) 35.腳太短(PIN SHORT) 62.版本錯誤(REV WRONG)9.冷焊(COLD SOLDER) 36.J1不潔(J1 DIRTY) 63.電測不良(TEST FAILURE)10.包焊(EXCESS SOLDER) 37.錫凹陷(SOLDER SCOOPED) 64.版本未標(NON REV LEBEL)11.空焊(MISSING SOLDER) 38.線序錯(W/L OF WIRE) 65.包裝損壞(PACKING DAMAGED)12.錫尖(SOLDER ICICLE) 39.未測試(NO TEST) 66.印章模糊(STAMPS DEFECTIVE)13.錫渣(SOLDER SPLASH) 40.VR變形(VR DEFORMED) 67.標籤歪斜(LABEL TILT)14.錫裂(SOLDER CRACK) 41.PCB翹皮(PCB PEELING) 68.外箱損壞(CARTON DAMAGED)15.錫洞(PIN HOLE) 42.PCB彎曲(PCB TWIST) 69.點膠不良(POOR GLUE)16.錫球(SOLDER BALL) 43.零件沾膠(GLUE ON PARTS) 70.IC座氧化(SOCKET RUST)17.錫橋(SOLDER BRIDGE) 44.零件腳長(PARTS PIN LONG) 71.缺UL標籤(MISSING UL LABEL)18.滑牙(SCREW LOOSE) 45.浮件(PARTS LIFT) 72.線材不良(WIRE FAILURE)19.氧化(RUST) 46.零件歪斜(PARTS TILT) 73.零件腳損壞(PIN DAMAGED)20.異物(FOREIGNER MA TERIAL) 47.零件相觸(PARTS TOUCH) 74.金手指沾錫(SOLDER ON GOLDEN FINGERS)21.溢膠(EXCESSIVE GLUE) 48.零件變形(PARTS DEFORMED) 75.包裝文件錯(RACKING DOC WRONG)22.錫短路(SOLDER BRIDGE) 49.零件損壞(PARTS DAMAGED) 76.包裝數量錯(PACKING Q’TY WRONG)23.錫不足(SOLDER INSUFFICIENT) 50.零件腳髒(PIN DIRTY) 77.零件未定位(PARTS UNSEA TED)24.極性反(WRONG POLARITY) 51.零件多裝(PARTS EXCESS) 78.金手指沾膠(GLUE ON GOLDEN FINGERS)25.腳未入(PIN UNSEATED) 52.零件沾錫(SOLDER ON PARTS) 79.墊片安裝不良(WASHER UNSEATED)26.腳未出(PIN UNVISIBLE) 53.零件偏移(PARTS SHIFT) 80.線材安裝不良(WIRE UNSEATED)27.腳未剪(PIN NO CUT) 54.包裝錯誤(WRONG PACKING) 81. 立碑(TOMBSTONE)。
不良现象中英文对照表
良现象中英文对照表不良现象中英文对照表1.缺件(MISSING PARTS)…missing parts2.错件(WRONG PARTS) wrong parts3.多件(EXCESSIVE PARTS…excessive parts4.短路(SHORT…short5.断路(OPEN)-open6.线短(WIRE SHORT…wire short7.线长(WIRE LONG)…wire long8.拐线(WIRE POOR DDRESS)-wire poor adress9.冷焊(COLD SOLDER)…cold solder10.包焊(EXCESS SOLDER)-excess solder11.空焊(MISSING SOLDER)- missing solder12.锡尖(SOLDER ICICLE) … icicle13.锡渣(SOLDER SPLASH)-• solder splash14.锡裂(SODER CRACK)-solder crack15.锡洞(PIN HOLE)..solder hole16.锡球(SOLDER BALL)..sloder ball17.锡桥(SOLDER BRIDGE…solder bridge18.滑牙(SCREW LOOSE)-screw loose19.氧化(RUST) … rust20.异物(FOREIGNER MATERIAL)-• foreigner material21.溢胶(EXCESSIVE GLUE)22.锡短路(SOLDER BRIDGE)23.锡不足(SOLDER INSUFFICIENT)24.极性反(WRONG POLARITY)25.脚未入(PIN UNSEATED)26.脚未出(PIN UNVISIBLE)27.脚未剪(PIN NO CUT)28.脚未弯(PIN NOT BENT)29.缺盖章(MISSING STAMP)30.缺标签(MISSING LABEL) … missing label31.缺序号(MISSING S/N)32.序号错(WRONG S/N)33.标签错(WRONG LABEL)34.标示错(WRONG MARK)35.脚太短(PIN SHORT)36.J1 不洁(J1 DIRTY)37.锡凹陷(SOLDER SCOOPED)38.线序错(W/L OF WIRE)39.未测试(NO TEST)40.VR 变形(VR DEFORMED]・deformel43.零件沾胶(GLUE ON PARTS)41.PCB 翘皮(PCB PEELING)42.PCB 弯曲(PCB TWIST)44.零件脚长(PARTS PIN LONG)45.浮件(PARTS LIFT)46.零件歪斜(PARTS TILT) ] tilt47.零件相触(PARTS TOUCH)48.零件变形(PARTS DEFORMED)49.零件损坏(PARTS DAMAGED)50.零件脚脏(PIN DIRTY)51.零件多装(PARTS EXCESS)52.零件沾锡(SOLDER ON PARTS)53.零件偏移(PARTS SHIFT)54.包装错误(WRONG PACKING)55.印章错误(WRONG STAMPS)56.尺寸错误(DIMENSION WRONG)57.二极管坏(DIODE NG)58.晶体管坏(TRANSISTOR NG)59.振荡器坏(X'TL NG)60.管装错误(TUBES WRONG)61.阻值错误(IMPEDANCE WRONG])impedance62.版本错误(REV WRONG)63.电测不良(TEST FAILURE)] test failure64.版本未标(NON REV LEBEL)65.包装损坏(PACKING DAMAGED)66.印章模糊(STAMPS DEFECTIVE)67.标签歪斜(LABEL TILT)68.外箱损坏(CARTON DAMAGED])carton damaged69.点胶不良(POOR GLUE)70.IC 座氧化(SOCKET RUST)71.缺UL 标签(MISSING UL LABEL)72.线材不良(WIRE FAILURE)73.零件脚损坏(PIN DAMAGED)74.金手指沾锡(SOLDER ON GOLDEN FINGERS)75.包装文件错(RACKING DOC WRONG)76.包装数量错(PACKING Q'TY WRONG)77.零件未定位(PARTS UNSEATED)78.金手指沾胶(GLUE ON GOLDEN FINGERS)79.垫片安装不良(WASHER UNSEATED])unseat80.线材安装不良(WIRE UNSEATED)81.立碑(TOMBSTONE)。
不良项目中英文对照
不良项目中英文对照Die cracked芯片暗裂Incorrect gold ball position焊球焊偏Contiaminated lead frame protrude reflector cup 支架沾胶Revensed leadcut切脚反向Lampdead灯死..............更多如下:以下内容只有回复后才可以浏览1.Excessive Ag paste 银胶过多2.Paste smudge 芯片沾胶3.Lead frame short 支架短路4.Incorrect die type芯片固错5. Die cracked 芯片破损6. insufficient Ag paste银胶过少7. Ag paste short circuit银胶短路8.Hpside down die 翻芯片9.Incorrect direction错方向10.Bonding pad defect 铝垫刮伤11.Die lean 芯片倾斜12.Missing die bonding position芯片方向固错13.Die stacking固重芯片14.Missing die漏固15.Incorrect paste positioning银胶点偏16.Missing die掉芯片17.Deformed lead frame 支架变形18. Contaminated lead frame支架沾胶19.Alien matters 杂物20.Incorrect position 位置不当21.Excessive nonconductive paste绝缘胶过多22.Insufficient nonconductive paste绝缘胶过少24.Reverse polarity reversed极性反向25.Incoreect wire bonding position偏焊26.Defective wire bonding错焊27.No stitch bonding松焊28.Mis-bonding边焊29.Gold ball size焊球大小30.Reeling 拔铝垫31.Wire break断线32.Defective wire线受损33.Wire loop height 芯片弧高34.Wire bonding defect 焊线线尾35.LIFTED Die 芯片抬起36.Tool marking 铜咀印37.Stitch bonding size焊点大小38.Mixed materlac混料39.No wire bonding 未焊线Defective bondin假焊Collapsed wire塌线Non-conformed product夹线Die ceacked芯片破裂......更多...............以下内容只有回复后才可以浏览45.Surplus wire 线尾46.Rust De-colourization生锈变色47.Incorrect epoxy height胶体过高过低48.Incorrect P/N型号不符49.Air bubble气泡50.Scratch mark疤痕51. Scratch mark顶面刮伤52.Defective molding 模坏扎模53.Water marks水气花纹54.Deformed epoxy毛边、凹凸胶55.Incorrect colour颜色不对56.Uneven diffusant雾状深浅57.Epoxy colour shading沉淀不良58.Slant mount偏心59.Alien matters杂物60.Reflector cup air bwbble碗气泡61.Excessive epoxy 表面沾胶62.Incorrect mounting模粒反向63.Miyed materiac混料64.Defective epoxy 胶不良65.Cracked epoxy胶龟裂66.Excessue protruding 凸胶67.Insufficient epoxy 凹胶68.Deformed epoxy 胶体变形69.Incorrect epoxy colour shade 胶变色70.Incorrect lamp colour 发光色泽不符71.Upper tie bar protrude 上bar毛边72.Lower tie bar protrude下bar毛边74.Refcelter protrude 碗外露76.Uneven brightness 亮度不均77.Uneven wave length 波长不均。
不良现象中英文对照表(1)
1.缺件(MISSING PARTS) 2.错件(WRONG PARTS) 3.多件(EXCESSIVE PARTS) 4.短路(SHORT) 5.断路(OPEN) 6.线短(WIRE SHORT) 7.线长(WIRE LONG) 8.拐线(WIRE POOR DDRESS) 9.冷焊(COLD SOLDER) 10.包焊(EXCESS SOLDER) 11.空焊(MISSING SOLDER) 12.锡尖(SOLDER ICICLE) 13.锡渣(SOLDER SPLASH) 14.锡裂(SODER CRACK) 15.锡洞(PIN HOLE) 16.锡球(SOLDER BALL) 17.锡桥(SOLDER BRIDGE) 18.滑牙(SCREW LOOSE) 19.氧化(RUST) 20.异物(FOREIGNER MATERIAL) 21.溢胶(EXCESSIVE GLUE) 22.锡短路(SOLDER BRIDGE) 23.锡不足(SOLDER INSUFFICIENT) 24.极性反(WRONG POLARITY) 25.脚未入(PIN UNSEATED) 26.脚未出(PIN UNVISIBLE) 27.脚未剪(PIN NO CUT) 28.脚未弯(PIN NOT BENT) 29.缺盖章(MISSING STAMP) 30.缺标签(MISSING LABEL) 31.缺序号(MISSING S/N) 32.序号错(WRONG S/N) 33.标签错(WRONG LABEL) 34.标示错(WRONG MARK) 35.脚太短(PIN SHORT)
36.J1不洁(JW/L OF WIRE) 39.未测试(NO TEST) 40.VR变形(VR DEFORMED)
中英文不良对照表
中英文不良对照表中英文不良对照表画面异常Picture deformed收敛不良Misconvergence色纯不良Purity NG亮度VR无作用Brightness VR no function对比VR无作用Contrast VR no function水平VR无作用H-size VR no function水平位置H-pos VR no function左右画差Picture close to one side零件翘脚Pin Bent缺件Missing Parts错件Wrong Parts短路Pin short错位Wrong Position of Parts断件Parts broken破损BreakdownLED闪LED Flash余光打点Spot when cut off不能Recall No Recall Function场VR无作用V-size VR no function场位置VR无作用V-Pos VR no function小姐腰VR无作用Pincushion VR no function亮度VR无作用Brightness VR bad function对比VR作用不良Contrast VR bad function接触不良Connections NG倾斜Screen tilt按键无功能No function key NG水平大小无法调No H-size function拖影Pix Drag/smearing垂直不同步V-Unsync死机No Power/Power off锡洞Solder hole虚焊Cold Solder未过板Component Leg Dislodged/Pin Bent亮度超规Brightness uniformity out of specW/U超规White uniformity out of specLED(v-size control rang)亮度不均LED (v-size control rang) having a reduced brightness 倾斜Tilt /swivel base hook was curve画抖Picture jump后壳右倾刮伤Back cover was scratched on right side孔塞Hole Bung无画No picture/No videoLED异常LED Abnormal模糊Blooming关机彩斑Strag Emissio异音Unusual Sound/Nolse from unlt画面一横线One Horz Line水平不同步H-Unsync聚集不良Poor focus画面一横线One hor line画面一竖线One ver line抖动Jitter按键不良Touch Key Failure行不同步Faulty H-sync场不同步Faulty V-sync缺红色Lack red color仅有红色Only red color异音Nolse from unlt外观不良CosmetlcsCRT刮伤CRT ScratchCRT污点CRT color blemlshCRT剥落CRT Missing pixel作用小Small Range几何失真Geometric Distortion缺色Missing colorDDC失败DDC Failure倾斜Tilt/Rotation画偏H-Phase Deviation亮度高低Brightness out or SPECSize大小Size out of SPEC鱼尾纹Moire白平衡White Balance外壳刮伤Case Scratch黑影Black Shadow底盘松Base loose640*480/85Hz异音干扰Noise on 640*480/85Hz and interference.敲击时画面红线开扰Red line showing on screen when tapping test 按键不顺Touch key failureLED断LED indicator no function按键响声Noise when pressed the function key画闪Image lightningDDC序号错DDC S/N was wrong on DDC test底亮Raster干扰Interference缺散热片Missing Heat Sink锡裂Solder Pad Fractured未贴板Parts Not Touch PCB画面倾斜Bad Raster Rotaion平形四边形失真Bad Parallelogram梯形失真Bad Trapezoid色纯不良Purity out of specCRT错料Wrong CRTCRT刮伤CRT scratchCRT污点CRT blemishesCRT亮点/CRT 水晶球CRT embedded stonesCRT抛光CRT polishedCRT气泡CRT blistersCRT色斑CRT Color saturationCRT暗斑CRT shadow spotsCRT污染CRT stains开机彩斑Switch off color spot大标签错Wrong big label角缘失真Cornet distortion管型错(DY)Wrong tube or DYSE Stray Emission管面沾胶Faceplate glued位移Shift玻璃胶贯穿Glass glue thorough管面涂布不良Poor CRT =S daubing黑纵线Ringing out of samples管颈断Neck broken紫光Purple light耳歪Ear contour面罩变形Mask distortion缺色Missing color色弱Dim video冷开机收敛异常Poor convergence when switch onMenu键无作用The key of menu no function720*400 37K/84Hz画面异音Noise on 720*400 37K/84Hz mode底色亮度超规Preset raster brightness out of specCRT与前框间隙GAP between CRT and bezel out of spec开机画面模糊Blooming when switch onAll mode拖绿边Shadow on all modeCOWJ画面模糊Picture fuzzy (focus very poor) when tapping test COWJ归线The retrace line show on white pattern when tapping test COWJ红线Red line showing on screen when tapping testCOWJ无画After tapping test video brightness/no video when the tapping test低频画抖Jitter found on low frequency(31KHZ)mode底盘脚弯Tilt / swivel base hood was curve拖毛边Tailing foundCRT面脏CRT surface dirty机内开关帽Switch cap on function静电大The CRT surface electrostatic is strong, paper can bestuck on CRT surface CRT刮伤CRT surface scratched底色亮度超规Average background brightness out of spec/ Background brightness max out of spec"Pin Balance"键无作用"Pin Balance" no function画抖在720*400 31KHz/70Hz Swimming in the 720*400 31KHZ/70HZID刮伤Scratched on ID后壳刮伤Back cover scratch/Scratched on back cover 后壳缺料(接口处)Plastic material isn't enough along水平线性超规=14% H-linearity in the 50KHZ ,100HZ out of spec白画面敲击彩条(在白画面敲击有不稳定的线条)Picture unstable and color line showing on white pattern when tapping test指示灯LED"V-size/梯形"暗LED (v-size control rang) having a reduced brightness 底部弯曲Swivel base hook was curve画抖Picture jump后壳碰伤(擦伤)Back cover was scratched on right sideT34异音且横线干扰Noise on 640*480/85HZ and interference机内异物(磁环)Foreign material (FB) inside monitor机内异物(锡珠)Foreign material (solder ball) inside monitor前框杂质/碰伤Front bezel scratched on lower right corner前框刮伤(下部)Front bezel scratch on lower right corner功率测试LED灭LED dose not light onT39切边Picture was close to raster (tangency) on 1024*768/75Hz mode后壳翘角(刮伤)Back cover scratch at lower right corner 转"Rotation"键作用小Parallelogram one side no function底盘松(转盘)Swivel base too loose画闪且底色变Picture flash and raster color was change automatically缺底盘T/S base missing全白亮度偏低Max 100%brightness white field out of spec色纯不良(Red)Impurity out of spec at red pattern画面伸缩Picture is auto flexing拖影Focus is very poor转消磁键画异Picture abnormal (very large)after press degaussing Key 9300K底亮与窗口值小Brightness is reduced after press 9300 function key Logo 翘角Logo sticking floatingCRT面脏CRT surface dirty所有画面垂直线弯曲Vertical line was bend at crosshatch pattern画闪(画面间歇性闪)Picture flash intermittent /Image lightningCRT 水晶面CRT lens全部画面鱼尾纹Morie on all modes敲打不良Tapping test failed"△"键无作用Function key "+"scratchedSIEMENS 厂牌印刷不良SIEMENS logo on carting NGAll mode 拖绿边Shadow on all modes开机画面模糊Blooming when switch on"+"键无作用"+"key no functionCRT 与前框间隙Gap between CRT and bezel out of specT09 异音Noise on 720*400/37K/84HZ mode死机No power/Unit diedMUTE键无作用The key of mute no function冷开机收敛异常Poor convergence when switch onDDC序号错DDC S/N was wrong on DDC test按键不顺Noise when pressed the function keyLED断Touch key failure水平大小无法调No H-size function垂直不同步V-synchronization锡洞Solder hole翘皮Solder pad lifted加温冒烟且缺绿色Condition warm smoke and missing green color.画面模糊Focus was became very poor and retrace line found during warm Up process.COWJ 死机Unit dead (no power) during the tapping test.COWJ变蓝色且归线Color became from white to blue and retrace line found when tapping test.COWJ 细线干扰Thin line interference found during tapping testAll mode画异且关机彩斑No recall function after power switch on/off five times, and color spot show on the screen after power switch off.按键杂质Function key dirty画面中心聚焦不良Poor focus at center of screen.梯形失真(7.5mm)Geometric distortion (trapezoid) out of spec (7.5mm) on all modes。
SMT不良描述中英文对照
常用英语词汇与缩写:Accuracy:精度Additive Process:加成工艺Adhesion:附着力Aerosol:气溶剂Angle of attack:迎角Anisotropic adhesive:各异向性胶Annular ring:环状圈Application specific integrated circuit :ASIC特殊应用集成电路Array:列阵Artwork:布线图Automated test equipment:ATE自动测试设备Bond lift-off:焊接升离Bonding agent:粘合剂CAD/CAM system:计算机辅助设计与制造系统Capillary action:毛细管作用Chip on board :COB板面芯片Circuit tester:电路测试机Cladding:覆盖层Cold cleaning:冷清洗Cold solder joint:冷焊锡点Conductive epoxy:导电性环氧树脂Conductive ink:导电墨水Conformal coating:共形涂层Copper foil:铜箔Copper mirror test:铜镜测试Cure:烘焙固化AOI(Automatic optical inspection):自动光学检查Assembly:组件ATE(Automated test equipment):自动测试设备Bare Chip:裸芯片BGA(Ball grid array)球栅列阵Blind via:盲孔Blowholes:吹孔Bridge:锡桥Bridging:搭锡bulk feeder:散装式供料器Buried via:埋孔Chamber System:炉膛系统Chip:片状元件Circuit tester:电路测试机cleaning after soldering:焊后清洗Cold solder joint:冷焊锡点Component Check:元件检查Component density:元件密度Component Pick-Up:元件拾取Component Transport:元件传送Component:元件convection reflow soldering:热对流再流焊Copper Clad Laminates:覆铜箔层压板Copper foil:铜箔Copper mirror test:铜镜测试CSP(Chip Scale Package):芯片规模的封装CTE(Coefficient of the thermal expansion):温度膨胀系数Cure:烘焙固化Cursting:发生皮层Cycle rate:循环速率Data recorder:数据记录器Defect:缺陷Delamination:分层Desoldering:卸焊Dewetting:去湿DFM:为制造着想的设计Dispersant:分散剂Documentation:文件编制Downtime:停机时间Durometer:硬度计Desoldering:卸焊Device:器件Dewetting:缩锡DIP:双列直插Downtime:停机时间Dpm(defects per million):百万缺陷率dual wave soldering:双波峰焊Dull Joint:焊点灰暗Environmental test:环境测试Eutectic solders:共晶焊锡Excessive Paste:膏量太多FCT(Functional test):功能测试feeder holder:供料器架feeders:供料器Fiducial:基准点Fillet:焊角Fine-pitch technology :FPT密脚距技术Fixture:夹具Flexibility:柔性flexible stencil:柔性金属漏版Flip chip:倒装芯片flux bubbles:焊剂气泡flying:飞片FPT(Fine-pitch technology):密脚距技术Full liquidus temperature:完全液化温度Golden boy:金样Fundamentals of Solders and Soldering焊料及焊接基础知识Soldering Theory焊接理论Microstructure and Soldering显微结构及焊接Effect of Elemental Constituents on Wetting焊料成分对润湿的影响Effect of Impurities on Soldering杂质对焊接的影响Solder Paste Technology焊膏工艺Solder Powder 锡粉Solder Paste Rheology锡膏流变学Solder Paste Composition & Manufacturing锡膏成分和制造SMT Problems Occurred Prior to Reflow回流前SMT问题Flux Separation助焊剂分离Paste Hardening焊膏硬化Poor Stencil Life网板寿命问题Poor Print Thickness印刷厚度不理想Poor Paste Release From Squeegee锡膏脱离刮刀问题Smear印锡模糊Insufficiency锡不足Needle Clogging针孔堵塞Slump塌落Low Tack低粘性Short Tack Time 粘性时间短SMT Problems Occurred During Reflow回流过程中的SMT问题Cold Joints冷焊Nonwetting不润湿Dewetting反润湿Leaching浸析Intermetallics金属互化物Tombstoning立碑Skewing歪斜Wicking焊料上吸Bridging桥连Voiding空洞Opening开路Solder Balling锡球Solder Beading锡珠Spattering飞溅SMT Problems Occurred at Post Reflow Stage回流后问题White Residue白色残留物Charred Residue炭化残留物Poor Probing Contact探针测接问题Surface Insulation Resistance or Electrochemical Migration Failure表面绝缘阻抗或电化迁移缺陷Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants分层/空洞/敷形涂覆或包封的固化问题Challenges at BGA and CSP Assembly and Rework Stage BGA、CSP组装和翻修的挑战Starved Solder Joint少锡焊点Poor Self-Alignment自对位问题Poor Wetting润湿不良Voiding空洞Bridging桥连Uneven Joint Height焊点高度不均Open开路Popcorn and Delamination爆米花和分层Solder Webbing锡网Solder Balling锡球Problems Occurred at Flip Chip Reflow Attachment倒装晶片回流期间发生的问题Misalignment位置不准Poor Wetting润湿不良Solder Voiding空洞Underfill Voiding底部填充空洞Bridging桥连Open开路Underfill Crack底部填充裂缝Delamination分层)Filler Segregation填充分离Insufficient Underfilling底部填充不充分Optimizing Reflow Profile via Defect Mechanisms Analysis回流曲线优化与缺陷机理分析Flux Reaction助焊剂反应Peak Temperature峰值温度Cooling Stage冷却阶段Heating Stage加热阶段Timing Considerations时间研究Optimization of Profile曲线优化Comparison with Conventional Profiles与传统曲线的比较Discussion讨论Implementing Linear Ramp Up Profile斜坡式曲线general placement equipment:中速贴装机Golden boy:金样Halides:卤化物Hard water:硬水Hardener:硬化剂high speed placement equipment:高速贴装机hot air reflow soldering:热风再流焊ICT(In-circuit test):在线测试In-circuit test:在线测试Insufficient Paste:膏量不足JIT(Just-in-time):刚好准时laser reflow soldering:激光再流焊LCCC(Leadless Ceramic Chip Carrier):无引脚陶瓷芯片载体Lead configuration:引脚外形Line certification:生产线确认located soldering:局部软钎焊low speed placement equipment:低速贴装机low temperature paste:低温焊膏Machine vision:机器视觉Mean time between failure :MTBF平均故障间隔时间Manhattan effect:曼哈顿现象melf:圆柱形元件metal stencil:金属漏版Misalignment:偏斜Modularity:模块化Movement:移位no-clean solder paste:免清洗焊膏Non-Dewetting:不沾锡Nonwetting:不熔湿的optic correction system :光学校准系统Organic activated :OA有机活性的Packaging density:装配密度Photoploter:相片绘图仪Placement equipment:贴装设备past mask:焊膏膜(漏板)paste shelf life:焊膏贮存寿命PCB(Printed circuit board):印刷电路板Pick-and-place:拾取-贴装设备placement accuracy:贴装精度placement direction:贴装方位Placement equipment:贴装设备placement pressure:贴装压力Placement Procedure:元件放置placement speed:贴装速度PLCC(Plastic Leaded Chip Carrier):塑型有引脚芯片载体Poor Tack Retention:粘着力不足precise placement equipment:精密贴装机PTH (Pin Through the Hole):通孔安装QFP(Quad Flat Package):多引脚方形扁平封装Reflow soldering:回流焊接Repair:修理Repeatability:可重复性Rheology:流变学repeatability:重复性resolution:分辨率Rework:返工rotating deviation:旋转偏差Schematic:原理图Semi-aqueous cleaning:不完全水清洗Shadowing:阴影Silver chromate test:铬酸银测试Slump:坍落Solder bump:焊锡球Solderability:可焊性Soldermask:阻焊Solids:固体。
- 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。
1>Abrasion: A surface imperfection that removes ordisplaces material characterized by itslarge width and length relative to itsdepth.中译: 擦破/磨损一个表面的瑕疵。
移动材料时造成较大的宽度、长度、深度之特徵。
2>Bleeding: This defect is the discoloration created bythe diffusion of coloring material throughan applied coating from the substrate to thesurface of the coating.中译: 渗出染料扩散,自底层到表层,造成表面上的瑕疵。
3>Blemish: The change in the surface appearance due toa flaw or cosmetic defect.中译: 污损/污点因为一个瑕疵或外观不良而改变表面外部4>Blister: The raised bumps in the surface, caused byair or solvent vapors forming within orunder the coating.中译: 水泡由於来自烤漆内部或表面的空气或溶剂气体造成表面隆起突出。
5>Blush: Discoloration or change in gloss, generallyappearing at the gates, abrupt thickness changes or other structures along flow pat.中译: 异色通常发生在射出进料口、肉厚突然缩减、或流道交错之处6>Bubble: A gas pocket in a plastic molded part. Fora coating, it is the same as blister.中译: 气泡一个气体包覆(中空)在塑胶件上,对烤漆来说,与blister意义相同7>Burn Mark: A condition where supper-heated trapped airin the cavity heats or burns the surface ofthe plastic part.中译: 焦痕8>Burr:This defect appears as a rough or sharp edgeon metal after it has been cast, cut,drilled, stamped, and so forth. Burrs willusually snag or tear a cleaning cloth.中译: 毛边(头) 在材料经过铸造、切割、钻孔、冲压等等外观形成一个粗糙或锐利边缘,毛边总是会刺穿或扯裂整齐的衣物。
9>Chip: This defect is defined as the loss ofadhesion and the removal usually in smallfragments, of the surface coating resultingfrom impact by hard objects. Sometimes itis also known as Mar, Ding or Nick.中译: 漆屑因为烤漆表面受到硬质物体压迫,产生小碎片,失去附着力而剥落,如损坏、压印或刻痕。
10>Crack: A thin break (splitting) in the coating orplastic material or sheet-metal.中译: 裂痕/裂缝在烤漆或塑胶或钣件上,一条细薄破裂(拉裂)。
11>Crater: This type of defect is characterized by acup-shaped depression or cavity in thecoated surface. Sometimes confused withpinholes, craters begin as blisters withthe depression formed as the gas forming theblister escapes before surface hardening.中译: 气孔这不良形态特徵,是在烤漆表面上,有一个杯形洼地或洞穴形状。
有时候会跟针孔混淆。
气孔的形成就像水泡,在烤漆表面硬化之前,气体从水泡中逸出而形成。
12>Color Variance: A difference in hue or color from thespecified color.中译: 色差13>Contamination: It is a condition created by foreignmaterial becoming mixed with virgin plasticmaterial. The contamination spots areusually black or brown in color.中译: 污染就是外来原料与原塑料混合掺杂一起所形成。
一般污点颜色近似黑色或棕色。
14>Corrosion: This defect is caused by chemical reactionwith hot humid air or any other solvent.中译: 腐蚀因湿热空气或任何溶剂而产生化学反应,形成不良现像。
15>Crazing: This defect is noticeable in surfacecoatings by slight break in the coating thatdo not penetrate through to the substrateor a previously applied coating.中译: 烧裂烤漆表面上细微裂痕16>Dent: A surface depression caused by a blow orpressure from another object. Dents have nocharacteristic size or shape.中译: 凹痕来自另一个物体的捶击或挤压造成一个表面洼地。
凹痕没有特定的大小或形状。
17>Ding:An impression or depression formed on thesurface with impact from another hardobject.中译: 压印来自其它硬物的碰撞,在表面上形成一个压痕。
18>Die Mark: This type of defect is an indentation,depression, or line that occurs in the samelocation of every part due to a damaged die,mold, tool and so forth.中译: 模痕不良形态像是一个压痕、凹陷洼地、线状。
因为冲模、铸模、工具等等损坏,而发生在每个零件的相同位置。
19>Dirt:This defect often appears in the form ofirregularly distributed dust particles,usually appearing burnt and black. Theseparticles generally have no common shape orsize and may appear long in shape much liketiny hairs. Particles that are 15-20 milsin diameter can usually be felt.中译: 污秽/灰尘时常呈现不规则分布灰尘微粒,总是显现焦黑。
这些微粒没有共同形状或大小20>Ejector Mark:This defect is found in compression moldedparts. It is caused by distorted the moldejector pin and leaves a scar on the part.中译: 冲头压印不良常见於冲压件。
它是模具冲头歪曲,在零件上所留下伤痕。
21>Fracture: This defect is characterized by a tear,separation, or pulling apart of metal. Afracture is generally found at corners orwherever sharp radii are located.中译: 裂口/断裂不良现象是一个撕裂、分开、扯断的钣件通常可以在转角或任何一个尖锐的弧径位置上发现到。
22>Flash:This is unwanted excess plastic that occursat the parting line or interface of moldedparts.中译: 毛边这是多余额外的塑料。
发生在塑胶(铸造)件的分模线或接合面。
23>Gloss Variance: This is a difference in the degree of lightreflected from a surface. This is alsosometimes call loss of sheen, shine, lusteror brightness.中译: 光泽偏差(度) 来自一个表面反射光泽度数的差异。
24>Grainy Coating: This coating defect is characterized by thepresence of irregularly shaped, angular orround protrusions evenly spread over thearea of concern.中译: 烤漆颗粒烤漆的不良特徵,有不规则形状、尖角、或圆形凸点均匀范围超出关心的区域。
25>Gouge: A gouge is characterized as a scratch ofwider width.中译: 圆凿一个圆凿的特徵就像是一个较宽广宽度的抓痕。
26>Jetting: It is flow mark that is caused by theimproper injection of plastic melt into amold cavity. This defect sometimes alsocalled “Snaking”.中译: 流痕因不当射出的塑料融入模穴所引起的。