软硬结合板设计制作指引与流程控制要点解析
合集下载
相关主题
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
软硬结合板设计制作指引与 生产控制要点
目 录
• 软硬结合板的常见结构及工艺流程
• 软硬结合板的设计指引 • 软硬结合板的生产控制要点
常见结构及工艺流程（4L）
• 1R+2F+1R ：单面硬板夹软板结构
Type
yer
4L R-F Stack-up
GME Design Rigid material Flex material
常见结构及工艺流程（6L）
• 2R+2F+2R ：双面硬板夹软板结构
Layer L1 L2 T ype solder mask Copper core Copper No-Flow PP L3 L4 Copper PI Copper No-Flow PP L5 L6 Copper core Copper solder mask Customer requirement:0.8+/-0.15mm Coverlay AD Copper PI Copper AD Coverlay 25um 25um 17.5um 50um 17.5um 25um 25um Stack-up Cust. Design Material type PSR4000 H 150 H 2116 RC57% 17.5um 50um 17.5um H H 2116 RC57% H 150 H PSR4000
L25
L16
常见结构及工艺流程（2+HDI 6L）
• 1+1F+2F+1F+1 ：2+HDI结构
Solder Resist Copper 1 No flow prepreg Copper 2 No flow prepreg Coverlay PI Adhensive Copper Polyimide Copper Adhensive Coverlay PI stifferner
L2-L3
Board cutting – Mech. drill –Shadow–Button image -- Button Plating – I/L D/F – I/L exposure – DES –AOI – B.O. – Sticking Cover lay – Pressing cover lay – Measuring expansion Coefficient –PE Punch -- FQC
Finish(um) R-F part Flex part
Top S/M core NF PP Copper PI Copper NF PP core Bottom S/M Coverlay AD Copper PI Copper AD Coverlay
Taiyo PSR4000 R1566 0.102mm(H/0) 12um R1551 NF PP1080 25um 18um 25um 18um 25um R1551 NF PP1080 12um 50um AD 200um Stiffener R1566 0.102mm(0/H) Taiyo PSR4000 Total Thickness
Finis
30um 35um 150u 15um
125u
15um 50um 15um
125u
15um 150u 35um 30um
790u
L3-L4 L12/L56
Board cutting –I/L D/F – I/L exposure – DES – AOI – B.O. – Sticking Cover lay – Pressing cover lay – Measuring expansion Coefficient – PE Punch --FQC Board cutting—I/L D/F—DES— PE Punch—AOI—B/O NF PP Open – Plasma – B.O. – Pressing(L12&&L34&L56) – Mech. Drill – De-burr – De-smear – PTH+ Flash –OL D/F – OL exposure –Pattern plate—SES – AOI – S/M – C/M – ENIG –Pre-Routing – Laser De-cap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing
Board cutting –Mech. Drill–Shadow-- Button Image– Button plate -- I/L D/F – I/L exposure – DES –– AOI– B.O. – Sticking Cover lay – Pressing cover lay – ENIG– Punch Finger--Measuring expansion Coefficient –PE Punch -- FQC Board cutting (Single side FCCL Preparation) NF PP Open – Plasma – B.O. – Pressing(L2&&L34&L5) – Laser Drill –– De-smear – PTH+ Flash –Panel Plate—IL D/F – DES –UV Cut PI -- AOI —B/O Pressing—Laser Drill—Mech. Drill – De-burr – De-smear – PTH+ Flash —Panel Plate—D/F--- DES—AOI—S/M – C/M – ENIG –Pre-Routing – Laser De-cap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing
Flex core
TUC-84P NF 106 70%
NF PP 106 72%
L5 L6
TUC-722-7 2m il(H/0) TUC-72P-7 106 73% H PSR4000 G23K
R1566W 2m il
Norm al106 78 T
L3-L4
GM E suggest material: Panasonic Board cutting –I/L D/F – I/L exposure – DES ---–– AOI– B.O. – Sticking Cover lay – Pressing cover lay – Measuring expansion Coefficient – PE Punch --FQC
20 µm 41 µm 12 µm 58 µm 31 µm 12 µm 45 µm 13 µm 25 µm
solder mask
No-flow PP
No-flow PP coverlay FCCL coverlay No-flow PP
3 4 stifferner
12 µm 50 µm 12 µm 25 µm 13 µm 45 µm
PSR4000 G23K
Norm al106 78
R1566W 2m il c
coverlay AD L3 L4 Copper PI Copper AD coverlay
13um 25um 18um 50um 18um 25um 13um
TUC-84P NF 106 70%
NF PP 106 72%
32 35 102 Grace Panasonic FCCL Grace 65 14 25 14 64 102 35 32 520 12 25 14 25 14 25 12 50 200
377
E proposal as below: Cowenku.baidu.comerlay supplier: Grace Rigid material supplier:Panasonic FCCL supplier: Panasonic Stiffener: FR4 with 3M PSA glue VH hole wall copper thickness (by button plating process): 10um min. TH hole wall copper thickness: 18um min.20um avg. Flex finished board thickness : 0.377+/-0.05mm Total finished board thickness : 0.52mm+/-0.08mm
L1-L4
NF PP Open – Plasma – B.O. – Pressing(L1&L4 is Single copper core) – Mech. Drill – De-burr – De-smear – PTH+ Flash – Panel Plating – OL D/F – OL exposure – DES – AOI – S/M – C/M – ENIG – Pre- Routing – Laser De-cap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing
L16
常见结构及工艺流程（1+HDI 8L）
Layer Type s older m as k L1 L2 L3 Foil+plating Norm al PP Copper core Copper No-Flow PP L4 L5 Copper PI Copper No-Flow PP L6 L7 L8 Copper core Copper Norm al PP Foil+plating s older m as k Total: Coverlay AD Copper PI Copper AD Coverlay 13um 15um 18um 25um 18um 15um 13um Stack-up Cust. Design 20um 30um 60um 30um 100um 18um 100um 18um 25um 18um 100um 18um 100um 30um 60um 30um 20um 777um Material type Copper content Finished PSR4000 H 1080 RC 62% H H 55.30% 50.30% 4m il 46.20% 30um 35um 44um 35um 100um 15um 86um 15um 25um 32.40% 15um 83um 54.40% 54.80% 45.90% 15um 100um 35um 44um 35um 30um 743um
L1-L6
常见结构及工艺流程（1+HDI 6L）
• 1+1R+2F+1R+1 ：1+HDI结构的硬板夹软板结构
Layer L1 L2 Stack-up Cus t. Des ign PSR4000 G23K H TUC-72P-7 106 73% TUC-722-7 2m il(H/0) T
GME propos
L2/L5
Board cutting—I/L D/F—DES（蚀刻单面）— PE Punch—AOI—B/O（Core厚大于0.2mm， 需要在B/O前做预激光切割） NF PP Open – Plasma – B.O. – Pressing(L2&&L34&L5) – Mech. Drill – De-burr – De-smear – PTH+ Flash –Panel Plate—IL D/F – DES – AOI —B/O Pressing—Laser Drill—Mech. Drill – De-burr – De-smear – PTH+ Flash —ODF—Pattern Plate—SES—AOI—S/M – C/M – ENIG –Pre-Routing – Laser De-cap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing
PI flex Core
No flow prepreg Copper No flow prepreg Copper Solder Resist Total 5
12 µm 31 µm 58 µm 12 µm 41 µm 20 µm
No-flow PP
6
solder mask
512 µm
L3-L4 L2/L5 L25
目 录
• 软硬结合板的常见结构及工艺流程
• 软硬结合板的设计指引 • 软硬结合板的生产控制要点
常见结构及工艺流程（4L）
• 1R+2F+1R ：单面硬板夹软板结构
Type
yer
4L R-F Stack-up
GME Design Rigid material Flex material
常见结构及工艺流程（6L）
• 2R+2F+2R ：双面硬板夹软板结构
Layer L1 L2 T ype solder mask Copper core Copper No-Flow PP L3 L4 Copper PI Copper No-Flow PP L5 L6 Copper core Copper solder mask Customer requirement:0.8+/-0.15mm Coverlay AD Copper PI Copper AD Coverlay 25um 25um 17.5um 50um 17.5um 25um 25um Stack-up Cust. Design Material type PSR4000 H 150 H 2116 RC57% 17.5um 50um 17.5um H H 2116 RC57% H 150 H PSR4000
L25
L16
常见结构及工艺流程（2+HDI 6L）
• 1+1F+2F+1F+1 ：2+HDI结构
Solder Resist Copper 1 No flow prepreg Copper 2 No flow prepreg Coverlay PI Adhensive Copper Polyimide Copper Adhensive Coverlay PI stifferner
L2-L3
Board cutting – Mech. drill –Shadow–Button image -- Button Plating – I/L D/F – I/L exposure – DES –AOI – B.O. – Sticking Cover lay – Pressing cover lay – Measuring expansion Coefficient –PE Punch -- FQC
Finish(um) R-F part Flex part
Top S/M core NF PP Copper PI Copper NF PP core Bottom S/M Coverlay AD Copper PI Copper AD Coverlay
Taiyo PSR4000 R1566 0.102mm(H/0) 12um R1551 NF PP1080 25um 18um 25um 18um 25um R1551 NF PP1080 12um 50um AD 200um Stiffener R1566 0.102mm(0/H) Taiyo PSR4000 Total Thickness
Finis
30um 35um 150u 15um
125u
15um 50um 15um
125u
15um 150u 35um 30um
790u
L3-L4 L12/L56
Board cutting –I/L D/F – I/L exposure – DES – AOI – B.O. – Sticking Cover lay – Pressing cover lay – Measuring expansion Coefficient – PE Punch --FQC Board cutting—I/L D/F—DES— PE Punch—AOI—B/O NF PP Open – Plasma – B.O. – Pressing(L12&&L34&L56) – Mech. Drill – De-burr – De-smear – PTH+ Flash –OL D/F – OL exposure –Pattern plate—SES – AOI – S/M – C/M – ENIG –Pre-Routing – Laser De-cap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing
Board cutting –Mech. Drill–Shadow-- Button Image– Button plate -- I/L D/F – I/L exposure – DES –– AOI– B.O. – Sticking Cover lay – Pressing cover lay – ENIG– Punch Finger--Measuring expansion Coefficient –PE Punch -- FQC Board cutting (Single side FCCL Preparation) NF PP Open – Plasma – B.O. – Pressing(L2&&L34&L5) – Laser Drill –– De-smear – PTH+ Flash –Panel Plate—IL D/F – DES –UV Cut PI -- AOI —B/O Pressing—Laser Drill—Mech. Drill – De-burr – De-smear – PTH+ Flash —Panel Plate—D/F--- DES—AOI—S/M – C/M – ENIG –Pre-Routing – Laser De-cap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing
Flex core
TUC-84P NF 106 70%
NF PP 106 72%
L5 L6
TUC-722-7 2m il(H/0) TUC-72P-7 106 73% H PSR4000 G23K
R1566W 2m il
Norm al106 78 T
L3-L4
GM E suggest material: Panasonic Board cutting –I/L D/F – I/L exposure – DES ---–– AOI– B.O. – Sticking Cover lay – Pressing cover lay – Measuring expansion Coefficient – PE Punch --FQC
20 µm 41 µm 12 µm 58 µm 31 µm 12 µm 45 µm 13 µm 25 µm
solder mask
No-flow PP
No-flow PP coverlay FCCL coverlay No-flow PP
3 4 stifferner
12 µm 50 µm 12 µm 25 µm 13 µm 45 µm
PSR4000 G23K
Norm al106 78
R1566W 2m il c
coverlay AD L3 L4 Copper PI Copper AD coverlay
13um 25um 18um 50um 18um 25um 13um
TUC-84P NF 106 70%
NF PP 106 72%
32 35 102 Grace Panasonic FCCL Grace 65 14 25 14 64 102 35 32 520 12 25 14 25 14 25 12 50 200
377
E proposal as below: Cowenku.baidu.comerlay supplier: Grace Rigid material supplier:Panasonic FCCL supplier: Panasonic Stiffener: FR4 with 3M PSA glue VH hole wall copper thickness (by button plating process): 10um min. TH hole wall copper thickness: 18um min.20um avg. Flex finished board thickness : 0.377+/-0.05mm Total finished board thickness : 0.52mm+/-0.08mm
L1-L4
NF PP Open – Plasma – B.O. – Pressing(L1&L4 is Single copper core) – Mech. Drill – De-burr – De-smear – PTH+ Flash – Panel Plating – OL D/F – OL exposure – DES – AOI – S/M – C/M – ENIG – Pre- Routing – Laser De-cap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing
L16
常见结构及工艺流程（1+HDI 8L）
Layer Type s older m as k L1 L2 L3 Foil+plating Norm al PP Copper core Copper No-Flow PP L4 L5 Copper PI Copper No-Flow PP L6 L7 L8 Copper core Copper Norm al PP Foil+plating s older m as k Total: Coverlay AD Copper PI Copper AD Coverlay 13um 15um 18um 25um 18um 15um 13um Stack-up Cust. Design 20um 30um 60um 30um 100um 18um 100um 18um 25um 18um 100um 18um 100um 30um 60um 30um 20um 777um Material type Copper content Finished PSR4000 H 1080 RC 62% H H 55.30% 50.30% 4m il 46.20% 30um 35um 44um 35um 100um 15um 86um 15um 25um 32.40% 15um 83um 54.40% 54.80% 45.90% 15um 100um 35um 44um 35um 30um 743um
L1-L6
常见结构及工艺流程（1+HDI 6L）
• 1+1R+2F+1R+1 ：1+HDI结构的硬板夹软板结构
Layer L1 L2 Stack-up Cus t. Des ign PSR4000 G23K H TUC-72P-7 106 73% TUC-722-7 2m il(H/0) T
GME propos
L2/L5
Board cutting—I/L D/F—DES（蚀刻单面）— PE Punch—AOI—B/O（Core厚大于0.2mm， 需要在B/O前做预激光切割） NF PP Open – Plasma – B.O. – Pressing(L2&&L34&L5) – Mech. Drill – De-burr – De-smear – PTH+ Flash –Panel Plate—IL D/F – DES – AOI —B/O Pressing—Laser Drill—Mech. Drill – De-burr – De-smear – PTH+ Flash —ODF—Pattern Plate—SES—AOI—S/M – C/M – ENIG –Pre-Routing – Laser De-cap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing
PI flex Core
No flow prepreg Copper No flow prepreg Copper Solder Resist Total 5
12 µm 31 µm 58 µm 12 µm 41 µm 20 µm
No-flow PP
6
solder mask
512 µm
L3-L4 L2/L5 L25