焊线动画-wirebonding
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lead
pad
lead
pad
lead
pad
lead
pad
lead
Formation of a second bond
pad
heat
lead
Formation of a second bond
pad
heat
lead
pad
heat
lead
pad
heat
lead
pad
lead
pad
lead
pad
lead
Free air ball is captured in the chamfer
pad
lead
Free air ball is captured in the chamfer
pad
lead
Formation of a first bond
pad
lead
Formation of a first bond
Semiconductor Packaging Process
WAFER
WAFER MOUNT
WAFER SAW
DIE ATTACH
MODING
WIRE BOND
EPOXY CURE
TRIM / FORM
Integrated Circuit (IC)
CONTENTS
• A. PURPOSE • B. PRINCIPLE • C. PROCESS • D. PACKAGE INTODUCE • E. M/C BASIC DATA • F. MATERIAL • G. PARAMETER • H. DEFECTS • I. REFERENCE
A.PURPOSE
Ball Bond ( 1st Bond )
Wedge Bond ( 2nd Bond )
Gold wire
pad lead
B.PRINCIPLE
• HARD WELDING:
– PRESSURE – AMPLIFY & FREQUENCY – WELDING TIME – WELDING TEMPATURE
Si
MOISTURE
C. WIREBOND PROCESS
Free air ball is captured in the chamfer
GOLD BALL
pad lead
Free air ball is captured in the chamfer
pad lead
Free air ball is captured in the chamfer
pad
lead
pad
lead
pad
lead
pad
lead
Disconnection of the tail
pad
lead
Disconnection of the tail
pad
lead
Formation of a new free air ball
pad
lead
A.PURPOSE
• FORMING A STRONG AND RELIABLE INTERTALLIC BOND BETWWEEN THE WIRE AND THE PAD , AS WELL AS BETWEEN THE WIRE AND THE LEAD
DICE GOLD WIRE LEADFRAME
pad
lead
Formation of a first bond
PRESSURE
Ultra Sonic Vibration
pad
heat
lead
Formation of a first bond
PRESSURE
Ultra Sonic Vibration
Fra Baidu bibliotek
pad
heat
lead
Capillary rises to loop height position
• THERMOSONIC BONDING:
– THERMAL COMPRESSURE – ULTRASONIC ENERGY(1.2MHZ)
B.PRINCIPLE
PRESSURE VIBRATION
AL2O3
CONTAMINATION GLASS
GOLD BALL
Al SiO2, TiN, TiW
pad
lead
Formation of a loop
pad
lead
Formation of a loop
pad
lead
pad
lead
pad
lead
pad
lead
pad
lead
pad
lead
pad
lead
pad
lead
pad
lead
pad
lead
pad
lead
pad
lead
pad
pad
lead
Capillary rises to loop height position
pad
lead
Capillary rises to loop height position
pad
lead
Capillary rises to loop height position
pad
lead
Capillary rises to loop height position