内部品质稽核表

已經 執行 填入 1 分, 未執 行填 入0 分, NA 為不 適用.
FAIRWAY PCBA Quality Process Audit
Past
e
#
Audit Criterion 稽核條款
3.
Ste
Are all Stencils adequately stored in a manner to avoid potential damage and to keep out foreign or airborne materials? 3.1
2.4 溫度記錄器是否連接警報器以提供溫度超出管制界限時的警報?
2.5 Is there a documented requirement to periodically check that the recorded temperature is within the required storage limits? 有否文件規定定期檢視溫度記錄器的頻率以確保錫膏儲存冰櫃溫度處於控制範圍? Is there evidence to demonstrate that action was taken when the temperature was outside the defined storage limits?
錫膏容器是否標示錫膏移出冰箱之日期與時間?
Is the date and time that the Solder Paste is available for use, after removal from cold storage, specified on its container? 2.9
作業指導書(文件)是否規定不准使用金屬工具作為添加或移除錫膏之工具?
已經 執行 填入 1 分, 未執 行填 入0 分, NA 為不 適用.
自評分
稽核得分
稽核證據
FAIRWAY PCBA Quality Process Audit
Past
e
#
Audit Criterion 稽核條款
Is the PCB part number and Revision specified on the Work Instruction or line set-up instructions? 1.12
2.13 Are Screen Print Operators required to wear gloves when handling Solder Paste? 錫膏印刷操作人員取用錫膏是否戴手套?
Is there a specification readily available for the Solder Paste? 2.14
稽核得分
稽核證據
FAIRWAY PCBA Quality Process Audit
Past
e
#
Audit Criterion 稽核條款
Is the date and time that the Solder Paste has been removed from cold storage specified on its container? 2.8
FAIRWAY PCBA Quality Process Audit
Past
e
#
Audit Criterion 稽核條款
1.
Wo
1.1
Is there a revision controlled Operator Work Instruction which contains unique details for the specific product being built? 對特定產品有否受版本控制的作業指導書(文件)說明其特點?
2.6 有無證據顯示當錫膏儲存冰櫃溫度超出控制範圍時的對策處理記錄? Is the cold storage expiration date of the Solder Paste specified on the Solder Paste container?
2.7 錫膏容器有否標示錫膏失效到期日?
1.14 Is the machine Program Name specified on the Work Instruction or line set-up instructions? 程式名稱是否規定於作業指導書(文件)或開線設置查檢表上?
2.
Sol
Is there a Standard Operating Procedure for the cold storage of solder paste? 2.1
2.3 Does the cold storage unit have a temperature recorder, which can be read without opening the unit, to record temperature over time? 錫膏儲存冰櫃是否配置不需開門即可隨時觀看記錄的溫度記錄器? Is the temperature recorder linked to an alarm system to provide an indication of an unacceptable temperature status?
பைடு நூலகம்
1.6
Is the Stencil's identification traceable to a specific PCB part number, revision level and board side? 鋼板識別碼是否可對應到 PCB 料號/版本/版面?
1.7
Is the Stencil loading orientation specified on the Stencil or on Work Instructions? 鋼板與印刷作業指導書(文件)是否都有方向標示及說明鋼板裝入機台的方向?
錫膏容器是否標示當錫膏由冰箱取出後多久才可使用的日期/時間(回溫時間)?
2.10 Is the date and time that the Solder Paste expires at ambient temperature with its 'seal broken' documented and known? 錫膏移出冰箱並已開封置於室溫環境時是否有規定其允許時間? 12 小時
Is the date and time that the Solder Paste expires at ambient temperature with its 'seal in tact' documented and known? 2.11
錫膏移出冰箱(密封狀態)置於室溫時是否有規定允許時間? 72 小時
Is there evidence to demonstrate that this information has been correctly completed and that this process is fully understood? 2.12
作業者對以上錫膏管制方式是否都已熟悉並被正確執行?
鋼板是否有適當儲存位置與方法以防外來異物沾粘或破壞?
已經 執行 填入 1 分, 未執 行填 入0 分, NA 為不 適用.
自評分
3.2 Are all Stencils identified with process proof labels or plates which are visible when the stencil is in its rack or mounted in the Printer? 鋼板是否有標示識別碼並且在其儲存或放入機器中亦可清楚看到其標示?
錫膏儲存是否制定管理辦法?
已經 執行 填入 1 分, 未執 行填 入0 分, NA 為不 適用.
自評分
2.2 Is the Solder Paste FIFO controlled while in cold storage with min/max levels defined? A gravity feed rack is preferred. 錫膏管制是否有先進先出管理並定義出儲存箱最高/最低溫度條件?
1.10 Are all hand tools needed by the operator listed with their descriptions on Work Instructions? 錫膏印刷作業指導書(文件)是否說明需使用的工具及工具的規格描述?
Has the use of metal tools for the application and/or removal of paste been specifically disallowed? 1.11
Is the Solder Paste lot code recorded and fully and easily traceable to the individual product serial number product? 2.17
錫膏 lot code 是否記錄完全且可追溯使用的各機種及序號?
1.4
Is the Solder Paste manufacturer, number, & mesh defined in the Paste Print Program or on Work Instructions? 錫膏印刷作業指導書(文件)或程式是否說明錫膏廠牌、料號、規格?
1.5
Is the Stencil's identification specified on Work Instructions? 錫膏印刷作業指導書(文件)是否說明鋼板識別的方法?
1.8
Is the Squeegee in use specified in the Paste Print program or Work Instructions? 錫膏印刷作業指導書(文件)或程式是否說明刮刀的型式?
1.9
Is the number, location, type and height of the Support Blocks/Pins specified on Work Instructions? 錫膏印刷作業指導書(文件)是否說明頂針(支撐塊)數目、位置、型式、高度?
1.2
Are Work Instructions readily available to the operator and are they followed at Paste Print? 一個受版本控制的作業指導書(文件)是否易於取得並真正適用於作業者且能絕對遵守?
1.3
Is the Solder Paste specified in the Paste Printing program or on Work Instructions? 錫膏規格是否說明於錫膏印刷作業指導書(文件)或程式?
Does the MQT/QMP include the requirement that changes to the Solder Paste used requires advance approval of Dell SQE? 2.18
有否文件(如品質工程圖)規定錫膏變更時要先取得客戶批准?
對於錫膏的說明是否已經完全足夠適用?
Is the mesh for the Solder Paste used suitable for the pitch technology used on the board being built? 2.15
鋼板開孔網目的工藝是否合乎適用於小間隙零件?
2.16 Is the maximum time that the Solder Paste is allowed to remain on a board prior to reflow documented, known, & followed? 有否文件規定 PCB 經錫膏印刷後,暴露空氣允許的最長未過爐時間?
PCB 料號及版本是否規定於作業指導書(文件)或開線設置查檢表上?
Is the PCB orientation to the Stencil identified in the Work Instructions or line set-up instructions? 1.13
PCB 進板方向是否規定於作業指導書(文件)或開線設置查檢表上?