Fine-Grained Control of Security Capabilities
制程能力评估(中英文)

Is there a Standard Operating Procedure for the cold storage of solder paste? 是Is 否the有c标ol准d s的to锡ra糕ge冷te冻m操pe作ra流tur程e ?within the manufacturers' recommended range for all solder paste in cold storage? 锡糕的冷冻温度是否在供应商的建议温度范围内? Is the Solder Paste FIFO controlled while in cold storage? A gravity feed rack is preferred. 锡Do糕es的th冷e冻co贮ld藏st时or,ag是e 否un先it h入av先e出a 控tem制p?er重at力ur自e r流ec进or料de将r, 更wh好ic。h can be read without opening the unit, to record temperature over time? 冷Is 冻the机re器a是d否oc有um温e度nte记d录re器qu长ire期m记en录t t温o p度e,rio以dic便a不lly用ch打ec开k 机tha器t 就the可r知ec道or里de面d t温em度p?erature is within the required storage limits? 是Is 否the有re文e本vid的en请c求e t去o d定e时mo检n查str记at录e t的ha温t a度ct是ion否w的as需t要ak的en温w度he范n 围the内t?emperature was outside the defined storage limits? 当温度超出定义的贮藏温度极限时,是否有证据证明采取了行动? Is the cold storage expiration date of the Solder Paste specified on the Solder Paste container? 冷冻锡糕有效期是否定义在贮锡容器上? Is the date and time that the Solder Paste has been removed from cold storage specified on its container? 从Is 贮the藏d室at移e a开n锡d t糕im的e 日tha期t 和the时S间ol是de否r P记a录ste在is贮a锡va糕ila容bl器e f上or?use, after removal from cold storage, specified on its container? 从Is 冷the冻d容at器e a搬n出d t来im后e ,tha锡t 糕the适S合ol使de用r P的a日ste期e和xp时ire间s 是at否am定b在ie容nt 器tem上p?erature with its 'seal broken' documented and known? 锡Is 糕the暴d露at于e a正n常d t的im环e 境tha温t 度the期S满ol时de间r P和a日ste期e是xp否ire用s 它at的am封b条ie记nt 录tem?perature with its 'seal in place' documented and known?
Perma-Cast Clear Liquid Release Technical Data Sh

Aurora, IL 60506Phone: 800-282-3388Fax: 630-906-1982information for your project: Technical Data Sheet (TDS), Color Chart, Installation Guide, Safety Data Sheet (SDS). All information is available for download online at or at 800-282-3388.MasterFormat ™ Guide Specifications, and Butterfield Color ® Architectural Details and Specifications are available for the specifier/designer. All information is available for download online at or at 800-282-3388.Uni-Mix, Perma-Cast, Perma-Shake, Select Grade, Sierra Stain, Elements, Clear Guard, Color Guard, PRO 350, First Seal, T1000, TEC FILM, MT Resurfacer, Cantera, SurfEtch, Delaminator, CHO, Flat Out, Perma-Tique, and Pro Pack are trademarks of Butterfield Color, Inc.MasterFormat is a registered trademark of The Construction Specifications Institute – CSI | 11219© 2019 Butterfield Color, Inc.All rights reserved. Made in USA1. Description: Perma-Cast ® Clear Liquid Release is a bond breaker used with stamping mats, texturing skins or texture rollers prior to imprinting concrete or cementitious overlays. It prevents the stamping or texturing tool from sticking to the surface, enhances the transfer of the detailed pattern and texture, and prolongs the surface life of the stamping mat or texturing tool. Use on integrally colored or uncolored concrete, shake-on color hardeners, and stampable cementitious overlays. It is suitable for outdoor and indoor use. It is particularly useful with overlays, since it will not contaminate the existing concrete substrate as readily as powdered releases. It evaporates quickly and requires little to no clean up prior to applying solvent based curing and sealing compounds such as Clear Guard ® Cure and Seal, or prior to chemical staining with Perma-Cast ® Sierra Stain ™.2. Packaging: Perma-Cast ® Clear Liquid Release is available in 5 gal. (19 L) pails. Pails should be stored in a cool, dry place when not in use. Store away from combustible materials and sources of heat. Do not reuse empty container.2.1 SHELF LIFE: Indefinite, when stored in original, unopened containers,in dry storage.3. Coverage: A 5 gal. pail covers approximately 750 sq. ft. (1 l/3.7 m 2) of concrete surface. Apply full strength. Do not dilute. Coverage will vary depending on timing, surface finish prior to stamping, application method, air temperature, humidity and wind conditions. Conditioning of the stamping tools with the liquid release prior to stamping will also affect the amount of material used.4. Application Equipment: A clean, quality hand-pump sprayer equippedwith a fan pattern spray nozzle should be used to apply Perma-Cast ® Clear Liquid Release. Material should be applied to the surface of the concrete and to the pattern and texturing tools. Spraying equipment must be resistant to solvent-based materials.5. Application: Apply Perma-Cast ® Clear Liquid Release after all finishing is completed and prior to imprinting the surface. Do not attempt to float, trowel, or otherwise work the surface once the liquid release is applied. Do not apply over a large area, as the liquid release may evaporate prior to the imprinting process. Do not apply if bleed water is visible on the concrete surface. Material should also be applied to the imprinting tools.Apply liberally. Perma-Cast ® ClearLiquid Release evaporates and it mustbe reapplied to the concrete surface andtools during the imprinting process. Donot attempt to imprint the surface withoutliquid release visible on the concrete orimprinting tool surface. After completeevaporation, the concrete surface willlose its wet sheen and appear dull. At this time, the surface may be cured or sealed with Clear Guard ®Cure and Seal, or chemically stained with Perma-Cast ® Sierra Stain ™in accordance with the Technical Data Sheets for those products. All information is available for download online at www.butterfieldcolor.com or at 800-282-3388.6. Quality Control: Cast a job site sample at least 21 days prior to the installation for approval of color and finish. Utilize all materials, tools, and techniques from the actual job in the mock-up. Consistent batching, pouring, finishing, curing, sealing, and preparation techniques, will ensure the uniformity of architectural concrete. Verify adequate wet and dry slip resistance. Verify maintenance requirements. Site visits by Butterfield Color, Inc. Personnel are for making technical recommendations only and not for supervising or providing quality control.KEEP CONTAINER TIGHTLY CLOSED. KEEP OUT OF REACH OF CHILDREN. NOT FOR INTERNAL CONSUMPTION. FOR PROFESSIONAL USE ONLY.For further information and advice regarding transportation, handling, storage and disposal of chemicalproducts, users should refer to theactual Safety Data Sheets containing physical, ecological, toxicological and other safety related data. Read the current actual Safety Data Sheet before using the product. In case of emergency, in U.S. call CHEMTREC at 1-800-424-9300, International 703-741-5970, in Canada call CANUTEC (collect) 613-996-6666.Prior to use of any Butterfield Color, Inc. product, the user must always read and follow the warnings and instructions onthe product's most current TechnicalData Sheet, product label and SafetyData Sheet which are available onlineat or at 800-282-3388. Nothing contained in anyButterfield Color, Inc. materials relievesthe user of the obligation to read andfollow the warnings and instruction foreach Butterfield Color, Inc. product asset forth in the current Technical DataSheet, product label and Safety DataSheet prior to product use.LIMITED WARRANTY AND DISCLAIMER – EXCLUSIVE REMEDY:Butterfield Color, Inc. (“BC”) warrants that this product conforms to its publishedspecifications when it is shipped.THIS LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY AND THEREARE NO OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. BC does not warrant any particular method of use or application of the product or its performance under any particular condition. If this product does not conform to its published specifications when shipped, we will replace theproduct as your exclusive remedy. Anyaction for breach of the limited warranty or any other liability arising from this product must be brought within 90 days of receiving the product. BC is not liable for consequential damages or personal injury arising from the use, storage or handling of this product.。
如何识别和应对假冒产品 英语作文

如何识别和应对假冒产品英语作文Counterfeit products have become a growing global concern, posing significant risks to consumers and businesses alike. These fake goods, which are designed to mimic the appearance and branding of legitimate products, can be found in a wide range of industries, from luxury fashion to pharmaceuticals. As the demand for affordable alternatives increases, the proliferation of counterfeit goods has also escalated, making it crucial for individuals and organizations to develop strategies to identify and respond to this pressing issue.One of the primary challenges in addressing the problem of counterfeit products is the sheer scale and complexity of the global supply chain. Counterfeiters have become increasingly sophisticated in their methods, utilizing advanced technologies and intricate distribution networks to infiltrate legitimate markets. This makes it increasingly difficult for consumers to distinguish genuine products from their fake counterparts, as the quality and appearance of these imitations can be remarkably similar to the original.To effectively identify counterfeit goods, consumers must develop akeen eye for detail and a deep understanding of the characteristics of authentic products. This often involves carefully examining the packaging, labeling, and even the product itself for any discrepancies or inconsistencies. For example, genuine luxury items may feature intricate stitching, unique serial numbers, or specialized materials that are difficult to replicate. By familiarizing themselves with these distinctive features, consumers can more readily identify potential counterfeits and make informed purchasing decisions.In addition to visual inspection, consumers can also leverage technology to aid in the detection of counterfeit goods. Many brands now offer mobile applications or online tools that allow users to scan product codes or barcodes to verify their authenticity. These digital solutions can provide real-time information on the provenance and legitimacy of a product, helping consumers to avoid falling victim to fraudulent purchases.Another effective strategy for combating counterfeit products is to support reputable and trusted retailers. By purchasing from authorized dealers or directly from the brand's official channels, consumers can significantly reduce the risk of acquiring counterfeit goods. These established vendors often have robust systems in place to ensure the integrity of their supply chain, reducing the likelihood of counterfeit infiltration.When consumers do suspect that they have purchased a counterfeit product, it is essential to take swift and appropriate action. This may involve reporting the incident to the relevant authorities, such as law enforcement or consumer protection agencies, who can investigate the matter and take legal action against the perpetrators. Additionally, consumers can engage directly with the brand or manufacturer to inform them of the suspected counterfeit, as these companies often have dedicated teams and resources to address such issues.Beyond individual consumer efforts, businesses and governments play a crucial role in combating the proliferation of counterfeit goods. Companies can implement robust supply chain management practices, including rigorous vendor vetting and product authentication measures, to mitigate the risk of counterfeit infiltration. Governments, on the other hand, can strengthen legislative frameworks, enhance border controls, and collaborate with international organizations to disrupt the supply and distribution of counterfeit products.The impact of counterfeit goods extends far beyond the immediate financial loss to consumers and businesses. Counterfeit products can pose significant health and safety risks, particularly in the case of pharmaceuticals, automotive parts, or consumer electronics. Substandard or tampered-with goods can lead to serious injuries,illnesses, or even fatalities, underscoring the urgent need to address this global challenge.In conclusion, the identification and response to counterfeit products require a multi-faceted approach involving consumers, businesses, and governments. By developing a keen awareness of the characteristics of genuine products, leveraging technology-enabled authentication tools, and supporting reputable vendors, consumers can play a vital role in combating the proliferation of counterfeit goods. Businesses and governments must also take decisive action to strengthen supply chain security, enhance legal frameworks, and disrupt the distribution networks of counterfeiters. Only through a collaborative and comprehensive effort can we effectively protect consumers, safeguard intellectual property rights, and foster a more secure and trustworthy marketplace.。
信任蓝色COMBIDISC 刮刀工具说明书

New! Incl.TRUST BLUE■Versatile product line for coarse machining, surface texturing and polishing■Optimal solutions even for complicated applications■High performance, quick and safeThe COMBIDISC product range contains a wide selection of grinding tools for surface finishing. From coarse machining and surface texturing to face-down mirror polishing – the range provides the best tool, even for complicated applications.Advantages:■High profitability thanks to quick tool changes.■Great convenience thanks to simple handling and low-vibration working.■No operational disruptions caused by sticking, slipping or disengaging. Applications:■Roughening■Levelling■Deburring■Surface work■Work on edges■Polishing■Cleaning■Sharpening■Work on weld seams■Structuring surfaces■Step-by-step fine grinding Recommendations for use:■Use COMBIDISC grinding tools with arborsor abrasive disc holders on flexible shaftdrives with angle handpieces, com-pressed-air or electric angle grinders.■Use grinding oil which is suitable for thematerial in order to considerably increasethe tool life and abrasive performanceof the tools. More detailed informationand ordering data for grinding oils can befound in our Tool Manual 23, cataloguesection 4, page 155 or at .Matching tool drives:■Flexible shaft drives■Straight grinders■Angle grinders■Cordless angle grindersOrdering notes:■Please order arbors or COMBIDISC abrasivedisc holders separately.More detailed information and orderingdata can be found on page 18.■When ordering, please state the EAN orthe full description.■Ordering example:EAN 4007220266175CD 38 A 180■Ordering example explanation:CD = COMBIDISC abrasive discs38 = Outer diameter D1[mm]A = Abrasive180= Grit sizeSafety notes:■The maximum permitted peripheral speedis 50 m/s.■For safety reasons, the specified maximumpermitted rotational speed must never beexceeded.Accessories:■Arbors for COMBIDISC Mini-POLIFAN■COMBIDISC abrasive disc holders■COMBIDISC DUST REMOVERTool side: Threaded connection with female thread (metal/plastic)Also suitable for the following systems used on the market: PSG, Power Lock Type II "turn on", SocAtt, Turn-On Tool side: Threaded connection with malethread (plastic)Also suitable for the following systems usedon the market: Roloc™, Lockit, Speed LokTR, Power Lock Type III, Fastlock-System B,Roll-OnPFERD VALUE:PFERD ERGONOMICS recommendsCOMBIDISC tools as a solution to sustainablyreduce vibration, noise and dust levelsproduced by tools and to improve workingcomfort.PFERD EFFICIENCY recommends COMBIDISCtools to reduce tool change and setup times.PFERD VIDEO:Learn more about theadvantages of usingCOMBIDISC tools.The fast way to the best toolRecommended rotational speed rangeExample:CD 50 A-COOL 60 Application:Grinding stainless steel (INOX)Cutting speed: 20–25 m/sRotational speed: 7,600–9,500 RPM3CD CDRAluminium oxide A typeFor universal coarse grinding work with high stock removal rates.Ideal for dressing weld seams in hard-to-reach places.Longer tool life and higher stock removal rate when compared to abrasive discs.Abrasive:Aluminium oxide AOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :CD CDRZirconia alumina Z typeFor coarse grinding work with a high stock removal rate and a long tool life.Abrasive:Zirconia alumina ZRecommendations for use:■Use in the case of a higher contact pressure.Ordering notes:■Please complete the description with the desired grit size.PFERD VALUE :Mini-POLIFAN arborsBO PFFMatching arbors for COMBIDISC Mini-POLIFAN.CD CDRAluminium oxide A typeFor universal coarse to fine grinding applications in industry and professional trades.Abrasive:Aluminium oxide AOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :CD CDRAluminium oxide A-PLUS typeFor universal applications from coarse to fine grinding.Higher stock removal rate due to sturdy backing material. Particularly for use in edge grinding due to high tear strength.Abrasive:Aluminium oxide A-PLUSOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDCDRAluminium oxide A-FLEX typeParticularly flexible abrasive discs, which are especially suitable for work on contours and concave surfaces, e.g. in tool- and mould-making. For achieving seamless transitions in the surface finish.Abrasive:Aluminium oxide A-FLEXRecommendations for use:■These discs should be used with a soft holder to support their flexibility.Ordering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDCDRAluminium oxide A-FORTE typeFor universal applications from coarse to fine grinding, with a high stock removal rate and long tool life.Abrasive:Aluminium oxide A-FORTEOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDCDRAluminium oxide A-COOL typeFor universal applications from coarse to fine grinding on materials with challenging stock removal properties, e.g. stainless steel (INOX).Active grinding additives in the coating substantially improve the stock removal rate, prevent clogging and result in cooler grinding.Abrasive:Aluminium oxide A-COOLOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDCDRAluminium oxide A compact grain typeOutstandingly suited to fine and very fine grinding, and for step-by-step preparations for polishing.The self-sharpening compact grain facilitates a very long tool life and achieves consistent surface quality levels throughout the entire tool life.Abrasive:Aluminium oxide A compact grainOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDCDRAluminium oxide A-CONTOUR typeVery flexible and adaptable on account of the outer contour. Cutting into the workpiece is avoided.Abrasive:Aluminium oxide A-CONTOUR Recommendations for use:■Use an abrasive disc holder with a diameter of 20–50 mm.Ordering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDCDRZirconia alumina Z typeFor coarse grinding work with a high stock removal rate and a long tool life.Particularly high stock removal rate in coarse grinding applications using grit sizes 36 and 60.Abrasive:Zirconia alumina ZRecommendations for use:■Use with hard or medium-hard COMBIDISC abrasive disc holders.Ordering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDCDRCeramic oxide grain CO-COOL typeFor aggressive grinding with maximum stock removal rate on hard materials which do not conduct heat well. Consistently high performance due to self-sharpening ceramic oxide grain.Active grinding additives in the coating substantially improve the stock removal rate, prevent clogging and result in cooler grinding.Abrasive:Ceramic oxide grain CO-COOLOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDFCDFRCeramic oxide grain CO-COOL midget fibre discs typeExceptionally well-suited to surface and edge grinding. The fibre backing strengthens the abrasive disc and improves stock removal.For aggressive grinding with maximum stock removal rate on hard materials which do not conduct heat well. Consistently high performance due to self-sharpening ceramic oxide grain.Active grinding additives in the coating substantially improve the stock removal rate, prevent clogging and result in cooler grinding.Abrasive:Ceramic oxide grain CO-COOLOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :VICTO GRAIN products are some of the most effective grinding tools in the world. PFERD’s triangular, precision-formed abrasive grain achieves unique-ly high abrasive performance.The VICTO GRAIN abrasive grain triangles are identical in shape and size and their cutting edges are applied to the workpiece at the optimum an -gle, meaning the grain needs very little energy to penetrate the workpiece. As such, the user benefits from an efficient machining process with ■ fast working, ■ a long tool life,■ less heat build-up in the workpiece, and■ a lower power output required for the tool drive.The VICTO GRAIN abrasive grain triangles are fixed to the substrate on one of their sides. This means they are securely fixed in place and, together with their slim design, offer an extremely large chip space in order to further improve machining efficiency.The structure of the triangular VICTO GRAIN has also been specially adapt -GRAIN abrasive grainThe VICTO GRAIN abrasive grain is optimally alignedVIDEO :Learn more about the advantages of using GRAIN products.VICTO GRAIN -COOL midget fibre discs typeExceptionally well-suited to surface and edge grinding. The fibre backing considerably strengthens the abrasive disc and improves stock removal.For extremely aggressive grinding with an extremely long tool life and an outstanding stock removal rate on steels and materials which are hard or have poor heat-conducting properties.Outstanding, constant high performance thanks to the VICTO GRAIN-COOL abrasive grain.Active grinding additives in the coating substantially improve the stock removal rate, prevent clogging and result in cooler grinding.Abrasive:VICTO GRAIN-COOLPFERD VALUE :CDF CDFRVICTO GRAIN -COOL typeFor extremely aggressive grinding with an extremely long tool life and an outstanding stock removal rate on steels and materials which are hard or have poor heat-conducting properties.Outstanding, constant high performance thanks to the VICTO GRAIN-COOL abrasive grain.Active grinding additives in the coating substantially improve the stock removal rate, prevent clogging and result in cooler grinding.Abrasive:VICTO GRAIN-COOLPFERD VALUE :CDCDRCD CDRDiamond typeExceptionally suitable for work on wear-resistant coatings and for hard facings made of tung-sten carbide, chromium carbide, titanium carbide, etc. Particularly recommended for work on materials used for aircraft engine construction, e.g. Hastelloy, Inconel and titanium/titanium alloys. Also highly suitable for work on extremely hard materials such as tungsten carbide, glass, ceramics, enamel, stone and GRP/CRP.Detailed information on diamond grinding tools can be found in our Tool Manual 23, catalogue section 5.Abrasive:Diamond D 251 = P 60D 126 = P 120D 76 = P 220(P = G rit size according to ISO 6344)Recommendations for use:■For the best results, use at a recommend-ed cutting speed of 10–20 m/s. ■Use with hard or medium-hard COMBIDISC abrasive disc holders.Ordering notes:■Please complete the description with the desired grit size.■Grit sizes are indicated in µm.PFERD VALUE :CDCDRSilicon carbide SiC typeFor universal grinding work on components made from aluminium, copper, bronze, titanium and fibre-reinforced plastics.Particularly recommended for use on titanium alloys.Ideally suited to use in the aeronautical industry, especially where SiC is the only approved abrasive, e.g. for use on engine components.Abrasive:Silicon carbide SiCOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :POLICLEAN discs CD, CDRCDCDRPCLR and PCLR PLUS typesFor coarse cleaning work such as removing paint, scale, heat discolouration, rust and adhesive residues in face-down grinding.POLICLEAN-PLUS discs (blue) exhibit a higher stock removal rate with a very long tool life.Applications:roughening, surface work, cleaning Abrasive:Aluminium oxide A Silicon carbide SiCRecommendations for use:■Use with hard or medium-hard COMBIDISC abrasive disc holders.PFERD VALUE :CD CDRHard type VRHSuitable for universal work on small and medium-sized metal surfaces, e.g. removing rough grinding traces, removing oxidation and light deburring work. Achieve matt and satin-finished surfaces.Applications:roughening, deburring, surface work, clean -ing, weld dressing, structuring, fine grinding in multiple stepsAbrasive:Aluminium oxide AAvailable POLIVLIES grit sizes:100 G = c oarse (yellow-brown)180 M = m edium (red-brown)240 F = fi ne (blue)Recommendations for use:■The addition of oil or water during grind -ing results in a finer finish, cooler grinding and longer tool life.Ordering notes:■Please complete the description with the desired grit size.PFERD VALUE :CD CDRSoft type VRWSuitable for very fine grinding on small and medium-sized surfaces and contours, and for cleaning metal and painted surfaces. Achieve matt and satin-finished surfaces. Highly open structure.Applications:roughening, deburring, surface work, clean -ing, weld dressing, structuring, fine grinding in multiple stepsAbrasive:Aluminium oxide AAvailable POLINOX grit sizes:100 = m edium 180 = fi ne 280 = v ery fineRecommendations for use:■The addition of oil or water during grind -ing results in a finer finish, cooler grinding and longer tool life.Ordering notes:■Please complete the description with the desired grit size.PFERD VALUE :CD CDRPNER typeFor achieving a very fine, uniform surface finish which, depending on requirements, is a sufficient preparation for high-gloss polishing. Particularly suitable for work on small and medium-sized surfaces of stainless steel (INOX) components.The different thicknesses/hardnesses of the non-woven material are colour-coded:W (soft) = g rey MH (medium-hard) = d ark blue H (hard) = r ed Applications:roughening, deburring, surface work, clean -ing, weld dressing, structuring, fine grinding in multiple steps Abrasive:Aluminium oxide A Silicon carbide SiCOrdering notes:■Please complete the description with the desired grit size.■The non-woven discs are supplied with a thickness of 6 mm.PFERD VALUE :For further information on non-woven products in the PNER type please refer to our brochure “Non-woven tools PNER and PNK – The professionals for high-grade surfaces” at .Aluminium oxide A typeFor achieving fine, matt grinding finishes in one process. The very sturdy granular bond facilitates very aggressive abrasive performance.Particularly suitable for work on stainless steel (INOX) and aluminium.Applications:deburring, surface work, weld dressing, structuring, fine grinding in multiple steps Abrasive:Aluminium oxide AOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :Felt discs CD, CDRCD CDRFR typeSuitable for polishing with polishing paste bars, grinding pastes or diamond polishing pastes in face-down grinding on small and medium-sized surfaces.Applications:polishingRecommendations for use:■Use COMBIDISC felt discs with an abrasive disc holder on flexible shaft drives with an angle handpiece or small compressed-air or electric angle grinders.■For the best results, use at a recom-mended cutting speed of 5–10 m/s. This provides an ideal compromise between polishing performance, thermal load on the workpiece and tool wear.■When applying a different polishing paste, use a new unused felt disc.Ordering notes:■Further information on felt tools can be found in our Tool Manual 23, catalogue section 4, page 144.Accessories:Grinding and polishing pastes (Tool Manual 23, catalogue section 4, pages 153–154)PFERD VALUE :LSBH and SBHR typesMatching arbors for COMBIDISC grinding tools. Available in three different hardness grades.Ordering notes:■The different hardness grades are col-our-coded: W (soft) – grey; M (medium) – blue; H (hard) – red■Please complete the description with the desired hardness grade.PFERD VALUE :AF 14-1/4 CD ,(EAN 4007220302026) Female thread M14,male thread 1/4-20 UNC. Suitable for drives with spindle M14.SPV-20 CD 1/4-20 UNC , (EAN 4007220333167) Female thread 1/4-20 UNC, male thread 1/4-20 UNC. Suitable for drives withspindle 1/4-20 UNC, e.g. for PW 3/120 DH.AF M5 CD 1/4-20 UNC (EAN 4007220064702)Male thread M5,male thread 1/4-20 UNC. Suitable for cordless angle grinder, dia. 75, with spindle M5 (female thread).Adapters:The shank of the abrasive disc holders can be replaced by suitable adapters. This enables the abrasive disc holder to be mounted directly to the drive spindle of the tool drive. The following adapters are available:Ordering notes:More detailed information and ordering data for adapters can be found in in our Tool Manual 23, catalogue section 9 or at .COMBIDISC SETSet of various COMBIDISC tools.Contents:■3 pcs. each of COMBIDISC abrasive discs: -CD A 60 FORTE -CD A 120 FORTE -CD A-COOL 60 -CD CO-COOL 36 -CD Z 60■3 pcs. each of COMBIDISC non-woven discs:-CD VRH A 180 M -CD VRW A 100 ■1 pc. each of:-Abrasive disc holder SBH M Advantages:■Getting to know and testing the comprehensive system.■Coordinated selection of the most common versions.Abrasive:Aluminium oxide A Zirconia alumina ZAluminium oxide A-FORTE Aluminium oxide A-COOL Ceramic oxide grain CO-COOLRecommendations for use:■Use COMBIDISC grinding tools with an arbor or abrasive disc holder on flexible shaft drives with an angle handpiece or small compressed-air or electric angle grinders.PFERD VALUE :SET CD UWERSet of different COMBIDISC tools, including single-hand angle grinder, for all coarse and fine grinding, polishing and cleaning work, especially on assembly and construction sites.Contents:■Electric angle grinder UWER 5/200 SI with electronic rotational speed control (9,000–20,000 RPM), output 500 watts ■4 abrasive disc holders and 2 adapters for alternative tool drives■135 different abrasive discs, TX discs, Mini-POLIFAN, non-woven and felt discs with a diameter of 50 mm■Polishing paste bar for using felt discsAdvantages:■Entire rotational speed range covered for COMBIDISC tools with a diameter of 50 mm.■Easy and comfortable to use thanks to the handy angle grinder design.■Coordinated selection of the most common versions.Ordering notes:■Detailed information and ordering data on tool drives can be found in in our Tool Manual 23, catalogue section 9.PFERD VALUE :08/2020S u b j e c t t o t e c h n i c a l m o d i fi c a t i o n s .DUST REMOVERWith the COMBIDISC DUST REMOVER, grinding dust can be extracted very effectively from places where something is ground. It can be universally used with all dust extraction systems (portable or stationary). The DUST REMOVER can be used with CD and CDR backing pads.Advantages:■Clean work environment with less dust. ■Compatible with all drive systems. ■Flexible tube for easy accessibility.Recommendations for use:■To guarantee effective extraction, the volumetric flow rate has to be at least 300 m³/h.■Reducing the rotational speed increases the effectiveness of extraction. Matching tool drives: ■Flexible shaft drives ■Straight grinders ■Angle grinders■Cordless angle grinders Ordering notes:■Please order arbors or COMBIDISC abrasive disc holders separately.■When ordering, please state the EAN or the full description.Safety notes:■The maximum permitted peripheral speed is 50 m/s.■For safety reasons, the specified maximum permitted rotational speed must never be exceeded.Accessories:■CD and CDR abrasive disc holders with a diameter of 50 mm or 75 mm.D 1D 2。
电子英语证书考试(PEC)-集成电路词汇汇总

电子英语证书考试(PEC)-集成电路词汇汇总Abrupt junction 突变结Accelerated testing 加速实验Acceptor 受主Acceptor atom 受主原子Accumulation 积累、堆积Accumulating contact 积累接触Accumulation region 积累区Accumulation layer 积累层Active region 有源区Active component 有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源(放大)区Admittance 导纳Allowed band 允带Alloy-junction device合金结器件Aluminum(Aluminium) 铝Aluminum – oxide 铝氧化物Aluminum passivation 铝钝化Ambipolar 双极的Ambient temperature 环境温度Amorphous 无定形的,非晶体的Amplifier 功放扩音器放大器Analogue(Analog) comparator 模拟比较器Angstrom 埃Anneal 退火Anisotropic 各向异性的Anode 阳极Arsenic (AS) 砷Auger 俄歇Auger process 俄歇过程Avalanche 雪崩Avalanche breakdown 雪崩击穿Avalanche excitation雪崩激发Background carrier 本底载流子Background doping 本底掺杂Backward 反向Backward bias 反向偏置Ballasting resistor 整流电阻Ball bond 球形键合Band 能带Band gap 能带间隙Barrier 势垒Barrier layer 势垒层Barrier width 势垒宽度Base 基极Base contact 基区接触Base stretching 基区扩展效应Base transit time 基区渡越时间Base transport efficiency基区输运系数Base-width modulation基区宽度调制Basis vector 基矢Bias 偏置Bilateral switch 双向开关Binary code 二进制代码Binary compound semiconductor 二元化合物半导体Bipolar 双极性的Bipolar Junction Transistor (BJT)双极晶体管Bloch 布洛赫Blocking band 阻挡能带Blocking contact 阻挡接触Body - centered 体心立方Body-centred cubic structure 体立心结构Boltzm ann 波尔兹曼Bond 键、键合Bonding electron 价电子Bonding pad 键合点Bootstrap circuit 自举电路Bootstrapped emitter follower 自举射极跟随器Boron 硼Borosilicate glass 硼硅玻璃Boundary condition 边界条件Bound electron 束缚电子Breadboard 模拟板、实验板Break down 击穿Break over 转折Brillouin 布里渊Brillouin zone 布里渊区Built-in 内建的Build-in electric field 内建电场Bulk 体/体内Bulk absorption 体吸收Bulk generation 体产生Bulk recombination 体复合Burn - in 老化Burn out 烧毁Buried channel 埋沟Buried diffusion region 隐埋扩散区Can 外壳Capacitance 电容Capture cross section 俘获截面 Capture carrier 俘获载流子Carrier 载流子、载波Carry bit 进位位Carry-in bit 进位输入 Carry-out bit 进位输出Cascade 级联 Case 管壳Cathode 阴极 Center 中心Ceramic 陶瓷(的)Channel 沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂 Channel shortening 沟道缩短Channel width 沟道宽度 Characteristic impedance 特征阻抗Charge 电荷、充电 Charge-compensation effects 电荷补偿效应Charge conservation 电荷守恒 Charge neutrality condition 电中性条件Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemmical etching 化学腐蚀法 Chemically-Polish 化学抛光Chemmically-Mechanically Polish (CMP) 化学机械抛光Chip 芯片Chip yield 芯片成品率Clamped 箝位Clamping diode 箝位二极管Cleavage plane 解理面Clock rate 时钟频率 Clock generator 时钟发生器Clock flip-flop 时钟触发器Close-packed structure 密堆积结构Close-loop gain 闭环增益 Collector 集电极Collision 碰撞 Compensated OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain 共模增益 Common-mode input 共模输入Common-mode rejection ratio (CMRR) 共模抑制比Compatibility 兼容性Compensation 补偿Compensated impurities 补偿杂质 Compensated semiconductor 补偿半导体Complementary Darlington circuit 互补达林顿电路Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Complementary error function 余误差函数Computer-aided design (CAD)/test(CAT)/manufacture(CAM) 计算机辅助设计/ 测试/制造Compound Semiconductor 化合物半导体 Conductance 电导Conduction band (edge) 导带(底) Conduction level/state 导带态Conductor 导体 Conductivity 电导率Configuration 组态 Conlomb 库仑Conpled Configuration Devices 结构组态Constants 物理常数Constant energy surface 等能面 Constant-source diffusion恒定源扩散Contact 接触Contamination 治污Continuity equation 连续性方程Contact hole 接触孔Contact potential 接触电势Continuity condition 连续性条件Contra doping 反掺杂 Controlled 受控的Converter 转换器Conveyer 传输器Copper interconnection system 铜互连系统Couping 耦合Covalent 共阶的Crossover 跨交Critical 临界的Crossunder 穿交Crucible坩埚 Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Current density 电流密度Curvature 曲率Cut off 截止Current drift/dirve/sharing 电流漂移/驱动/共享Current Sense 电流取样Curvature 弯曲Custom integrated circuit 定制集成电路Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique 切克劳斯基技术(Cz法直拉晶体J)Dangling bonds 悬挂键Dark current 暗电流Dead time 空载时间Debye length 德拜长度De.broglie 德布洛意Decderate 减速Decibel (dB) 分贝Decode 译码Deep acceptor level 深受主能级Deep donor level 深施主能级Deep impurity level 深度杂质能级Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体Degeneracy 简并度Degradation 退化Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度Delay 延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近似Depletion contact 耗尽接触Depletion depth 耗尽深度Depletion effect 耗尽效应Depletion layer 耗尽层Depletion MOS 耗尽MOSDepletion region 耗尽区Deposited film 淀积薄膜Deposition process 淀积工艺Design rules 设计规则Die 芯片(复数dice)Diode 二极管Dielectric 介电的Dielectric isolation 介质隔离Difference-mode input 差模输入Differential amplifier 差分放大器Differential capacitance 微分电容Diffused junction 扩散结Diffusion 扩散Diffusion coefficient 扩散系数Diffusion constant 扩散常数Diffusivity 扩散率Diffusion capacitance/barrier/current/furnace 扩散电容/势垒/电流/炉Digital circuit 数字电路Dipole domain 偶极畴Dipole layer 偶极层Direct-coupling 直接耦合Direct-gap semiconductor 直接带隙半导体Direct transition 直接跃迁Discharge 放电Discrete component 分立元件Dissipation 耗散Distribution 分布Distributed capacitance 分布电容Distributed model 分布模型Displacement 位移Dislocation 位错Domain 畴Donor 施主Donor exhaustion 施主耗尽Dopant 掺杂剂Doped semiconductor 掺杂半导体Doping concentration 掺杂浓度Double-diffusive MOS(DMOS)双扩散MOS.Drift 漂移Drift field 漂移电场Drift mobility 迁移率Dry etching 干法腐蚀Dry/wet oxidation 干/湿法氧化Dose 剂量Duty cycle 工作周期Dual-in-line package (DIP)双列直插式封装Dynamics 动态Dynamic characteristics 动态属性Dynamic impedance 动态阻抗Early effect 厄利效应Early failure 早期失效Effective mass 有效质量Einstein relation(ship) 爱因斯坦关系Electric Erase Programmable Read Only Memory(E2PROM) 一次性电可擦除只读存储器Electrode 电极Electrominggratim 电迁移Electron affinity 电子亲和势Electronic -grade 电子能Electron-beam photo-resist exposure 光致抗蚀剂的电子束曝光Electron gas 电子气Electron-grade water 电子级纯水Electron trapping center 电子俘获中心 Electron Volt (eV) 电子伏Electrostatic 静电的Element 元素/元件/配件Elemental semiconductor 元素半导体Ellipse 椭圆Ellipsoid 椭球Emitter 发射极Emitter-coupled logic 发射极耦合逻辑Emitter-coupled pair 发射极耦合对Emitter follower 射随器Empty band 空带Emitter crowding effect 发射极集边(拥挤)效应Endurance test =life test 寿命测试 Energy state 能态Energy momentum diagram 能量-动量(E-K)图Enhancement mode 增强型模式Enhancement MOS 增强性MOS Entefic (低)共溶的Environmental test 环境测试Epitaxial 外延的Epitaxial layer 外延层Epitaxial slice 外延片Expitaxy 外延Equivalent curcuit 等效电路Equilibrium majority /minority carriers 平衡多数/少数载流子Erasable Programmable ROM (EPROM)可搽取(编程)存储器Error function complement 余误差函数Etch 刻蚀Etchant 刻蚀剂Etching mask 抗蚀剂掩模Excess carrier 过剩载流子Excitation energy 激发能 Excited state 激发态Exciton 激子 Extrapolation 外推法Extrinsic 非本征的Extrinsic semiconductor 杂质半导体Face - centered 面心立方Fall time 下降时间Fan-in 扇入Fan-out 扇出Fast recovery 快恢复F ast surface states 快界面态Feedback 反馈Fermi level 费米能级Fermi-Dirac Distribution 费米-狄拉克分布Femi potential 费米势Fick equation 菲克方程(扩散)Field effect transistor 场效应晶体管Field oxide 场氧化层Filled band 满带Film 薄膜Flash memory 闪烁存储器Flat band 平带Flat pack 扁平封装Flicker noise 闪烁(变)噪声Flip-flop toggle 触发器翻转Floating gate 浮栅Fluoride etch 氟化氢刻蚀Forbidden band 禁带Forward bias 正向偏置Forward blocking /conducting正向阻断/导通Frequency deviation noise频率漂移噪声Frequency response 频率响应Function 函数Gain 增益Gallium-Arsenide(GaAs) 砷化钾Gamy ray r 射线Gate 门、栅、控制极Gate oxide 栅氧化层Gauss(ian)高斯Gaussian distribution profile 高斯掺杂分布Generation-recombination 产生-复合Geometries 几何尺寸Germanium(Ge) 锗Graded 缓变的Graded (gradual) channel 缓变沟道Graded junction 缓变结Grain 晶粒Gradient 梯度Grown junction 生长结Guard ring 保护环Gummel-Poom model 葛谋-潘模型Gunn - effect 狄氏效应Hardened device 辐射加固器件Heat of formation 形成热Heat sink 散热器、热沉Heavy/light hole band 重/轻空穴带Heavy saturation 重掺杂Hell - effect 霍尔效应Heterojunction 异质结Heterojunction structure 异质结结构Heterojunction Bipolar Transistor(HBT)异质结双极型晶体High field property 高场特性High-performance MOS.( H-MOS)高性能MOS. Hormalized 归一化Horizontal epitaxial reactor 卧式外延反应器Hot carrior 热载流子Hybrid integration 混合集成Image - force 镜象力Impact ionization 碰撞电离Impedance 阻抗Imperfect structure 不完整结构Implantation dose 注入剂量Implanted ion 注入离子Impurity 杂质Impurity scattering 杂志散射Incremental resistance 电阻增量(微分电阻)In-contact mask 接触式掩模Indium tin oxide (ITO) 铟锡氧化物Induced channel 感应沟道Infrared 红外的Injection 注入Input offset voltage 输入失调电压Insulator 绝缘体Insulated Gate FET(IGFET)绝缘栅FET Integrated injection logic集成注入逻辑Integration 集成、积分Interconnection 互连Interconnection time delay 互连延时Interdigitated structure 交互式结构Interface 界面Interference 干涉International system of unions国际单位制Internally scattering 谷间散射Interpolation 内插法Intrinsic 本征的Intrinsic semiconductor 本征半导体Inverse operation 反向工作Inversion 反型Inverter 倒相器Ion 离子Ion beam 离子束Ion etching 离子刻蚀Ion implantation 离子注入Ionization 电离Ionization energy 电离能Irradiation 辐照Isolation land 隔离岛Isotropic 各向同性Junction FET(JFET) 结型场效应管Junction isolation 结隔离Junction spacing 结间距Junction side-wall 结侧壁Latch up 闭锁Lateral 横向的Lattice 晶格Layout 版图Lattice binding/cell/constant/defect/distortion 晶格结合力/晶胞/晶格/晶格常熟/晶格缺陷/晶格畸变Leakage current (泄)漏电流Level shifting 电平移动Life time 寿命linearity 线性度Linked bond 共价键Liquid Nitrogen 液氮Liquid-phase epitaxial growth technique 液相外延生长技术Lithography 光刻Light Emitting Diode(LED) 发光二极管Load line or Variable 负载线Locating and Wiring 布局布线Longitudinal 纵向的Logic swing 逻辑摆幅Lorentz 洛沦兹Lumped model 集总模型Majority carrier 多数载流子Mask 掩膜板,光刻板Mask level 掩模序号Mask set 掩模组Mass - action law质量守恒定律Master-slave D flip-flop主从D触发器Matching 匹配Maxwell 麦克斯韦Mean free path 平均自由程Meandered emitter junction梳状发射极结Mean time before failure (MTBF) 平均工作时间Megeto - resistance 磁阻Mesa 台面MESFET-Metal Semiconductor金属半导体FETMetallization 金属化Microelectronic technique 微电子技术Microelectronics 微电子学Millen indices 密勒指数Minority carrier 少数载流子Misfit 失配Mismatching 失配Mobile ions 可动离子Mobility 迁移率Module 模块Modulate 调制Molecular crystal分子晶体Monolithic IC 单片IC MOSFET金属氧化物半导体场效应晶体管Mos. Transistor(MOST )MOS. 晶体管Multiplication 倍增Modulator 调制Multi-chip IC 多芯片ICMulti-chip module(MCM) 多芯片模块Multiplication coefficient倍增因子Naked chip 未封装的芯片(裸片)Negative feedback 负反馈Negative resistance 负阻Nesting 套刻Negative-temperature-coefficient 负温度系数Noise margin 噪声容限Nonequilibrium 非平衡Nonrolatile 非挥发(易失)性Normally off/on 常闭/开Numerical analysis 数值分析Occupied band 满带 Officienay 功率Offset 偏移、失调On standby 待命状态Ohmic contact 欧姆接触 Open circuit 开路Operating point 工作点 Operating bias 工作偏置Operational amplifier (OPAMP)运算放大器Optical photon =photon 光子 Optical quenching光猝灭Optical transition 光跃迁 Optical-coupled isolator光耦合隔离器Organic semiconductor有机半导体 Orientation 晶向、定向Outline 外形Out-of-contact mask非接触式掩模Output characteristic 输出特性Output voltage swing 输出电压摆幅Overcompensation 过补偿 Over-current protection 过流保护Over shoot 过冲Over-voltage protection 过压保护Overlap 交迭 Overload 过载Oscillator 振荡器Oxide 氧化物Oxidation 氧化Oxide passivation 氧化层钝化Package 封装 Pad 压焊点Parameter 参数 Parasitic effect 寄生效应Parasitic oscillation 寄生振荡 Passination 钝化Passive component 无源元件 Passive device 无源器件Passive surface 钝化界面 Parasitic transistor 寄生晶体管Peak-point voltage 峰点电压 Peak voltage 峰值电压Permanent-storage circuit 永久存储电路Period 周期Periodic table 周期表 Permeable - base 可渗透基区Phase-lock loop 锁相环Phase drift 相移Phonon spectra 声子谱Photo conduction 光电导 Photo diode 光电二极管Photoelectric cell 光电池Photoelectric effect 光电效应Photoenic devices 光子器件Photolithographic process 光刻工艺(photo) resist (光敏)抗腐蚀剂Pin 管脚Pinch off 夹断Pinning of Fermi level 费米能级的钉扎(效应)Planar process 平面工艺 Planar transistor 平面晶体管Plasma 等离子体 Plezoelectric effect 压电效应Poisson equation 泊松方程Point contact 点接触Polarity 极性 Polycrystal 多晶Polymer semiconductor聚合物半导体 Poly-silicon 多晶硅Potential (电)势Potential barrier 势垒Potential well 势阱Power dissipation 功耗Power transistor 功率晶体管 Preamplifier 前置放大器Primary flat 主平面Principal axes 主轴Print-circuit board(PCB) 印制电路板Probability 几率Probe 探针Process 工艺Propagation delay 传输延时Pseudopotential method 膺势发Punch through 穿通 Pulse triggering/modulating 脉冲触发/调制PulseWiden Modulator(PWM) 脉冲宽度调制Punchthrough 穿通 Push-pull stage 推挽级Quality factor 品质因子 Quantization 量子化Quantum 量子Quantum efficiency量子效应Quantum mechanics 量子力学Quasi – Fermi-level准费米能级Quartz 石英Radiation conductivity 辐射电导率Radiation damage 辐射损伤Radiation flux density 辐射通量密度Radiation hardening 辐射加固Radiation protection 辐射保护Radiative - recombination辐照复合Radioactive 放射性Reach through 穿通Reactive sputtering source 反应溅射源Read diode 里德二极管Recombination 复合Recovery diode 恢复二极管Reciprocal lattice 倒核子Recovery time 恢复时间Rectifier 整流器(管)Rectifying contact 整流接触Reference 基准点基准参考点Refractive index 折射率Register 寄存器Registration 对准Regulate 控制调整Relaxation lifetime 驰豫时间Reliability 可靠性Resonance 谐振Resistance 电阻Resistor 电阻器Resistivity 电阻率Regulator 稳压管(器)Relaxation 驰豫Resonant frequency共射频率Response time 响应时间Reverse 反向的Reverse bias 反向偏置Sampling circuit 取样电路Sapphire 蓝宝石(Al2O3)Satellite valley 卫星谷Saturated current range电流饱和区Saturation region 饱和区Saturation 饱和的Scaled down 按比例缩小Scattering 散射Schockley diode 肖克莱二极管Schottky 肖特基Schottky barrier 肖特基势垒Schottky contact 肖特基接触Schrodingen 薛定厄Scribing grid 划片格Secondary flat 次平面Seed crystal 籽晶Segregation 分凝Selectivity 选择性Self aligned 自对准的Self diffusion 自扩散Semiconductor 半导体Semiconductor-controlled rectifier 可控硅Sendsitivity 灵敏度Serial 串行/串联Series inductance 串联电感Settle time 建立时间Sheet resistance 薄层电阻Shield 屏蔽Short circuit 短路Shot noise 散粒噪声Shunt 分流Sidewall capacitance 边墙电容Signal 信号Silica glass 石英玻璃Silicon 硅Silicon carbide 碳化硅Silicon dioxide (SiO2) 二氧化硅Silicon Nitride(Si3N4) 氮化硅Silicon On Insulator 绝缘硅Siliver whiskers 银须Simple cubic 简立方Single crystal 单晶Sink 沉Skin effect 趋肤效应Snap time 急变时间Sneak path 潜行通路Sulethreshold 亚阈的Solar battery/cell 太阳能电池Solid circuit 固体电路Solid Solubility 固溶度Sonband 子带Source 源极Source follower 源随器Space charge 空间电荷Specific heat(PT) 热Speed-power product 速度功耗乘积Spherical 球面的Spin 自旋Split 分裂Spontaneous emission 自发发射Spreading resistance扩展电阻Sputter 溅射Stacking fault 层错Static characteristic 静态特性Stimulated emission 受激发射Stimulated recombination 受激复合Storage time 存储时间Stress 应力Straggle 偏差Sublimation 升华Substrate 衬底Substitutional 替位式的Superlattice 超晶格Supply 电源Surface 表面Surge capacity 浪涌能力Subscript 下标Switching time 开关时间Switch 开关Tailing 扩展Terminal 终端Tensor 张量Tensorial 张量的Thermal activation 热激发Thermal conductivity 热导率Thermal equilibrium 热平衡Thermal Oxidation 热氧化Thermal resistance 热阻Thermal sink 热沉Thermal velocity 热运动Thermoelectricpovoer 温差电动势率Thick-film technique 厚膜技术Thin-film hybrid IC薄膜混合集成电路Thin-Film Transistor(TFT) 薄膜晶体Threshlod 阈值Thyistor 晶闸管Transconductance 跨导Transfer characteristic 转移特性Transfer electron 转移电子Transfer function 传输函数Transient 瞬态的Transistor aging(stress) 晶体管老化Transit time 渡越时间Transition 跃迁Transition-metal silica 过度金属硅化物Transition probability 跃迁几率Transition region 过渡区Transport 输运Transverse 横向的Trap 陷阱Trapping 俘获Trapped charge 陷阱电荷Triangle generator 三角波发生器Triboelectricity 摩擦电Trigger 触发Trim 调配调整Triple diffusion 三重扩散Truth table 真值表Tolerahce 容差Tunnel(ing) 隧道(穿)Tunnel current 隧道电流Turn over 转折Turn - off time 关断时间Ultraviolet 紫外的Unijunction 单结的Unipolar 单极的Unit cell 原(元)胞Unity-gain frequency 单位增益频率Unilateral-switch单向开关Vacancy 空位Vacuum 真空Valence(value) band 价带Value band edge 价带顶Valence bond 价键Vapour phase 汽相Varactor 变容管Varistor 变阻器Vibration 振动Voltage 电压Wafer 晶片 Wave equation 波动方程Wave guide 波导 Wave number 波数Wave-particle duality 波粒二相性Wear-out 烧毁Wire routing 布线 Work function 功函数Worst-case device 最坏情况器件Yield 成品率Zener breakdown 齐纳击穿Zone melting 区熔法。
AT28HC64B高性能电擦可编程只读存储器(EEPROM)说明书

Features Array•Fast Read Access Time – 70 ns•Automatic Page Write Operation–Internal Address and Data Latches for 64 Bytes•Fast Write Cycle Times–Page Write Cycle Time: 10 ms Maximum (Standard)2 ms Maximum (Option – Ref. AT28HC64BF Datasheet)–1 to 64-byte Page Write Operation•Low Power Dissipation–40 mA Active Current–100µA CMOS Standby Current•Hardware and Software Data Protection•DATA Polling and Toggle Bit for End of Write Detection•High Reliability CMOS Technology–Endurance: 100,000 Cycles–Data Retention: 10 Years•Single 5 V ±10% Supply•CMOS and TTL Compatible Inputs and Outputs•JEDEC Approved Byte-wide Pinout•Industrial Temperature Ranges•Green (Pb/Halide-free) Packaging Option Only1.DescriptionThe AT28HC64B is a high-performance electrically-erasable and programmable read-only memory (EEPROM). Its 64K of memory is organized as 8,192 words by 8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device offers access times to 55 ns with power dissipation of just 220 mW. When the device is deselected, the CMOS standby current is less than 100µA.The AT28HC64B is accessed like a Static RAM for the read or write cycle without the need for external components. The device contains a 64-byte page register to allow writing of up to 64 bytes simultaneously. During a write cycle, the addresses and 1 to 64 bytes of data are internally latched, freeing the address and data bus for other operations. Following the initiation of a write cycle, the device will automatically write the latched data using an internal control timer. The end of a write cycle can be detected by DATA polling of I/O7. Once the end of a write cycle has been detected, a new access for a read or write can begin.Atmel’s AT28HC64B has additional features to ensure high quality and manufactura-bility. The device utilizes internal error correction for extended endurance and improved data retention characteristics. An optional software data protection mecha-nism is available to guard against inadvertent writes. The device also includes anextra 64 bytes of EEPROM for device identification or tracking.20274L–PEEPR–2/3/09AT28HC64B2.Pin Configurations2.128-lead SOIC Top ViewPin Name Function A0 - A12Addresses CE Chip Enable OE Output Enable WE Write Enable I/O0 - I/O7Data Inputs/Outputs NC No Connect DCDon’t Connect2.232-lead PLCC Top ViewNote:PLCC package pins 1 and 17 are Don’t Connect.2.328-lead TSOP Top View30274L–PEEPR–2/3/09AT28HC64B3.Block Diagram4.Device Operation4.1ReadThe AT28HC64B is accessed like a Static RAM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted on the out-puts. The outputs are put in the high-impedance state when either CE or OE is high. This dual line control gives designers flexibility in preventing bus contention in their systems.4.2Byte WriteA low pulse on the WE or CE input with CE or WE low (respectively) and OE high initiates a write cycle. The address is latched on the falling edge of CE or WE, whichever occurs last. The data is latched by the first rising edge of CE or WE. Once a byte write has been started, it will automatically time itself to completion. Once a programming operation has been initiated and for the duration of t WC , a read operation will effectively be a polling operation.4.3Page WriteThe page write operation of the AT28HC64B allows 1 to 64 bytes of data to be written into the device during a single internal programming period. A page write operation is initiated in the same manner as a byte write; after the first byte is written, it can then be followed by 1 to 63 additional bytes. Each successive byte must be loaded within 150 µs (t BLC ) of the previous byte. If the t BLC limit is exceeded, the AT28HC64B will cease accepting data and commence the internal programming operation. All bytes during a page write operation must reside on the same page as defined by the state of the A6 to A12 inputs. For each WE high-to-low transition during the page write operation, A6 to A12 must be the same.The A0 to A5 inputs specify which bytes within the page are to be written. The bytes may be loaded in any order and may be altered within the same load period. Only bytes which are specified for writing will be written; unnecessary cycling of other bytes within the page does not occur.4.4DATA PollingThe AT28HC64B features DATA Polling to indicate the end of a write cycle. During a byte or page write cycle, an attempted read of the last byte written will result in the complement of the written data to be presented on I/O7. Once the write cycle has been completed, true data is valid on all outputs, and the next write cycle may begin. DATA Polling may begin at any time during the write cycle.40274L–PEEPR–2/3/09AT28HC64B4.5Toggle BitIn addition to DATA Polling, the AT28HC64B provides another method for determining the end of a write cycle. During the write operation, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the write has completed, I/O6 will stop toggling, and valid data will be read. Toggle bit reading may begin at any time during the write cycle.4.6Data ProtectionIf precautions are not taken, inadvertent writes may occur during transitions of the host system power supply. Atmel ® has incorporated both hardware and software features that will protect the memory against inadvertent writes.4.6.1Hardware ProtectionHardware features protect against inadvertent writes to the AT28HC64B in the following ways: (a) V CC sense – if V CC is below 3.8 V (typical), the write function is inhibited; (b) V CC power-on delay – once V CC has reached 3.8 V, the device will automatically time out 5 ms (typical) before allowing a write; (c) write inhibit – holding any one of OE low, CE high or WE high inhib-its write cycles; and (d) noise filter – pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a write cycle.4.6.2Software Data ProtectionA software-controlled data protection feature has been implemented on the AT28HC64B. When enabled, the software data protection (SDP), will prevent inadvertent writes. The SDP feature may be enabled or disabled by the user; the AT28HC64B is shipped from Atmel with SDP disabled.SDP is enabled by the user issuing a series of three write commands in which three specific bytes of data are written to three specific addresses (refer to the “Software Data Protection Algorithm” diagram on page 10). After writing the 3-byte command sequence and waiting t WC , the entire AT28HC64B will be protected against inadvertent writes. It should be noted that even after SDP is enabled, the user may still perform a byte or page write to the AT28HC64B. This is done by preceding the data to be written by the same 3-byte command sequence used to enable SDP.Once set, SDP remains active unless the disable command sequence is issued. Power transi-tions do not disable SDP, and SDP protects the AT28HC64B during power-up and power-down conditions. All command sequences must conform to the page write timing specifica-tions. The data in the enable and disable command sequences is not actually written into the device; their addresses may still be written with user data in either a byte or page write operation.After setting SDP, any attempt to write to the device without the 3-byte command sequence will start the internal write timers. No data will be written to the device, however. For the dura-tion of t WC , read operations will effectively be polling operations.4.7Device IdentificationAn extra 64 bytes of EEPROM memory are available to the user for device identification. By raising A9 to 12 V ±0.5 V and using address locations 1FC0H to 1FFFH, the additional bytes may be written to or read from in the same manner as the regular memory array.50274L–PEEPR–2/3/09AT28HC64BNotes:1.X can be VIL or VIH.2.See “AC Write Waveforms” on page 8.3.VH = 12.0 V ±0.5 V.Note:1.I SB1 and I SB2 for the 55 ns part is 40 mA maximum.5.DC and AC Operating RangeAT28HC64B-70AT28HC64B-90AT28HC64B-120Operating Temperature (Case)-40°C - 85°C -40°C - 85°C -40°C - 85°C V CC Power Supply5 V ±10%5 V ±10%5 V ±10%6.Operating ModesMode CE OE WE I/O Read V IL V IL V IH D OUT Write (2)V IL V IH V IL D IN Standby/Write Inhibit V IH X (1)X High ZWrite Inhibit X X V IH Write Inhibit X V IL X Output Disable X V IH XHigh ZChip Erase V ILV H (3)V IL High Z7.Absolute Maximum Ratings*Temperature Under Bias................................-55°C to +125°C *NOTICE:Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent dam-age to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliabilityStorage Temperature.....................................-65°C to +150°C All Input Voltages(including NC Pins)with Respect to Ground.................................-0.6 V to +6.25 V All Output Voltageswith Respect to Ground...........................-0.6 V to V CC + 0.6 V Voltage on OE and A9with Respect to Ground..................................-0.6 V to +13.5V8.DC CharacteristicsSymbol Parameter ConditionMinMax Units I LI Input Load Current V IN = 0 V to V CC + 1 V 10µA I LO Output Leakage Current V I/O = 0 V to V CC10µA I SB1V CC Standby Current CMOS CE = V CC - 0.3 V to V CC + 1 V 100(1)µA I SB2V CC Standby Current TTL CE = 2.0 V to V CC + 1 V 2(1)mA I CC V CC Active Current f = 5 MHz; I OUT = 0 mA40mA V IL Input Low Voltage 0.8V V IH Input High Voltage 2.0V V OL Output Low Voltage I OL = 2.1 mA 0.40V V OH Output High VoltageI OH = -400 µA2.4V60274L–PEEPR–2/3/09AT28HC64B10.AC Read Waveforms (1)(2)(3)(4)Notes:1.CE may be delayed up to t ACC - t CE after the address transition without impact on t ACC .2.OE may be delayed up to t CE - t OE after the falling edge of CE without impact on t CE or by t ACC - t OE after an address changewithout impact on t ACC .3.t DF is specified from OE or CE whichever occurs first (C L = 5 pF).4.This parameter is characterized and is not 100% tested.9.AC Read CharacteristicsSymbol ParameterAT28HC64B-70AT28HC64B-90AT28HC64B-120Units MinMax MinMax MinMax t ACC Address to Output Delay 7090120ns t CE (1)CE to Output Delay 7090120ns t OE (2)OE to Output Delay 035040050ns t DF (3)(4)OE to Output Float 035040050ns t OHOutput Hold00ns70274L–PEEPR–2/3/09AT28HC64B11.Input Test Waveforms and Measurement Level12.Output Test LoadNote:1.This parameter is characterized and is not 100% tested.R F 13.Pin Capacitancef = 1 MHz, T = 25°C (1)Symbol Typ Max Units Conditions C IN 46pF V IN = 0 V C OUT 812pFV OUT = 0 V815.AC Write Waveforms15.1WE Controlled15.2CE Controlled14.AC Write CharacteristicsSymbol ParameterMin MaxUnits t AS , t OES Address, OE Setup Time 0ns t AH Address Hold Time 50ns t CS Chip Select Setup Time 0ns t CH Chip Select Hold Time 0ns t WP Write Pulse Width (WE or CE)100ns t DS Data Setup Time 50ns t DH , t OEHData, OE Hold Timens90274L–PEEPR–2/3/09AT28HC64B17.Page Mode Write Waveforms (1)(2)Notes: 1.A6 through A12 must specify the same page address during each high to low transition of WE (or CE).2.OE must be high only when WE and CE are both low.18.Chip Erase Waveformst S = t H = 5 µs (min.)t W = 10 ms (min.)V H = 12.0 V ±0.5 V16.Page Mode CharacteristicsSymbol Parameter MinMax Units t WC Write Cycle Time10ms t WC Write Cycle Time (Use AT28HC64BF))2ms t AS Address Setup Time 0ns t AH Address Hold Time 50ns t DS Data Setup Time 50ns t DH Data Hold Time 0ns t WP Write Pulse Width 100ns t BLC Byte Load Cycle Time 150µs t WPHWrite Pulse Width High50ns100274L–PEEPR–2/3/09AT28HC64B19.Software Data Protection EnableAlgorithm (1)Notes:1.Data Format: I/O7 - I/O0 (Hex);Address Format: A12 - A0 (Hex).2.Write Protect state will be activated at end of writeeven if no other data is loaded.3.Write Protect state will be deactivated at end of writeperiod even if no other data is loaded.4.1 to 64 bytes of data are loaded.20.Software Data Protection DisableAlgorithm (1)Notes:1.Data Format: I/O7 - I/O0 (Hex);Address Format: A12 - A0 (Hex).2.Write Protect state will be activated at end of writeeven if no other data is loaded.3.Write Protect state will be deactivated at end of writeperiod even if no other data is loaded.4. 1 to 64 bytes of data are loaded.21.Software Protected Write Cycle Waveforms (1)(2)Notes:1.A6 through A12 must specify the same page address during each high to low transition of WE (or CE) after the softwarecode has been entered.2.OE must be high only when WE and CE are both low.11AT28HC64BNote:1.These parameters are characterized and not 100% tested. See “AC Read Characteristics” on page 6.23.Data Polling WaveformsNotes:1.These parameters are characterized and not 100% tested.2.See “AC Read Characteristics” on page 6.25.Toggle Bit Waveforms (1)(2)(3)Notes: 1.Toggling either OE or CE or both OE and CE will operate toggle bit.2.Beginning and ending state of I/O6 will vary.3.Any address location may be used, but the address should not vary.22.Data Polling Characteristics (1)Symbol Parameter Min TypMaxUnits t DH Data Hold Time 0ns t OEH OE Hold Time 0ns t OE OE to Output Delay (1)ns t WR Write Recovery Timens24.Toggle Bit Characteristics (1)Symbol Parameter Min TypMaxUnits t DH Data Hold Time 10ns t OEH OE Hold Time 10ns t OE OE to Output Delay (2)ns t OEHP OE High Pulse 150ns t WR Write Recovery Timens12AT28HC64B26.Normalized I CCGraphs13AT28HC64B27.Ordering Information27.1Green Package Option (Pb/Halide-free)t ACC (ns)I CC (mA)Ordering Code Package Operation RangeActive Standby 70400.1AT28HC64B-70TU 28T Industrial (-40°C to 85°C)AT28HC64B-70JU 32J AT28HC64B-70SU 28S 90400.1AT28HC64B-90JU 32J AT28HC64B-90SU 28S AT28HC64B-90TU 28T 120400.1AT28HC64B-12JU 32J AT28HC64B-12SU28SPackage Type32J 32-lead, Plastic J-leaded Chip Carrier (PLCC)28S 28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)28T28-lead, Plastic Thin Small Outline Package (TSOP)27.2Die ProductsContact Atmel Sales for die sales options.28.Packaging Information 28.132J – PLCC14AT28HC64BAT28HC64B 28.228S – SOIC1528.328T – TSOP16AT28HC64BHeadquarters InternationalAtmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USATel: 1(408) 441-0311 Fax: 1(408) 487-2600Atmel AsiaUnit 1-5 & 16, 19/FBEA Tower, Millennium City 5418 Kwun Tong RoadKwun Tong, KowloonHong KongTel: (852) 2245-6100Fax: (852) 2722-1369Atmel EuropeLe Krebs8, Rue Jean-Pierre TimbaudBP 30978054 Saint-Quentin-en-Yvelines CedexFranceTel: (33) 1-30-60-70-00Fax: (33) 1-30-60-71-11Atmel Japan9F, Tonetsu Shinkawa Bldg.1-24-8 ShinkawaChuo-ku, Tokyo 104-0033JapanTel: (81) 3-3523-3551Fax: (81) 3-3523-7581Product ContactWeb SiteTechnical Support******************Sales Contact/contactsLiterature Requests/literatureDisclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI-TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDEN-TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.© 2009 Atmel Corporation. All rights reserved. Atmel®, logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.。
BECO MiniCap

Technical Data Sheet Laboratory-Scale Depth FiltrationBECO MiniCap TM ACFDisposable Filter Unit with BECO CARBON TMActivated Carbon Depth Filter SheetsBECO MiniCap ACF disposable filter units withBECO CARBON activated carbon depth filtersheets are ready-to-use for the filtration of smallvolumes for laboratory applications, scale-uptrials, and sample preparation.The depth filter sheets of BECO MiniCap ACFdisposable filters have a high adsorptive capacitydue to the use of immobilized activated carbon andare used for decolorization as well as for theremoval of undesired by-products or for taste andodor correction.The specific advantages of the BECO MiniCap ACFrange:- The disposable filter unit is autoclavable and thereis no cleaning effort required.- Due to the dust-free handling, the application is simple and clean.- BECO MiniCap ACF disposable filter units with activated carbon types of different porosity meetthe requirements of a broad range of applications. -Filtration-active and adsorptive properties are ideally combined in the BECO MiniCapACF 07.10.-The adsorption performance in the BECO MiniCap ACF 02 and ACF 03 is maximized through acarbon content of up to 1000 g/m² and the lowendotoxin content ensures high product safety. AValidation Guide for the activated carbon depthfilter sheet of BECO MiniCap ACF 03 is availableon request.Application Examples-Decolorization and removal of organic impurities from active pharmaceutical ingredients (API)solutions:-Decolorization of antibiotic solutions-Protein and endotoxin removal-Purification of blood plasma products-Treatment of contrast media-Decolorization of natural extracts and cosmetics -Removal of unwanted by-products from food or dietary supplements, e.g., decolorization ofglucose, enzyme and vitamin solutions-Correction of taste and color of beverages (Spirits, fruit juices, hard seltzer etc.)-Decolorization and removal of organic impurities from chemicals, organic solvents and syntheticoils, e.g., removal of …off-flavor“ and unwanted by-products from silicone oils Selection Guide for BECO MiniCap ACF Disposable Filter Units with BECO CARBON Activated Carbon Depth Filter SheetsThe activated carbon of the BECO MiniCap ACF filter is a microporous, inert material with a very large inner surface of up to 2000 m²/g of activated carbon. The activated carbon used can be divided into different porosity ranges:Macroporous (∅ >50 nm)Decolorization of dark discolorations (brown to yellow) and for the separation of large molecules(e.g., protein separation).Mesoporous (∅ 2-50 nm)Decolorization of medium discoloration (yellow to yellowish) and impurities, as well as for correcting the taste of food.Microporous (∅ <2 nm)Decolorization of light discolorations (yellowish to whitish-gray), for odor correction and for the separationof smaller molecules (e.g., endotoxins).Physical DataThis information is intended as a guideline for the selection of BECO MiniCap disposable filter units. The water throughput is a laboratory value characterizing the different BECO CARBON activated carbon depth filter sheets. It is not the recommended flow rate.22ACF 07.10 19607 15 >11.6 (80) 34.7 (1415) - 420 ACF 02 19602 2.5 >11.6 (80) 6.75 (275) < 0.125 1000 ACF 03 19603 5 >11.6 (80) 7.4 (300) < 0.125 1000* 100 kPa = 1 bar** Endotoxin content analysis after rinsing with 1.23 gal/ft² (50 l/m²) of WFI (Water for Injection)Technical Data3.3 in² (21.2 cm²)2.9 in (74 mm)Polypropylene according to FDA CFR § 177.1520Hose connections 0.24–0.47 in (6–12 mm) in diameter44 psi (300 kPa/3 bar) at 77°F (25°C)0.44 fl oz (13 ml)4.40.17 fl oz (5 ml)0.08–0.14 gal/h (85–145 gfd)5–8 ml/min (150–250 l/m²/h)0.05–2.6 gal (0.2–10 l)Ordering InformationF071C300 BECO MiniCap ACF 07.10 kit*F002C300 BECO MiniCap ACF 02 kit*F003C300 BECO MiniCap ACF 03 kit** One package contains three individually packed BECO MiniCap disposable filter units. The carton label shows the following information: article description, article, and lot numbers.Compliance NoticeBECO CARBON activated carbon depth filter sheets meet the requirements of the Regulation (European Commission) 1935/2004 and the LFGB standard (German Food, Commodity and Feed Act) as well as the test criteria of FDA (U.S. Food and Drug Administration) Directive 21 CFR § 177.2260.The polypropylene components comply with regulation (EU) 10/2011 and meet the requirements of FDA,21 CFR § 177.1520.BECO CARBON ACF 03 and the polypropylene components of the BECO MiniCap ACF 03 disposable filter unit also meet the requirements of the USP Class VI tests.For further details on individual components and materials see the declaration of conformity.ComponentsBECO CARBON activated carbon depth filter sheets are made from particularly pure materials. Finely fibrillated cellulose fibers and cationic charge carriers are used. The materials for each filter type in particular are as follows:-BECO CARBON ACF 07.10(S):acid-washed, steam-activated carbon and high-quality diatomaceous earth-BECO CARBON ACF 02:chemically activated carbon-BECO CARBON ACF 03:acid-washed, steam-activated carbonInstruction for CorrectDepending on the filtered liquids, the operating temperature should not exceed 176°F (80°C). Please contact Eaton regarding filtration applications at higher temperatures.Sterilization (optional)The wetted BECO MiniCap ACF disposable filter units can be sterilized one time in an autoclave as follows: Preparation: Rinsing with minimum of 1.7 fl oz (50 ml)for optimum wettingTemperature: M ax.250 °F (121 °C)Duration: Approx. 30 minutesRinsing: After sterilizing with 3.4 fl oz (100 ml)/1.23 gal/ft² (50 l/m²) at 1.25 times theflow rate Filter Preparation and FiltrationUnless already completed after sterilization, Eaton recommends pre-rinsing the closed filter with 3.4 fl oz (100 ml)/1.23 gal/ft² (50 l/m²) of water or in exceptional cases with product appropriate solution at 1.25 times the flow rate prior to the first filtration. Depending on the application, this usually equals a rinsing time of 10 to 20 minutes.Only in exceptional cases which, for example do not allow rinsing with water, product or product appropriate solution should be circulated for 10 to 20 minutes and disposed after rinsing.Test the entire filter for leakage at maximum operating pressure.Filtration SpeedAdsorption processes are decisively affected by the contact time between the product and the adsorbing substance. The adsorption performance can thus be controlled by the speed of filtration. Slow filtration speeds 0.08 – 0.14 gal/h (85 – 145 gfd)/5 – 8 ml/min (150 – 250 l/m²/h) respectively extended periods of contact result in optimum utilization of the adsorption capacity.Inlet and Differential PressureTerminate the filtration process once the limit of adsorption capacity or the maximum permitted inlet or differential pressure of 43.5 psi (300 kPa, 3 bar) is reached. A higher inlet and differential pressure could damage the depth filter sheet material.SafetyWhen used and handled correctly, there are no known unfavorable effects associated with this product. Further safety information can be found in the relevant Material Safety Data Sheet, which can be downloaded from our website.Waste DisposalDue to their composition, BECO MiniCap ACF disposable filter units can be disposed of as harmless waste. Comply with relevant current regulations, depending on the filtered product.StorageBECO MiniCap ACF disposable filter units must be stored in a dry, odor-free, and well-ventilated place, ideally in their original packaging.Do not expose the BECO MiniCap ACF disposable filter units to direct sunlight.BECO MiniCap ACF disposable filter units are intended for immediate use and should be used within 36 months after production date.Quality Assurance According to DIN EN ISO 9001 The Quality Management System of Eaton Technologies GmbH has been certified according to DIN EN ISO 9001.This certification verifies that a fully functioning comprehensive Quality Assurance System covering product development, contract controls, choice of suppliers, receiving inspections, production, final inspection, inventory management, and shipment has been implemented.Extensive quality assurance measures incorporate adherence to technical function criteria and chemical purity and quality recognized as safe under the German legislation governing the production of foods and beverages.All information is given to the best of our knowledge. However, the validity of the information cannot be guaranteed for every application, working practice and operating condition. Misuse of the product will result in all warrantees being voided.Subject to change in the interest of technical progress.North America44 Apple StreetTinton Falls, NJ 07724Toll Free: 800 656-3344 (North America only)Tel: +1 732 212-4700Europe/Africa/Middle EastAuf der Heide 253947 Nettersheim, Germany Tel: +49 2486 809-0 Friedensstraße 4168804 Altlußheim, Germany Tel: +49 6205 2094-0An den Nahewiesen 2455450 Langenlonsheim, Germany Tel: +49 6704 204-0 Greater ChinaNo. 7, Lane 280,Linhong RoadChangning District, 200335Shanghai, P.R. ChinaTel: +86 21 2899-3687Asia-Pacific100G Pasir Panjang Road#07-08 Interlocal CentreSingapore 118523Tel: +65 6825-1620For more information, pleaseemail us at ********************or visit /filtration© 2023 Eaton. All rights reserved. All trademarks andregistered trademarks are the property of their respectiveowners. All information and recommendations appearing inthis brochure concerning the use of products describedherein are based on tests believed to be reliable. However,it is the user’s responsibility to determine the suitability forhis own use of such products. Since the actual use byothers is beyond our control, no guarantee, expressed orimplied, is made by Eaton as to the effects of such use orthe results to be obtained. Eaton assumes no liabilityarising out of the use by others of such products. Nor is theinformation herein to be construed as absolutely complete,since additional information may be necessary or desirablewhen particular or exceptional conditions or circumstancesexist or because of applicable laws or governmentregulations.EN1 A 4.2.8.503-2023。
英文航模专业术语

航模专业术语1. 材料类:ACRYLIC——有机玻璃acrylic [[ə'krɪlɪk]]ACRYLIC:腈纶 | 亚克力 | 压克力BEECH——榉木 beech [[biːtʃ]]FILM——薄膜film [[fɪlm]]FUEL——燃油fuel [[fjʊəl]]PAINT——油漆paint [[peɪnt]]PLY——层板SPRUCE——云杉ADHESIVE——粘和剂BIR CH——桦木FIBER CARBON——碳纤维fiber [['faibə]] carbon [['kɑːb(ə)n]] GLUE——胶 glue [[gluː]]PAPER——纸RESIN——树脂STEEL——钢ALUMINUM——铝COPPER——铜FIBERGLASS——玻璃钢HARDENER——固化剂PINE——松木pine [[paɪn]]ROHCELL——发泡塑料WOOD——木材BALSA——巴尔沙轻木balsa [['bɔːlsə; 'bɒlsə]] EPOXY——环氧树脂FOAM——泡沫塑料NUT——螺母PLASTIC——塑料SCREW——螺丝2.型材类:BLOCK(BLK)——块SHEET(SHT)——板材1/4X1/4方型材HINGE——合页SKIN——蒙皮TRI-STOCK——三角加强材NUT——螺钉SQUIRE(SQ)——正方型材PIPE——管材ROD——杆WIRE——线材STRIP——条形板材3.结构类:AILERON——副翼COWL——(发动机)外罩ELEVATOR——升降舵FIN——垂直安定面FRAME. 1——N(F1-N)机身横隔框,注:通常F1用于发动机安装,又称为FIREWALL-防火板HATCH——舱盖LEAD EDGE(LE)——前缘NOSE WHEEL——前轮PUSHROD——操纵联杆SPAR——梁或衍条SUB…——辅助(梁等)TANE——邮箱TRIPLANE——三翼机BIPLANE(BIPS)——双翼机BOUBLER——(同型的)加强材料ENGINE MOUNT——(发动机)安装架FLAP——襟翼HIGH WING——上翼LOW WING——下翼PLATE——外部面板RIB——翼肋PINNER——(螺旋桨)罩TALL EDGE(TE)——后缘TIP——翼尖TOW HOOK——牵引钩CANOPY(COCKPIT)——飞行员座舱DOWEL——(镶入泡沫的)加强条FILLER——充填块FUSELAGE——机身JOINER——结合部加强块MAIN WHEEL——主轮PROPELLER——螺旋桨(FOLD—折叠式螺旋桨)RUDDER——方向舵STABILIZER——安定面TAIL WHEEL——尾轮WING——机翼TOW LINE——牵引绳CORE——芯材FOLD PREP——(可折叠)螺旋桨LANDING GEAR——起落架MONOPLANE——单翼机RETRACTS——可收放起落架STRUT——支柱TALL PLANE——尾翼WHEEL——机轮4.设备类:ANTENNA——天线HYDRO——液压(动作器)SPEED CONTROLLER——电子调速器BATTERY——电池MOTOR——电动机ELECTRONICS——电子设备RECEIVER——接受机SWITCH——电源开关GYRO——陀螺仪SERVO——舵机5.模型类:AEROBATICS——特技COMBAT——空战FREEFLITE(FF)——自由飞HELICOPTER——直升飞机PARTERN——花样RUBBER——橡皮筋SPORT——体育运动机ATTACK——攻击CONTROLINE(CL)——线控FIGHTER——空战机INDOOR——室内机PYLON——绕标SCALE——比例仿真TANKER——加油机BOMB——轰炸DURATION——留空GIANT——大(巨)型机JET——喷气机R/C——无线电遥控SOARING——翱翔TRAINER——练习机CARRIER——舰载ELECTRICS——电动GLIDER——滑翔机MULTY——多发动机RACING——竞速SLOPES——山坡翱6.发动机类2STROCK(2-S)——二冲程BEARING——轴承CRANK——曲轴MOTOR——电动机PLUG——火花(电热)塞THROTTLE——风门4STROCK(4-S)——四冲程CARBURETOR——化油器CYLINDER——气缸MUFFLER——消声器ROD——连杆TUNED PIPE——谐震管BRUSHLESS DC MOTOR——直流无刷电动机CO2 ENGINE——二氧化碳发动机ENGINE——发动机IDIE——怠速MULTY CYLINDER——多起缸发动机RPM——转数/分STARTER——发动器TURBOJET——涡轮喷气发动机7.工具类:CUTTER——剪线钳KNIFE——刀SAW——锯DRILDRILL——钻PAINT BRUSH——油漆刷SCREW DRIVER——螺丝刀FOIL——錣RULER——尺HARMER——锤SAND PAPER——砂纸8.空气动力类:AERODYNAMIC CENTER(A.C)CENTER OF GRAVITY(C.G)CLIMB——爬升HIGHT(H)——全高MOMENT——力矩moment [['məʊm(ə)nt]] STREAMWING AREA(S)——翼面积DIAMETER(D)——直径LANDING——着陆AIREOIL——翼型TAIL MOMENT ARM——尾力臂WING SPAN(B)——已占ATTACK ANGLE——攻角CENTRIFUGALIC——离心力DRAG——阻力LENGTH(L)——全长length [[leŋθ; leŋkθ]] SPIN——螺旋spin [[spɪn]]WING LOAD——翼载荷BALANCE——平衡CHORD——翼弦GILDING——滑翔LIFT——升力STALL——失速TURN——转弯。
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Fine-grained Control of Security CapabilitiesDan BonehComputer Science Department,Stanford University.dabo@andXuhua DingDepartment of Information and Computer Science,University of California,Irvine.xhd-ing@andGene TsudikDepartment of Information and Computer Science,University of California,Irvine. gts@We present a new approach forfine-grained control over users’security privileges(fast revocation of credentials)centered around the concept of an on-line semi-trusted mediator(SEM).The use of a SEM in conjunction with a simple threshold variant of the RSA cryptosystem(mediated RSA) offers a number of practical advantages over current revocation techniques.The benefits include simplified validation of digital signatures,efficient certificate revocation for legacy systems and fast revocation of signature and decryption capabilities.This paper discusses both the architecture and the implementation of our approach as well as its performance and compatibility with the existing infrastructure.Experimental results demonstrate its practical aspects.Categories and Subject Descriptors:E.3.3[Data]:Data Encryption—Public Key Cryptosystems; K.6.5[Management of Computing and Information Systems]:Security and Protection General Terms:Algorithms,SecurityAdditional Key Words and Phrases:Certificate Revocation,Digital Signatures,Public Key In-frastructure1.INTRODUCTIONWe begin this paper with an example to illustrate the premise for this work.Con-sider an organization–industrial,government,or military–where all employees (referred to as users)have certain authorizations.We assume that a Public Key Infrastructure(PKI)is available and all users have digital signature,as well as en/de-cryption,capabilities.In the course of performing routine everyday tasks, users take advantage of secure applications,such as email,file transfer,remote log-in and web browsing.This work was supported by the Defense Advanced Project Agency(DARPA)under contract F30602-99-1-0530.An earlier version of this paper was presented,in part,at the2001Usenix Security Symposium. Permission to make digital/hard copy of all or part of this material without fee for personal or classroom use provided that the copies are not made or distributed for profit or commercial advantage,the ACM copyright/server notice,the title of the publication,and its date appear,and notice is given that copying is by permission of the ACM,Inc.To copy otherwise,to republish, to post on servers,or to redistribute to lists requires prior specific permission and/or a fee.c 20YY ACM0000-0000/20YY/0000-0001$5.00ACM Journal Name,Vol.V,No.N,Month20YY,Pages1–0??.2·Now suppose that a trusted user(Alice)does something that warrants immediate revocation of her security privileges.For example,Alice might befired,or she may suspect that her private key has been compromised.Ideally,immediately following revocation,the key holder,either Alice herself or an attacker,should be unable to perform any security operations and use any secure applications.Specifically,this might mean:–The key holder cannot read any secure email.This includes encrypted email that already resides on Alice’s email server(or local host)and possible future email erroneously encrypted for Alice.Although encrypted email may be delivered to Alice’s email server,the key holder should be unable to decrypt it.–The key holder cannot generate valid digital signatures on any further messages.However,signatures generated by Alice prior to revocation may need to remain valid.–The key holder cannot authenticate itself to corporate servers(and other users) as a legitimate user.Throughout the paper,we use email as an example application.While it is a popular mechanism for general-purpose communication,our rationale also applies to other secure means of information exchange.To provide immediate revocation it is natural tofirst consider traditional re-vocation techniques.Many revocation methods have been proposed;they can be roughly classified into two prominent types:1)explicit revocation structures such as Certificate Revocation Lists(CRLs)and variations on the theme,and2)real time revocation checking such as the Online Certificate Status Protocol(OCSP) [23]and its variants.In both cases,some trusted entities are ultimately in charge of validating user certificates.However,the above requirements for immediate revo-cation are impossible to satisfy with existing techniques.This is primarily because they do not providefine-grained enough control over users’security capabilities. Supporting immediate revocation with existing revocation techniques would result in heavy performance cost and very poor scalability,as discussed in Section8.As pointed out in[22],since each revocation technique exhibits a unique set of pros and cons,the criteria for choosing the best technique should be based on the specifics of the target application environment.Fast revocation andfine-grained control over users’security capabilities are the motivating factors for our work. However,the need for these features is clearly not universal since many computing environments(e.g.,a typical university campus)are relatively“relaxed”and do not warrant employing fast revocation techniques.However,there are plenty of government,corporate and military settings where fast revocation andfine-grained control are very important.Organization.This paper is organized as follows.The next section provides an overview of our work.The technical details of the architecture are presented in Section3and Section4,respectively.Then,Section5shows four extensions. Sections6and7,describe the implementation and performance results,respectively.A comparison of with current revocation techniques is presented Section8,followed by the overview of related work in Section8.2and a summary in Section9.ACM Journal Name,Vol.V,No.N,Month20YY.·3 2.OVERVIEWWe refer to our approach as the SEM architecture.The basic idea is as fol-lows:We introduce a new entity,referred to as a SEM(SEcurity Mediator):an online semi-trusted server.To sign or decrypt a message,a client mustfirst ob-tain a message-specific token from its SEM.Without this token,the user cannot accomplish the intended task.To revoke the user’s ability to sign or decrypt,the security administrator instructs the SEM to stop issuing tokens for that user’s fu-ture request.At that instant,the user’s signature and/or decryption capabilities are revoked.For scalability reasons,a single SEM serves many users.We stress that the SEM architecture is transparent to non-SEM users,i.e.,a SEM is not involved in encryption or signature verification operations.With SEM’s help, a SEM client(Alice)can generate standard RSA signatures,and decrypt standard ciphertext messages encrypted with her RSA public key.Without SEM’s help,she cannot perform either of these operations.This backwards compatibility is one of our main design principles.Another notable feature is that a SEM is not a fully trusted entity.It keeps no client secrets and all SEM computations are checkable by its clients.However, a SEM is partially trusted since each signature verifier implicitly trusts it to have checked the signer’s(SEM’s client’s)certificate status at signature generation time. Similarly,each encryptor trusts a SEM to check the decryptor’s(SEM’s client’s) certificate status at message decryption time.We consider this level of trust rea-sonable,especially since a SEM serves a multitude of clients and thus represents an organization(or a group).In order to experiment and gain practical experience,we prototyped the SEM architecture using the popular OpenSSL library.SEM is implemented as a daemon process running on a secure server.On the client side,we built plug-ins for the Eudora and Outlook email clients for signing outgoing,and decrypting incoming, emails.Both of these tasks are performed with the SEM’s help.Consequently, signing and decryption capabilities can be easily revoked.It is natural to ask whether the same functionality can be obtained with more tra-ditional security approaches tofine-grained control and fast credential revocation, such as Kerberos.Kerberos[25],after all,has been in existence since the mid-80s and tends to work very well in corporate-style settings.However,Kerberos is awkward in heterogeneous networks such as the Internet;its inter-realm extensions are difficult to use and require a certain amount of manual setup.Furthermore, Kerberos does not inter-operate with modern PKI-s and does not provide univer-sal origin authentication offered by public key signatures.On the other hand,the SEM architecture is fully compatible with existing PKI systems.In addition,the SEM is only responsible for revocation.Unlike a Kerberos server,the SEM cannot forge user signatures or decrypt messages intended for users.As we discuss later in the paper,our approach is not mutually exclusive with Kerberos-like intra-domain security architectures.We assert that the SEM architecture can be viewed as a set of complementary security services.ACM Journal Name,Vol.V,No.N,Month20YY.4·2.1Decryption and signing in the SEM architectureWe now describe in more detail how decryption and digital signature generation are performed in the SEM architecture:–Decryption:suppose that Alice wants to decrypt an email message using her private key.Recall that public key-encrypted email is usually composed of two parts:(1)a short preamble containing a per-message key encrypted with Alice’s public key,and(2)the body containing the actual email message encrypted using the per-message key.To decrypt,Alicefirst sends the preamble to her SEM.SEM responds with a token which enables Alice to complete the decryption of the per-message key and,ultimately,to read her email.However,this token contains no information useful to anyone other than Alice.Hence,communication with the SEM does not need to be secret or authenticated.Also,interaction with the SEM is fully managed by Alice’s email reader and does not require any intervention on Alice’s part.If Alice wants to read her email offline,the interaction with the SEM takes places at the time Alice’s email client downloads her email from the mail server.–Signatures:suppose that Alice wishes to sign a message using her private key. She sends a(randomized)hash of the message to her SEM which,in turn,responds with a token(also referred to as a half-signature)enabling Alice to generate the signature.As with decryption,this token contains no useful information to anyone other than Alice.2.2Other FeaturesOur initial motivation for introducing a SEM is to enable immediate revocation of Alice’s public key.As a byproduct,the SEM architecture provides additional ben-efits.In particular,validation of signatures generated with the help of a SEM does not require the verifier to consult a CRL or a revocation authority:the existence of the a verifiable signature implies that the signer was not revoked at the time the signature was generated.Consequently,signature validation is greatly simplified. More importantly,the SEM architecture enables revocation in legacy systems that do not support certificate revocation.Consider a legacy system performing digital signature verification.Often,such systems have no certificate status checking ca-pabilities.For example,old browsers(e.g.,Netscape3.0)verify server certificates without any means for checking certificate revocation status.Similarly,Microsoft’s Authenticode system in Windows NT(used for verifying signatures on executable code)does not support certificate revocation.In the SEM architecture,certificate revocation is provided without requiring any change to the verification process in such legacy systems.The only aspect that needs changing is signature genera-tion.Fortunately,in many settings(such as code signing)the number of entities generating signatures is significantly smaller than that of entities verifying them. Semantics.The SEM architecture naturally provides the following semantics for digital signatures:Binding Signature Semantics:a digital signature is considered validif the public key certificate associated with the private key used to gen-erate the signature was valid at the time the signature was issued.ACM Journal Name,Vol.V,No.N,Month20YY.·5 According to this definition,all verifiable signatures–by virtue of their existence –are generated prior to revocation and,hence,are considered valid.Binding sig-nature semantics are natural in many settings,such as business contracts.For example,suppose Alice and Bob enter into a contract.They both sign the contract at time T.Bob begins to fulfill the contract and incurs certain costs in the process. Now,suppose at time T >T,Alice revokes her own certificate(e.g.,by“losing”her private key).Is the contract valid at time T ?With binding semantics,Alice is still bound to the contract since it was signed at time T when her certificate was still valid.In other words,Alice cannot nullify the contract by causing her own certificate to be revoked.We note that binding semantics are inappropriate in some scenarios.For example,if a certificate is obtained from a CA under false pretense,e.g.,Alice masquerading as Bob,the CA should be allowed to declare at any time that all signatures generated with that certificate are invalid. Implementing binding signature semantics with existing revocation techniques is non-trivial,as discussed in Section8.Whenever Bob verifies a signature generated by Alice,Bob must also check that Alice’s certificate was valid at the time the signature was generated.In fact,every verifier of Alice’s signature must perform this certificate validation step.Note that,unless a trusted time-stamping service is involved in generating all of Alice’s signatures,Bob cannot trust the timestamp included by Alice in her signatures.Not surprisingly,implementing binding semantics with the SEM architecture is trivial.To validate Alice’s signature,a verifier need only verify the signature itself. There is no need to check the status of Alice’s certificate.(We are assuming here that revocation of Alice’s key is equivalent to revocation of Alice’s certificate.In general,however,Alice’s certificate may encode many rights,not just the right to use her key(s).It is then possible to revoke only some of these rights while not revoking the entire certificate.)Once Alice’s certificate is revoked,she can no longer generate valid signatures.Therefore,the mere existence of a valid signature implies that Alice’s certificate was valid at the time the signature was issued.3.MEDIATED RSAWe now describe in detail how a SEM interacts with clients to generate tokens. The SEM architecture is based on a variant of RSA which we call Mediated RSA (mRSA).The main idea is to split each RSA private key into two parts using simple 2-out-of-2threshold RSA[14;7].One part is given to a client and the other is given to a SEM.If the client and its SEM cooperate,they employ their respective half-keys in a way that is functionally equivalent to(and indistinguishable from)standard RSA.The fact that the private key is not held in its entirety by any one party is transparent to the outside world,i.e.,to the those who use the corresponding public key.Also,knowledge of a half-key cannot be used to derive the entire private key. Therefore,neither the client nor the SEM can decrypt or sign a message without mutual consent.(Recall that a single SEM serves many clients.)The mRSA method is composed of three algorithms:mRSA key generation, mRSA signatures,and mRSA decryption.We present them in the next section.ACM Journal Name,Vol.V,No.N,Month20YY.6·3.1mRSA Key GenerationSimilar to RSA,each client U i has a unique public key and private key.The public key P K i includes n i and e i,where the former is a product of two large distinct primes(p i,q i)and e i is an integer relatively prime toφ(n i)=(p i−1)(q i−1). Logically,there is also a corresponding RSA private key SK i=(n i,d i)where d i∗e i=1modφ(n i).However,as mentioned above,no one party has possessionof d i.Instead,d i is effectively split into two parts:d u i and d semi which are secretlyheld by the client U i and a SEM,respectively.The relationship among them is:d i=d semi+d u i modφ(n i)Unlike plain RSA,an individual client U i cannot generate its own mRSA keys. Instead,a trusted party(most likely,a CA)initializes and distributes the mRSA keys to clients.The policy for authenticating and authorizing clients’key generation requests is not discussed in this paper.Once a client’s request is received and approved,a CA executes the mRSA key generation algorithm described below.mRSA Key Setup.CA generates a distinct set:{p i,q i,e i,d i,d semi ,d u i}for U i.Thefirst four values are generated as in standard RSA.Thefifth value,d semi ,isa random integer in the interval[1,n i],where n i=p i q i.The last value is set as: d u i=d i−d semimodφ(n i).We show the protocol in Figure1.Algorithm:mRSA.key(executed by CA)Let k(even)be a security parameter(1)Generate random k/2-bit primes:p i,q i(2)n i←p i q i(3)e i r←Z∗φ(n i)(4)d i←1/e i modφ(n i)(5)d semi r←{1,...,ni−1}(6)d ui ←(d i−d semi)modφ(n i)(7)SK i←(n i,d ui)(8)P K i←(n i,e i)Fig.1.mRSA Key Generation AlgorithmAfter CA computes the above values,d semi is securely communicated to the SEMand d u i is communicated to U i.The details of this step are elaborated upon in Section6.3.2mRSA SignaturesAccording to PKCS1v2.1[18],RSA signature generation is composed of two steps: message encoding and cryptographic primitive computation.Thefirst step is pre-served in mRSA without any changes.However,the second step requires SEM’s involvement since,in mRSA,a client does not possess its entire private key.We denote by EC()and DC()the encoding and decoding functions,respectively. Both encodings include hashing the input message m using a collision resistant hash function.For now,we assume the message encoding function EC()is determin-istic.A user(U i)generates a signature on a message m as follows:ACM Journal Name,Vol.V,No.N,Month20YY.·71.Preprocessing:U i sends the message m to the SEM.putation:–SEM checks that U i is not revoked and,if so,computes a partial signature P S sem=EC(m)d semi mod n i and replies with it to the client.This P S sem isthe token enabling signature generation on message m.–Concurrently,U i computes P S u=EC(m)d u i mod n i3.Output:U i receives P S sem and computes S i(m)=(P S sem∗P S u)mod n i.Itthen verifies S i(m)as a standard RSA signature.(This step also verifies the SEM’s computation.)If the signature is valid,U i outputs it.The algorithm is shown in Figure 2.Algorithm mRSA.sign(executed by User and SEM)(1)USER:Send m to SEM.(2)In parallel:2.1.SEM:(a)If USER revoked return(ERROR);(b)P S sem←EC(m)d semi mod n iwhere EC()is the EMSA-PKCS1-v15encoding function,recommendedin[18].(c)send P S sem to USERER:(a)P S u←EC(m)d u i mod n i(3)USER:S←P S sem∗P S u mod n i(4)USER:Verify that S is a valid signature on m under the public key(N,e i).Ifnot then return(ERROR)(5)USER:return(m,S)Fig.2.mRSA Signature AlgorithmWe observe that the resulting mRSA and RSA signatures are indistinguishablesince:w d u i∗w d semi=w d i mod n.Consequently,the mRSA signature i=w d u i+d semgeneration process is transparent to eventual signature verifiers,since both the verification process and the signature format are identical to those in standard RSA.Security.We briefly discuss the security of the signature scheme of Figure2.At a high level,we require two properties:(1)the user cannot generate signatures after being revoked,and(2)the SEM cannot generate signatures on behalf of the user. For both properties we require existential unforgeability under a chosen message attack.Precise security models for this scheme(used in a slightly different context of multicative version of mRSA)can be found in[4]where a proof of security is given.Randomized encodings.Note that,we assumed above that the encoding pro-cedure EC()is deterministic,as in EMSA-PKCS1-v15[18]encoding and Full Domain Hash(FDH)encoding[3].If EC()is a randomized encoding,such as EMSA-PSS[18],we have to make sure both the user and SEM use the same ran-domness so that the resulting signature is valid.At the same time,to prevent theACM Journal Name,Vol.V,No.N,Month20YY.8·user from generating signatures without its help,the SEM has to ensure that the random bits used for the encoding are chosen independently at random.Therefore, we cannot simply let the user choose the randomness for the encoding.Instead,the user and the SEM must engage in a two-party coinflipping protocol to generate the required shared randomness.Neither party can bias the resulting random bits. Consequently,these bits can be used as the randomness needed for the encoding function.However,when using deterministic encoding,such as EMSA-PKCS1-v15, there is no need for this step.We note that in the above protocol the user sends the entire message m to the SEM in step(1).For privacy reasons,one might instead consider sending the digest EC(m)the SEM.This would eliminate the difficulty with randomized encodings mentioned above.Unfortunately,the resulting system cannot be shown as secure as the underlying RSA signature scheme.Specifically,when only sending EC(m) to SEM,we are unable to prove that the user cannot generate signatures after being revoked.The problem is that,while the user is not revoked,the SEM functions as an unrestricted RSA inversion oracle for the user.For example,the user can use the attack of[11]to generate signatures after being revoked.A proof of security is still possible,using a strong assumption on RSA:a variant of the“One-more RSA Assumption”[4].Nevertheless,when using EMSA-PKCS1-v15[18]encoding, which is only heuristically secure,it might befine to send EC(m)to the SEM. 3.3mRSA DecryptionRecall that PKCS1[18]stipulates that an input message m must be OAEP-encoded before carrying out the actual RSA encryption.We use EC oaep()and DC oaep() to denote OAEP encoding and decoding functions,respectively.The encryption process is identical to standard RSA,where c=EC oaep(m)e i mod n i for each client U i.Decryption,on the other hand,is very similar to mRSA signature generation described above.1.U i obtains encrypted message c and forwards it to its SEM.–SEM checks that U i is not revoked and,if so,computes a partial clear-text P C sem=c d semi mod n i and replies to the client.–concurrently,U i computes P C u=c d u i mod n i.2.U i receives P C sem and computes c =P C sem∗P C u mod n i.If OAEP decodingof c succeeds,U i outputs the clear-text m=DC oaep(c ).Security.We now briefly discuss the security of the mRSA decryption scheme shown in Figure3.At a high level,we require two properties:(1)the user cannot decrypt ciphertexts encrypted with the user’s public key after being revoked,and (2)the SEM cannot decrypt messages encrypted using the user’s public key.For both properties we require semantic security under a chosen-ciphertext attack.Un-fortunately,we cannot quite claim that the scheme above satisfies both properties. OAEP and it variants are designed to provide chosen ciphertext security for RSA encryption in the random oracle model.The protocol above provides chosen cipher-text security against an attacker who is neither the SEM nor the user.However, OAEP does not necessarily satisfy properties(1)and(2)above.The problem is that the user can employ the SEM as an RSA inversion oracle until the user is revoked.There is no way for the SEM to check whether a partial decryption it gen-ACM Journal Name,Vol.V,No.N,Month20YY.·9Algorithm:mRSA.decryption(executed by User and SEM)(1)USER:c←encrypted message(2)USER:send c to SEM(3)In parallel:3.1.SEM:(a)If USER revoked return(ERROR)(b)P C sem←c d semi mod n i(c)Send P C sem to USER U iER←c d u i mod n i(a)P C ui(4)USER:w←(P C sem∗P C u)mod n i(5)USER:OAEP decode w.If success,output m=DC oaep(w).Fig.3.mRSA Decryption Algorithmerates corresponds to a well-formed plaintext.However,as in the previous section, security can be proven in a weaker model under a strong assumption on RSA.(A detailed proof will be available in the extended version of this paper.)We note that one way to make sure that the user cannot decrypt messages with-out the help of the SEM would be to use a Chosen Ciphertext Secure threshold cryptosystem[28;8].However,this would render the resulting scheme incompati-ble with currently deployed encryption systems(based on PKCS1).3.4Notable FeaturesAs mentioned earlier,mRSA is only a slight modification of the RSA cryptosystem. However,at a higher level,mRSA affords some interesting features.CA-based Key Generation.Recall that,in a normal PKI setting with RSA,a pri-vate/public key-pair is always generated by its intended owner.In mRSA,a client’s key-pair is instead generated by a CA or some other trusted entity.Nonetheless, a CA only generates client’s keys and does not need to keep them.In fact,a CA must erase them to assure that any successful future attack on the CA does not result in client’s keys being compromised.In spite of that,having a trusted entity that generates private keys for a multitude of clients can be viewed as a liability. If CA-based key generation is undesirable then one can use a protocol of[5]to dis-tributively generate an RSA key between the SEM and the user.The downside is that this requires more work than letting the CA generate the key and give shares to the user and SEM.We note that CA-based key generation enables key escrow (provided that clients’keys are not erased after their out-of-band distribution). For example,if Alice isfired,her organization can still access Alice’s encrypted work-related data by obtaining her private key from the CA.Fast Revocation.The main point of mRSA is that the revocation problem is greatly simplified.In order to revoke a client’s public key,it suffices to notify that client’s SEM.Each SEM merely maintains a list of revoked clients which is consulted upon every service request.Our implementation uses standard X.509Certificate Revocation Lists(CRL’s)for this purpose.ACM Journal Name,Vol.V,No.N,Month20YY.10·Transparency.mRSA is completely transparent to entities encrypting data for mRSA clients and those verifying signatures produced by mRSA clients.To them, mRSA appears indistinguishable from standard RSA.Furthermore,mRSA certifi-cates are identical to standard RSA certificates.Thus,the SEM architecture is completely backwards compatible for the signature verifier and message encryptor. Coexistence.mRSA’s built-in revocation approach can co-exist with the tradi-tional,explicit revocation approaches.For example,a CRL-or a CRT-based scheme can be used in conjunction with mRSA in order to accommodate existing imple-mentations that require verifiers(and encryptors)to perform certificate revocation checks.CA Communication.in mRSA,a CA remains an off-line entity.mRSA cer-tificates,along with private half-keys are distributed to the client and SEM-s in an off-line manner.This follows the common certificate issuance and distribution paradigm.In fact,in our implementation(Section6)there is no need for the CA and the SEM to ever communicate directly.SEM Communication.mRSA does not require explicit authentication between a SEM and its clients.A client implicitly authenticates a SEM by verifying its own signature(or decryption)as described in Sections3.2and3.3.These signature and encryption verification steps assure the client of the validity of SEM’s replies.Al-though authentication of a client to a SEM is not required for the security of mRSA itself,it is needed for protection against denial-of-service attacks on a SEM.This can be easily accomplished with the authentication protocol described in Section5. Semi-trusted SEM.The SEM cannot issue messages on behalf of unrevoked users nor can it decrypt messages intended for unrevoked users.The worst-case damage caused by a compromise at the SEM is that users who were previously revoked can become unrevoked.This is similar to a compromise at a standard Revocation Authority which would enable the attacker to unrevoke revoked users.4.ARCHITECTUREThe overall architecture is made up of three components:CA,SEM,and clients.A typical organizational setup involves one CA,a small set of SEM-s and a multitude of clients.A CA governs a small number of SEM-s.Each SEM,in turn,serves many clients.(In Section5we show how a single client can be supported by multiple SEM-s.)The assignment of clients to SEM-s is assumed to be handled off-line by a security administrator.The CA component is a simple add-on to the existing CA and is thus still consid-ered an off-line entity.For each client,the CA component takes care of generating an RSA public key,the corresponding certificate and a pair of half-keys(one for the client and one for the SEM)which,when combined,form the RSA private key. The respective half-keys are then delivered,out-of-band,to the interested parties. The client component consists of the client library that provides the mRSA sig-nature and mRSA decryption operations.It also handles the installation of the client’s credentials at the local host.The SEM component is the critical part of the architecture.Since a single ACM Journal Name,Vol.V,No.N,Month20YY.。