Fine-Grained Control of Security Capabilities

合集下载

制程能力评估(中英文)

制程能力评估(中英文)

Is there a Standard Operating Procedure for the cold storage of solder paste? 是Is 否the有c标ol准d s的to锡ra糕ge冷te冻m操pe作ra流tur程e ?within the manufacturers' recommended range for all solder paste in cold storage? 锡糕的冷冻温度是否在供应商的建议温度范围内? Is the Solder Paste FIFO controlled while in cold storage? A gravity feed rack is preferred. 锡Do糕es的th冷e冻co贮ld藏st时or,ag是e 否un先it h入av先e出a 控tem制p?er重at力ur自e r流ec进or料de将r, 更wh好ic。h can be read without opening the unit, to record temperature over time? 冷Is 冻the机re器a是d否oc有um温e度nte记d录re器qu长ire期m记en录t t温o p度e,rio以dic便a不lly用ch打ec开k 机tha器t 就the可r知ec道or里de面d t温em度p?erature is within the required storage limits? 是Is 否the有re文e本vid的en请c求e t去o d定e时mo检n查str记at录e t的ha温t a度ct是ion否w的as需t要ak的en温w度he范n 围the内t?emperature was outside the defined storage limits? 当温度超出定义的贮藏温度极限时,是否有证据证明采取了行动? Is the cold storage expiration date of the Solder Paste specified on the Solder Paste container? 冷冻锡糕有效期是否定义在贮锡容器上? Is the date and time that the Solder Paste has been removed from cold storage specified on its container? 从Is 贮the藏d室at移e a开n锡d t糕im的e 日tha期t 和the时S间ol是de否r P记a录ste在is贮a锡va糕ila容bl器e f上or?use, after removal from cold storage, specified on its container? 从Is 冷the冻d容at器e a搬n出d t来im后e ,tha锡t 糕the适S合ol使de用r P的a日ste期e和xp时ire间s 是at否am定b在ie容nt 器tem上p?erature with its 'seal broken' documented and known? 锡Is 糕the暴d露at于e a正n常d t的im环e 境tha温t 度the期S满ol时de间r P和a日ste期e是xp否ire用s 它at的am封b条ie记nt 录tem?perature with its 'seal in place' documented and known?

Perma-Cast Clear Liquid Release Technical Data Sh

Perma-Cast  Clear Liquid Release Technical Data Sh

Aurora, IL 60506Phone: 800-282-3388Fax: 630-906-1982information for your project: Technical Data Sheet (TDS), Color Chart, Installation Guide, Safety Data Sheet (SDS). All information is available for download online at or at 800-282-3388.MasterFormat ™ Guide Specifications, and Butterfield Color ® Architectural Details and Specifications are available for the specifier/designer. All information is available for download online at or at 800-282-3388.Uni-Mix, Perma-Cast, Perma-Shake, Select Grade, Sierra Stain, Elements, Clear Guard, Color Guard, PRO 350, First Seal, T1000, TEC FILM, MT Resurfacer, Cantera, SurfEtch, Delaminator, CHO, Flat Out, Perma-Tique, and Pro Pack are trademarks of Butterfield Color, Inc.MasterFormat is a registered trademark of The Construction Specifications Institute – CSI | 11219© 2019 Butterfield Color, Inc.All rights reserved. Made in USA1. Description: Perma-Cast ® Clear Liquid Release is a bond breaker used with stamping mats, texturing skins or texture rollers prior to imprinting concrete or cementitious overlays. It prevents the stamping or texturing tool from sticking to the surface, enhances the transfer of the detailed pattern and texture, and prolongs the surface life of the stamping mat or texturing tool. Use on integrally colored or uncolored concrete, shake-on color hardeners, and stampable cementitious overlays. It is suitable for outdoor and indoor use. It is particularly useful with overlays, since it will not contaminate the existing concrete substrate as readily as powdered releases. It evaporates quickly and requires little to no clean up prior to applying solvent based curing and sealing compounds such as Clear Guard ® Cure and Seal, or prior to chemical staining with Perma-Cast ® Sierra Stain ™.2. Packaging: Perma-Cast ® Clear Liquid Release is available in 5 gal. (19 L) pails. Pails should be stored in a cool, dry place when not in use. Store away from combustible materials and sources of heat. Do not reuse empty container.2.1 SHELF LIFE: Indefinite, when stored in original, unopened containers,in dry storage.3. Coverage: A 5 gal. pail covers approximately 750 sq. ft. (1 l/3.7 m 2) of concrete surface. Apply full strength. Do not dilute. Coverage will vary depending on timing, surface finish prior to stamping, application method, air temperature, humidity and wind conditions. Conditioning of the stamping tools with the liquid release prior to stamping will also affect the amount of material used.4. Application Equipment: A clean, quality hand-pump sprayer equippedwith a fan pattern spray nozzle should be used to apply Perma-Cast ® Clear Liquid Release. Material should be applied to the surface of the concrete and to the pattern and texturing tools. Spraying equipment must be resistant to solvent-based materials.5. Application: Apply Perma-Cast ® Clear Liquid Release after all finishing is completed and prior to imprinting the surface. Do not attempt to float, trowel, or otherwise work the surface once the liquid release is applied. Do not apply over a large area, as the liquid release may evaporate prior to the imprinting process. Do not apply if bleed water is visible on the concrete surface. Material should also be applied to the imprinting tools.Apply liberally. Perma-Cast ® ClearLiquid Release evaporates and it mustbe reapplied to the concrete surface andtools during the imprinting process. Donot attempt to imprint the surface withoutliquid release visible on the concrete orimprinting tool surface. After completeevaporation, the concrete surface willlose its wet sheen and appear dull. At this time, the surface may be cured or sealed with Clear Guard ®Cure and Seal, or chemically stained with Perma-Cast ® Sierra Stain ™in accordance with the Technical Data Sheets for those products. All information is available for download online at www.butterfieldcolor.com or at 800-282-3388.6. Quality Control: Cast a job site sample at least 21 days prior to the installation for approval of color and finish. Utilize all materials, tools, and techniques from the actual job in the mock-up. Consistent batching, pouring, finishing, curing, sealing, and preparation techniques, will ensure the uniformity of architectural concrete. Verify adequate wet and dry slip resistance. Verify maintenance requirements. Site visits by Butterfield Color, Inc. Personnel are for making technical recommendations only and not for supervising or providing quality control.KEEP CONTAINER TIGHTLY CLOSED. KEEP OUT OF REACH OF CHILDREN. NOT FOR INTERNAL CONSUMPTION. FOR PROFESSIONAL USE ONLY.For further information and advice regarding transportation, handling, storage and disposal of chemicalproducts, users should refer to theactual Safety Data Sheets containing physical, ecological, toxicological and other safety related data. Read the current actual Safety Data Sheet before using the product. In case of emergency, in U.S. call CHEMTREC at 1-800-424-9300, International 703-741-5970, in Canada call CANUTEC (collect) 613-996-6666.Prior to use of any Butterfield Color, Inc. product, the user must always read and follow the warnings and instructions onthe product's most current TechnicalData Sheet, product label and SafetyData Sheet which are available onlineat or at 800-282-3388. Nothing contained in anyButterfield Color, Inc. materials relievesthe user of the obligation to read andfollow the warnings and instruction foreach Butterfield Color, Inc. product asset forth in the current Technical DataSheet, product label and Safety DataSheet prior to product use.LIMITED WARRANTY AND DISCLAIMER – EXCLUSIVE REMEDY:Butterfield Color, Inc. (“BC”) warrants that this product conforms to its publishedspecifications when it is shipped.THIS LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY AND THEREARE NO OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. BC does not warrant any particular method of use or application of the product or its performance under any particular condition. If this product does not conform to its published specifications when shipped, we will replace theproduct as your exclusive remedy. Anyaction for breach of the limited warranty or any other liability arising from this product must be brought within 90 days of receiving the product. BC is not liable for consequential damages or personal injury arising from the use, storage or handling of this product.。

如何识别和应对假冒产品 英语作文

如何识别和应对假冒产品 英语作文

如何识别和应对假冒产品英语作文Counterfeit products have become a growing global concern, posing significant risks to consumers and businesses alike. These fake goods, which are designed to mimic the appearance and branding of legitimate products, can be found in a wide range of industries, from luxury fashion to pharmaceuticals. As the demand for affordable alternatives increases, the proliferation of counterfeit goods has also escalated, making it crucial for individuals and organizations to develop strategies to identify and respond to this pressing issue.One of the primary challenges in addressing the problem of counterfeit products is the sheer scale and complexity of the global supply chain. Counterfeiters have become increasingly sophisticated in their methods, utilizing advanced technologies and intricate distribution networks to infiltrate legitimate markets. This makes it increasingly difficult for consumers to distinguish genuine products from their fake counterparts, as the quality and appearance of these imitations can be remarkably similar to the original.To effectively identify counterfeit goods, consumers must develop akeen eye for detail and a deep understanding of the characteristics of authentic products. This often involves carefully examining the packaging, labeling, and even the product itself for any discrepancies or inconsistencies. For example, genuine luxury items may feature intricate stitching, unique serial numbers, or specialized materials that are difficult to replicate. By familiarizing themselves with these distinctive features, consumers can more readily identify potential counterfeits and make informed purchasing decisions.In addition to visual inspection, consumers can also leverage technology to aid in the detection of counterfeit goods. Many brands now offer mobile applications or online tools that allow users to scan product codes or barcodes to verify their authenticity. These digital solutions can provide real-time information on the provenance and legitimacy of a product, helping consumers to avoid falling victim to fraudulent purchases.Another effective strategy for combating counterfeit products is to support reputable and trusted retailers. By purchasing from authorized dealers or directly from the brand's official channels, consumers can significantly reduce the risk of acquiring counterfeit goods. These established vendors often have robust systems in place to ensure the integrity of their supply chain, reducing the likelihood of counterfeit infiltration.When consumers do suspect that they have purchased a counterfeit product, it is essential to take swift and appropriate action. This may involve reporting the incident to the relevant authorities, such as law enforcement or consumer protection agencies, who can investigate the matter and take legal action against the perpetrators. Additionally, consumers can engage directly with the brand or manufacturer to inform them of the suspected counterfeit, as these companies often have dedicated teams and resources to address such issues.Beyond individual consumer efforts, businesses and governments play a crucial role in combating the proliferation of counterfeit goods. Companies can implement robust supply chain management practices, including rigorous vendor vetting and product authentication measures, to mitigate the risk of counterfeit infiltration. Governments, on the other hand, can strengthen legislative frameworks, enhance border controls, and collaborate with international organizations to disrupt the supply and distribution of counterfeit products.The impact of counterfeit goods extends far beyond the immediate financial loss to consumers and businesses. Counterfeit products can pose significant health and safety risks, particularly in the case of pharmaceuticals, automotive parts, or consumer electronics. Substandard or tampered-with goods can lead to serious injuries,illnesses, or even fatalities, underscoring the urgent need to address this global challenge.In conclusion, the identification and response to counterfeit products require a multi-faceted approach involving consumers, businesses, and governments. By developing a keen awareness of the characteristics of genuine products, leveraging technology-enabled authentication tools, and supporting reputable vendors, consumers can play a vital role in combating the proliferation of counterfeit goods. Businesses and governments must also take decisive action to strengthen supply chain security, enhance legal frameworks, and disrupt the distribution networks of counterfeiters. Only through a collaborative and comprehensive effort can we effectively protect consumers, safeguard intellectual property rights, and foster a more secure and trustworthy marketplace.。

信任蓝色COMBIDISC 刮刀工具说明书

信任蓝色COMBIDISC 刮刀工具说明书

New! Incl.TRUST BLUE■Versatile product line for coarse machining, surface texturing and polishing■Optimal solutions even for complicated applications■High performance, quick and safeThe COMBIDISC product range contains a wide selection of grinding tools for surface finishing. From coarse machining and surface texturing to face-down mirror polishing – the range provides the best tool, even for complicated applications.Advantages:■High profitability thanks to quick tool changes.■Great convenience thanks to simple handling and low-vibration working.■No operational disruptions caused by sticking, slipping or disengaging. Applications:■Roughening■Levelling■Deburring■Surface work■Work on edges■Polishing■Cleaning■Sharpening■Work on weld seams■Structuring surfaces■Step-by-step fine grinding Recommendations for use:■Use COMBIDISC grinding tools with arborsor abrasive disc holders on flexible shaftdrives with angle handpieces, com-pressed-air or electric angle grinders.■Use grinding oil which is suitable for thematerial in order to considerably increasethe tool life and abrasive performanceof the tools. More detailed informationand ordering data for grinding oils can befound in our Tool Manual 23, cataloguesection 4, page 155 or at .Matching tool drives:■Flexible shaft drives■Straight grinders■Angle grinders■Cordless angle grindersOrdering notes:■Please order arbors or COMBIDISC abrasivedisc holders separately.More detailed information and orderingdata can be found on page 18.■When ordering, please state the EAN orthe full description.■Ordering example:EAN 4007220266175CD 38 A 180■Ordering example explanation:CD = COMBIDISC abrasive discs38 = Outer diameter D1[mm]A = Abrasive180= Grit sizeSafety notes:■The maximum permitted peripheral speedis 50 m/s.■For safety reasons, the specified maximumpermitted rotational speed must never beexceeded.Accessories:■Arbors for COMBIDISC Mini-POLIFAN■COMBIDISC abrasive disc holders■COMBIDISC DUST REMOVERTool side: Threaded connection with female thread (metal/plastic)Also suitable for the following systems used on the market: PSG, Power Lock Type II "turn on", SocAtt, Turn-On Tool side: Threaded connection with malethread (plastic)Also suitable for the following systems usedon the market: Roloc™, Lockit, Speed LokTR, Power Lock Type III, Fastlock-System B,Roll-OnPFERD VALUE:PFERD ERGONOMICS recommendsCOMBIDISC tools as a solution to sustainablyreduce vibration, noise and dust levelsproduced by tools and to improve workingcomfort.PFERD EFFICIENCY recommends COMBIDISCtools to reduce tool change and setup times.PFERD VIDEO:Learn more about theadvantages of usingCOMBIDISC tools.The fast way to the best toolRecommended rotational speed rangeExample:CD 50 A-COOL 60 Application:Grinding stainless steel (INOX)Cutting speed: 20–25 m/sRotational speed: 7,600–9,500 RPM3CD CDRAluminium oxide A typeFor universal coarse grinding work with high stock removal rates.Ideal for dressing weld seams in hard-to-reach places.Longer tool life and higher stock removal rate when compared to abrasive discs.Abrasive:Aluminium oxide AOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :CD CDRZirconia alumina Z typeFor coarse grinding work with a high stock removal rate and a long tool life.Abrasive:Zirconia alumina ZRecommendations for use:■Use in the case of a higher contact pressure.Ordering notes:■Please complete the description with the desired grit size.PFERD VALUE :Mini-POLIFAN arborsBO PFFMatching arbors for COMBIDISC Mini-POLIFAN.CD CDRAluminium oxide A typeFor universal coarse to fine grinding applications in industry and professional trades.Abrasive:Aluminium oxide AOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :CD CDRAluminium oxide A-PLUS typeFor universal applications from coarse to fine grinding.Higher stock removal rate due to sturdy backing material. Particularly for use in edge grinding due to high tear strength.Abrasive:Aluminium oxide A-PLUSOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDCDRAluminium oxide A-FLEX typeParticularly flexible abrasive discs, which are especially suitable for work on contours and concave surfaces, e.g. in tool- and mould-making. For achieving seamless transitions in the surface finish.Abrasive:Aluminium oxide A-FLEXRecommendations for use:■These discs should be used with a soft holder to support their flexibility.Ordering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDCDRAluminium oxide A-FORTE typeFor universal applications from coarse to fine grinding, with a high stock removal rate and long tool life.Abrasive:Aluminium oxide A-FORTEOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDCDRAluminium oxide A-COOL typeFor universal applications from coarse to fine grinding on materials with challenging stock removal properties, e.g. stainless steel (INOX).Active grinding additives in the coating substantially improve the stock removal rate, prevent clogging and result in cooler grinding.Abrasive:Aluminium oxide A-COOLOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDCDRAluminium oxide A compact grain typeOutstandingly suited to fine and very fine grinding, and for step-by-step preparations for polishing.The self-sharpening compact grain facilitates a very long tool life and achieves consistent surface quality levels throughout the entire tool life.Abrasive:Aluminium oxide A compact grainOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDCDRAluminium oxide A-CONTOUR typeVery flexible and adaptable on account of the outer contour. Cutting into the workpiece is avoided.Abrasive:Aluminium oxide A-CONTOUR Recommendations for use:■Use an abrasive disc holder with a diameter of 20–50 mm.Ordering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDCDRZirconia alumina Z typeFor coarse grinding work with a high stock removal rate and a long tool life.Particularly high stock removal rate in coarse grinding applications using grit sizes 36 and 60.Abrasive:Zirconia alumina ZRecommendations for use:■Use with hard or medium-hard COMBIDISC abrasive disc holders.Ordering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDCDRCeramic oxide grain CO-COOL typeFor aggressive grinding with maximum stock removal rate on hard materials which do not conduct heat well. Consistently high performance due to self-sharpening ceramic oxide grain.Active grinding additives in the coating substantially improve the stock removal rate, prevent clogging and result in cooler grinding.Abrasive:Ceramic oxide grain CO-COOLOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :CDFCDFRCeramic oxide grain CO-COOL midget fibre discs typeExceptionally well-suited to surface and edge grinding. The fibre backing strengthens the abrasive disc and improves stock removal.For aggressive grinding with maximum stock removal rate on hard materials which do not conduct heat well. Consistently high performance due to self-sharpening ceramic oxide grain.Active grinding additives in the coating substantially improve the stock removal rate, prevent clogging and result in cooler grinding.Abrasive:Ceramic oxide grain CO-COOLOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :VICTO GRAIN products are some of the most effective grinding tools in the world. PFERD’s triangular, precision-formed abrasive grain achieves unique-ly high abrasive performance.The VICTO GRAIN abrasive grain triangles are identical in shape and size and their cutting edges are applied to the workpiece at the optimum an -gle, meaning the grain needs very little energy to penetrate the workpiece. As such, the user benefits from an efficient machining process with ■ fast working, ■ a long tool life,■ less heat build-up in the workpiece, and■ a lower power output required for the tool drive.The VICTO GRAIN abrasive grain triangles are fixed to the substrate on one of their sides. This means they are securely fixed in place and, together with their slim design, offer an extremely large chip space in order to further improve machining efficiency.The structure of the triangular VICTO GRAIN has also been specially adapt -GRAIN abrasive grainThe VICTO GRAIN abrasive grain is optimally alignedVIDEO :Learn more about the advantages of using GRAIN products.VICTO GRAIN -COOL midget fibre discs typeExceptionally well-suited to surface and edge grinding. The fibre backing considerably strengthens the abrasive disc and improves stock removal.For extremely aggressive grinding with an extremely long tool life and an outstanding stock removal rate on steels and materials which are hard or have poor heat-conducting properties.Outstanding, constant high performance thanks to the VICTO GRAIN-COOL abrasive grain.Active grinding additives in the coating substantially improve the stock removal rate, prevent clogging and result in cooler grinding.Abrasive:VICTO GRAIN-COOLPFERD VALUE :CDF CDFRVICTO GRAIN -COOL typeFor extremely aggressive grinding with an extremely long tool life and an outstanding stock removal rate on steels and materials which are hard or have poor heat-conducting properties.Outstanding, constant high performance thanks to the VICTO GRAIN-COOL abrasive grain.Active grinding additives in the coating substantially improve the stock removal rate, prevent clogging and result in cooler grinding.Abrasive:VICTO GRAIN-COOLPFERD VALUE :CDCDRCD CDRDiamond typeExceptionally suitable for work on wear-resistant coatings and for hard facings made of tung-sten carbide, chromium carbide, titanium carbide, etc. Particularly recommended for work on materials used for aircraft engine construction, e.g. Hastelloy, Inconel and titanium/titanium alloys. Also highly suitable for work on extremely hard materials such as tungsten carbide, glass, ceramics, enamel, stone and GRP/CRP.Detailed information on diamond grinding tools can be found in our Tool Manual 23, catalogue section 5.Abrasive:Diamond D 251 = P 60D 126 = P 120D 76 = P 220(P = G rit size according to ISO 6344)Recommendations for use:■For the best results, use at a recommend-ed cutting speed of 10–20 m/s. ■Use with hard or medium-hard COMBIDISC abrasive disc holders.Ordering notes:■Please complete the description with the desired grit size.■Grit sizes are indicated in µm.PFERD VALUE :CDCDRSilicon carbide SiC typeFor universal grinding work on components made from aluminium, copper, bronze, titanium and fibre-reinforced plastics.Particularly recommended for use on titanium alloys.Ideally suited to use in the aeronautical industry, especially where SiC is the only approved abrasive, e.g. for use on engine components.Abrasive:Silicon carbide SiCOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :POLICLEAN discs CD, CDRCDCDRPCLR and PCLR PLUS typesFor coarse cleaning work such as removing paint, scale, heat discolouration, rust and adhesive residues in face-down grinding.POLICLEAN-PLUS discs (blue) exhibit a higher stock removal rate with a very long tool life.Applications:roughening, surface work, cleaning Abrasive:Aluminium oxide A Silicon carbide SiCRecommendations for use:■Use with hard or medium-hard COMBIDISC abrasive disc holders.PFERD VALUE :CD CDRHard type VRHSuitable for universal work on small and medium-sized metal surfaces, e.g. removing rough grinding traces, removing oxidation and light deburring work. Achieve matt and satin-finished surfaces.Applications:roughening, deburring, surface work, clean -ing, weld dressing, structuring, fine grinding in multiple stepsAbrasive:Aluminium oxide AAvailable POLIVLIES grit sizes:100 G = c oarse (yellow-brown)180 M = m edium (red-brown)240 F = fi ne (blue)Recommendations for use:■The addition of oil or water during grind -ing results in a finer finish, cooler grinding and longer tool life.Ordering notes:■Please complete the description with the desired grit size.PFERD VALUE :CD CDRSoft type VRWSuitable for very fine grinding on small and medium-sized surfaces and contours, and for cleaning metal and painted surfaces. Achieve matt and satin-finished surfaces. Highly open structure.Applications:roughening, deburring, surface work, clean -ing, weld dressing, structuring, fine grinding in multiple stepsAbrasive:Aluminium oxide AAvailable POLINOX grit sizes:100 = m edium 180 = fi ne 280 = v ery fineRecommendations for use:■The addition of oil or water during grind -ing results in a finer finish, cooler grinding and longer tool life.Ordering notes:■Please complete the description with the desired grit size.PFERD VALUE :CD CDRPNER typeFor achieving a very fine, uniform surface finish which, depending on requirements, is a sufficient preparation for high-gloss polishing. Particularly suitable for work on small and medium-sized surfaces of stainless steel (INOX) components.The different thicknesses/hardnesses of the non-woven material are colour-coded:W (soft) = g rey MH (medium-hard) = d ark blue H (hard) = r ed Applications:roughening, deburring, surface work, clean -ing, weld dressing, structuring, fine grinding in multiple steps Abrasive:Aluminium oxide A Silicon carbide SiCOrdering notes:■Please complete the description with the desired grit size.■The non-woven discs are supplied with a thickness of 6 mm.PFERD VALUE :For further information on non-woven products in the PNER type please refer to our brochure “Non-woven tools PNER and PNK – The professionals for high-grade surfaces” at .Aluminium oxide A typeFor achieving fine, matt grinding finishes in one process. The very sturdy granular bond facilitates very aggressive abrasive performance.Particularly suitable for work on stainless steel (INOX) and aluminium.Applications:deburring, surface work, weld dressing, structuring, fine grinding in multiple steps Abrasive:Aluminium oxide AOrdering notes:■Please complete the description with the desired grit size.PFERD VALUE :Felt discs CD, CDRCD CDRFR typeSuitable for polishing with polishing paste bars, grinding pastes or diamond polishing pastes in face-down grinding on small and medium-sized surfaces.Applications:polishingRecommendations for use:■Use COMBIDISC felt discs with an abrasive disc holder on flexible shaft drives with an angle handpiece or small compressed-air or electric angle grinders.■For the best results, use at a recom-mended cutting speed of 5–10 m/s. This provides an ideal compromise between polishing performance, thermal load on the workpiece and tool wear.■When applying a different polishing paste, use a new unused felt disc.Ordering notes:■Further information on felt tools can be found in our Tool Manual 23, catalogue section 4, page 144.Accessories:Grinding and polishing pastes (Tool Manual 23, catalogue section 4, pages 153–154)PFERD VALUE :LSBH and SBHR typesMatching arbors for COMBIDISC grinding tools. Available in three different hardness grades.Ordering notes:■The different hardness grades are col-our-coded: W (soft) – grey; M (medium) – blue; H (hard) – red■Please complete the description with the desired hardness grade.PFERD VALUE :AF 14-1/4 CD ,(EAN 4007220302026) Female thread M14,male thread 1/4-20 UNC. Suitable for drives with spindle M14.SPV-20 CD 1/4-20 UNC , (EAN 4007220333167) Female thread 1/4-20 UNC, male thread 1/4-20 UNC. Suitable for drives withspindle 1/4-20 UNC, e.g. for PW 3/120 DH.AF M5 CD 1/4-20 UNC (EAN 4007220064702)Male thread M5,male thread 1/4-20 UNC. Suitable for cordless angle grinder, dia. 75, with spindle M5 (female thread).Adapters:The shank of the abrasive disc holders can be replaced by suitable adapters. This enables the abrasive disc holder to be mounted directly to the drive spindle of the tool drive. The following adapters are available:Ordering notes:More detailed information and ordering data for adapters can be found in in our Tool Manual 23, catalogue section 9 or at .COMBIDISC SETSet of various COMBIDISC tools.Contents:■3 pcs. each of COMBIDISC abrasive discs: -CD A 60 FORTE -CD A 120 FORTE -CD A-COOL 60 -CD CO-COOL 36 -CD Z 60■3 pcs. each of COMBIDISC non-woven discs:-CD VRH A 180 M -CD VRW A 100 ■1 pc. each of:-Abrasive disc holder SBH M Advantages:■Getting to know and testing the comprehensive system.■Coordinated selection of the most common versions.Abrasive:Aluminium oxide A Zirconia alumina ZAluminium oxide A-FORTE Aluminium oxide A-COOL Ceramic oxide grain CO-COOLRecommendations for use:■Use COMBIDISC grinding tools with an arbor or abrasive disc holder on flexible shaft drives with an angle handpiece or small compressed-air or electric angle grinders.PFERD VALUE :SET CD UWERSet of different COMBIDISC tools, including single-hand angle grinder, for all coarse and fine grinding, polishing and cleaning work, especially on assembly and construction sites.Contents:■Electric angle grinder UWER 5/200 SI with electronic rotational speed control (9,000–20,000 RPM), output 500 watts ■4 abrasive disc holders and 2 adapters for alternative tool drives■135 different abrasive discs, TX discs, Mini-POLIFAN, non-woven and felt discs with a diameter of 50 mm■Polishing paste bar for using felt discsAdvantages:■Entire rotational speed range covered for COMBIDISC tools with a diameter of 50 mm.■Easy and comfortable to use thanks to the handy angle grinder design.■Coordinated selection of the most common versions.Ordering notes:■Detailed information and ordering data on tool drives can be found in in our Tool Manual 23, catalogue section 9.PFERD VALUE :08/2020S u b j e c t t o t e c h n i c a l m o d i fi c a t i o n s .DUST REMOVERWith the COMBIDISC DUST REMOVER, grinding dust can be extracted very effectively from places where something is ground. It can be universally used with all dust extraction systems (portable or stationary). The DUST REMOVER can be used with CD and CDR backing pads.Advantages:■Clean work environment with less dust. ■Compatible with all drive systems. ■Flexible tube for easy accessibility.Recommendations for use:■To guarantee effective extraction, the volumetric flow rate has to be at least 300 m³/h.■Reducing the rotational speed increases the effectiveness of extraction. Matching tool drives: ■Flexible shaft drives ■Straight grinders ■Angle grinders■Cordless angle grinders Ordering notes:■Please order arbors or COMBIDISC abrasive disc holders separately.■When ordering, please state the EAN or the full description.Safety notes:■The maximum permitted peripheral speed is 50 m/s.■For safety reasons, the specified maximum permitted rotational speed must never be exceeded.Accessories:■CD and CDR abrasive disc holders with a diameter of 50 mm or 75 mm.D 1D 2。

电子英语证书考试(PEC)-集成电路词汇汇总

电子英语证书考试(PEC)-集成电路词汇汇总

电子英语证书考试(PEC)-集成电路词汇汇总Abrupt junction 突变结Accelerated testing 加速实验Acceptor 受主Acceptor atom 受主原子Accumulation 积累、堆积Accumulating contact 积累接触Accumulation region 积累区Accumulation layer 积累层Active region 有源区Active component 有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源(放大)区Admittance 导纳Allowed band 允带Alloy-junction device合金结器件Aluminum(Aluminium) 铝Aluminum – oxide 铝氧化物Aluminum passivation 铝钝化Ambipolar 双极的Ambient temperature 环境温度Amorphous 无定形的,非晶体的Amplifier 功放扩音器放大器Analogue(Analog) comparator 模拟比较器Angstrom 埃Anneal 退火Anisotropic 各向异性的Anode 阳极Arsenic (AS) 砷Auger 俄歇Auger process 俄歇过程Avalanche 雪崩Avalanche breakdown 雪崩击穿Avalanche excitation雪崩激发Background carrier 本底载流子Background doping 本底掺杂Backward 反向Backward bias 反向偏置Ballasting resistor 整流电阻Ball bond 球形键合Band 能带Band gap 能带间隙Barrier 势垒Barrier layer 势垒层Barrier width 势垒宽度Base 基极Base contact 基区接触Base stretching 基区扩展效应Base transit time 基区渡越时间Base transport efficiency基区输运系数Base-width modulation基区宽度调制Basis vector 基矢Bias 偏置Bilateral switch 双向开关Binary code 二进制代码Binary compound semiconductor 二元化合物半导体Bipolar 双极性的Bipolar Junction Transistor (BJT)双极晶体管Bloch 布洛赫Blocking band 阻挡能带Blocking contact 阻挡接触Body - centered 体心立方Body-centred cubic structure 体立心结构Boltzm ann 波尔兹曼Bond 键、键合Bonding electron 价电子Bonding pad 键合点Bootstrap circuit 自举电路Bootstrapped emitter follower 自举射极跟随器Boron 硼Borosilicate glass 硼硅玻璃Boundary condition 边界条件Bound electron 束缚电子Breadboard 模拟板、实验板Break down 击穿Break over 转折Brillouin 布里渊Brillouin zone 布里渊区Built-in 内建的Build-in electric field 内建电场Bulk 体/体内Bulk absorption 体吸收Bulk generation 体产生Bulk recombination 体复合Burn - in 老化Burn out 烧毁Buried channel 埋沟Buried diffusion region 隐埋扩散区Can 外壳Capacitance 电容Capture cross section 俘获截面 Capture carrier 俘获载流子Carrier 载流子、载波Carry bit 进位位Carry-in bit 进位输入 Carry-out bit 进位输出Cascade 级联 Case 管壳Cathode 阴极 Center 中心Ceramic 陶瓷(的)Channel 沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂 Channel shortening 沟道缩短Channel width 沟道宽度 Characteristic impedance 特征阻抗Charge 电荷、充电 Charge-compensation effects 电荷补偿效应Charge conservation 电荷守恒 Charge neutrality condition 电中性条件Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemmical etching 化学腐蚀法 Chemically-Polish 化学抛光Chemmically-Mechanically Polish (CMP) 化学机械抛光Chip 芯片Chip yield 芯片成品率Clamped 箝位Clamping diode 箝位二极管Cleavage plane 解理面Clock rate 时钟频率 Clock generator 时钟发生器Clock flip-flop 时钟触发器Close-packed structure 密堆积结构Close-loop gain 闭环增益 Collector 集电极Collision 碰撞 Compensated OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain 共模增益 Common-mode input 共模输入Common-mode rejection ratio (CMRR) 共模抑制比Compatibility 兼容性Compensation 补偿Compensated impurities 补偿杂质 Compensated semiconductor 补偿半导体Complementary Darlington circuit 互补达林顿电路Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Complementary error function 余误差函数Computer-aided design (CAD)/test(CAT)/manufacture(CAM) 计算机辅助设计/ 测试/制造Compound Semiconductor 化合物半导体 Conductance 电导Conduction band (edge) 导带(底) Conduction level/state 导带态Conductor 导体 Conductivity 电导率Configuration 组态 Conlomb 库仑Conpled Configuration Devices 结构组态Constants 物理常数Constant energy surface 等能面 Constant-source diffusion恒定源扩散Contact 接触Contamination 治污Continuity equation 连续性方程Contact hole 接触孔Contact potential 接触电势Continuity condition 连续性条件Contra doping 反掺杂 Controlled 受控的Converter 转换器Conveyer 传输器Copper interconnection system 铜互连系统Couping 耦合Covalent 共阶的Crossover 跨交Critical 临界的Crossunder 穿交Crucible坩埚 Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Current density 电流密度Curvature 曲率Cut off 截止Current drift/dirve/sharing 电流漂移/驱动/共享Current Sense 电流取样Curvature 弯曲Custom integrated circuit 定制集成电路Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique 切克劳斯基技术(Cz法直拉晶体J)Dangling bonds 悬挂键Dark current 暗电流Dead time 空载时间Debye length 德拜长度De.broglie 德布洛意Decderate 减速Decibel (dB) 分贝Decode 译码Deep acceptor level 深受主能级Deep donor level 深施主能级Deep impurity level 深度杂质能级Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体Degeneracy 简并度Degradation 退化Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度Delay 延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近似Depletion contact 耗尽接触Depletion depth 耗尽深度Depletion effect 耗尽效应Depletion layer 耗尽层Depletion MOS 耗尽MOSDepletion region 耗尽区Deposited film 淀积薄膜Deposition process 淀积工艺Design rules 设计规则Die 芯片(复数dice)Diode 二极管Dielectric 介电的Dielectric isolation 介质隔离Difference-mode input 差模输入Differential amplifier 差分放大器Differential capacitance 微分电容Diffused junction 扩散结Diffusion 扩散Diffusion coefficient 扩散系数Diffusion constant 扩散常数Diffusivity 扩散率Diffusion capacitance/barrier/current/furnace 扩散电容/势垒/电流/炉Digital circuit 数字电路Dipole domain 偶极畴Dipole layer 偶极层Direct-coupling 直接耦合Direct-gap semiconductor 直接带隙半导体Direct transition 直接跃迁Discharge 放电Discrete component 分立元件Dissipation 耗散Distribution 分布Distributed capacitance 分布电容Distributed model 分布模型Displacement 位移Dislocation 位错Domain 畴Donor 施主Donor exhaustion 施主耗尽Dopant 掺杂剂Doped semiconductor 掺杂半导体Doping concentration 掺杂浓度Double-diffusive MOS(DMOS)双扩散MOS.Drift 漂移Drift field 漂移电场Drift mobility 迁移率Dry etching 干法腐蚀Dry/wet oxidation 干/湿法氧化Dose 剂量Duty cycle 工作周期Dual-in-line package (DIP)双列直插式封装Dynamics 动态Dynamic characteristics 动态属性Dynamic impedance 动态阻抗Early effect 厄利效应Early failure 早期失效Effective mass 有效质量Einstein relation(ship) 爱因斯坦关系Electric Erase Programmable Read Only Memory(E2PROM) 一次性电可擦除只读存储器Electrode 电极Electrominggratim 电迁移Electron affinity 电子亲和势Electronic -grade 电子能Electron-beam photo-resist exposure 光致抗蚀剂的电子束曝光Electron gas 电子气Electron-grade water 电子级纯水Electron trapping center 电子俘获中心 Electron Volt (eV) 电子伏Electrostatic 静电的Element 元素/元件/配件Elemental semiconductor 元素半导体Ellipse 椭圆Ellipsoid 椭球Emitter 发射极Emitter-coupled logic 发射极耦合逻辑Emitter-coupled pair 发射极耦合对Emitter follower 射随器Empty band 空带Emitter crowding effect 发射极集边(拥挤)效应Endurance test =life test 寿命测试 Energy state 能态Energy momentum diagram 能量-动量(E-K)图Enhancement mode 增强型模式Enhancement MOS 增强性MOS Entefic (低)共溶的Environmental test 环境测试Epitaxial 外延的Epitaxial layer 外延层Epitaxial slice 外延片Expitaxy 外延Equivalent curcuit 等效电路Equilibrium majority /minority carriers 平衡多数/少数载流子Erasable Programmable ROM (EPROM)可搽取(编程)存储器Error function complement 余误差函数Etch 刻蚀Etchant 刻蚀剂Etching mask 抗蚀剂掩模Excess carrier 过剩载流子Excitation energy 激发能 Excited state 激发态Exciton 激子 Extrapolation 外推法Extrinsic 非本征的Extrinsic semiconductor 杂质半导体Face - centered 面心立方Fall time 下降时间Fan-in 扇入Fan-out 扇出Fast recovery 快恢复F ast surface states 快界面态Feedback 反馈Fermi level 费米能级Fermi-Dirac Distribution 费米-狄拉克分布Femi potential 费米势Fick equation 菲克方程(扩散)Field effect transistor 场效应晶体管Field oxide 场氧化层Filled band 满带Film 薄膜Flash memory 闪烁存储器Flat band 平带Flat pack 扁平封装Flicker noise 闪烁(变)噪声Flip-flop toggle 触发器翻转Floating gate 浮栅Fluoride etch 氟化氢刻蚀Forbidden band 禁带Forward bias 正向偏置Forward blocking /conducting正向阻断/导通Frequency deviation noise频率漂移噪声Frequency response 频率响应Function 函数Gain 增益Gallium-Arsenide(GaAs) 砷化钾Gamy ray r 射线Gate 门、栅、控制极Gate oxide 栅氧化层Gauss(ian)高斯Gaussian distribution profile 高斯掺杂分布Generation-recombination 产生-复合Geometries 几何尺寸Germanium(Ge) 锗Graded 缓变的Graded (gradual) channel 缓变沟道Graded junction 缓变结Grain 晶粒Gradient 梯度Grown junction 生长结Guard ring 保护环Gummel-Poom model 葛谋-潘模型Gunn - effect 狄氏效应Hardened device 辐射加固器件Heat of formation 形成热Heat sink 散热器、热沉Heavy/light hole band 重/轻空穴带Heavy saturation 重掺杂Hell - effect 霍尔效应Heterojunction 异质结Heterojunction structure 异质结结构Heterojunction Bipolar Transistor(HBT)异质结双极型晶体High field property 高场特性High-performance MOS.( H-MOS)高性能MOS. Hormalized 归一化Horizontal epitaxial reactor 卧式外延反应器Hot carrior 热载流子Hybrid integration 混合集成Image - force 镜象力Impact ionization 碰撞电离Impedance 阻抗Imperfect structure 不完整结构Implantation dose 注入剂量Implanted ion 注入离子Impurity 杂质Impurity scattering 杂志散射Incremental resistance 电阻增量(微分电阻)In-contact mask 接触式掩模Indium tin oxide (ITO) 铟锡氧化物Induced channel 感应沟道Infrared 红外的Injection 注入Input offset voltage 输入失调电压Insulator 绝缘体Insulated Gate FET(IGFET)绝缘栅FET Integrated injection logic集成注入逻辑Integration 集成、积分Interconnection 互连Interconnection time delay 互连延时Interdigitated structure 交互式结构Interface 界面Interference 干涉International system of unions国际单位制Internally scattering 谷间散射Interpolation 内插法Intrinsic 本征的Intrinsic semiconductor 本征半导体Inverse operation 反向工作Inversion 反型Inverter 倒相器Ion 离子Ion beam 离子束Ion etching 离子刻蚀Ion implantation 离子注入Ionization 电离Ionization energy 电离能Irradiation 辐照Isolation land 隔离岛Isotropic 各向同性Junction FET(JFET) 结型场效应管Junction isolation 结隔离Junction spacing 结间距Junction side-wall 结侧壁Latch up 闭锁Lateral 横向的Lattice 晶格Layout 版图Lattice binding/cell/constant/defect/distortion 晶格结合力/晶胞/晶格/晶格常熟/晶格缺陷/晶格畸变Leakage current (泄)漏电流Level shifting 电平移动Life time 寿命linearity 线性度Linked bond 共价键Liquid Nitrogen 液氮Liquid-phase epitaxial growth technique 液相外延生长技术Lithography 光刻Light Emitting Diode(LED) 发光二极管Load line or Variable 负载线Locating and Wiring 布局布线Longitudinal 纵向的Logic swing 逻辑摆幅Lorentz 洛沦兹Lumped model 集总模型Majority carrier 多数载流子Mask 掩膜板,光刻板Mask level 掩模序号Mask set 掩模组Mass - action law质量守恒定律Master-slave D flip-flop主从D触发器Matching 匹配Maxwell 麦克斯韦Mean free path 平均自由程Meandered emitter junction梳状发射极结Mean time before failure (MTBF) 平均工作时间Megeto - resistance 磁阻Mesa 台面MESFET-Metal Semiconductor金属半导体FETMetallization 金属化Microelectronic technique 微电子技术Microelectronics 微电子学Millen indices 密勒指数Minority carrier 少数载流子Misfit 失配Mismatching 失配Mobile ions 可动离子Mobility 迁移率Module 模块Modulate 调制Molecular crystal分子晶体Monolithic IC 单片IC MOSFET金属氧化物半导体场效应晶体管Mos. Transistor(MOST )MOS. 晶体管Multiplication 倍增Modulator 调制Multi-chip IC 多芯片ICMulti-chip module(MCM) 多芯片模块Multiplication coefficient倍增因子Naked chip 未封装的芯片(裸片)Negative feedback 负反馈Negative resistance 负阻Nesting 套刻Negative-temperature-coefficient 负温度系数Noise margin 噪声容限Nonequilibrium 非平衡Nonrolatile 非挥发(易失)性Normally off/on 常闭/开Numerical analysis 数值分析Occupied band 满带 Officienay 功率Offset 偏移、失调On standby 待命状态Ohmic contact 欧姆接触 Open circuit 开路Operating point 工作点 Operating bias 工作偏置Operational amplifier (OPAMP)运算放大器Optical photon =photon 光子 Optical quenching光猝灭Optical transition 光跃迁 Optical-coupled isolator光耦合隔离器Organic semiconductor有机半导体 Orientation 晶向、定向Outline 外形Out-of-contact mask非接触式掩模Output characteristic 输出特性Output voltage swing 输出电压摆幅Overcompensation 过补偿 Over-current protection 过流保护Over shoot 过冲Over-voltage protection 过压保护Overlap 交迭 Overload 过载Oscillator 振荡器Oxide 氧化物Oxidation 氧化Oxide passivation 氧化层钝化Package 封装 Pad 压焊点Parameter 参数 Parasitic effect 寄生效应Parasitic oscillation 寄生振荡 Passination 钝化Passive component 无源元件 Passive device 无源器件Passive surface 钝化界面 Parasitic transistor 寄生晶体管Peak-point voltage 峰点电压 Peak voltage 峰值电压Permanent-storage circuit 永久存储电路Period 周期Periodic table 周期表 Permeable - base 可渗透基区Phase-lock loop 锁相环Phase drift 相移Phonon spectra 声子谱Photo conduction 光电导 Photo diode 光电二极管Photoelectric cell 光电池Photoelectric effect 光电效应Photoenic devices 光子器件Photolithographic process 光刻工艺(photo) resist (光敏)抗腐蚀剂Pin 管脚Pinch off 夹断Pinning of Fermi level 费米能级的钉扎(效应)Planar process 平面工艺 Planar transistor 平面晶体管Plasma 等离子体 Plezoelectric effect 压电效应Poisson equation 泊松方程Point contact 点接触Polarity 极性 Polycrystal 多晶Polymer semiconductor聚合物半导体 Poly-silicon 多晶硅Potential (电)势Potential barrier 势垒Potential well 势阱Power dissipation 功耗Power transistor 功率晶体管 Preamplifier 前置放大器Primary flat 主平面Principal axes 主轴Print-circuit board(PCB) 印制电路板Probability 几率Probe 探针Process 工艺Propagation delay 传输延时Pseudopotential method 膺势发Punch through 穿通 Pulse triggering/modulating 脉冲触发/调制PulseWiden Modulator(PWM) 脉冲宽度调制Punchthrough 穿通 Push-pull stage 推挽级Quality factor 品质因子 Quantization 量子化Quantum 量子Quantum efficiency量子效应Quantum mechanics 量子力学Quasi – Fermi-level准费米能级Quartz 石英Radiation conductivity 辐射电导率Radiation damage 辐射损伤Radiation flux density 辐射通量密度Radiation hardening 辐射加固Radiation protection 辐射保护Radiative - recombination辐照复合Radioactive 放射性Reach through 穿通Reactive sputtering source 反应溅射源Read diode 里德二极管Recombination 复合Recovery diode 恢复二极管Reciprocal lattice 倒核子Recovery time 恢复时间Rectifier 整流器(管)Rectifying contact 整流接触Reference 基准点基准参考点Refractive index 折射率Register 寄存器Registration 对准Regulate 控制调整Relaxation lifetime 驰豫时间Reliability 可靠性Resonance 谐振Resistance 电阻Resistor 电阻器Resistivity 电阻率Regulator 稳压管(器)Relaxation 驰豫Resonant frequency共射频率Response time 响应时间Reverse 反向的Reverse bias 反向偏置Sampling circuit 取样电路Sapphire 蓝宝石(Al2O3)Satellite valley 卫星谷Saturated current range电流饱和区Saturation region 饱和区Saturation 饱和的Scaled down 按比例缩小Scattering 散射Schockley diode 肖克莱二极管Schottky 肖特基Schottky barrier 肖特基势垒Schottky contact 肖特基接触Schrodingen 薛定厄Scribing grid 划片格Secondary flat 次平面Seed crystal 籽晶Segregation 分凝Selectivity 选择性Self aligned 自对准的Self diffusion 自扩散Semiconductor 半导体Semiconductor-controlled rectifier 可控硅Sendsitivity 灵敏度Serial 串行/串联Series inductance 串联电感Settle time 建立时间Sheet resistance 薄层电阻Shield 屏蔽Short circuit 短路Shot noise 散粒噪声Shunt 分流Sidewall capacitance 边墙电容Signal 信号Silica glass 石英玻璃Silicon 硅Silicon carbide 碳化硅Silicon dioxide (SiO2) 二氧化硅Silicon Nitride(Si3N4) 氮化硅Silicon On Insulator 绝缘硅Siliver whiskers 银须Simple cubic 简立方Single crystal 单晶Sink 沉Skin effect 趋肤效应Snap time 急变时间Sneak path 潜行通路Sulethreshold 亚阈的Solar battery/cell 太阳能电池Solid circuit 固体电路Solid Solubility 固溶度Sonband 子带Source 源极Source follower 源随器Space charge 空间电荷Specific heat(PT) 热Speed-power product 速度功耗乘积Spherical 球面的Spin 自旋Split 分裂Spontaneous emission 自发发射Spreading resistance扩展电阻Sputter 溅射Stacking fault 层错Static characteristic 静态特性Stimulated emission 受激发射Stimulated recombination 受激复合Storage time 存储时间Stress 应力Straggle 偏差Sublimation 升华Substrate 衬底Substitutional 替位式的Superlattice 超晶格Supply 电源Surface 表面Surge capacity 浪涌能力Subscript 下标Switching time 开关时间Switch 开关Tailing 扩展Terminal 终端Tensor 张量Tensorial 张量的Thermal activation 热激发Thermal conductivity 热导率Thermal equilibrium 热平衡Thermal Oxidation 热氧化Thermal resistance 热阻Thermal sink 热沉Thermal velocity 热运动Thermoelectricpovoer 温差电动势率Thick-film technique 厚膜技术Thin-film hybrid IC薄膜混合集成电路Thin-Film Transistor(TFT) 薄膜晶体Threshlod 阈值Thyistor 晶闸管Transconductance 跨导Transfer characteristic 转移特性Transfer electron 转移电子Transfer function 传输函数Transient 瞬态的Transistor aging(stress) 晶体管老化Transit time 渡越时间Transition 跃迁Transition-metal silica 过度金属硅化物Transition probability 跃迁几率Transition region 过渡区Transport 输运Transverse 横向的Trap 陷阱Trapping 俘获Trapped charge 陷阱电荷Triangle generator 三角波发生器Triboelectricity 摩擦电Trigger 触发Trim 调配调整Triple diffusion 三重扩散Truth table 真值表Tolerahce 容差Tunnel(ing) 隧道(穿)Tunnel current 隧道电流Turn over 转折Turn - off time 关断时间Ultraviolet 紫外的Unijunction 单结的Unipolar 单极的Unit cell 原(元)胞Unity-gain frequency 单位增益频率Unilateral-switch单向开关Vacancy 空位Vacuum 真空Valence(value) band 价带Value band edge 价带顶Valence bond 价键Vapour phase 汽相Varactor 变容管Varistor 变阻器Vibration 振动Voltage 电压Wafer 晶片 Wave equation 波动方程Wave guide 波导 Wave number 波数Wave-particle duality 波粒二相性Wear-out 烧毁Wire routing 布线 Work function 功函数Worst-case device 最坏情况器件Yield 成品率Zener breakdown 齐纳击穿Zone melting 区熔法。

AT28HC64B高性能电擦可编程只读存储器(EEPROM)说明书

AT28HC64B高性能电擦可编程只读存储器(EEPROM)说明书

Features Array•Fast Read Access Time – 70 ns•Automatic Page Write Operation–Internal Address and Data Latches for 64 Bytes•Fast Write Cycle Times–Page Write Cycle Time: 10 ms Maximum (Standard)2 ms Maximum (Option – Ref. AT28HC64BF Datasheet)–1 to 64-byte Page Write Operation•Low Power Dissipation–40 mA Active Current–100µA CMOS Standby Current•Hardware and Software Data Protection•DATA Polling and Toggle Bit for End of Write Detection•High Reliability CMOS Technology–Endurance: 100,000 Cycles–Data Retention: 10 Years•Single 5 V ±10% Supply•CMOS and TTL Compatible Inputs and Outputs•JEDEC Approved Byte-wide Pinout•Industrial Temperature Ranges•Green (Pb/Halide-free) Packaging Option Only1.DescriptionThe AT28HC64B is a high-performance electrically-erasable and programmable read-only memory (EEPROM). Its 64K of memory is organized as 8,192 words by 8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device offers access times to 55 ns with power dissipation of just 220 mW. When the device is deselected, the CMOS standby current is less than 100µA.The AT28HC64B is accessed like a Static RAM for the read or write cycle without the need for external components. The device contains a 64-byte page register to allow writing of up to 64 bytes simultaneously. During a write cycle, the addresses and 1 to 64 bytes of data are internally latched, freeing the address and data bus for other operations. Following the initiation of a write cycle, the device will automatically write the latched data using an internal control timer. The end of a write cycle can be detected by DATA polling of I/O7. Once the end of a write cycle has been detected, a new access for a read or write can begin.Atmel’s AT28HC64B has additional features to ensure high quality and manufactura-bility. The device utilizes internal error correction for extended endurance and improved data retention characteristics. An optional software data protection mecha-nism is available to guard against inadvertent writes. The device also includes anextra 64 bytes of EEPROM for device identification or tracking.20274L–PEEPR–2/3/09AT28HC64B2.Pin Configurations2.128-lead SOIC Top ViewPin Name Function A0 - A12Addresses CE Chip Enable OE Output Enable WE Write Enable I/O0 - I/O7Data Inputs/Outputs NC No Connect DCDon’t Connect2.232-lead PLCC Top ViewNote:PLCC package pins 1 and 17 are Don’t Connect.2.328-lead TSOP Top View30274L–PEEPR–2/3/09AT28HC64B3.Block Diagram4.Device Operation4.1ReadThe AT28HC64B is accessed like a Static RAM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted on the out-puts. The outputs are put in the high-impedance state when either CE or OE is high. This dual line control gives designers flexibility in preventing bus contention in their systems.4.2Byte WriteA low pulse on the WE or CE input with CE or WE low (respectively) and OE high initiates a write cycle. The address is latched on the falling edge of CE or WE, whichever occurs last. The data is latched by the first rising edge of CE or WE. Once a byte write has been started, it will automatically time itself to completion. Once a programming operation has been initiated and for the duration of t WC , a read operation will effectively be a polling operation.4.3Page WriteThe page write operation of the AT28HC64B allows 1 to 64 bytes of data to be written into the device during a single internal programming period. A page write operation is initiated in the same manner as a byte write; after the first byte is written, it can then be followed by 1 to 63 additional bytes. Each successive byte must be loaded within 150 µs (t BLC ) of the previous byte. If the t BLC limit is exceeded, the AT28HC64B will cease accepting data and commence the internal programming operation. All bytes during a page write operation must reside on the same page as defined by the state of the A6 to A12 inputs. For each WE high-to-low transition during the page write operation, A6 to A12 must be the same.The A0 to A5 inputs specify which bytes within the page are to be written. The bytes may be loaded in any order and may be altered within the same load period. Only bytes which are specified for writing will be written; unnecessary cycling of other bytes within the page does not occur.4.4DATA PollingThe AT28HC64B features DATA Polling to indicate the end of a write cycle. During a byte or page write cycle, an attempted read of the last byte written will result in the complement of the written data to be presented on I/O7. Once the write cycle has been completed, true data is valid on all outputs, and the next write cycle may begin. DATA Polling may begin at any time during the write cycle.40274L–PEEPR–2/3/09AT28HC64B4.5Toggle BitIn addition to DATA Polling, the AT28HC64B provides another method for determining the end of a write cycle. During the write operation, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the write has completed, I/O6 will stop toggling, and valid data will be read. Toggle bit reading may begin at any time during the write cycle.4.6Data ProtectionIf precautions are not taken, inadvertent writes may occur during transitions of the host system power supply. Atmel ® has incorporated both hardware and software features that will protect the memory against inadvertent writes.4.6.1Hardware ProtectionHardware features protect against inadvertent writes to the AT28HC64B in the following ways: (a) V CC sense – if V CC is below 3.8 V (typical), the write function is inhibited; (b) V CC power-on delay – once V CC has reached 3.8 V, the device will automatically time out 5 ms (typical) before allowing a write; (c) write inhibit – holding any one of OE low, CE high or WE high inhib-its write cycles; and (d) noise filter – pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a write cycle.4.6.2Software Data ProtectionA software-controlled data protection feature has been implemented on the AT28HC64B. When enabled, the software data protection (SDP), will prevent inadvertent writes. The SDP feature may be enabled or disabled by the user; the AT28HC64B is shipped from Atmel with SDP disabled.SDP is enabled by the user issuing a series of three write commands in which three specific bytes of data are written to three specific addresses (refer to the “Software Data Protection Algorithm” diagram on page 10). After writing the 3-byte command sequence and waiting t WC , the entire AT28HC64B will be protected against inadvertent writes. It should be noted that even after SDP is enabled, the user may still perform a byte or page write to the AT28HC64B. This is done by preceding the data to be written by the same 3-byte command sequence used to enable SDP.Once set, SDP remains active unless the disable command sequence is issued. Power transi-tions do not disable SDP, and SDP protects the AT28HC64B during power-up and power-down conditions. All command sequences must conform to the page write timing specifica-tions. The data in the enable and disable command sequences is not actually written into the device; their addresses may still be written with user data in either a byte or page write operation.After setting SDP, any attempt to write to the device without the 3-byte command sequence will start the internal write timers. No data will be written to the device, however. For the dura-tion of t WC , read operations will effectively be polling operations.4.7Device IdentificationAn extra 64 bytes of EEPROM memory are available to the user for device identification. By raising A9 to 12 V ±0.5 V and using address locations 1FC0H to 1FFFH, the additional bytes may be written to or read from in the same manner as the regular memory array.50274L–PEEPR–2/3/09AT28HC64BNotes:1.X can be VIL or VIH.2.See “AC Write Waveforms” on page 8.3.VH = 12.0 V ±0.5 V.Note:1.I SB1 and I SB2 for the 55 ns part is 40 mA maximum.5.DC and AC Operating RangeAT28HC64B-70AT28HC64B-90AT28HC64B-120Operating Temperature (Case)-40°C - 85°C -40°C - 85°C -40°C - 85°C V CC Power Supply5 V ±10%5 V ±10%5 V ±10%6.Operating ModesMode CE OE WE I/O Read V IL V IL V IH D OUT Write (2)V IL V IH V IL D IN Standby/Write Inhibit V IH X (1)X High ZWrite Inhibit X X V IH Write Inhibit X V IL X Output Disable X V IH XHigh ZChip Erase V ILV H (3)V IL High Z7.Absolute Maximum Ratings*Temperature Under Bias................................-55°C to +125°C *NOTICE:Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent dam-age to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliabilityStorage Temperature.....................................-65°C to +150°C All Input Voltages(including NC Pins)with Respect to Ground.................................-0.6 V to +6.25 V All Output Voltageswith Respect to Ground...........................-0.6 V to V CC + 0.6 V Voltage on OE and A9with Respect to Ground..................................-0.6 V to +13.5V8.DC CharacteristicsSymbol Parameter ConditionMinMax Units I LI Input Load Current V IN = 0 V to V CC + 1 V 10µA I LO Output Leakage Current V I/O = 0 V to V CC10µA I SB1V CC Standby Current CMOS CE = V CC - 0.3 V to V CC + 1 V 100(1)µA I SB2V CC Standby Current TTL CE = 2.0 V to V CC + 1 V 2(1)mA I CC V CC Active Current f = 5 MHz; I OUT = 0 mA40mA V IL Input Low Voltage 0.8V V IH Input High Voltage 2.0V V OL Output Low Voltage I OL = 2.1 mA 0.40V V OH Output High VoltageI OH = -400 µA2.4V60274L–PEEPR–2/3/09AT28HC64B10.AC Read Waveforms (1)(2)(3)(4)Notes:1.CE may be delayed up to t ACC - t CE after the address transition without impact on t ACC .2.OE may be delayed up to t CE - t OE after the falling edge of CE without impact on t CE or by t ACC - t OE after an address changewithout impact on t ACC .3.t DF is specified from OE or CE whichever occurs first (C L = 5 pF).4.This parameter is characterized and is not 100% tested.9.AC Read CharacteristicsSymbol ParameterAT28HC64B-70AT28HC64B-90AT28HC64B-120Units MinMax MinMax MinMax t ACC Address to Output Delay 7090120ns t CE (1)CE to Output Delay 7090120ns t OE (2)OE to Output Delay 035040050ns t DF (3)(4)OE to Output Float 035040050ns t OHOutput Hold00ns70274L–PEEPR–2/3/09AT28HC64B11.Input Test Waveforms and Measurement Level12.Output Test LoadNote:1.This parameter is characterized and is not 100% tested.R F 13.Pin Capacitancef = 1 MHz, T = 25°C (1)Symbol Typ Max Units Conditions C IN 46pF V IN = 0 V C OUT 812pFV OUT = 0 V815.AC Write Waveforms15.1WE Controlled15.2CE Controlled14.AC Write CharacteristicsSymbol ParameterMin MaxUnits t AS , t OES Address, OE Setup Time 0ns t AH Address Hold Time 50ns t CS Chip Select Setup Time 0ns t CH Chip Select Hold Time 0ns t WP Write Pulse Width (WE or CE)100ns t DS Data Setup Time 50ns t DH , t OEHData, OE Hold Timens90274L–PEEPR–2/3/09AT28HC64B17.Page Mode Write Waveforms (1)(2)Notes: 1.A6 through A12 must specify the same page address during each high to low transition of WE (or CE).2.OE must be high only when WE and CE are both low.18.Chip Erase Waveformst S = t H = 5 µs (min.)t W = 10 ms (min.)V H = 12.0 V ±0.5 V16.Page Mode CharacteristicsSymbol Parameter MinMax Units t WC Write Cycle Time10ms t WC Write Cycle Time (Use AT28HC64BF))2ms t AS Address Setup Time 0ns t AH Address Hold Time 50ns t DS Data Setup Time 50ns t DH Data Hold Time 0ns t WP Write Pulse Width 100ns t BLC Byte Load Cycle Time 150µs t WPHWrite Pulse Width High50ns100274L–PEEPR–2/3/09AT28HC64B19.Software Data Protection EnableAlgorithm (1)Notes:1.Data Format: I/O7 - I/O0 (Hex);Address Format: A12 - A0 (Hex).2.Write Protect state will be activated at end of writeeven if no other data is loaded.3.Write Protect state will be deactivated at end of writeperiod even if no other data is loaded.4.1 to 64 bytes of data are loaded.20.Software Data Protection DisableAlgorithm (1)Notes:1.Data Format: I/O7 - I/O0 (Hex);Address Format: A12 - A0 (Hex).2.Write Protect state will be activated at end of writeeven if no other data is loaded.3.Write Protect state will be deactivated at end of writeperiod even if no other data is loaded.4. 1 to 64 bytes of data are loaded.21.Software Protected Write Cycle Waveforms (1)(2)Notes:1.A6 through A12 must specify the same page address during each high to low transition of WE (or CE) after the softwarecode has been entered.2.OE must be high only when WE and CE are both low.11AT28HC64BNote:1.These parameters are characterized and not 100% tested. See “AC Read Characteristics” on page 6.23.Data Polling WaveformsNotes:1.These parameters are characterized and not 100% tested.2.See “AC Read Characteristics” on page 6.25.Toggle Bit Waveforms (1)(2)(3)Notes: 1.Toggling either OE or CE or both OE and CE will operate toggle bit.2.Beginning and ending state of I/O6 will vary.3.Any address location may be used, but the address should not vary.22.Data Polling Characteristics (1)Symbol Parameter Min TypMaxUnits t DH Data Hold Time 0ns t OEH OE Hold Time 0ns t OE OE to Output Delay (1)ns t WR Write Recovery Timens24.Toggle Bit Characteristics (1)Symbol Parameter Min TypMaxUnits t DH Data Hold Time 10ns t OEH OE Hold Time 10ns t OE OE to Output Delay (2)ns t OEHP OE High Pulse 150ns t WR Write Recovery Timens12AT28HC64B26.Normalized I CCGraphs13AT28HC64B27.Ordering Information27.1Green Package Option (Pb/Halide-free)t ACC (ns)I CC (mA)Ordering Code Package Operation RangeActive Standby 70400.1AT28HC64B-70TU 28T Industrial (-40°C to 85°C)AT28HC64B-70JU 32J AT28HC64B-70SU 28S 90400.1AT28HC64B-90JU 32J AT28HC64B-90SU 28S AT28HC64B-90TU 28T 120400.1AT28HC64B-12JU 32J AT28HC64B-12SU28SPackage Type32J 32-lead, Plastic J-leaded Chip Carrier (PLCC)28S 28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)28T28-lead, Plastic Thin Small Outline Package (TSOP)27.2Die ProductsContact Atmel Sales for die sales options.28.Packaging Information 28.132J – PLCC14AT28HC64BAT28HC64B 28.228S – SOIC1528.328T – TSOP16AT28HC64BHeadquarters InternationalAtmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USATel: 1(408) 441-0311 Fax: 1(408) 487-2600Atmel AsiaUnit 1-5 & 16, 19/FBEA Tower, Millennium City 5418 Kwun Tong RoadKwun Tong, KowloonHong KongTel: (852) 2245-6100Fax: (852) 2722-1369Atmel EuropeLe Krebs8, Rue Jean-Pierre TimbaudBP 30978054 Saint-Quentin-en-Yvelines CedexFranceTel: (33) 1-30-60-70-00Fax: (33) 1-30-60-71-11Atmel Japan9F, Tonetsu Shinkawa Bldg.1-24-8 ShinkawaChuo-ku, Tokyo 104-0033JapanTel: (81) 3-3523-3551Fax: (81) 3-3523-7581Product ContactWeb SiteTechnical Support******************Sales Contact/contactsLiterature Requests/literatureDisclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI-TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDEN-TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.© 2009 Atmel Corporation. All rights reserved. Atmel®, logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.。

BECO MiniCap

BECO MiniCap

Technical Data Sheet Laboratory-Scale Depth FiltrationBECO MiniCap TM ACFDisposable Filter Unit with BECO CARBON TMActivated Carbon Depth Filter SheetsBECO MiniCap ACF disposable filter units withBECO CARBON activated carbon depth filtersheets are ready-to-use for the filtration of smallvolumes for laboratory applications, scale-uptrials, and sample preparation.The depth filter sheets of BECO MiniCap ACFdisposable filters have a high adsorptive capacitydue to the use of immobilized activated carbon andare used for decolorization as well as for theremoval of undesired by-products or for taste andodor correction.The specific advantages of the BECO MiniCap ACFrange:- The disposable filter unit is autoclavable and thereis no cleaning effort required.- Due to the dust-free handling, the application is simple and clean.- BECO MiniCap ACF disposable filter units with activated carbon types of different porosity meetthe requirements of a broad range of applications. -Filtration-active and adsorptive properties are ideally combined in the BECO MiniCapACF 07.10.-The adsorption performance in the BECO MiniCap ACF 02 and ACF 03 is maximized through acarbon content of up to 1000 g/m² and the lowendotoxin content ensures high product safety. AValidation Guide for the activated carbon depthfilter sheet of BECO MiniCap ACF 03 is availableon request.Application Examples-Decolorization and removal of organic impurities from active pharmaceutical ingredients (API)solutions:-Decolorization of antibiotic solutions-Protein and endotoxin removal-Purification of blood plasma products-Treatment of contrast media-Decolorization of natural extracts and cosmetics -Removal of unwanted by-products from food or dietary supplements, e.g., decolorization ofglucose, enzyme and vitamin solutions-Correction of taste and color of beverages (Spirits, fruit juices, hard seltzer etc.)-Decolorization and removal of organic impurities from chemicals, organic solvents and syntheticoils, e.g., removal of …off-flavor“ and unwanted by-products from silicone oils Selection Guide for BECO MiniCap ACF Disposable Filter Units with BECO CARBON Activated Carbon Depth Filter SheetsThe activated carbon of the BECO MiniCap ACF filter is a microporous, inert material with a very large inner surface of up to 2000 m²/g of activated carbon. The activated carbon used can be divided into different porosity ranges:Macroporous (∅ >50 nm)Decolorization of dark discolorations (brown to yellow) and for the separation of large molecules(e.g., protein separation).Mesoporous (∅ 2-50 nm)Decolorization of medium discoloration (yellow to yellowish) and impurities, as well as for correcting the taste of food.Microporous (∅ <2 nm)Decolorization of light discolorations (yellowish to whitish-gray), for odor correction and for the separationof smaller molecules (e.g., endotoxins).Physical DataThis information is intended as a guideline for the selection of BECO MiniCap disposable filter units. The water throughput is a laboratory value characterizing the different BECO CARBON activated carbon depth filter sheets. It is not the recommended flow rate.22ACF 07.10 19607 15 >11.6 (80) 34.7 (1415) - 420 ACF 02 19602 2.5 >11.6 (80) 6.75 (275) < 0.125 1000 ACF 03 19603 5 >11.6 (80) 7.4 (300) < 0.125 1000* 100 kPa = 1 bar** Endotoxin content analysis after rinsing with 1.23 gal/ft² (50 l/m²) of WFI (Water for Injection)Technical Data3.3 in² (21.2 cm²)2.9 in (74 mm)Polypropylene according to FDA CFR § 177.1520Hose connections 0.24–0.47 in (6–12 mm) in diameter44 psi (300 kPa/3 bar) at 77°F (25°C)0.44 fl oz (13 ml)4.40.17 fl oz (5 ml)0.08–0.14 gal/h (85–145 gfd)5–8 ml/min (150–250 l/m²/h)0.05–2.6 gal (0.2–10 l)Ordering InformationF071C300 BECO MiniCap ACF 07.10 kit*F002C300 BECO MiniCap ACF 02 kit*F003C300 BECO MiniCap ACF 03 kit** One package contains three individually packed BECO MiniCap disposable filter units. The carton label shows the following information: article description, article, and lot numbers.Compliance NoticeBECO CARBON activated carbon depth filter sheets meet the requirements of the Regulation (European Commission) 1935/2004 and the LFGB standard (German Food, Commodity and Feed Act) as well as the test criteria of FDA (U.S. Food and Drug Administration) Directive 21 CFR § 177.2260.The polypropylene components comply with regulation (EU) 10/2011 and meet the requirements of FDA,21 CFR § 177.1520.BECO CARBON ACF 03 and the polypropylene components of the BECO MiniCap ACF 03 disposable filter unit also meet the requirements of the USP Class VI tests.For further details on individual components and materials see the declaration of conformity.ComponentsBECO CARBON activated carbon depth filter sheets are made from particularly pure materials. Finely fibrillated cellulose fibers and cationic charge carriers are used. The materials for each filter type in particular are as follows:-BECO CARBON ACF 07.10(S):acid-washed, steam-activated carbon and high-quality diatomaceous earth-BECO CARBON ACF 02:chemically activated carbon-BECO CARBON ACF 03:acid-washed, steam-activated carbonInstruction for CorrectDepending on the filtered liquids, the operating temperature should not exceed 176°F (80°C). Please contact Eaton regarding filtration applications at higher temperatures.Sterilization (optional)The wetted BECO MiniCap ACF disposable filter units can be sterilized one time in an autoclave as follows: Preparation: Rinsing with minimum of 1.7 fl oz (50 ml)for optimum wettingTemperature: M ax.250 °F (121 °C)Duration: Approx. 30 minutesRinsing: After sterilizing with 3.4 fl oz (100 ml)/1.23 gal/ft² (50 l/m²) at 1.25 times theflow rate Filter Preparation and FiltrationUnless already completed after sterilization, Eaton recommends pre-rinsing the closed filter with 3.4 fl oz (100 ml)/1.23 gal/ft² (50 l/m²) of water or in exceptional cases with product appropriate solution at 1.25 times the flow rate prior to the first filtration. Depending on the application, this usually equals a rinsing time of 10 to 20 minutes.Only in exceptional cases which, for example do not allow rinsing with water, product or product appropriate solution should be circulated for 10 to 20 minutes and disposed after rinsing.Test the entire filter for leakage at maximum operating pressure.Filtration SpeedAdsorption processes are decisively affected by the contact time between the product and the adsorbing substance. The adsorption performance can thus be controlled by the speed of filtration. Slow filtration speeds 0.08 – 0.14 gal/h (85 – 145 gfd)/5 – 8 ml/min (150 – 250 l/m²/h) respectively extended periods of contact result in optimum utilization of the adsorption capacity.Inlet and Differential PressureTerminate the filtration process once the limit of adsorption capacity or the maximum permitted inlet or differential pressure of 43.5 psi (300 kPa, 3 bar) is reached. A higher inlet and differential pressure could damage the depth filter sheet material.SafetyWhen used and handled correctly, there are no known unfavorable effects associated with this product. Further safety information can be found in the relevant Material Safety Data Sheet, which can be downloaded from our website.Waste DisposalDue to their composition, BECO MiniCap ACF disposable filter units can be disposed of as harmless waste. Comply with relevant current regulations, depending on the filtered product.StorageBECO MiniCap ACF disposable filter units must be stored in a dry, odor-free, and well-ventilated place, ideally in their original packaging.Do not expose the BECO MiniCap ACF disposable filter units to direct sunlight.BECO MiniCap ACF disposable filter units are intended for immediate use and should be used within 36 months after production date.Quality Assurance According to DIN EN ISO 9001 The Quality Management System of Eaton Technologies GmbH has been certified according to DIN EN ISO 9001.This certification verifies that a fully functioning comprehensive Quality Assurance System covering product development, contract controls, choice of suppliers, receiving inspections, production, final inspection, inventory management, and shipment has been implemented.Extensive quality assurance measures incorporate adherence to technical function criteria and chemical purity and quality recognized as safe under the German legislation governing the production of foods and beverages.All information is given to the best of our knowledge. However, the validity of the information cannot be guaranteed for every application, working practice and operating condition. Misuse of the product will result in all warrantees being voided.Subject to change in the interest of technical progress.North America44 Apple StreetTinton Falls, NJ 07724Toll Free: 800 656-3344 (North America only)Tel: +1 732 212-4700Europe/Africa/Middle EastAuf der Heide 253947 Nettersheim, Germany Tel: +49 2486 809-0 Friedensstraße 4168804 Altlußheim, Germany Tel: +49 6205 2094-0An den Nahewiesen 2455450 Langenlonsheim, Germany Tel: +49 6704 204-0 Greater ChinaNo. 7, Lane 280,Linhong RoadChangning District, 200335Shanghai, P.R. ChinaTel: +86 21 2899-3687Asia-Pacific100G Pasir Panjang Road#07-08 Interlocal CentreSingapore 118523Tel: +65 6825-1620For more information, pleaseemail us at ********************or visit /filtration© 2023 Eaton. All rights reserved. All trademarks andregistered trademarks are the property of their respectiveowners. All information and recommendations appearing inthis brochure concerning the use of products describedherein are based on tests believed to be reliable. However,it is the user’s responsibility to determine the suitability forhis own use of such products. Since the actual use byothers is beyond our control, no guarantee, expressed orimplied, is made by Eaton as to the effects of such use orthe results to be obtained. Eaton assumes no liabilityarising out of the use by others of such products. Nor is theinformation herein to be construed as absolutely complete,since additional information may be necessary or desirablewhen particular or exceptional conditions or circumstancesexist or because of applicable laws or governmentregulations.EN1 A 4.2.8.503-2023。

英文航模专业术语

英文航模专业术语

航模专业术语1. 材料类:ACRYLIC——有机玻璃acrylic [[ə'krɪlɪk]]ACRYLIC:腈纶 | 亚克力 | 压克力BEECH——榉木 beech [[biːtʃ]]FILM——薄膜film [[fɪlm]]FUEL——燃油fuel [[fjʊəl]]PAINT——油漆paint [[peɪnt]]PLY——层板SPRUCE——云杉ADHESIVE——粘和剂BIR CH——桦木FIBER CARBON——碳纤维fiber [['faibə]] carbon [['kɑːb(ə)n]] GLUE——胶 glue [[gluː]]PAPER——纸RESIN——树脂STEEL——钢ALUMINUM——铝COPPER——铜FIBERGLASS——玻璃钢HARDENER——固化剂PINE——松木pine [[paɪn]]ROHCELL——发泡塑料WOOD——木材BALSA——巴尔沙轻木balsa [['bɔːlsə; 'bɒlsə]] EPOXY——环氧树脂FOAM——泡沫塑料NUT——螺母PLASTIC——塑料SCREW——螺丝2.型材类:BLOCK(BLK)——块SHEET(SHT)——板材1/4X1/4方型材HINGE——合页SKIN——蒙皮TRI-STOCK——三角加强材NUT——螺钉SQUIRE(SQ)——正方型材PIPE——管材ROD——杆WIRE——线材STRIP——条形板材3.结构类:AILERON——副翼COWL——(发动机)外罩ELEVATOR——升降舵FIN——垂直安定面FRAME. 1——N(F1-N)机身横隔框,注:通常F1用于发动机安装,又称为FIREWALL-防火板HATCH——舱盖LEAD EDGE(LE)——前缘NOSE WHEEL——前轮PUSHROD——操纵联杆SPAR——梁或衍条SUB…——辅助(梁等)TANE——邮箱TRIPLANE——三翼机BIPLANE(BIPS)——双翼机BOUBLER——(同型的)加强材料ENGINE MOUNT——(发动机)安装架FLAP——襟翼HIGH WING——上翼LOW WING——下翼PLATE——外部面板RIB——翼肋PINNER——(螺旋桨)罩TALL EDGE(TE)——后缘TIP——翼尖TOW HOOK——牵引钩CANOPY(COCKPIT)——飞行员座舱DOWEL——(镶入泡沫的)加强条FILLER——充填块FUSELAGE——机身JOINER——结合部加强块MAIN WHEEL——主轮PROPELLER——螺旋桨(FOLD—折叠式螺旋桨)RUDDER——方向舵STABILIZER——安定面TAIL WHEEL——尾轮WING——机翼TOW LINE——牵引绳CORE——芯材FOLD PREP——(可折叠)螺旋桨LANDING GEAR——起落架MONOPLANE——单翼机RETRACTS——可收放起落架STRUT——支柱TALL PLANE——尾翼WHEEL——机轮4.设备类:ANTENNA——天线HYDRO——液压(动作器)SPEED CONTROLLER——电子调速器BATTERY——电池MOTOR——电动机ELECTRONICS——电子设备RECEIVER——接受机SWITCH——电源开关GYRO——陀螺仪SERVO——舵机5.模型类:AEROBATICS——特技COMBAT——空战FREEFLITE(FF)——自由飞HELICOPTER——直升飞机PARTERN——花样RUBBER——橡皮筋SPORT——体育运动机ATTACK——攻击CONTROLINE(CL)——线控FIGHTER——空战机INDOOR——室内机PYLON——绕标SCALE——比例仿真TANKER——加油机BOMB——轰炸DURATION——留空GIANT——大(巨)型机JET——喷气机R/C——无线电遥控SOARING——翱翔TRAINER——练习机CARRIER——舰载ELECTRICS——电动GLIDER——滑翔机MULTY——多发动机RACING——竞速SLOPES——山坡翱6.发动机类2STROCK(2-S)——二冲程BEARING——轴承CRANK——曲轴MOTOR——电动机PLUG——火花(电热)塞THROTTLE——风门4STROCK(4-S)——四冲程CARBURETOR——化油器CYLINDER——气缸MUFFLER——消声器ROD——连杆TUNED PIPE——谐震管BRUSHLESS DC MOTOR——直流无刷电动机CO2 ENGINE——二氧化碳发动机ENGINE——发动机IDIE——怠速MULTY CYLINDER——多起缸发动机RPM——转数/分STARTER——发动器TURBOJET——涡轮喷气发动机7.工具类:CUTTER——剪线钳KNIFE——刀SAW——锯DRILDRILL——钻PAINT BRUSH——油漆刷SCREW DRIVER——螺丝刀FOIL——錣RULER——尺HARMER——锤SAND PAPER——砂纸8.空气动力类:AERODYNAMIC CENTER(A.C)CENTER OF GRAVITY(C.G)CLIMB——爬升HIGHT(H)——全高MOMENT——力矩moment [['məʊm(ə)nt]] STREAMWING AREA(S)——翼面积DIAMETER(D)——直径LANDING——着陆AIREOIL——翼型TAIL MOMENT ARM——尾力臂WING SPAN(B)——已占ATTACK ANGLE——攻角CENTRIFUGALIC——离心力DRAG——阻力LENGTH(L)——全长length [[leŋθ; leŋkθ]] SPIN——螺旋spin [[spɪn]]WING LOAD——翼载荷BALANCE——平衡CHORD——翼弦GILDING——滑翔LIFT——升力STALL——失速TURN——转弯。

PFU PaperStream IP与PaperStream Capture软件综述说明书

PFU PaperStream IP与PaperStream Capture软件综述说明书

Advanced software for maximized efficiencyBypass the inconvenience of making fine adjustments to OCR settings with the Paper-Stream IP scanner driver, supporting bothTWAIN and ISIS. The software automatically converts scanned images into exceptionally clean images, supporting OCR accuracy even when scanning documents with background patterns or wrinkled and soiled documents. Seamlessly linked to PaperStream IP, Paper-Stream Capture offers various batch scanningcapture features to effectively and efficiently feed information into your organization workflow. Automatically utilizing data extract-ed from barcodes (2D included) and patch codes, the software also determines your preferred saving destinations and eliminatestime allocated to routine tasks.*Based on PFU’s investigation performed as of August 31st, 2013 for A4 ADF type document scanners between US$1,500 - $3,999.Boosted usability with a user-friendly and versatile design Equipped with a built-in flatbed, this scanner can scan fragile documents and thick books, impossible to scan with ADF. Start scanning with a single push of a button. Keep track of scanner operations such as document scanning settings, number of sheets scanned, as well as any existing error statuses, using the LCD operation panels. Daily maintenance tasks, including interior cleaning and roller replacement, can also be done with ease for long-lasting utilization.High quality images in any conditionEnjoy sharp, high quality images with the fi-7280’s CCD image sensors. Subtle changes in scanning environment, such as in air temperature and LED illumination, are also no longer a need for concern with the scannerautomatically changing background colors to maintain consistently crisp images.The fi-7280 scans A4 portraits at 80 ppm/160 ipm (200/300 dpi), loads up to 80 sheets at a time, and ensures utmost efficiency with best-of-class* scanning performance.Assistance for safe and reliable scanning The fi-7280 possesses diverse stable paper feeding mechanisms, ensuring speedy and high quality scanning without relying on PC performance. Minimize risk of document damage with Paper Protection function detecting anomalies in sound and monitoring paper feed distance. And bid farewell to missing edges with the scanner’s SkewReducer mechanism. Potential information loss, resulting from multiple sheets being fed through the scanner at once, is also no longeran issue with Ultrasonic Multi-feed detection. Combo A4 flatbed / ADF scanner offers best performance out of its classDatasheetFUJITSU Image Scanner fi-7280ContactTrademarksABBYY™ FineReader™ Engine © ABBYY. OCR by ABBYY. ABBYY and FineReader are trademarks of ABBYY Software, Ltd. which may be registered in some jurisdictions. ISIS is a trademark of Open Text. Microsoft, Windows, and Windows Server are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. Linux is the registered trademark of Linus Torvalds in the U.S. and other countries. Any other products or company names appearing in this document are the trademarks or registered trademarks of the respective companies.Safety PrecautionsBe sure to carefully read all safety precautions prior to using this product and use this device as instructed. Do not place this device in wet, moist, steamy, dusty or oily areas. Using this product under such conditions may result in electrical shock, fire or damage to this product. Be sure to limit the use of this product to listed power ratings.ENERGY STAR®PFU Limited, a Fujitsu company, has determined that this product meets the ENERGY STAR® guidelines for energy efficiency. ENERGY STAR® is a registered trademark of the United States.Specifications are subject to change without notice. Visit your local Fujitsu website for more information.*1 Actual scanning speeds are affected by data transmission and software processing times. *2 Indicated speeds are from using JPEG compression. *3 Indicated speeds are from using TIFF CCITT Group 4 compression.*4 Selectable maximum density may vary depending on the length of the scanned document. *5 Limitations may apply to the size of documents that can be scanned, depending on system environment, when scanning at high resolution (over 600 dpi). *6 Scans folded documents of up to 297 x 432 mm (11.7 x 17 in.) with carrier sheet scanning. *7 Scanning area limitations only apply when using the ADF. There are no limitations when using the flatbed. *8 Capable of scanning documents longer than A4 (210 x 297 mm / 8.3 x 11.7 in.) sizes. When using PaperStream IP (TWAIN/ISIS) to scan at 200 dpi, the maximum scanning length is 5,588 mm (220 in.). *9 Paper weight limitations only apply when using the ADF. There are no limitations when using the flatbed. *10 Thicknesses of up to 127 to 209 g/m² (34 to 56 lb) can be scanned for A8 (52 x 74 mm / 2.1 x 2.9 in.) sizes. *11 Capable of scanning up to 1.25 mm (0.049 in.) when scanning in landscape orientation at 300 dpi (80 ppm). *12 Capable of scanning up to 3 cards at a time (Note: does not set more than one embossed card at a time). *13 Maximum capacity depends on paper weight and may vary. *14 Capable of setting additional documents while scanning. *15 Numbers are calculated using scanning speeds and typical hours of scanner use, and are not meant to guarantee daily volume or unit durability. *16 Intelligent Sonic Paper Protection. *17 Connection with USB 3.0 / 2.0 requires the USB port and hub to support USB 3.0 / 2.0. Also note that scanning speed slows down when using USB 1.1. *18 Excludes the ADF paper chute and stacker. *19 Requires PaperStream IP 1.60.0 or earlier and PaperStream Capture 2.8.2 or earlier. *20 Functions equivalent to those offered by PaperStream IP may not be available with the Image Scanner Driver for Linux or WIA Driver. *21 Refer to the fi Series Support Site for driver/software downloads and full lineup of all supported operating system versions.Brake Roller PA03670-0001 Every 200,000 sheets or one year Pick RollerPA03670-0002Every 200,000 sheets or one yearConsumablesPA43404-A675 PaperStream Capture Pro optional licensePaperStream Capture ProScan Station (DP)PA03360-0013 Each package contains 5 carrier sheetsCarrier SheetsPA03670-D801 Black flatbed background pad Black Document Pad (FI-728BK) OptionsADF paper chute, AC cable, AC adapter, USB cable, Setup DVD-ROMIncluded ItemsMulti image output, Automatic color detection, Blank page detection, Dynamic threshold (iDTC), Advanced DTC, SDTC,Error diffusion, Dither, De-Screen, Emphasis, Dropout color (None/Red/Green/Blue/White/Saturation/Custom), sRGBoutput, Hole punch removal, Index tab cropping, Split image,De-Skew, Edge filler, Vertical streaks reduction, Cropping,Static threshold, Moire removalImage Processing FunctionsPaperStream IP Driver (TWAIN/TWAIN x64/ISIS), WIA Driver *²⁰, Image Scanner Driver for Linux (SANE)*²⁰*²¹, PaperStream Capture, PaperStream ClickScan *²¹, Software Operation Panel, Error Recovery Guide, ABBYY FineReader for ScanSnap™*²¹, Scanner Central Admin, 2D Barcode for PaperStream *²¹Included Software / DriversWindows® 10, Windows® 8.1, Windows® 7, Windows Server® 2019, Windows Server® 2016, Windows Server® 2012 R2, Windows Server® 2012, Windows Server® 2008 R2, Windows Server® 2008*¹⁹, Linux (Ubuntu)Supported Operating System8.8 kg (19.4 lb)Weight300 x 577 x 234 mm (11.8 x 22.7 x 9.2 in.)Dimensions *¹⁸(Width x Depth x Height)ENERGY STAR®, RoHSEnvironmental Compliance 20 to 80% (non-condensing)Relative Humidity 5 to 35 °C (41 to 95 °F)Temperature Operating Environment 0.35 W or lessAuto Standby (Off) Mode1.8 W or less Sleep Mode43 W or less Operating Mode Power Consumption AC 100 to 240 V ±10 %Power Requirements USB 3.0 / USB 2.0 / USB 1.1Interface *¹⁷Lag detection, Sound detection (iSOP)*¹⁶Paper Protection Overlap detection (Ultrasonic sensor), Length detectionMultifeed Detection 11,000 sheetsExpected Daily Volume *¹⁵80 sheets (A4 80 g/m² or Letter 20 lb)ADF Capacity *¹³*¹⁴27 to 413 g/m² (7.2 to 110 lb)*¹⁰Plastic Card 1.4 mm (0.055 in.) or less (ADF)*¹¹*¹²Paper Paper Weight (Thickness)*⁹216 x 297 mm (8.5 x 11.7 in.)MaximumFlatbed5,588 mm (220 in.)Long Page Scanning *⁸50.8 x 54 mm (2 x 2.1 in.)Minimum *⁷216 x 355.6 mm (8.5 x 14 in.)Maximum *⁶ADFDocument Size ADF: White / Black (selectable)Flatbed: White (or optional black)Background Colors Color: 24-bit, Grayscale: 8-bit, Monochrome: 1-bit Output Format 50 to 600 dpi (adjustable by 1 dpi increments),1,200 dpi (driver)*⁵Output Resolution *⁴(Color / Grayscale / Monochrome)600 dpiOptical ResolutionWhite LED Array x 3(front x 1, back x 1, Flatbed x 1)Light Source Color CCD x 3 (front x 1, back x 1, Flatbed x 1)Image Sensor Type ADF Simplex: 80 ppm (200/300 dpi)Duplex: 160 ipm (200/300 dpi)Flatbed 1.7 seconds (200 dpi) Scanning Speed *¹ (A4 Portrait)(Color *²/Grayscale *²/Monochrome *³)ADF (Automatic Document Feeder) / Flatbed, DuplexScanner TypeTechnical InformationIndonesiaPT Fujitsu Indonesia Tel: +62 21 570 9330 *********************.com/id/scannersMalaysiaFujitsu (Malaysia) Sdn Bhd Tel: +603 8230 4188askfujitsu .my@/my/scannersPhilippinesFujitsu Philippines, Inc. Tel: +63 2 841 8488 ***************.com/ph/scannersSingaporeFujitsu Asia Pte Ltd Tel: +65 6512 7555 *******************/sg/scannersThailandFujitsu (Thailand) Co., Ltd. Tel: +66 2 302 1500 *******************/th/en/scannersVietnamFujitsu Vietnam Limited Tel: + 84 4 2220 3113 ****************.com/vn/en/scanners。

小贝壳冷钱包存储器产品中英文简介

小贝壳冷钱包存储器产品中英文简介

随着全球区块链资产种类和价值的不断上涨,其被盗的恶性事件也愈发频繁,保护区块链数字资产是全球共同面临的课题。

目前市场上多见的热钱包,虽然操作便捷、有效降低了资产被黑客窃取的风险,但由于其基于网络平台的天然属性,仍有面临存储介质风险、木马植入、病毒攻击、运行环境漏洞、底层系统风险等问题。

对于大额数字资产,有必要寻求更加安全的资产存储和管理的解决方案。

而香港小贝壳数字资产管理有限公司出品的小贝壳数字资产存储器,则是一款完全隔绝网络、让资产被盗风险无所遁形的数字资产管理“神器”。

With the growing number of cryptocurrencies and their rising token values, digital assets security is becoming a prominent problem around the world. Hot wallet, which is easy to use and effectively lowers the risk of theft, is vulnerable to storage medium risks, Trojan, virus attacks, operating system bugs, and underlying system risks. A more secure solution is therefore needed to deposit and manage large amounts of money. Little Shell Digital Asset Management tool, designed by Hong Kong Little Shell Digital Asset Management Corp. Ltd, is a perfect solution that is completely offline and anti-theft.公司简介香港小贝壳数字资产管理有限公司,是专业的区块链数字资产安全存储解决方案提供商。

【参考文档】保证产品全部自己检验英文申明-推荐word版 (15页)

【参考文档】保证产品全部自己检验英文申明-推荐word版 (15页)

本文部分内容来自网络整理,本司不为其真实性负责,如有异议或侵权请及时联系,本司将立即删除!== 本文为word格式,下载后可方便编辑和修改! ==保证产品全部自己检验英文申明篇一:产品检验保证书辰昊铝塑复合节能窗产品质量保证书为保证铝合金门窗工程的生产质量、安装质量达到部级优良标准,公司要求施工人员必须严格按照设计图纸和有关文件,以及国家颁发的施工验收规范评定标准进行施工。

1、公司建立以iso9001国际标准质量体系为核心的全面质量管理体系,该体系主要包括:管理规定、信息反馈、组织机构、规章制度、质量检验评定、标准工作体系、质量教育、培训体制、质量策划、质量体系审核、质量改进等质量管理活动。

2公司的质量方针为“坚持标准、业主满意、信守合同、争创一流”。

质量保证体系的目标是:用户至上,在满足用户要求的同时,全方位的为用户提供优质的服务。

施工中尽可能地采用新技术、新材料、新方法,力争与国际接轨,工程一次验收优良率达到100%。

3进行全员、全过程的质量教育和培训,贯彻“百年大计质量第一”的思想,使全国职工树立进度服从质量,严格行使质量否决权,奖优罚劣的观念,树立预防为主、检防结合、避免通病消除隐患的观念。

树立质量是生命、是企业自上而下发展基础的观念。

4建立一整套质量保证组织体系,公司设有以总经理挂帅的质量保证领导小组、制定各级领导各部门和重点岗位的质量责任制。

建立以公司质量保证领导小组为领导,各职能部门密切配合的综合质量管理机构,在工程施工中实施检查、监督、指导职能,从机构组织上对工程质量给予充分保证。

公司质量部门具体负责质量信息的收集、整理分析、反馈,以及行使质量否决权,实行工序程序控制。

5针对工程具体情况,公司制定三级质量保证体系管理机构,具体由公司质量保证领导小组对各工程项目实行质量监控;由项目经理、工长、质量检查员、工程技术员组成的工程项目质量保证小组直接管理和评定;由班、组长执行质量规章制度,严格执行质量“三检制”。

机器视觉农作物品质检测英语

机器视觉农作物品质检测英语

机器视觉农作物品质检测英语Machine vision for crop quality inspection is acutting-edge technology that utilizes advanced imaging systems and artificial intelligence algorithms to assess the quality of agricultural products. This technology involves the use of cameras and sensors to capture high-resolution images of crops, which are then analyzed to detect defects, assess ripeness, and determine overall quality.One of the key advantages of using machine vision for crop quality inspection is its ability to provide fast and accurate assessments of large quantities of produce. By automating the inspection process, this technology can help farmers and food producers improve efficiency and reduce the risk of human error in quality control.In addition, machine vision systems can be trained to recognize a wide range of quality parameters, such as size, shape, color, texture, and blemishes, allowing forcomprehensive quality assessment. This can be particularly valuable in the context of export markets, where strict quality standards must be met.Furthermore, the data collected through machine vision systems can be used to track and analyze trends in crop quality over time, enabling farmers to make informed decisions about planting, harvesting, and post-harvest handling practices. This can ultimately lead to improvements in overall crop yield and quality.Overall, machine vision for crop quality inspection represents a powerful tool for enhancing the efficiency, accuracy, and consistency of agricultural product assessment, ultimately benefiting both producers and consumers. As the technology continues to advance, it holds great promise for revolutionizing the way we evaluate and manage crop quality in the agricultural industry.。

The Role Of Vanadium In Microalloyed Steels

The Role Of Vanadium In Microalloyed Steels

THE ROLE OF VANADIUM IN MICROALLOYED STEELS Rune Lagneborg, Tadeusz Siwecki, Stanislaw Zajac and Bevis HutchinsonSwedish Institute for Metals ResearchS-11428 Stockholm, SwedenABSTRACTThe overall objective of the present paper is to review the role of V in microalloyed steels with a particular address as to how it affects microstrucural evolution and mechanical properties. Its role in thermomechanical controlled processing (TMCP) is emphasised. The review is largely based on work carried out at the Swedish Institute for Metals Research (SIMR) during the last 25 years but includes also reference to other relevant, published work.A specific aim is to demonstrate the present scientific knowledge of the subject. Therefore the understanding and interpretation of essential phenomena related to microstructure formation and properties are thoroughly examined, ranging from the influence of microalloying on prevention of austenite grain growth and recrystallization, to precipitation in ferrite and its effect on strength. Within the well-known thermodynamic database Thermocalc a special microalloy database has been developed at SIMR, allowing reliable predictions of phase equilibria and thermodynamic functions for phase transformations in microalloyed steels. A comprehensive account is given of the role of V in the most important processing steps that the microalloyed steels are subjected to, viz. TMCP, continuous casting and welding. Compared to the other microalloying elements, Nb and Ti, V exhibits essential differences. In particular the solubility of its carbonitrides is much larger and the solubility of its nitride is about two orders of magnitude smaller than its carbide, contrary to Nb but similar to Ti. For optimal alloy design and thermomechanical processing proper allowance must be made for these differences. To reach the maximum ferrite grain refinement, ~4 µm, repeated recrystallization in a series of rolling reductions is used in TMCP of V-microalloyed steels, so called Recrystallization-Controlled-Rolling (RCR), as opposed to traditional controlled rolling of Nb-steels where heavy rolling at low temperatures in the non-recrystallization regime is the means of attaining grain refinement. RCR presents some important advantages, in particular a more economical hot rolling practice by allowing low reheating and high finishing temperatures.As compared to Nb, V has certain further advantages as a microalloying element due to its greater solubility in autstenite. The tendency for hot cracking of cast slabs is much less pronounced and dissolution of coarse V(C,N) compounds is more easily achieved prior to hot rolling than for the corresponding NbC.It is demonstrated that the relatively large solubility of V(C,N) and the much lower solubility of VN than VC makes V an eminent choice for strong and easily controllable precipitation strengthening. A corollary of the difference in VN and VC solubilities is that N becomes an essential microalloying element in V-steels, because it largely determines the density ofV(C,N) precipitation and thereby the degree of precipitation strengthening. Moreover, since pure ferrite dissolves more N than C the total N-content of the steel is normally dissolved in the ferrite before V(C,N) precipitation whereas only a fraction of the C-content, given by the austenite/ferrite or ferrite/cementite equilibrium, is dissolved in ferrite. Hence, by precise additions of N this circumstance facilitates the control of V(C,N) precipitation strengthening. Recent studies at SIMR have shown that the precipitation strengthening increases significantly with total C-content of the steel, an effect previously not recognised. Increasing C-content delays the pearlite formation and thereby maintains for a longer time the higher content of solute C in ferrite corresponding to the austenite/ferrite equilibrium as compared to that of ferrite/cementite, allowing new nucleation C-rich V(C,N) to occur when most N has been consumed.High N-contents, >0,010%, in V-microalloyed steels are often considered to cause unsatisfactory HAZ weldability due to solute N which has been claimed to impair toughness. Recent studies show, however, that such sweeping statements are incorrect and that fully satisfactory welding results can be achieved also at high N-contents by selective choice of welding parameters. Furthermore, it has been shown that when a lowering of the impact toughness is observed at high N-levels and high heat input it cannot be explained by solute N but rather by changes in the HAZ microstructure.TABLE OF CONTENTS1.PROLOGUE (1)1.1 The discovery of vanadium and the evolution of its use (1)1.2 Statistics of the use of vanadium (2)1.3 The development of V-microalloying for structural steels (2)1.4 Scope of the present review (3)2.ALLOY SYSTEM AND THERMODYNAMIC BASES (4)2.1Thermodynamic considerations (5)2.2Thermodynamic description of the Fe-V-C-N system (7)2.3The Fe-Ti-C-N system (8)2.4The Fe-Nb-C-N system (10)2.5The Fe-Al-B-C-N system (11)2.6Chemical composition of precipitated particles in multi-microalloyed steels (12)2.7Thermodynamic Driving Force for Precipitation (13)2.8Practical consequences of different solubilities of V carbides and nitrides (14)2.9 Summary of chapter (14)3.MICROALLOYING EFFECTS IN AUSTENITE (15)3.1 Precipitation and dissolution of microalloy-carbonitrides in austenite (15)3.2 Grain growth inhibition and grain coarsening (19)3.3Effects on recrystallization (23)3.4 Effects on the austenite-ferrite transformation (24)3.5Summary of chapter (25)4.PRECIPITATION IN FERRITE (26)4.1 Interphase precipitation (27)4.2 The mechanism of interphase precipitation (29)4.3 General precipitation (32)4.4 Effects of precipitation on strength (34)4.5Summary of chapter (38)5.PRINCIPLES AND PRACTICE OF THERMO-MECHANICAL CONTROLLEDPROCESSING, TMCP (40)5.1General principles of recrystallization-controlled rolling, RCR, and controlledrolling, CR, processing (40)5.2 Mechanical properties and microstructure of TMCP material (41)5.3Effect of nitrogen content (44)5.4Application of TMCP practice (46)5.5Microstructure development during TMCP rolling (52)5.6Summary of chapter (54)6.CAST STRUCTURES (55)6.1Microstructural features (55)6.2Ductility during casting (57)7.WELDABILITY (61)7.1Structure and properties of coarsed grained HAZ (61)7.2Effect of nitrogen and welding parameters on HAZ toughness of V-steels (62)7.3Toughness-Microstructure Relationships (65)7.4Summary of chapter (67)8.HOW IS V BEST USED IN MICROALLOYED STEELS - EXECUTIVESUMMARY (68)8.1Austenite conditioning by thermomechanical processing (68)8.2Precipitation strengthening (70)8.3Cast structures (71)8.4HAZ weldability (71)8.5Interplay between general trends in steel technology and the technology of V-microalloyed steels (72)ACKNOWLEDGEMENTS (73)REFERENCES (74)1.PROLOGUE1.1 The discovery of vanadium and the evolution of its useVanadium was discovered by the Swedish scientist and doctor Nils Gabriel Sefström in 1830. In his studies of ductile iron originating from iron ore of the Taberg mine he obtained a residue which he concluded contained a compound with a previously unknown element, vanadium. At this point, Sefström’s master, the famous Swedish chemist Jöns Jacob Berzelius, took up interest in the new element. He announced Sefström’s discovery internationally and also initiated a large research programme on vanadium salts. Sefström’s and Berzelius’ work was, however, confined to chemical studies of a large number of vanadium compounds. It was only some 30 years later that vanadium was isolated as a metal due to work by the English chemist, Sir Henry Roscoe.The early use of vanadium was as a chemical compound and was based on the investigations by Sefström, Berzelius and Roscoe. Examples of early applications of vanadium compound are: black colouring of ink and fixing aniline black dyes for fabrics. The function of vanadium salts as catalyst for many chemical reactions was discovered 1900 in Germany and has become the most important application of vanadium as a chemical.At the turn of the century the technology of process metallurgy had developed such that commercial quantities of ferroalloys could be produced. In order to exploit the opportunities for V as an alloying element in steel the first production unit was set up in South Wales, Great Britain, and a special assignment was given to Professor Arnold of Sheffield College to investigate effects of V alloying in various steels.Arnold’s research together with studies in steel works in the Sheffield neighbourhood laid the foundation for a whole range of tool and die steels, from high speed steels to both cold work and hot work die steels. Hence, in these applications the hardness of V carbide and its stability at high temperatures played an essential part. The importance of V-alloying in tool steels has not diminished with time. The development of new processing technologies, especially powder metallurgy, has made it possible to increase the hard phase content in high speed and cold work steels considerably. Hence, in recent years this has rather increased the use of V in tool steels.The usefulness of V in engineering steels was early recognised. Work in the first years of the century both in England and France showed that carbon steels exhibit a considerable increase in strength by V-alloying, particularly when quenched and tempered. In the U.S. the use of V for alloying of automotive steels had, as it appears, an accidental beginning. Henry Ford I watched a motor race in which a French car crashed. He examined the wreck and found a crankshaft made from Swedish iron that suffered less damage than expected. After examination in his laboratories it was reported that the steel contained V. As a result Ford gave instructions to use V-steels in critical components in Ford cars ‘in order to better resist shock and fatigue on American roads’. At that time, ~ 1910, an understanding of the beneficial effect of V was missing. With today’s knowledge we can confidently say that the observed strengthening was due to fine precipitation of V-carbonitrides during cooling or tempering. The improved impact resistance was due to a refined grain structure resulting from grain growth inhibition by V-nitrides at the quenching or normalizing temperature.Other important applications of V-alloying, primarily developed, during the first two thirds of this century, are high temperature power plant steels, rail steels and cast iron.The most exciting and today the largest use of V is in high strength low alloy (HSLA) structural steels; another name for the same group of steels and more related to their alloying is ‘microalloyed steels’. The development of these materials started in the 50’s and a brief historical account of this is given below.Beside its application in alloying of steel and cast iron V is an essential alloying addition in Ti-alloys for aircraft and aerospace applications. Although V-base alloys have been used in nuclear breeder reactors because of their nuclear, physical and high temperature mechanical and corrosive properties and are considered as a candidate in future fusion reactors, they have at present no important application as structural materials.1.2 Statistics of the use of vanadiumThe world consumption of vanadium is today (1999) some 34000 tonnes per annum, of which 28000 tonnes in the Western world.The predominant application of vanadium is for alloying of steel and cast iron. It amounts to about 85 % of the total consumption, a share that appears rather stable over time. The remaining part goes to chemicals and to alloying of titanium. World-wide about 65% of the vanadium for alloying of steel is used in microalloyed structural steels, whereas the remaining 35% is used in V-alloyed steels, such as high speed and tools steels, high temperature low alloy steels, etc.From this follows that the consumption of vanadium and the production of steel are strongly interrelated. The rather constant level of steel production over the last 20 years has consequently resulted in a similar constant consumption of vanadium, at a level of 0,04 kg per tonne steel produced. However, since 1992 this level has increased to about 0,05 kg now, most probably reflecting an increased use of V-microalloyed structural steels.1.3 The development of V-microalloying for structural steelsThe development of the microalloyed structural steels and the related development of controlled rolling started in the late 1950’s. With the broad introduction of welded structures after the Second World War strengthening of steel by increasing the carbon content became practically prohibitive in view of carbon’s detrimental effect on toughness of welded structures and on weldability. Therefore the new knowledge that grain refinement can improve both these properties and at the same time enhance strength was a strong stimulus for developing new hot rolling practices and new steels. With time it was also recognised that strengthening by microalloy precipitation could be substituted for strengthening by carbon while weldability is improved.In the past normalizing heat treatment was an absolute requirement for steel plate and most structural sections used in structures for heavy-duty service. In the 60’s and 70’s V-microalloyed steels with 0.15-0.20% and 0.10-0.15% V and somewhat enhanced N-content 0.010-0.015% found wide use for this type of applications, e.g. thick walled gas pipe lines.In the early 60’s Bethlehem Steel developed and marketed a series of V-N steels with max. content of C and Mn of 0.22% and 1.25%, respectively, with yield strengths ranging from 320 to 460 MPa and to be used in the as-rolled condition. The steels were offered in practically all product forms, plate, strip and structural sections.An early advanced V strip steel was VAN80, developed at Jones & Laughlin around 1975 with a typical yield strength of 560 MPa. This was one of the first steels where in-line accelerated cooling was applied in a controlled manner to enhance grain refinement and strengthening by microalloy precipitation.Around 1965 the development of controlled rolling had reached a level such that it was introduced in commercial production. By microalloying with Nb it was possible to prevent recrystallization during hot rolling, thereby flattening the austenite grains gradually more with reduction and in this way the austenite was conditioned to transform to very fine-grained ferrite. In order to increase strength it was soon found advantageous to also microalloy with V. This type of controlled rolled Nb-V steels, with about 0.10%C, 0.03%Nb and 0.07%V, has been widely adopted for pipelines.A controlled rolling route later developed, ~ 1980, was recrystallization-controlled-rolling. By allowing the worked austenite to recrystallize after each rolling reduction it was found possible to reach a similar grain refinement as with the former method. This process results in higher finishing temperatures; it therefore requires lower rolling forces and can accordingly be practised in weaker rolling mills as well as offering superior productivity. It was found that Ti-V microalloyed steels are especially suited for this process since both these elements only retard recrystallization weakly and therefore allow repeated recrystallization during rolling. 1.4 Scope of the present reviewThe aim of the present paper is to review the role of V in microalloyed structural steels and our understanding of how it affects microstructure evolution and mechanical properties. Its role related to thermo-mechanical processing is especially addressed.The paper covers V-microalloyed structural steels with ferrite-pearlite microstructures having low to medium carbon contents. Hence, the many important uses of V-alloying in other steels, e.g. tool and high speed steels, low-alloy creep resistant steels etc., are omitted.The review is mainly based on work carried out at the Swedish Institute for Metals Research during the last 25 years but includes also reference to other relevant, published work. It should be emphasised, though, that the intention is not to attempt to critically review all the available literature in the area.A specific aim is to show the present scientific understanding of the subject. Therefore we have devoted the first 3 chapters following the introduction to our view as to how essential phenomena and properties of V-microalloyed steels should be understood and interpreted, ranging from thermodynamic predictions of relevant phase equilibria in V-steels, to microalloying effects in austenite and precipitation in ferrite and its effect on strength. The last 3 chapters are devoted to a comprehensive account for the role of V related to the most important processing steps that microalloyed structural steels are subjected to, viz. thermomechanical processing, continuous casting and welding.2.ALLOY SYSTEM AND THERMODYNAMIC BASESThe strengthening effect of microalloying additions may be produced by the dispersion strengthening effect of fine carbo-nitride particles or by grain refinement, i.e. inhibition of grain growth by carbo-nitride particles, or by a combination of these two effects. In order to maintain a fine austenite grain size prior to transformation, particles that remain undissolved in the austenite, or particles that will precipitate during hot rolling are required. To produce the very fine particles that are responsible for dispersion strengthening (i.e. particles that are 2-5 nm in diameter), it is necessary that these should be freshly precipitated during or after transformation to ferrite.To achieve the desired metallurgical states, a detailed knowledge of the solubilities of the microalloy carbides and nitrides is required, together with a knowledge of their precipitation behaviour. An understanding of the role of different microalloying elements can be gained from the solubility product data summarised in Fig. 2.1 from recent thermodynamical evaluation. Despite a simplification the individual solubilities of the microalloyed carbides and nitrides offer clear directions for the selection of microalloying additions for specific purposes. It is seen that TiN is extremely stable and can withstand dissolution at high temperatures during reheating prior to rolling or during welding. Niobium nitride and carbide have relatively low solubilities and may precipitate out in the later stages of rolling. Vanadium on the other hand, has a rather high solubility in austenite even at temperatures as low as 1050°C. It is also seen that the nitrides are substantially less soluble than the corresponding carbides. This is especially true for titanium and vanadium where the differences are particularly pronounced.Fig. 2.1 Solubilities of microalloy carbides and nitrides.In normal circumstances the solubility relationships shown in Fig. 2.1 represent a simplification, as steel may contain more alloying elements with high affinity for carbon and nitrogen which alter the solubility of the microalloyed carbides and nitrides.2.1Thermodynamic considerations2.1.1Approximate expression for the solubility productAs was stated above the solubility of carbides and nitrides in austenite and ferrite is usually expressed as a solubility product in terms of wt pct of microalloy element and carbon and/or nitrogen. The temperature dependence of the solubility product is expressed by the Arrhenius relationship in the form,log k s= log [M][X]= A-B/T, 2.1where k s is the equilibrium constant, [M] is the dissolved microalloy (wt%), [X] is the content (wt%) of nitrogen or carbon, A and B are constants and T is absolute temperature.Several authors have made efforts to establish the solubility of carbides, nitrides and carbo-nitrides in austenite (see compilation in 2.1). All of these investigations expressed their results in a form of solubility products. However, the results proposed by various authors as the "best-line" relationships sometimes differ considerably. An analysis of published data concerning the solubility of VC, VN, NbC, NbN, TiN and AlN, Fig. 2.2, has shown that there exist more than ten different solubility equations for each carbide/nitride, and the spread between them is significant, in most cases greater than 150°C. It should be pointed out that the situation is even more complicated when more than one microalloy element is present and when the ratio of carbon to nitrogen is changed. The influence of carbon and nitrogen on carbo-nitride formation has been handled in different ways by different authors, (2.2). For example, for Nb-microalloyed steels the nitrogen was often considered to modify the effective carbon concentration as [C+12/14N] (e.g. 2.3).The analysis of the solubility data in terms of solubility products implicitly assumes that the activity coefficients of microalloying elements as well as carbon and nitrogen are equal to unity and the microadditons are treated as a dilute solute and any interactions between solutes in the system are neglected. Therefore the individual solubility equations apply only to a particular composition investigated and are not capable of predicting the solubility at different compositions, where the effects of solute interactions become significant. The carbides and nitrides are also non-stoichiometric and, hence, their composition can vary when precipitated in steels.The similarity of crystal structure of carbides and nitrides enables them to show mutual solubility. Except for (V,Zr)N, all other carbides and nitrides formed by Ti, Nb, Zr and V show continuous or extended mutual solubility. For V and Zr the large difference in atomic size enables their compounds only to show limited mutual solubility. It is necessary to emphasise that aluminium differs from the microalloying elements V, Nb and Ti because it does not form a carbide in steel, but only the nitride, AlN, having a different crystal structure (hexagonal close packed). Therefore, there is no mutual solubility with the carbides/nitrides of V, Nb and Ti, all of which have NaCl cubic crystal structure.Fig. 2.2 Solubility data for (a) VC and VN, (b) NbC and NbN, (c) TiN and (d) AlN (2.1).2.1.2 Thermo-Calc modelIn order to accurately predict the austenite/ferrite carbo-nitride equilibria, expressions describing the chemical potentials of the transition metals and carbon and nitrogen in austenite and metal carbo-nitride are required as a function of composition and temperature.To describe the thermodynamics of austenite, ferrite and the non-stoichiometric carbo-nitride phase respectively, the Wagner formalism (2.4) for dilute ternary solutions or a sublattice-subregular solution model proposed by Hillert and Staffanson (2.5) can be used. The Wagner formalism is in fact identical to the regular solution model if the second-power terms are neglected.In the sublattice-subregular model proposed by Hillert and Staffansson the partial Gibbs energy of component M in each individual phase is expressed as,G RT lna ln G M M M E M==+RT x (2.2)where a is the activity and E M G is the excess Gibbs energy.The real crystalline structure of nitrides and carbides is expressed in the form of two sublattices, one for the substitutional elements and one for the interstitial elements. Most of the interstitial sites are usually vacant and vacancies (Va) must thus be treated as an additional element. In principle, an interstitial solution cannot extend beyond the composition where all the interstitial sites are occupied. To take fcc V-N as an example, the model of the solution extends from pure V, which may be regarded as a V 1Va 1 to a compound V 1N 1. A general Thermo-Calc database for the thermodynamic properties of microalloyed steels has recently been developed at the SIMR (2.6), which comprises the thermochemical parameters for multi-component systems of HSLA steels. In the Thermo-Calc approach (2.7), the properties of elements and phases are described by the mathematical representation of their thermodynamic properties and the phase equilibria and complete phase diagrams are calculated by minimising the Gibbs energy. The database can also be used to calculate metastable equilibria since the data can be extrapolated from the regions where the phases involved are stable. Interactions between different atoms in higher-order systems are described by the mixing parameters.This model is now successfully utilised to calculate the volume fraction and compositions of particles at different temperatures as well as the driving force for precipitation. The analysis of the alloy systems of microalloyed steels described below was made with the aid of the Thermo-Calc model.2.2Thermodynamic description of the Fe-V-C-N system2.2.1The Fe-V-C Ternary SystemIn the Fe-V-C ternary system the following phases have been considered (including a vanadium-rich eutectic); liquid, ferrite, austenite, VC 1-x carbide, V 2C 1-x carbide, V 3C 2 carbide,sigma (σ) phase, graphite and metastable phase cementite. Both V 2C and VC carbides have appreciable ranges of homogeneity due to the carbon deficit (2.8). The carbon atoms are randomly distributed in the interstitial sublattice at high temperatures. The solubility of VC carbide in the Fe-V-C system has been studied rather extensively (2.9). The experimental iso-carbon activity data in austenite were described by the ternary interaction parameter, L Fe V C fcc ,:,in the form -(7645.5 + 2.069T)[1+(y Fe -y V )] (2.10).2.2.2The Fe-V-N Ternary SystemThe Fe-V-N ternary system consists of two bcc phases (ferrite (α) V(b-V)), two fcc phases (austenite (γ), vanadium mononitride (VN)), two hcp phases (iron nitride (ε), vanadium dinitride (V 2N)), liquid (L), Fe 4N(γ´) and so-called sigma phase (σ), Fig. 2.3 (2.11). In addition to these phases, N 2 gas is involved in some equilibria.The VN phase has a NaCl type of structure, which can be described as fcc V with all the interstitial sites filled with N. Since this phase is isomorphous with austenite from a crystallographic point of view, the solubility of VN in austenite is described by a miscibility gap which separates the Fe-rich fcc phase (i.e. austenite) from Fe-poor fcc phase (i.e. VN).Several reports were presented previously on the equilibrium nitrogen solubility and nitride formation in austenite (2.12) and ferrite (2.13). Considerable experimental uncertainty still remains which makes some difficulty in the accurate determination of the interaction parameters. This is mainly due to the quite narrow austenite single phase region in the experimental temperature range. The ternary interaction parameters L Fe,V:C were evaluated by Ohtani and Hillert (2.11) for liquid phase and fcc. Using these parameters it was possible to estimate the solubility product of VN in austenite and ferrite. The following equations were obtained, in austenite; log (wt%V)(wt%N)= - 7600/T – 10.34 + 1.8lnT + 7.2x10-5 T (2.3)and ferrite; log (wt%V)(wt%N)= - 12500/T + 6.63 – 0.056lnT + 4.7x10-6 T (2.4)Fig. 2.3 The Fe-V-N ternary system at 800°C.2.2.3Solubility and composition of V(C,N) in V-microalloyed steelsThermo-Calc calculations of precipitation of V(C,N) in steels microalloyed with vanadium is shown in Fig. 2.4. For these calculations the parameters for the carbon, nitrogen and vanadium interaction with other elements present in steels have been taken from the SSOL and TCFE Thermo-Calc databases (2.7). For V-microalloyed steels the effect of manganese on the activity of V is especially important. Mn is known to increase the activity coefficient of V and at the same time decrease the activity coefficient of C. Also shown in this figure is the mole fraction of nitrogen in carbo-nitrides at various temperatures and for various nitrogen contents from hyperstoichiometric levels to zero. This shows that vanadium starts to precipitate in austenite as almost pure nitride, until practically all the nitrogen is consumed. When the nitrogen is about to be exhausted there is a gradual transition to form mixed carbo-nitrides, Fig. 2.4(b). Nitrogen rich vanadium carbonitrides may precipitate during or subsequent to the γ-α transformation. Precipitation during the transformation is a result of the solubility drop of the vanadium carbo-nitrides associated with the transformation from austenite to ferrite at a given temperature.A significant feature of the solubility of vanadium carbide in austenite is that it is considerably higher than those of the other microalloy carbides and nitrides, suggesting that vanadium carbide will be completely dissolved even at low austenitising temperatures.2.3The Fe-Ti-C-N systemThe calculated precipitation of TiN and TiC in steels microalloyed with titanium, is shown in Fig. 2.5. Also shown in this figure is the mole fraction of nitrogen in carbo-nitrides at various temperatures for various nitrogen contents from hyperstoichiometric levels to zero. Titanium forms an extremely stable nitride TiN that is virtually insoluble in austenite and may be effective in restricting its grain growth during processing and welding. Only a small titanium addition (~ 0.01%Ti) is required for this purpose. If larger contents are present the excess titanium can precipitate at lower temperatures as carbide TiC which contributes a precipitation hardening effect. This shows that the solubilities of titanium nitride and titanium carbide are significantly different and the precipitates formed in the austenite are almost purenitrides, until practically all the nitrogen is consumed. It is worth noting that in the Ti-steel。

FDA常用词汇中英文,请收好!

FDA常用词汇中英文,请收好!

FDA常用词汇中英文,请收好!AAccelerated: 加速条件 Accuracy: 准确性AIP(Application Integrity Policy): 申请完全政策制裁ANDA(Abbreviation New Drug Application):仿制药或仿制新药申请API(Active Pharmaceutical Ingredient):原料药或活性药。

原简称BPC(Bulk Pharmaceutical Chemical),现常用API。

在药典和一些论文中也常用Drug Substance 或Substance 来代表原料药。

Appearance: 外观Assay:含量Assessment: 药厂自我评估(厂家组织进行的对药厂本身设施有关文件的模拟FDA检查)Audit:审查(预审查,多用于美方原料药用户,在FDA和PAI之前到药厂进行现场预检查)Auditor:审核员Audit trail: 审计踪迹BBasket:篮子式Batch production records: 批生产纪录Batch records:批号(量)纪录(即batch production and control records 批量生产和检验纪录)BPC:(Bulk Pharmaceutical chemical)原料药Bracketing stability design:稳定性试验的括号分组设计Blend uniformity: 均匀度CCalibration: 校正或校准(对设备,仪器和衡器等的准确度进行校正)Certification of Areas for GMP compliance: (检验企业实施现行药品生产管路规范部门的标准操作规程)CFR 21 Part 11(Code of federal Registry Part11):联邦法规法典标题21第11部分CGMP(Current Good Manufacturing Practice):现行药品生产质量管理规范Change control form:也简称CCF 变更控制表Change control:变更控制Cleaning validation:清洁验证CMC(Chemistry and manufacture control)化学和生产的控制Compliance:符合性Compatibility:共存性或兼容性Content uniformity test: 产品含量均匀性测定Container closure system: 容器封闭系统 COA(Certification of analysis ):分析合格证书,检验报告或检验报告单DDelayed release:延期放行Design qualification: 设计确认Dissolution test:溶出度测试 Deviation records:偏差纪录DMF(drug master file):药物主文件或原料药档案Drug product:成品药 Drug substance:原料药EEIR(Establishment inspection report):确定检查报告Electronic signature:电子签名Equipment qualification:对设备,设施,仪器等性能的鉴定Excipients:赋形剂或辅料Excit meeting:现场检查结束会 Extended release: 缓慢释放EMEA(The European Medicines Evaluation Agency):欧洲医药评审委员会FFinished pharmaceuticals (drug product, finishes product, finished dosage form):制剂药(成品药)其定义位已原料药为起始物料,加一定的赋形剂,制成具有一定剂型可直接用于治疗的药剂。

高精度 anyCAP

高精度 anyCAP

REV.AInformation furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication oraADP3303One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.Tel: 781/329-4700World Wide Web Site: High Accuracy anyCAP™200 mA Low Dropout Linear RegulatorFUNCTIONAL BLOCK DIAGRAMQ2THERMAL PROTECTIONg mQ1CCBANDGAPREFDRIVERR1R2ADP3303OUTINERRSDGNDADP3303-5.05463NR OUTIN 1278ERR 330k ⍀E OUTC20.47␮FV OUT = +5VON OFFSDC10.47␮FV IN SDGNDFigure 1.Typical Application CircuitFEATURESHigh Accuracy Over Line and Load ؎0.8% @ at +25؇C,؎1.4% Over TemperatureUltralow Dropout Voltage: 180 mV (Typ) @ 200 mA Requires Only C O = 0.47 ␮F for StabilityanyCAP = Stable with All Types of Capacitors (Including MLCC)3.2 V to 12 V Supply Range Current and Thermal Limiting Low NoiseDropout DetectorLow Shutdown Current: < 1 ␮A Thermally Enhanced SO-8 PackageExcellent Line and Load Regulation Performance APPLICATIONSCellular TelephonesNotebook, Palmtop Computers Battery Powered Systems Portable InstrumentsPost Regulator for Switching Supplies Bar Code ScannersGENERAL DESCRIPTIONThe ADP3303 is a member of the ADP330x family of preci-sion low dropout anyCAP voltage regulators. The ADP3303stands out from the conventional LDOs with a novel architec-ture, an enhanced process and a new package. Its patented design requires only a 0.47µF output capacitor for stability.This device is insensitive to capacitor Equivalent Series Resis-tance (ESR) and is stable with any good quality capacitor, in-cluding ceramic types (MLCC) for space restricted applications.The ADP3303 achieves exceptional accuracy of ±0.8% at room temperature and ±1.4% overall accuracy over temperature, line and load regulations. The dropout voltage of the ADP3303 is only 180mV (typical) at 200 mA.In addition to the new architecture and process, ADI’s new proprietary thermally enhanced package (Thermal Coastline)can handle 1 W of power dissipation without external heatsink or large copper surface on the PC board. This keeps PC board real estate to a minimum and makes the ADP3303 very attrac-tive for use in portable equipment.The ADP3303 operates with a wide input voltage range from 3.2 V to 12 V and delivers a load current in excess of 200 mA.It features an error flag that signals when the device is about to lose regulation or when the short circuit or thermal overload protection is activated. Other features include shutdown and optional noise reduction capabilities. The ADP330x anyCAP LDO family offers a wide range of output voltages and output current levels:ADP3300 (50 mA, SOT-23)ADP3301 (100 mA)ADP3302 (100 mA, Dual Output)ADP3307 (100 mA, SOT-23-6)ADP3308 (50 mA, SOT-23-5)ADP3309 (100 mA, SOT-23-5)anyCAP is a trademark of Analog Devices Inc.查询ADP3300供应商捷多邦,专业PCB打样工厂,24小时加急出货ADP3303-xx–SPECIFICATIONS(@ T A = –20؇C to +85؇C, V IN = 7 V, C IN = 0.47 ␮F, C OUT = 0.47 ␮F, unlessotherwise noted)1Parameter Symbol Conditions Min Typ Max UnitsOUTPUT VOLTAGE V OUT V IN = V OUTNOM +0.5 V to 12 VACCURACY I L = 0.1 mA to 200 mAT A = +25°C–0.8+0.8%V IN = V OUTNOM +0.5 V to 12 VI L = 0.1 mA to 200 mA–1.4+1.4% LINE REGULATION∆V O V IN = V OUTNOM +0.5 V to 12 V∆V IN T A = +25°C0.01mV/V LOAD REGULATION∆V O I L = 0.1 mA to 200 mA∆I L T A = +25°C0.013mV/mA GROUND CURRENT I GND I L = 200 mA 1.54mAI L = 0.1 mA0.250.4mA GROUND CURRENT I GND V IN = 2.5 VIN DROPOUT I L = 0.1 mA 1.12 2.5mA DROPOUT VOLTAGE V DROP V OUT = 98% of V OUTNOMI L = 200 mA0.180.4VI L = 10 mA0.020.07VI L = 1 mA0.0030.03V SHUTDOWN THRESHOLD V THSD ON 2.0VOFF0.3V SHUTDOWN PIN I SDIN0 < V SD< 5 V1µAINPUT CURR E NT 5 ≤ V SD≤ 12 V @ V IN = 12 V22µA GROUND CURRENT IN I Q V SD = 0, V IN = 12 VSHUTDOWN MODE T A = +25°C1µAV SD = 0, V IN = 12 VT A = +85°C5µA OUTPUT CURRENT IN I OSD T A = +25°C @ V IN = 12 V 2.5µA SHUTDOWN MODE T A = +85°C @ V IN = 12 V4µA ERROR PIN OUTPUTLEAKAGE I EL V EO = 5 V13µA ERROR PIN OUTPUT“LOW” VOLTAGE V EOL I SINK = 400 µA0.150.3V PEAK LOAD CURRENT I LDPK V IN = V OUTNOM + 1 V300mA OUTPUT NOISE V NOISE f = 10 Hz–100 kHz@ 5 V OUTPUT C NR = 0100µV rmsC NR = 10 nF, C L = 10 µF30µV rmsNOTES1Ambient temperature of +85°C corresponds to a typical junction temperature of +125°C under typical full load test conditions.Specifications subject to change without notice.ADP3303CAUTIONESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily accumulate on the human body and test equipment and can discharge without detection.Although the ADP3303 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper E SD precautions are recommended to avoid performance degradation or loss of functionality.PIN FUNCTION DESCRIPTIONSPin Mnemonic Function1 & 2OUTOutput of the Regulator. Bypass to ground with a 0.47 µF or largercapacitor. Pins 1 and 2 must be con-nected together for proper operation.3NRNoise Reduction Pin. Used for reduc-tion of the output noise. (See text for details.) No connection if not used.4GND Ground Pin.5SDActive Low Shutdown Pin. Connect to ground to disable the regulator output.When shutdown is not used, this pin should be connected to the input pin.6ERROpen Collector Output. Goes low to indicate that the output is about to go out of regulation.7 & 8INRegulator Input. Pins 7 and 8 must be connected together for proper operation.PIN CONFIGURATIONININERR SD ABSOLUTE MAXIMUM RATINGS*Input Supply Voltage . . . . . . . . . . . . . . . . . . . –0.3 V to +16 V Shutdown Input Voltage . . . . . . . . . . . . . . . . –0.3 V to +16 V Error Flag Output Voltage . . . . . . . . . . . . . . . –0.3 V to +16 V Noise Bypass Pin Voltage . . . . . . . . . . . . . . . . –0.3 V to +5 V Power Dissipation . . . . . . . . . . . . . . . . . . . Internally Limited Operating Ambient Temperature Range . . . . –20°C to +85°C Operating Junction Temperature Range . . .–20°C to +125°C θJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96°C/W θJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55°C/W Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C Lead Temperature Range (Soldering 10 sec) . . . . . . . +300°C Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215°C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C*This is a stress rating only; operation beyond these limits can cause the device to be permanently damaged.ORDERING GUIDEOutput Package ModelVoltage Option*ADP3303AR-2.7 2.7 V SO-8ADP3303AR-3 3.0 V SO-8ADP3303AR-3.2 3.2 V SO-8ADP3303AR-3.3 3.3 V SO-8ADP3303AR-55.0 VSO-8Contact the factory for the availability of other output voltage options.*SO = Small Outline.Other Members of anyCAP Family 1Output Package Model Current Options 2Comments ADP330050 mA SOT-23-6High AccuracyADP3301100 mA SO-8High Accuracy ADP3302100 mA SO-8Dual Output ADP3307100 mA SOT-23-6Small SizeADP330850 mA SOT-23-5Improved LP2980ADP3309100 mASOT-23-5Improved MIC5205NOTES 1See individual data sheets for detailed ordering information.2SO = Small Outline, SOT = Surface Mount.ADP3303–Typical Performance CharacteristicsINPUT VOLTAGE – VoltsO U T P U T V O L T A G E – V o l t s3.341656789101112131415Figure 2.Line Regulation: Output Voltage vs. Supply VoltageOUTPUT LOAD – mAG R O U N D C U R R E N T – ␮A20200406080100120140160180Figure 5.Quiescent Current vs. Load CurrentOUTPUT LOAD – mA20200406080100120140160180180160080604020140100120I N P U T -O U T P U T V O L T A G E – m VFigure 8.Dropout Voltage vs. Output CurrentOUTPUT LOAD – mAO U T PU T V O L T A G E – V o l t s020200406080100120140160180Figure 3.Output Voltage vs. Load CurrentTEMPERATURE – ؇CO U T P U T V O L T A G E – %0.2–0.40.10.0–0.1–0.2–0.3Figure 6.Output Voltage Variation % vs. TemperatureINPUT VOLTAGE – Volts54213I N P U T -O UT P U T V O L T A G E – V o l t sFigure 9.Power-Up/Power-DownINPUT VOLTAGE – VoltsG R O U N D C U R R E N T – ␮AFigure 4.Quiescent Current vs.Supply VoltageTEMPERATURE – ؇CG R O U N D C U R R E N T – ␮A25002000015001000500Figure 7.Quiescent Current vs.TemperatureTIME – ␮sI N P U T -O U T P U T V O L T A G E – V o l t sFigure 10.Power-Up TransientADP3303TIME – ␮sV o l t sFigure 11.Line Transient Response TIME – ␮sV o l tsm AFigure 14.Load Transient for 10 mA to 200 mA PulseTIME – ␮sV o l t sFigure 17.Turn OffTIME – ␮s04040080120160200240280320360V o l t sFigure 12.Line Transient ResponseV o l t sTIME – secm AFigure 15.Short Circuit CurrentFREQUENCY – HzR I P P L E R E J E C T I O N – d BFigure 18.Power Supply Ripple RejectionTIME – ␮sV o l t sm AFigure 13.Load Transient for 10 mA to 200 mA PulseTIME – ␮sV o l t sFigure 16.Turn OnFREQUENCY – HzV O L TA G E N O I S E S P E C T R A L D E N S I T Y – ␮V / H z1011001k 100k10k 0.1Figure 19.Output Noise DensityADP3303THEORY OF OPERATIONThe new anyCAP LDO ADP3303 uses a single control loop for regulation and reference functions. The output voltage is sensed by a resistive voltage divider consisting of R1 and R2, which is varied to provide the available output voltage options. Feedback is taken from this network by way of a series diode (D1) and a second resistor divider (R3 and R4) to the input of an amplifier.Figure 20.Functional Block DiagramA very high gain error amplifier is used to control this loop. The amplifier is constructed in such a way that at equilibrium it produces a large, temperature proportional input “offset voltage”that is repeatable and very well controlled. The temperature-proportional offset voltage is combined with the complementary diode voltage to form a “virtual bandgap” voltage, implicit in the network, although it never appears explicitly in the circuit. Ultimately, this patented design makes it possible to control the loop with only one amplifier. This technique also improves the noise characteristics of the amplifier by providing more flexibil-ity on the tradeoff of noise sources that leads to a low noise design.The R1, R2 divider is chosen in the same ratio as the bandgap voltage to the output voltage. Although the R1, R2 resistor divider is loaded by the diode D1, and a second divider consist-ing of R3 and R4, the values are chosen to produce a tempera-ture stable output. This unique arrangement specifically corrects for the loading of the divider so that the error resulting from base current loading in conventional circuits is avoided.The patented amplifier controls a new and unique noninverting driver that drives the pass transistor, Q1. The use of this special noninverting driver enables the frequency compensation to include the load capacitor in a pole splitting arrangement to achieve reduced sensitivity to the value, type and ESR of the load capacitance.Most LDOs place strict requirements on the range of ESR val-ues for the output capacitor because they are difficult to sta-bilize due to the uncertainty of load capacitance and resistance. Moreover, the ESR value, required to keep conventional LDOs stable, changes depending on load and temperature. These ESR limitations make designing with LDOs more difficult becauseof their unclear specifications and extreme variations over temperature.This is no longer true with the ADP3303 anyCAP LDO. It can be used with virtually any capacitor, with no constraint on the minimum ESR. The innovative design allows the circuit to be stable with just a small 0.47 µF capacitor on the output. Addi-tional advantages of the pole splitting scheme include superior line noise rejection and very high regulator gain, which leads to excel-lent line and load regulation. An impressive ±1.4% accuracy is guaranteed over line, load and temperature.Additional features of the circuit include current limit, thermal shutdown and noise reduction. Compared to standard solutions that give warning after the output has lost regulation, the ADP3303 provides improved system performance by enabling the ERR Pin to give warning before the device loses regulation.As the chip’s temperature rises above 165°C, the circuit acti-vates a soft thermal shutdown, indicated by a signal low on the ERR Pin, to reduce the current to a safe level.To reduce the noise gain of the loop, the node of the main di-vider network (a) is made available at the noise reduction (NR) pin, which can be bypassed with a small capacitor (10 nF–100 nF). APPLICATION INFORMATIONCapacitor SelectionOutput Capacitors:as with any micropower device, output transient response is a function of the output capacitance. The ADP3303 is stable with a wide range of capacitor values, types and ESR. A capacitor as low as 0.47 µF is all that is needed for stability; larger capacitors can be used if high output current surges are anticipated. The ADP3303 is stable with extremely low ESR capacitors (ESR ≈ 0), such as Multilayer Ceramic Capacitors (MLCC) or OSCON.Input Bypass Capacitor:an input bypass capacitor is not required; for applications where the input source is high imped-ance or far from the input pins, a bypass capacitor is recom-mended. Connecting a 0.47 µF capacitor from the input pins to ground reduces the circuit’s sensitivity to PC board layout. If a larger value output capacitor is used, then a larger value input capacitor is also recommended.Noise ReductionA noise reduction capacitor (C NR) can be used to further reduce the noise by 6 dB–10 dB (Figure 21). Low leakage capacitors in the 10 nF–100 nF range provide the best performance. Since the noise reduction pin (NR) is internally connected to a high impedance node, any connection to this node should be carefully done to avoid noise pickup from external sources. The pad connected to this pin should be as small as possible. Long PCboard traces are not recommended.V OUT = 5V V INFigure 21.Noise Reduction CircuitADP3303Thermal Overload ProtectionThe ADP3303 is protected against damage due to excessive power dissipation by its thermal overload protection circuit, which limits the die temperature to a maximum of 165°C. Under extreme conditions (i.e., high ambient temperature and power dissipation), where die temperature starts to rise above 165°C, the output current is reduced until the die temperature has dropped to a safe level. The output current is restored when the die temperature is reduced.Current and thermal limit protections are intended to protect the device against accidental overload conditions. For normal operation, device power dissipation should be externally limited so that junction temperatures will not exceed 125°C. Calculating Junction TemperatureDevice power dissipation is calculated as follows:P D = (V IN – V OUT) I LOAD+ (V IN) I GNDWhere I LOAD and I GND are load current and ground current, V IN and V OUT are input and output voltages, respectively. Assuming I LOAD = 200 mA, I GND = 2 mA, V IN = 7 V andV OUT = 5.0 V, device power dissipation is:P D = (7 V – 5 V)200 mA + (7 V)2 mA = 414 mWThe proprietary package used in ADP3303 has a thermal resistance of 96°C/W, significantly lower than a standard 8-lead SOIC package at 170°C/W.Junction temperature above ambient temperature will be ap-proximately equal to:0.414 W× 96°C/W = 39.7°CTo limit the maximum junction temperature to 125°C, maxi-mum ambient temperature must be lower than:T AMAX = 125°C – 40°C = 85°CPrinted Circuit Board Layout ConsiderationAll surface mount packages rely on the traces of the PC board to conduct heat away from the package.In standard packages, the dominant component of the heat resistance path is the plastic between the die attach pad and the individual leads. In typical thermally enhanced packages, one or more of the leads are fused to the die attach pad, significantly decreasing this component. To make the improvement mean-ingful, however, a significant copper area on the PCB must be attached to these fused pins.The patented thermal coastline lead frame design of theADP3303 (Figure 22) uniformly minimizes the value of the dominant portion of the thermal resistance. It ensures that heat is conducted away by all pins of the package. This yields a very low, 96°C/W, thermal resistance for an SO-8 package, without any special board layout requirements, relying on the normal traces connected to the leads. The thermal resistance can be decreased by approximately an additional 10% by attaching a few square cm of copper area to the IN pin of the ADP3303.It is not recommended to use solder mask or silkscreen on the PCB traces adjacent to the ADP3303’s pins since it will increase the junction to ambient thermal resistance of the package.4COPPERFigure 22.Thermal CoastlineError Flag Dropout DetectorThe ADP3303 will maintain its output voltage over a wide range of load, input voltage and temperature conditions. If, for example, the output is about to lose regulation by reducing the supply voltage below the combined regulated output and drop-out voltages, the ERR flag will be activated. The ERR output is an open collector, which will be driven low.Once set, the ERR flag’s hysteresis will keep the output low until a small margin of operating range is restored either by raising the supply voltage or reducing the load.Shutdown ModeApplying a TTL high signal to the shutdown (SD) pin, or tying it to the input pin, will turn the output ON. Pulling SD down to 0.3 V or below, or tying it to ground, will turn the output OFF. In shutdown mode, quiescent current is reduced to much less than 1 µA.APPLICATION CIRCUITSCrossover SwitchThe circuit in Figure 23 shows that two ADP3303s can be used to form a mixed supply voltage system. The output switches between two different levels selected by an external digital input. Output voltages can be any combination of voltages from the Ordering Guide.ADP3303C 2984a –1–12/98P R I N T E D I N U .S .A .OUTLINE DIMENSIONSDimensions shown in inches and (mm).8-Lead Small Outline IC(SO-8)PLANEBSC °FOUT = 5V/3.3VV IN Figure 23.Crossover SwitchHigher Output CurrentThe ADP3303 can source up to 200 mA without any heatsink or pass transistor. If higher current is needed, an appropriate pass transistor can be used, as in Figure 24, to increase theoutput current to 1 A.V IN V OUT = 5V @ 1AFigure 24.High Output Current Linear Regulator Constant Dropout Post RegulatorThe circuit in Figure 25 provides high precision with low drop-out for any regulated output voltage. It significantly reduces the ripple from a switching regulator while providing a constant dropout voltage, which limits the power dissipation of the LDO to 60 mW. The ADP3000 used in this circuit is a switching regulator in the step-up configuration.FV IN Figure 25.Constant Dropout Post Regulator。

开启片剂完整性的窗户(中英文对照)

开启片剂完整性的窗户(中英文对照)

开启片剂完整性的窗户日本东芝公司,剑桥大学摘要:由日本东芝公司和剑桥大学合作成立的公司向《医药技术》解释了FDA支持的技术如何在不损坏片剂的情况下测定其完整性。

太赫脉冲成像的一个应用是检查肠溶制剂的完整性,以确保它们在到达肠溶之前不会溶解。

关键词:片剂完整性,太赫脉冲成像。

能够检测片剂的结构完整性和化学成分而无需将它们打碎的一种技术,已经通过了概念验证阶段,正在进行法规申请。

由英国私募Teraview公司研发并且以太赫光(介于无线电波和光波之间)为基础。

该成像技术为配方研发和质量控制中的湿溶出试验提供了一个更好的选择。

该技术还可以缩短新产品的研发时间,并且根据厂商的情况,随时间推移甚至可能发展成为一个用于制药生产线的实时片剂检测系统。

TPI技术通过发射太赫射线绘制出片剂和涂层厚度的三维差异图谱,在有结构或化学变化时太赫射线被反射回。

反射脉冲的时间延迟累加成该片剂的三维图像。

该系统使用太赫发射极,采用一个机器臂捡起片剂并且使其通过太赫光束,用一个扫描仪收集反射光并且建成三维图像(见图)。

技术研发太赫技术发源于二十世纪九十年代中期13本东芝公司位于英国的东芝欧洲研究中心,该中心与剑桥大学的物理学系有着密切的联系。

日本东芝公司当时正在研究新一代的半导体,研究的副产品是发现了这些半导体实际上是太赫光非常好的发射源和检测器。

二十世纪九十年代后期,日本东芝公司授权研究小组寻求该技术可能的应用,包括成像和化学传感光谱学,并与葛兰素史克和辉瑞以及其它公司建立了关系,以探讨其在制药业的应用。

虽然早期的结果表明该技术有前景,但日本东芝公司却不愿深入研究下去,原因是此应用与日本东芝公司在消费电子行业的任何业务兴趣都没有交叉。

这一决定的结果是研究中心的首席执行官DonArnone和剑桥桥大学物理学系的教授Michael Pepper先生于2001年成立了Teraview公司一作为研究中心的子公司。

TPI imaga 2000是第一个商品化太赫成像系统,该系统经优化用于成品片剂及其核心完整性和性能的无破坏检测。

老俞词汇

老俞词汇

49alchemy n.炼金术50alder n.赤杨树51algae n.海藻52alien adj.相异的;陌生的53all but词组+ adj. 几乎…54all inclusive词组无所不包的55allocate vt.分配56alloy n.合金57alternative adj.另一可选的,另外的58altitude n.高度59ambience n.周围环境,气氛60amenable adj.顺从的;应服从的61amplify vt.放大;扩大;增强62ancestor n.祖先,祖宗63annihilate vt.消灭;消减64annual adj.每年的65annually adv.一年一次,每年66anomaly n.异常,不规则;异常的人或物67anonymous adj.匿名的68antibiotic adj.抗菌的,抗生的69antiquate vt.使古旧,废弃70antiquated adj.陈旧的,过时的71antiquity n.古迹;古物72apart from词组除…之外73appeal n.吸引力74apprentice n.学徒75approach n.方法76aptly adv.适当地,得体地77arc n.弧形,拱形78archaeology n.考古学79archaeological adj.考古学的80archipelago n.群岛81architect n.建筑师82arduous adj.费力的,艰难的83arena n.竞技场,舞台84arid adj.干旱的;贫瘠的85armor n.装甲;装甲车86aromatic adj.芬芳的87array n.展示,陈列;一系列88arthritis n.关节炎89artificial adj.人造的,人工的90artisan n.手工业工人,手艺人91as far as词组就...来说;远及92as such词组就象这样做,就本身而论93as a rule词组通常,总的来说94as a rule of thumb词组大概来说95ascend vt.(渐渐)上升,升高;攀登96ascent n.攀登,上升97aspiring adj.有抱负的,有理想的,积极向上的98assemble vt.集合,装配99assert vt.声称,坚持100associate v.关联,联合101assorted adj.各式各样的,多样混合的102assortment n.各类物品的聚集,混合物103assume vt.假定,设想104assumption n.假设;就职105assure vt.确保;向…保证,使确信106astonishing adj.惊人的,奇迹的107astounding adj.令人吃惊的108astute adj.机敏的,精明的109at intervals词组不时;相隔一段距离110at one session词组一下子,一次性111at the cuttingedge of词组在…的关键时刻/状态/位置112atomization n.原子化;雾化113attachment n.依恋,喜欢114attach vt.系,缚115attached adj.附加的,附属的116attain vt.达到,获得117attainment n.成就118attire n.穿着,服饰(正规服装的总称)119auditorium n.大礼堂120auger n.螺丝钻,钻孔机121aurora n.极光=auroral light122automated adj.自动的123available adj.自由的,有空的124aviation n.航空;航空学125avocational adj.副业的,嗜好的126awareness n.意识127awkwardly adv.(见到生人)局促不安地,笨拙地128backdrop n.舞台背景;背景129ballet n.芭蕾舞130balmy adj.芳香的;(空气)温和的131barb n.(鱼钩等的)倒钩;倒刺132barbed wire词组带倒钩的铁丝(铁丝网)133barge n.驳船134bark n.树皮135barn n.谷仓;畜棚136barren adj.贫瘠的;荒凉的137barrier n.屏障,障碍;栅栏138barter n./v.物品交换,易货贸易139basement n.地下室140basin n.盆;盆地141be taken by词组被迷住,被吓住142be up to词组由…做;胜任,从事于143beam n.大梁144bequest n.遗产;遗赠145besiege vt.围攻;困扰146bestow vt.给与,赐赠147bias n.偏见,偏好148bitterness n.苦味;辛酸,苦难149bizarre adj.奇异的,古怪的150blanket n.毯子;厚的遮盖物151blast vi.爆破152blazing adj.炽烧的;闪耀的153bleak adj.荒凉的;凄凉的154blend vt.混合,掺混155blessing n.祝福,恩赐156block n.一块(木头或石头等)157blossom n./vi.花/开花158blues n.抑郁,沮丧;布鲁斯音乐159bluff n.悬崖,绝壁;v.诈骗,吓唬160blunt adj.直言不讳的161bolster n.垫子,枕垫162boom n.繁荣163boon n.恩惠,恩赐164boost vt.增加,提高,促进165boring adj.令人厌烦的166boundary n.分界线,边界167bow n.弓;弓形168breach vt.打破,突破169break all ties with词组与…断绝一切关系170breeze n.微风171brittle adj.易碎的172bronze n.青铜;铜像173bubble n.气泡,水泡174buckle n.皮带扣环175buggy n.小马车,童车176building block词组积木177bulk n.大批;大部分178bundle n.捆,束,包179burdensome adj.繁重的,劳累的180burgeon vi.迅速成长,发展181burrow n.洞穴182bust n.半身像,半身雕像183bustle n.喧闹,匆匆忙忙184by a factor of词组翻…倍185by far词组迄今为止186cab n.出租马车、汽车187the Cabinet n.内阁 cabinet n. 橱柜188cacti n.(pl)仙人掌-单数cactus189calibration n.校准;标度,刻度190campaign n.(政治或商业性)活动,竞选活动191cannibalism n.同类相食192canopy n.天篷,遮篷193canyon n.峡谷194capability n.能力195capacity n.容量;能力196carbohydrate n.碳水化合物197cardiac adj.心脏的198cargo n.货物199carnival n.狂欢节200carnivorous adj.食肉的201carving n.雕刻品,雕花202cast vt.浇铸203casting n.铸件,铸造204cast off词组丢弃,摆脱205category n.种类,类目;范畴206cater vi.满足需要,迎合207cathedral n.总教堂,大教堂208cavern n.大山洞,大洞穴209cavity n.洞;腔210cease v.停止,终止211celestial adj.天体的;天上的212cell n.细胞,单人牢房,电池213cellist n.大提琴家214census n.人口调查,人口普查215ceremonial n.仪式216ceremony n.典礼,仪式;礼节217chafe vt.(将皮肤等)擦热,擦破218chamber n.室;房间219chaos n.混乱220be characterized by词组以…为特征,典型代表221charcoal n.炭;木炭222charter v.包租;特许223chateau n.城堡,高级旅馆224check vt.检查,核对;阻止,控制225chill vt.使冷,变冷;冷却226chilly adj.寒冷的227chimpanzee n.黑猩猩228chisel n.凿子229chivalry n.骑士气概,侠义;(男人)对女人彬彬有礼,献殷勤230chop vt.砍231choppy adj.波浪起伏的,(风)不断改变方向的232chord n.琴弦,心弦233chunk n.大块;矮胖的人或物234circulate v.(使)循环;(使)传播235circulation n.循环;流通236circumscribe vt.划界限;限制237cite vt.引用,举例238civility n.彬彬有礼,斯文239civilian adj.平民的;民用的240claim n.要求,要求权241clam n.蛤,蛤肉242clamor n.叫嚣,喧哗243clan n.家族,宗族244classify vt.把…分类,分等级245classification n.分类,分级246clay n.粘土;泥土247cliff n.悬崖峭壁248clockwise adj./adv.顺时针方向的(地)249clumsy adj.笨拙的;愚笨的250cluster n.簇,串,群251code of laws词组法典252coexist vi.同时存在,共存253cohesion n.附着(力),凝聚力254cohesive adj.粘着的255coil n.(一)卷;线圈256coincide vi.同时发生;相符合,相巧合257coincident adj.一致的,巧合的258collaboration n.合作259collective adj.集体的,共同的260collide vi.碰撞;冲突261colossal adj.巨大的262combustible adj.易燃的263combustion n.燃烧264comet n.彗星265commission vt.委任,任命;委托,委托制作266committed adj.效忠的;忠于…的267commodity n.商品,日用品268commonsense adj.具有常识的269communal adj.公共的;公社的270community n.社区;社会271commuter n.经常往返者272compact adj.紧凑的,紧密的;简洁的273companion n.同伴,同事274comparable adj.可比的,比得上的;类似的275compatible adj.可以并存的,相容的,协调的276compel vt.强迫,使不得不277compensation n.补偿,赔偿278competitiveness n.竞争能力279competing adj.有竞争性的,不相上下的280compile vt.汇集,编辑281complacence n.自满,自以为是282complement vt.补充,使完善283complementary adj.补充的,补足的284complex adj.复杂的,费解的;结构复杂的285complicated adj.费解的,棘手的;结构复杂的286comply with词组遵从,符合287component n.成分,组成部分288be composed of词组由…组成289composition n.构成,组成290compound n.化合物291compress vt.压缩,浓缩292comprise vt.包含;由…组成293conceal vt.隐藏,隐瞒294concede v.承认295conceive vt.构思;设想296conception n.观念,认识297concerted adj.商议好的,协定的298concise adj.简洁的,简明的299concrete n.水泥300condensation n.压缩,浓缩301condor n.秃鹰302conductivity n.导电率;传导率303confederacy n.联盟304configuration n.轮廓,构型305confinement n.限制,禁闭306confirm vt.证实,使…更坚定307conflict n.争论,冲突,斗争308conflicting adj.相冲突的,相矛盾的309confront vt.面对,正视310congenial adj.合得来的;适意的311congestion n.拥挤,拥塞312congregate v.聚集313consecutive adj.连续的314consequence n.结果,后果315conservative adj.保守的,谨慎的;守旧的316conserve vt.保存,保藏 n.可长期保存的食物317conservation n.保存,保持318conspiracy n.阴谋,共谋319constant adj.不变的,持续的;一再重复的320constantly adv.不断地321constellation n.星座322constituent n.成分,要素323constitution n.组织;宪法324constitute vt.建立(政府),组成,构成325constitutional adj.宪法的;章程的326constrain vt.限制,约束327constraint n.限制,约束328constrict vt.约束;收缩329constricted adj.抑制的,约束的330construction n.建筑,建造331consumption n.消耗,消费332contact vt.使接触,与…联系333container n.容器;集装箱334contemporary adj.当代的,现代的335context n.上下文,语境336contour n.contours 轮廓337contraction n.缩短,收缩338contractor n.定约人,承包人339contribute to词组有助于,对…起作用340convention n.会议;传统341conventional adj.传统的,习俗的342conventionally adv.按照惯例地,照常套地343converge vi.聚合,集中于一点,会聚344convert vt.转换;转变信仰345converter n.炼钢转炉346convict vt.证明…有罪,宣告…有罪347convincing adj.令人信服的348convinced adj.确信的,深信的349convivial adj.欢乐的,快乐的350coral reef词组珊瑚礁=corals351core n.中心,核心;地核352correlate vt.使相互关联;使相互影响353correlated adj.有相互关系的354corrosion n.腐蚀,侵蚀355corruption n.腐败,贪污,堕落356cosmic adj.宇宙的357costume n.服装358counteract vt.消除,抵消359counterbalance v.使平衡360counterclockwise adj./adv.逆时针的(地)361counterpart n.相似的人或物,配对物362cowhand n.牛仔,牧牛工363crab n.蟹364crack n.裂缝,裂纹;缺点365craft n.手艺;容器366craftspeople n.手工艺人367crater n.火山口;弹坑368crawl vi.爬,爬行369crayon n.彩色蜡笔、粉笔或其绘画370credence n.信任,相信371creditor n.债权人372crevice n.缺口,裂缝373cripple vt.削弱;使残废374crippling adj.令人震惊的375crisscross vi.交叉往来376crossbones n.十字骨头377crossbreeding n.(生物)杂种378crow n.乌鸦379crude adj.粗糙的,粗鲁的;原始的380crumple vt.把…弄皱;起皱381crust n.硬外皮;地壳382crustacean n.甲壳动物383crystalline adj.水晶的,透明的384crystallize v.明确;使结晶化385crystallized adj.变成晶体的386cubism n.立体主义387cue n.提示,暗示388culminate v.达到高潮/顶点389cumbersome adj.笨重的,难处理的390curator n.(博物馆等)馆长391curriculum n.学校的全部课程392custodian n.看守人,管理人393cuticle n.表皮394cylinder n.圆筒,圆柱体395dash off词组水猛冲;感情爆发396daunting adj.使人畏缩的397dawn n.黎明;开端,开始398dazzling adj.眼花缭乱的;耀眼的399debate n.争论,辩论400debris n.废墟,残骸;碎片401declaration n.宣布,宣言402decline vi./n.衰退;下降,减退403decorate vt.装饰,装潢,修饰404decoration n.装饰,装饰品405decorative adj.装饰的,可作装饰的406defecate vi.排粪;通大便407deferential adj.恭敬的, 恭顺的408deference n.尊重,顺从;敬意409deficiency n.缺乏;不足410deform vt.使变形411deformation n.损坏,变形412deft adj.灵巧的,熟练的413degrade v.使降级,贬低414degradation n.退化;降级,降格415dehydrate vt.使脱水416dehydrated adj.干燥的,脱水的417deliberate adj.故意的,早有准备的418delicate adj.脆的,易损的;娇弱的419delta n.三角洲420demobilize vt.遣散,使复员421demolish vt.破坏,摧毁422dense adj.密集的,浓厚的423density n.密度424depict vt.描绘;描写,描述425deplete vt.耗尽,使衰竭426deposit vt.堆积,沉淀427depredation n.劫掠,蹂躏428depression n.不景气,萧条期429deprive vt.剥夺,使失去430derive vt.得到,获取;源于431desalination n.脱盐,去盐作用432descend v.传下,遗传433descendant n.子孙,后裔434descent n.血统,世袭435designate vt.指定,任命436desirable adj.令人向往的;令人满意的437desperate adj.绝望的,不顾一切的,拼死的438despoiler n.掠夺者439destruction n.破坏;毁灭440detect vt.察觉,发觉;探测,侦查441detectable adj.可发觉的;可查明的442deter vt.阻碍,制止,使踌躇443deterrent n.制止物,威慑力量444deteriorate v.使恶化;质量下降445determinant n.决定因素446devastate vt.毁坏447devastation n.毁坏448devour vt.贪婪地吃,吞食449diagonal n./adj.对角线(的)450diagonally adv.成对角线地,斜对地451diameter n.直径452dictate vt.规定;决定,确定453diction n.措辞,用语454differentiate v.区分,区别455diffuse v.扩散;散播456digest vt.消化457digression n.离题,扯到枝节上458diminish v.(使)减少,(使)变小459discard vt.丢弃460discern vt.看出;察觉到461discernible adj.可识别的=discernable462discharge vt.释放;排出463n.流出464n.放电465discipline n.纪律,训练466discouraging adj.令人气馁的467discourse n.讲道,演讲468discrete adj.独立的;不连续的,离散的469disintegrate v.(使)瓦解,(使)碎裂470dispense vt.分配,分发471disperse vt.分散,散开472disposal n.垃圾倾倒;处置473dispute n.争论,纠纷474disrepute n.坏名声,不光彩475disseminate vt.传播,宣传476dissipate vi.消失;消散477dissipated adj.沉迷于酒色的, 浪荡的478dissolve vt.使溶解479distend vt./vi.(使)扩大,(使)扩张480distent adj.膨胀的,扩张的481distinction n.差别,特性482distinct adj.明确的,确实的;不同的483distinctly adv.清楚地,显然484distinctive adj.有特色的,出众的485distinctively adv.特殊地,区别地486distort vt.弄歪(形状等);歪曲487distract vt.使…分心,分散注意力488distribute vt.分配;分发,散布489distribution n.分发,分配490diver n.潜水者,跳水运动员491divergence n.分歧,岔开492diverse adj.不同的;变化多的493diversity n.差异,多样494diversified adj.多样化的495diversification n.多样化496diversion n.消遣,娱乐497documentation n.文件498dogma n.教条,教义499dolphin n.海豚500domain n.领域,范围501domestic adj.家里的;家养的502dominant adj.支配的,占优势的503dominate vt.统治,支配,控制504dormant adj.静止的,休眠的505dorsal adj.背部的,背脊的506draft animal词组役用动物507drain v.(使)流走,(使)排光508dramatically adv.戏剧性地;引人注目地509drawback n.弊端,缺点510drill vt.钻孔,打眼511drought n.干旱512ductile adj.易延展的;柔软的513dump vt.倾泻,倾倒514durable adj.持久的;耐用的515dwarf n.侏儒516eccentricity n.反常,怪癖517eclipse n.日蚀,月蚀518ecological adj.生态的;生态学的519economize vi.节约,节省520ecosystem n.生态系统521edentate n.贫齿类动物522edible adj.可食用的523edifice n.宏伟的建筑物524educable adj.可教育的,可培养的525eject vt.喷出,喷射526elaborate adj.精细的,精心的;详尽的527elaborately adv.精细地,详尽地528elegance n.高雅, 典雅, 优雅, 雅致529elevation n.高度,海拔530elicit vt.得出;引出531eligible adj.合格的,有资格的532eliminate vt.排除,剔除533elixir n.长生不老药,万能药534elliptical adj.椭圆的535elusive adj.难懂的,难捉摸的536embed vt.插入;镶嵌537embellish vt.装饰,修饰538emboss v.加浮雕花纹于,使凸出539embryological adj.胚胎学的540emerge vi.出现,浮现541emerging adj.正在不断出现的542emergence n.出现,形成543emigrant n.移民(出国)544emission n.散发;发射545emit vt.发出,放射546employ vt.用,使用547enactment n.设定,制定548encounter vt.遭遇,遇到549engraving n.雕刻术, 雕版, 雕版图550enormous adj.极大的,庞大的551enterprise n.事业,企业552enterprising adj.有进取心的,有事业心的,有魄力的553entrepreneur n.企业家,创业人554enzyme n.酶555epidermis n.表皮556epoch n.新纪元,时代557equilibrium n.平衡,均衡558equivalent n.等同品559erect vt.使树立;建立,创立560erode v.腐蚀,侵蚀561erosion n.腐蚀,侵蚀562eruption n.爆发,喷发563eternal adj.永恒的;永远的564ethically adv.在伦理上,道德上565ethnic adj.种族的566evaporate v.(使)蒸发;消失567eventful adj.多事的,充满大事的;意义重大的568evergreen adj.常绿的569evident adj.明显的570eviscerate vt.取出内脏;除去主要部分571evoke vt.引起,激起,唤起572exalted adj.崇高的,高贵的573excavation n.挖掘574exceed vt.超越,胜过575excel vi.胜过,杰出576exceptional adj.异常的,杰出的577exceptionally adv.特殊地;异常地578excess adj.过度的,额外的579excessive adj.过度的,过分的,过多的580exclusion n.排除,逐出581exclusive adj.单独的,唯一的;排外的582execution n.实施,执行;完成583exempt vt.使免除,豁免584exert vt.运用,行使,施加585exhale vt.呼出,呼气586exhibition n.展览会;展览品587exorbitant adj.(价格、索价)过高的,过分的588expansion n.扩张,发展589expenditure n.支出, 花费590expertise n.专门技术,技能591explicit adj.明确的,清楚的592exploit vt.开拓;开采,开发593exponential adj.指数的,幂数的594express business词组特快专递业务595express train词组特快列车596expressive adj.有表现力的,富有表情的,生动的597extend v.延长;扩大598extended adj.延长的,扩大的599extensive adj.广的;多方面的,广泛的600external adj.外部的;表面的601extinct adj.灭绝的;不再活跃的,熄灭的602extinction n.消失,灭绝603extract vt.拔出;榨取604fabric n.织物,布605facilitate vt.使容易;有助于,促进606facilitation n.促进,帮助607facility n.设施,设备608faction n.派别,宗派,小集团609factor n.因素;变量610faculty n.教职工的总称611fade vi.逐渐消失612famine n.饥荒,饥饿613fanatical adj.狂热的;入迷的614fascination n.入迷,迷恋;魅力615fashionable adj.流行的,时髦的,上流社会的616fatal adj.致命的617fatigue n.疲乏,劳累618faucet n.水龙头619fauna n.动物群,动物区系620flora n.植物群621feasible adj.切实可行的622feat n.功绩,壮举623feed on词组吃,以…为食624fencing n.围墙,栅栏;击剑,剑术625fend for oneself词组自己谋生626fertile adj.肥沃的,富饶的;能繁殖的627fertilize vt.施肥,使丰饶;使受精628fertilized egg词组受精卵629festival n.节日630feverish adj.发烧的631fiber n.纤维,光纤632fiction n.小说,(虚构)故事633fidelity n.忠实,忠诚634field research词组野外实地考察635figurehead n.装饰船头的雕像, 破浪神, 有名无实的领袖636file n.档案637fir n.杉木638flair n.才能,本领639flake v.使成薄片;雪片般落下640flea n.跳蚤641fleeting adj.短暂的,飞逝的642flexible adj.易弯曲的,柔软的;变通的643flexibility n.灵活性644float v.漂浮,使漂浮645flock n.(畜、禽)群,大量646flock to词组成群结队地去647fluctuation n.波动,起伏648flux n.变迁;涨潮649folklore n.民间传说650follow suit词组跟着做651folly n.愚笨,愚蠢,荒唐事652forage v.搜寻(食物)653forbidding adj.可怕的,令人难以亲近的,令人生畏的654foremost adj.最重要的;最先的655foresee vt.预见,预知656foreshadow vt.成为先兆,预示657formalized adj.形式化的,使程序化的658format n.模式,格式659formation n.形成,构成660formidable adj.令人敬畏的,可怕的661formulate vt.系统地阐述(或提出)662fort n.要塞,堡垒663fortify vt.加强,巩固664fortuitous adj.偶然的,意外的665fortuitously adv.偶然地,意外地666fossilize vt.使成化石667fossilized adj.变成化石的668foster vt.鼓励,促进669fracture n.骨折;破裂670fragile adj.易碎的,脆的;脆弱的671fragility n.脆弱672fragment n.碎片,破片673fray vi.磨损,磨破674freight n.货物,货运675frenetic adj.狂乱的,发狂的676frenzy n.狂暴;狂怒677frigid adj.寒冷的678fringe n.边缘;边界679from a far词组从遥远的地方680frustrate v.挫败,破坏681frustration n.挫败,挫折682frustrating adj.令人沮丧胆683fumigate vt.烟熏;用香薰684functioning n.运转,操作685fungi n.(fungus的复数)真菌686furnish vt.装备;提供687fusion n.核聚变688galaxy n.星系;银河689gallery n.画廊,美术馆690galvanize vt.通电流于;刺激,激起691gap n.裂口;缺口692gaseous adj.气体的,气态的693generate vt.造成,产生694generous adj.慷慨的695genetic adj.遗传的,起源的696genetically adv.遗传上697genial adj.和蔼可亲的698genre n.文学上的流派和体裁699genuine adj.真正的,真实的;真诚的700get in the way of词组阻挡701giant n.巨人,巨大的怪物702girder n.钢结构大梁703give way to词组让步,让路704glacial adj.冰的,冰河的;冰冷的705glacier n.冰川706glamorous adj.迷人的,富有魅力的707gland n.腺体708glandular adj.腺体的709glassware n.玻璃制品710glimpse n.一瞥,一看711global adj.全球性的712go broke词组破产713gorgeous adj.华丽的;灿烂的714gourmet n.美食家715graphic adj.绘画似的;图解的,生动的716grasshopper n.蚱蜢,蚂蚱717gravitational adj.地心引力的,重力的718gravity n.地心引力719graze vi.(牲畜)吃草;放牧720grazing land词组牧场,草场721grumble n./v.抱怨722gulf n.海湾723gush vi.喷涌,涌流724gymnastic adj.体操的,体育的725habitat n.产地,栖息地726hail n.冰雹727hallmark n.标志,特征728halt n./vt.(使)停止729hamper vt.妨碍,使困难730handicraft n.手工艺品731hands-on亲手抓的732harden v.使变硬733hardware n.五金制品734harness vt.利用(河流、瀑布等)产生动力735haste n.匆忙,急忙;草率736hatch vt.孵化737haunt vt.(思想、回忆等)萦绕心头738haunted adj.闹鬼的,鬼魂出没的,受到折磨的739haven n.避难所,安全地740hazard n.危险;危害物741heed n./v.注意,留意742heel n.脚后跟743helium n.氦744hem n.(衣服或裙子)褶边,边缘745hemisphere n.半球;半脑746herald vt.宣布…的消息;预示…的来临747herculean adj.力大无比的, 巨大的748herd n.兽群;人群749heritage n.遗产,继承物;传统750heterogeneous adj.异类的,不同的751hibernation n.冬眠752hierarchy n.阶层,等级制度753highlight vt.使显著,突出754hinge n.(门等)铰链,枢纽755hinterland n.穷乡僻壤;腹地756hold a large stake词组拥有巨额股份,带有极大冒险性757hollow adj.空心的,凹陷的758homogeneous adj.同类的;均匀的,同质的759horizon n.地平线;眼界,视野760horizontal adj.水平的761hostile adj.敌对的,不友好的762huddle vi.缩成一团;挤成一团763hummingbird n.蜂鸟764hurl vt.用力投掷765hydrogen n.氢766hypersensitive adj.高灵敏度的;感觉过敏的767hypothesis n.假设,假说768iceberg n.冰山769ice sheet词组冰层770icicle n.冰柱,冰垂771icon n.圣像,偶像772identical adj.同一的;完全相同的773identify vt.识别,认出;鉴定774identifiable adj.可辨认的775identity n.身份776ideology n.意识形态777idiom n.方言,土语;习惯用语778igneous adj.(地理)火的,火成的779illuminate v.照明,照亮780illumination n.照明;启发781illusion n.幻觉;错觉782illustrate vt.(用图或例子)说明,阐明783imaginative adj.富于想象力的784imaginary adj.想象中的,虚构的785imbibe v.吸;吸收786imitation n.模仿;仿制品787immense adj.巨大的;无边的788immobilize vt.使不动,使固定789immune adj.(对…)免疫的,不受影响的790immunity n.免疫,免疫性791impact n.影响792impair vt.损害,使弱793impart vt.传授;传递,传达794impediment n.妨碍,阻碍(物)795imperative adj.必要的;强制的796impermeable adj.不可渗透的;不透水的797impersonal adj.不受个人感情支配的,客观的,无私的798impersonate vt.模仿,扮演799impersonation n.模仿,扮演800impetus n.推动力;激励物801implement n.工具,器具802implication n.暗示,意义803implicit adj.不明确的,含蓄的804impose vt.把…强加于;施加影响805imposing adj.使人难忘的, 壮丽的806impressive adj.给人深刻印象的;威严的807imprint n.印痕,痕迹;深刻的印象808imprisonment n.监禁809improvise vt.即席创作,即兴表演810improvision n.即席创作811in accord with词组与…一致812in common词组共有,有共同之处813in scale词组相称,成比例814in terms of词组根据;就…而论815inaccessible adj.难达到的,不可及的;不能得到的816inactivate vt.使…不活跃817inadequate adj.不充分的,不适当的818inappropriate adj.不适当的,不相称的819incapacitate vt.使失去能力;使不胜任820incessant adj.不停的,连续的821incident n.事件822inclination n.嗜好,倾向823incongruity n.不一致,不和谐824incongruous adj.不协调的,不一致的825incorpoarate vt.合并,并入;包含826incredible adj.难以置信的,惊人的827indent vt.切割成锯齿状828indicate vt.指示,指出;象征,表明829indispensable adj.不可缺少的,必需的830individualism n.个人主义831inducible adj.可诱导的832industrialization n.工业化833industrialized vt.工业化的834inevitably adv.不可避免地,必然地835inextricably adv.无法摆脱地836infection n.传染(病)837inferiority n.自卑感838infest vt.骚扰,大批滋生839inflation n.通货膨胀840inflict vt.造成;(使)遭受(痛苦、损伤等) 841influx n.流入,汇集842ingenious adj.机灵的,有独创性的843ingeniously adv.天才地,独创地844ingredient n.配料,成份845inhabit vt.居住于,栖息于846inhabitant n.居民,住户847inherit vt.继承848inhibit vt.抑制;阻止849innumerable adj.无数的,数不清的850insanity n.精神错乱,疯狂851insight n.洞察力,见识852insistence n.坚持853inspection n.检查,细看854inspire vt.鼓舞;给…以灵感855inspiration n.灵感856instantaneous adj.瞬间的,即刻的857instinctive adj.天生的,本能的858instinctively adv.本能地;凭直觉地859institution n.机构;惯例860institutionalize v.使制度化861instructive adj.有益的;教育性的862instrumentalist n.器乐家,器乐演奏者863insulation n.绝缘;隔离;孤立864insulting adj.侮辱性的,欺负人的865insurmountable adj.不能克服的,不能超越的866intact adj.尚未被人碰到的,完整的867integral adj.整体的;构成整体所需的868integrate vt.使成为整体,使一体化869integrated adj.整合的,一体化的870intelligible adj.明了的,可理解的871intense adj.强烈的,剧烈的872intensive adj.加强的;集中的,密集的873interaction n.相互作用874interact vi.互相作用,互相影响875interconnected adj.相互连接的876interconnecting adj.相互连接的877interdependence n.互相依赖878interdependent adj.相互依赖的,互助的879interference n.冲突;干涉880interior n./adj.内部(的)881interlocking adj.连锁的,关联的882interpersonal adj.人与人之间的;关于人与人之间关系的883interpretation n.解释884interrupt vt.打断,使中断885interstellar adj.星际的886interval n.间隔时间887intervention n.干涉,介入888intimacy n.亲密,熟悉889intoxication n.陶醉,醉酒890intricate adj.复杂的,错综的891intricately adv.杂乱地892intriguing adj.吸引人的,引起兴趣(或好奇心)的893intrinsic adj.固有的,内在的894intrusion n.侵扰,干扰895intruder n.入侵者,闯入者896intruding adj.入侵性的897invade vt.侵略,侵犯898inventory n.存货清单;库存品899invertebrate n./adj.无脊椎动物(的)900ion n.离子901irresistible adj.无法抗拒的,无法抵抗的;诱人的902irreverent adj.不敬的903irreverence n.不敬;不敬的行为904irreversible adj.不可改变的;不可撤销的905irrevocable adj.不能取消的906irrigate vt.灌溉907irrigation n.灌溉908isolated adj.与世隔绝的,偏僻的;孤独的909isolation n.隔离;孤立910jealousy n.妒忌,羡慕911jellyfish n.水母912jibe with词组与…一致913jolting adj.令人震惊的914journalism n.新闻业, 报章杂志915junction n.连接;汇合处916jury n.陪审团917juxtaposition n.毗邻,并置,并列918keen adj.(感觉、观察、理解等)敏锐的,敏捷的919kennel n.狗舍,狗窝920kernel n.仁,核心;(去壳的)麦粒,谷粒921kerosene n.煤油922kinetic adj.运动的;动力学的923laborious adj.费力的,艰难的924labyrinth n.迷宫;错综复杂的事件925lament vt.为…悲痛,痛惜926landmass n.大片陆地927landscape n.风景,山水;风景画928landslide n.山崩929laser n.激光930latitude n.纬度,范围931lava n.熔岩,岩浆932lave vt.为沐浴, 洗933layer n.层,层次;阶层934layman n.俗人,犯人;外行935lease n.租约936ledge n.壁架, 架状突出物, 暗礁, 矿层937legacy n.遗产,遗物938legume n.豆类,豆荚939lengthen vt.延长,使变长940lettuce n.莴苣,生菜941light bulb词组灯泡942limestone n.石灰石943linger vi.逗留;徘徊944livelihood n.生计,谋生945living quarters词组住房,住处946locomote v.移动,行动947locomotion n.运动,移动948locomotive n.火车头949log n.圆木;航海日志;vt. 记录950long-range词组远程的951loom n.织布机952lore n.口头传说;学问,知识953lumber n.木材,木料954luminosity n.亮度,发光度955luminous adj.发光的;明亮的956lure vt.引诱,诱惑957lyric n.抒情诗;歌词958magnify vt.放大,扩大959magnitude n.大小,光度,重要960maize n.玉米961majestic adj.壮观的,庄严的962majority n.多数963makeup n.组成,结构964mallet n.槌棒965malleable adj.可锻的,可塑的,可延展的966malleability n.可锻性,可塑性,延展性967mammal n.哺乳动物968mammoth n.猛犸象969maneuver vt.(敏捷地)操纵;(用策略)调动970mania n.狂热971manifestation n.表现,显示972manipulate vt.操作;操纵,利用973mansion n.大厦;公寓974mantle n.地幔;覆盖物975margin n.边缘;余地976marine adj.海的,航海的,海产的977maritime adj.海上的,海事的978markedly adv.显著地,明显地979marrow cavity n.骨髓腔980mask n.面具981masonry n.石工术;石匠职业982massive adj.大而重的,庞大的;可观的983masterpiece n.杰作,名著984mate v.结伴,成配偶985meager adj.缺乏的,不足的986measures n.措施,方法987mechanical adj.机械的;机械性的,呆板的988mechanism n.机械;机理,运作机制989media n.媒体990medium n.媒体,媒介;方法991memorial n.纪念物992mercantile adj.商业的,贸易的993merchandise n.商品994metabolic adj.新陈代谢的995meteorite n.陨星,陨石996meteorologist n.气象学者997meticulous adj.一丝不苟的,过细的998metropolitan adj.主要都市的,大城市的999microorganism n.微生物1000microscope n.显微镜1001microscopic adj.用显微镜可见的;极小的1002microwave n.微波(炉)1003migrate vi.移动,迁徙1004migration n.定期迁移;迁居1005milestone n.里程碑;划时代的事件1006millennia n.一千年,千禧年1007mimetic adj.模仿的,(生物)拟态的1008mingle v.(使)混合1009mingling adj.混合的1010miniature adj.微型的,缩小的1011minimize v.最小化,减到最小1012minuscule adj.极小的1013minute adj.微小的1014miraculous adj.奇迹的,不可思议的1015mobility n.流动性;灵活性1016mock v.(模仿性的)嘲笑1017modify vt.修改,变更1018moisture n.潮湿,湿气;湿度1019molecule n.分子1020molecular adj.分子的1021molten adj.熔融的,熔化的1022monochromatic adj.单色的,一色的1023monopolize vt.独占,垄断1024monument n.纪念碑;纪念物1025morale n.士气1026morphololgy n.形态学,形态论1027motif n.(作品)主题,主旨1028motivation n.动机,刺激1029mud mortar词组灰泥浆1030multi-faceted adj.多方面的;多才多艺的1031multiple adj.多样的,多重的1032multiply v.繁殖,增加1033multistory n.多层建筑1034multitude n.大量,多数1035mundane adj.世俗的,平凡的1036municipal adj.市的,市政的1037muscular adj.强壮的,肌肉发达的1038myriad n.许多,无数1039mysterious adj.神秘的1040myth n.神话,神话故事1041mythology n.(总称)神话1042narcotic adj.麻醉的,催眠的;n. 麻醉剂1043narrator n.讲述者1044native to词组土生土长的1045neat adj.整洁的;整齐的1046needy adj.贫穷的,生活艰辛的1047neoclassical adj.新古典主义的1048neon n.[化]氖;霓虹灯1049nerve cord词组脊髓1050spinal cord词组脊髓1051neuron n.神经元,神经细胞1052neutron n.中子1053niche n.壁龛1054nickel n.镍;镍币1055nonconformist adj./n.不遵照传统生活的(人)1056nontraditional adj不遵照传统生活的1057nostalgia n.思家病,怀旧1058not…so much as…词组与其…还不如…1059not as yet词组迄今为止,还没有1060notch n.刻痕1061note n.音符1062notorious adj.臭名昭著的,声名狼藉的1063notoriously adv.声名狼藉地1064noxious adj.有害的,有毒的1065nuclei n.核子;核心1066nucleus n.合子,核心1067object to词组反对1068obscure vt.隐藏,使…模糊1069obsessed adj.心神不宁的,鬼迷心窍的,沉迷的1070obstacle n.障碍1071occurrence n.事件;发生1072of scale词组大规模的1073offshore adj.离岸的, 海面上的1074offspring n.子孙,后代1075olfactory adj.嗅觉的1076onset n.开始1077onslaught n.冲击;猛攻1078opaque adj.不透明的;晦涩难懂的1079optical adj.视觉的;光学的1080optimal adj.最佳的,最理想的1081optimum adj.最适宜的1082orchid n.兰花1083ore n.矿石1084organically adv.器官上地, 有机地,有组织地1085organism n.生物,有机物1086orientation n.定向;介绍性指导1087originality n.创意,新奇1088originate vt.发生;发起,创办1089ornament n.装饰;装饰物1090ornamentation n.装饰;装饰品1091ornamental adj.装饰的1092ounce n.盎司1093outbreak n.发作;爆发1094outlet n.(河流、烟等)出口1095output n.输出,产品;生产量1096oval adj.卵形的,椭圆的1097overlap vt.部分重叠,与…交搭,迭盖1098overlapping adj./n.交迭(的)1099overload vt.使超载,使超过负荷1100oversee vt.监督,管理1101overtax vt.课税过重1102overwhelm vt.战胜;压倒1103overwhelmingly adv.压倒性地;不可抵抗地1104pack vt.装;将…挤入,塞满1105packed adj.压紧的,压实的1106painstaking adj.辛苦的,辛勤的1107pane n.窗格玻璃1108panel n.镶板1109panic n.恐慌1110pants n.裤子;短裤1111paralysis n.瘫痪,中风1112paramount adj.最重要的;最高权力的1113paraphrase vt.将…释义,改写1114parasite n.寄生虫,食客1115particle n.颗粒,微粒1116pasture n.牧场,草地1117patent n.专利1118pathogen n.病菌,病原体1119patrol v.巡逻,巡视1120patron n.赞助人,资助人1121patronage n.赞助;惠顾1122pebble n.小鹅卵石1123peculiarity n.特性,怪癖1124pendant n.垂饰;下垂物1125penetrate vt.穿透;渗透1126penetrating adj.(声音)响亮的,尖锐的1127peninsula n.半岛1128perceive vt.感知;察觉,发觉1129perception n.理解;感知,感觉1130percussion n.打击乐器;震荡,影响1131peripheral adj.周边的,外围的1132perishable adj.(尤指食物)易腐的,易坏的1133permeate vt.弥漫;渗透,透过1134perpetuate vt.使…延续,使永存1135perplexing adj.使人困惑的;令人费解的1136persist vi.坚持;持续1137perspective n.(判断事物的)角度,方法,观点1138pertinent adj.相关的,切题的;中肯的1139pest n.害虫;令人讨厌的人或物1140petal n.花瓣1141pigment n.色素,颜料1142pillow n.枕头1143pine n.松树1144pit n.坑,地坑;煤矿1145pivotal adj.枢轴的,关键的1146a pivotal figure词组关键人物1147plank n.厚木板1148plaster n.灰泥,石膏1149plate n.盘子;版图;大片平面1150platitude n.陈词滥调1151pliable adj.易弯的,柔软的1152plight n.(恶劣的)情势,困境1153plumbing n.(供水)管道系统1154polarize vt.使极化,使两极分化1155pollination n.授粉1156pollen n.花粉1157pollinator n.传粉媒介,传粉昆虫1158pollutant n.污染物质1159popular tune词组流行歌曲1160portable adj.编携的,手提的;轻便的1161portend vt.预兆,预示1162portion n.一部分;部分1163positive adj.(电)阳极的1164possess vt.拥有,占有1165possession n.拥有,占有;财产1166postal service词组邮政服务1167postdate vt.填迟…的日期1168antedate vt.填早...的日期。

防假货管控处理流程

防假货管控处理流程

防假货管控处理流程英文回答:As a professional in the field of anti-counterfeiting, I am well-versed in the process of managing and controlling fake goods. One of the key steps in this process is to establish a robust system for monitoring and detecting counterfeit products. This involves working closely with law enforcement agencies, conducting regular audits of supply chains, and implementing strict quality control measures.For example, in my previous role at a luxury fashion brand, we implemented a multi-layered approach to prevent counterfeiting. This included using unique serial numbers on all products, conducting surprise inspections at manufacturing facilities, and collaborating with customs officials to intercept counterfeit goods at borders.In addition to monitoring and detection, it is crucialto have a clear protocol for handling counterfeit goods once they are identified. This may involve seizing the fake products, conducting investigations to track down the source of the counterfeits, and taking legal action against those responsible.Furthermore, educating consumers about the risks of purchasing counterfeit goods is an important part of the anti-counterfeiting process. By raising awareness about the dangers of fake products, we can help protect consumers from potential harm and discourage the demand for counterfeit goods.Overall, effective management and control of fake goods require a comprehensive strategy that includes monitoring, detection, enforcement, and education. By implementing these measures, we can work towards reducing the prevalence of counterfeit products in the market.中文回答:作为一名防伪领域的专业人士,我对防止和控制假货的过程非常了解。

IND930 IND970工业称量终端说明书

IND930 IND970工业称量终端说明书

IND930/IND970 Terminal Increase Process Control Connectivity & Visibility User Friendly Interface Optimal Process ProtectionI N D 930/970 I n d u s t r i a l T e r m i n a lProcess Control, Connectivity and ProtectionTailored to Your Workplaceand offers an intuitive menu structure.Choose the IND930/IND970 to:• Increase process control and productivity by using a wide range of weighing- and custom applications• Increase connectivity and visibility for informed steering of the production process • Reduce and resolve human errors with a user-friendly interface• Maximize the protection for your weighing process with advanced security options/IND930/IND970Benefit from software applications designed for your key processes includingstatistical quality control and formulation solutions or create custom applica-tions with INDpro to 100% fit your processes. See an increase in throughput,consistency in production and reduced cost off errors.Seamless data integration enables advanced traceability and allows formore transparency in your processes. Gain a competitive edge with theability to analyze the full picture and make improvements to your weighingprocesses.Enable your workforce with intuitive workstations. Graphical interfaces andINDpro guide operators to allow for error-free production. Effectively operateHow CouldYour OperationBenefit from theIND930/IND970?IncreaseProcessControl100%Connectivity &VisibilityUser FriendlyInterfaceOptimalProcessProtection IND930 with colorWeight bar graph IND970 weighing screen and IND970 Elo-BoxIT ProtectionState-of-the-art security options pre-vent the installation of malware and re-strict critical parts of the system from unwanted modification.Ready to connectSeamless integration options into PLC, MES, ERP and web-based systems en-able operational transparency for in-formed decision making.Q u a l i t yF o r m u l a t i o n V i s i b i l i t yC u s t o m A p p sSelect Your Solution:Powerful Statistical Quality Control and IND930 SQC statistical quality and process control solutions allow you to control and fine-tune the production process monitoring critical process parameters constantly.`/SQCSmart FormulationComplete control over recipe management and material dispensing process prevents operator er-rors and material waste, resulting in greater profit-ability and predictable manufacturing results.Form+ and solutions simplify your complex and demanding formulation needs.`/FormplusComplete Process MonitoringCollect+ data collection and visualization software can bring a new perspective to your processes by graphically representing process trends and en-abling you to make informed business decisions.`/CollectplusCustomized Programs Boosting Your Productivity Increase production throughput, speed up operator training and reduce errors with INDpro based soft-ware designed for your specific process.`/IND930 `/IND970I N D 930/970 I n d u s t r i a l T e r m i n a lTechnical SpecificationsIND930/IND970DescriptionIND930 compactIND970 Human machine interfaceIND970 Elo-BoxSupported Applications and Features FreeWeigh, FormWeigh, Base pac , COM pac, INDpro (Tool for custom application programing)FreeWeigh, FormWeigh, Base pac , COM pac, INDpro (Tool for custom application programing)-EnclosureDesk: 259x320x241mm Panel: 221x311x94mmDesk 15/19”:353×490×301mm Panel 15”: 320×480×51mm Panel 19”: 320×480×68mm254x132x400mmDispatch Weight Desk: 5.5 kg Panel: 4.5 kgDesk: 11.4 kg Panel: 8.5 kg6.3 kgOperating environment –10°C to 40° C (14 ° to 104 ° F), at 10 % to 85 % relative humidity, non-condensing Power supply unit Wide-range power supply unit: 100 – 240 V AC, 50/60 Hz, with country-specific power line Processor type N2807 / 1.83GH-mITX, i3-6100TERAM memory 4 GB- 4 GBIP rating IP69kDisplay 10”, 1280x800, TFT LED back-light15” or 19”, 1280x800 TFT LEDbacklight -Keypadtouchscreen15”: membrane keypad, 38 keyswith numeric keypads navigation keys, function keys and scale function keys 19”: ON/OFF key, touchscreenOperating system Windows 10 Iot Enterprise includes device lockdown features e.g. mass storage blocking (USB sticks),Windows desktop protection, Windows update, Defender, etc.Supported scale types Up to 4 scales: Analog, IDNet,SICS, SICSpro -Up to 4 scales: Analog, IDNet,SICS, SICSpro Data interfaces RS232, RS422, RS485, USB,4 I/O, ProfibusUSBRS232, RS422, RS485, USB,4 I/OProtocolls ASCII input, Continuous template, CTPZ, Demand output, Keyboard input, SICS, MMR, Toledo continuo-us, Toledo short Continuous, SAIUnitsg, kg, lb, oz, ozt, dwt, t, custom unitApplication pacs Base, COM, API, INDpro-Base, COM, API, INDproMore information:`/IND930 / /IND970DimensionsIND930 – desk versionIND930 – panel versionIND970-19” – desk version IND970-19” – panel versionIND970-15” – desk version IND970-15” – panel versionIND970 EloboxServices for Uptime, Performance, Compliance and Expertise Visit our Expertise Library to download and view a variety of resources, including:• Guides • Videos • Webinars • And More!` /libraryDiscover the Latest Industry KnowledgeFor more informationMETTLER TOLEDO Group Industrial DivisionLocal contact: /contactsSubject to technical changes©05/2019 METTLER TOLEDO. All rights reserved Document No. 30454355 A。

新产品转量产质控预防流程英文

新产品转量产质控预防流程英文

新产品转量产质控预防流程英文English:The process of transitioning a new product from development to full-scale production involves several important quality control and preventive measures to ensure a smooth and successful transition. Firstly, it is crucial to conduct a thorough validation of the production process to ensure that all equipment and systems are functioning properly and capable of consistently producing high-quality products. This may involve conducting equipment qualifications, process validations, and establishing critical quality parameters. Secondly, it is important to establish a robust quality control system to monitor the production process and detect any deviations or non-conformances early on. This may involve implementing in-process checks, regular sampling and testing, as well as continuous monitoring of key process indicators. Thirdly, it is essential to implement preventive maintenance programs to ensure that all equipment and machinery are properly maintained and serviced to prevent unexpected breakdowns and production delays. This may involve establishing regular maintenance schedules,conducting routine inspections, and training production staff on proper equipment maintenance. Additionally, it is important to establish clear Standard Operating Procedures (SOPs) and work instructions for all production processes to ensure consistency and adherence to quality standards. Finally, ongoing monitoring, analysis, and continuous improvement efforts should be implemented to ensure that the production process remains in control and capable of consistently meeting quality requirements.中文翻译:将新产品从开发转向批量生产的过程涉及到几个重要的质量控制和预防措施,以确保平稳而成功地完成转换。

  1. 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
  2. 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
  3. 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。

Fine-grained Control of Security CapabilitiesDan BonehComputer Science Department,Stanford University.dabo@andXuhua DingDepartment of Information and Computer Science,University of California,Irvine.xhd-ing@andGene TsudikDepartment of Information and Computer Science,University of California,Irvine. gts@We present a new approach forfine-grained control over users’security privileges(fast revocation of credentials)centered around the concept of an on-line semi-trusted mediator(SEM).The use of a SEM in conjunction with a simple threshold variant of the RSA cryptosystem(mediated RSA) offers a number of practical advantages over current revocation techniques.The benefits include simplified validation of digital signatures,efficient certificate revocation for legacy systems and fast revocation of signature and decryption capabilities.This paper discusses both the architecture and the implementation of our approach as well as its performance and compatibility with the existing infrastructure.Experimental results demonstrate its practical aspects.Categories and Subject Descriptors:E.3.3[Data]:Data Encryption—Public Key Cryptosystems; K.6.5[Management of Computing and Information Systems]:Security and Protection General Terms:Algorithms,SecurityAdditional Key Words and Phrases:Certificate Revocation,Digital Signatures,Public Key In-frastructure1.INTRODUCTIONWe begin this paper with an example to illustrate the premise for this work.Con-sider an organization–industrial,government,or military–where all employees (referred to as users)have certain authorizations.We assume that a Public Key Infrastructure(PKI)is available and all users have digital signature,as well as en/de-cryption,capabilities.In the course of performing routine everyday tasks, users take advantage of secure applications,such as email,file transfer,remote log-in and web browsing.This work was supported by the Defense Advanced Project Agency(DARPA)under contract F30602-99-1-0530.An earlier version of this paper was presented,in part,at the2001Usenix Security Symposium. Permission to make digital/hard copy of all or part of this material without fee for personal or classroom use provided that the copies are not made or distributed for profit or commercial advantage,the ACM copyright/server notice,the title of the publication,and its date appear,and notice is given that copying is by permission of the ACM,Inc.To copy otherwise,to republish, to post on servers,or to redistribute to lists requires prior specific permission and/or a fee.c 20YY ACM0000-0000/20YY/0000-0001$5.00ACM Journal Name,Vol.V,No.N,Month20YY,Pages1–0??.2·Now suppose that a trusted user(Alice)does something that warrants immediate revocation of her security privileges.For example,Alice might befired,or she may suspect that her private key has been compromised.Ideally,immediately following revocation,the key holder,either Alice herself or an attacker,should be unable to perform any security operations and use any secure applications.Specifically,this might mean:–The key holder cannot read any secure email.This includes encrypted email that already resides on Alice’s email server(or local host)and possible future email erroneously encrypted for Alice.Although encrypted email may be delivered to Alice’s email server,the key holder should be unable to decrypt it.–The key holder cannot generate valid digital signatures on any further messages.However,signatures generated by Alice prior to revocation may need to remain valid.–The key holder cannot authenticate itself to corporate servers(and other users) as a legitimate user.Throughout the paper,we use email as an example application.While it is a popular mechanism for general-purpose communication,our rationale also applies to other secure means of information exchange.To provide immediate revocation it is natural tofirst consider traditional re-vocation techniques.Many revocation methods have been proposed;they can be roughly classified into two prominent types:1)explicit revocation structures such as Certificate Revocation Lists(CRLs)and variations on the theme,and2)real time revocation checking such as the Online Certificate Status Protocol(OCSP) [23]and its variants.In both cases,some trusted entities are ultimately in charge of validating user certificates.However,the above requirements for immediate revo-cation are impossible to satisfy with existing techniques.This is primarily because they do not providefine-grained enough control over users’security capabilities. Supporting immediate revocation with existing revocation techniques would result in heavy performance cost and very poor scalability,as discussed in Section8.As pointed out in[22],since each revocation technique exhibits a unique set of pros and cons,the criteria for choosing the best technique should be based on the specifics of the target application environment.Fast revocation andfine-grained control over users’security capabilities are the motivating factors for our work. However,the need for these features is clearly not universal since many computing environments(e.g.,a typical university campus)are relatively“relaxed”and do not warrant employing fast revocation techniques.However,there are plenty of government,corporate and military settings where fast revocation andfine-grained control are very important.Organization.This paper is organized as follows.The next section provides an overview of our work.The technical details of the architecture are presented in Section3and Section4,respectively.Then,Section5shows four extensions. Sections6and7,describe the implementation and performance results,respectively.A comparison of with current revocation techniques is presented Section8,followed by the overview of related work in Section8.2and a summary in Section9.ACM Journal Name,Vol.V,No.N,Month20YY.·3 2.OVERVIEWWe refer to our approach as the SEM architecture.The basic idea is as fol-lows:We introduce a new entity,referred to as a SEM(SEcurity Mediator):an online semi-trusted server.To sign or decrypt a message,a client mustfirst ob-tain a message-specific token from its SEM.Without this token,the user cannot accomplish the intended task.To revoke the user’s ability to sign or decrypt,the security administrator instructs the SEM to stop issuing tokens for that user’s fu-ture request.At that instant,the user’s signature and/or decryption capabilities are revoked.For scalability reasons,a single SEM serves many users.We stress that the SEM architecture is transparent to non-SEM users,i.e.,a SEM is not involved in encryption or signature verification operations.With SEM’s help, a SEM client(Alice)can generate standard RSA signatures,and decrypt standard ciphertext messages encrypted with her RSA public key.Without SEM’s help,she cannot perform either of these operations.This backwards compatibility is one of our main design principles.Another notable feature is that a SEM is not a fully trusted entity.It keeps no client secrets and all SEM computations are checkable by its clients.However, a SEM is partially trusted since each signature verifier implicitly trusts it to have checked the signer’s(SEM’s client’s)certificate status at signature generation time. Similarly,each encryptor trusts a SEM to check the decryptor’s(SEM’s client’s) certificate status at message decryption time.We consider this level of trust rea-sonable,especially since a SEM serves a multitude of clients and thus represents an organization(or a group).In order to experiment and gain practical experience,we prototyped the SEM architecture using the popular OpenSSL library.SEM is implemented as a daemon process running on a secure server.On the client side,we built plug-ins for the Eudora and Outlook email clients for signing outgoing,and decrypting incoming, emails.Both of these tasks are performed with the SEM’s help.Consequently, signing and decryption capabilities can be easily revoked.It is natural to ask whether the same functionality can be obtained with more tra-ditional security approaches tofine-grained control and fast credential revocation, such as Kerberos.Kerberos[25],after all,has been in existence since the mid-80s and tends to work very well in corporate-style settings.However,Kerberos is awkward in heterogeneous networks such as the Internet;its inter-realm extensions are difficult to use and require a certain amount of manual setup.Furthermore, Kerberos does not inter-operate with modern PKI-s and does not provide univer-sal origin authentication offered by public key signatures.On the other hand,the SEM architecture is fully compatible with existing PKI systems.In addition,the SEM is only responsible for revocation.Unlike a Kerberos server,the SEM cannot forge user signatures or decrypt messages intended for users.As we discuss later in the paper,our approach is not mutually exclusive with Kerberos-like intra-domain security architectures.We assert that the SEM architecture can be viewed as a set of complementary security services.ACM Journal Name,Vol.V,No.N,Month20YY.4·2.1Decryption and signing in the SEM architectureWe now describe in more detail how decryption and digital signature generation are performed in the SEM architecture:–Decryption:suppose that Alice wants to decrypt an email message using her private key.Recall that public key-encrypted email is usually composed of two parts:(1)a short preamble containing a per-message key encrypted with Alice’s public key,and(2)the body containing the actual email message encrypted using the per-message key.To decrypt,Alicefirst sends the preamble to her SEM.SEM responds with a token which enables Alice to complete the decryption of the per-message key and,ultimately,to read her email.However,this token contains no information useful to anyone other than Alice.Hence,communication with the SEM does not need to be secret or authenticated.Also,interaction with the SEM is fully managed by Alice’s email reader and does not require any intervention on Alice’s part.If Alice wants to read her email offline,the interaction with the SEM takes places at the time Alice’s email client downloads her email from the mail server.–Signatures:suppose that Alice wishes to sign a message using her private key. She sends a(randomized)hash of the message to her SEM which,in turn,responds with a token(also referred to as a half-signature)enabling Alice to generate the signature.As with decryption,this token contains no useful information to anyone other than Alice.2.2Other FeaturesOur initial motivation for introducing a SEM is to enable immediate revocation of Alice’s public key.As a byproduct,the SEM architecture provides additional ben-efits.In particular,validation of signatures generated with the help of a SEM does not require the verifier to consult a CRL or a revocation authority:the existence of the a verifiable signature implies that the signer was not revoked at the time the signature was generated.Consequently,signature validation is greatly simplified. More importantly,the SEM architecture enables revocation in legacy systems that do not support certificate revocation.Consider a legacy system performing digital signature verification.Often,such systems have no certificate status checking ca-pabilities.For example,old browsers(e.g.,Netscape3.0)verify server certificates without any means for checking certificate revocation status.Similarly,Microsoft’s Authenticode system in Windows NT(used for verifying signatures on executable code)does not support certificate revocation.In the SEM architecture,certificate revocation is provided without requiring any change to the verification process in such legacy systems.The only aspect that needs changing is signature genera-tion.Fortunately,in many settings(such as code signing)the number of entities generating signatures is significantly smaller than that of entities verifying them. Semantics.The SEM architecture naturally provides the following semantics for digital signatures:Binding Signature Semantics:a digital signature is considered validif the public key certificate associated with the private key used to gen-erate the signature was valid at the time the signature was issued.ACM Journal Name,Vol.V,No.N,Month20YY.·5 According to this definition,all verifiable signatures–by virtue of their existence –are generated prior to revocation and,hence,are considered valid.Binding sig-nature semantics are natural in many settings,such as business contracts.For example,suppose Alice and Bob enter into a contract.They both sign the contract at time T.Bob begins to fulfill the contract and incurs certain costs in the process. Now,suppose at time T >T,Alice revokes her own certificate(e.g.,by“losing”her private key).Is the contract valid at time T ?With binding semantics,Alice is still bound to the contract since it was signed at time T when her certificate was still valid.In other words,Alice cannot nullify the contract by causing her own certificate to be revoked.We note that binding semantics are inappropriate in some scenarios.For example,if a certificate is obtained from a CA under false pretense,e.g.,Alice masquerading as Bob,the CA should be allowed to declare at any time that all signatures generated with that certificate are invalid. Implementing binding signature semantics with existing revocation techniques is non-trivial,as discussed in Section8.Whenever Bob verifies a signature generated by Alice,Bob must also check that Alice’s certificate was valid at the time the signature was generated.In fact,every verifier of Alice’s signature must perform this certificate validation step.Note that,unless a trusted time-stamping service is involved in generating all of Alice’s signatures,Bob cannot trust the timestamp included by Alice in her signatures.Not surprisingly,implementing binding semantics with the SEM architecture is trivial.To validate Alice’s signature,a verifier need only verify the signature itself. There is no need to check the status of Alice’s certificate.(We are assuming here that revocation of Alice’s key is equivalent to revocation of Alice’s certificate.In general,however,Alice’s certificate may encode many rights,not just the right to use her key(s).It is then possible to revoke only some of these rights while not revoking the entire certificate.)Once Alice’s certificate is revoked,she can no longer generate valid signatures.Therefore,the mere existence of a valid signature implies that Alice’s certificate was valid at the time the signature was issued.3.MEDIATED RSAWe now describe in detail how a SEM interacts with clients to generate tokens. The SEM architecture is based on a variant of RSA which we call Mediated RSA (mRSA).The main idea is to split each RSA private key into two parts using simple 2-out-of-2threshold RSA[14;7].One part is given to a client and the other is given to a SEM.If the client and its SEM cooperate,they employ their respective half-keys in a way that is functionally equivalent to(and indistinguishable from)standard RSA.The fact that the private key is not held in its entirety by any one party is transparent to the outside world,i.e.,to the those who use the corresponding public key.Also,knowledge of a half-key cannot be used to derive the entire private key. Therefore,neither the client nor the SEM can decrypt or sign a message without mutual consent.(Recall that a single SEM serves many clients.)The mRSA method is composed of three algorithms:mRSA key generation, mRSA signatures,and mRSA decryption.We present them in the next section.ACM Journal Name,Vol.V,No.N,Month20YY.6·3.1mRSA Key GenerationSimilar to RSA,each client U i has a unique public key and private key.The public key P K i includes n i and e i,where the former is a product of two large distinct primes(p i,q i)and e i is an integer relatively prime toφ(n i)=(p i−1)(q i−1). Logically,there is also a corresponding RSA private key SK i=(n i,d i)where d i∗e i=1modφ(n i).However,as mentioned above,no one party has possessionof d i.Instead,d i is effectively split into two parts:d u i and d semi which are secretlyheld by the client U i and a SEM,respectively.The relationship among them is:d i=d semi+d u i modφ(n i)Unlike plain RSA,an individual client U i cannot generate its own mRSA keys. Instead,a trusted party(most likely,a CA)initializes and distributes the mRSA keys to clients.The policy for authenticating and authorizing clients’key generation requests is not discussed in this paper.Once a client’s request is received and approved,a CA executes the mRSA key generation algorithm described below.mRSA Key Setup.CA generates a distinct set:{p i,q i,e i,d i,d semi ,d u i}for U i.Thefirst four values are generated as in standard RSA.Thefifth value,d semi ,isa random integer in the interval[1,n i],where n i=p i q i.The last value is set as: d u i=d i−d semimodφ(n i).We show the protocol in Figure1.Algorithm:mRSA.key(executed by CA)Let k(even)be a security parameter(1)Generate random k/2-bit primes:p i,q i(2)n i←p i q i(3)e i r←Z∗φ(n i)(4)d i←1/e i modφ(n i)(5)d semi r←{1,...,ni−1}(6)d ui ←(d i−d semi)modφ(n i)(7)SK i←(n i,d ui)(8)P K i←(n i,e i)Fig.1.mRSA Key Generation AlgorithmAfter CA computes the above values,d semi is securely communicated to the SEMand d u i is communicated to U i.The details of this step are elaborated upon in Section6.3.2mRSA SignaturesAccording to PKCS1v2.1[18],RSA signature generation is composed of two steps: message encoding and cryptographic primitive computation.Thefirst step is pre-served in mRSA without any changes.However,the second step requires SEM’s involvement since,in mRSA,a client does not possess its entire private key.We denote by EC()and DC()the encoding and decoding functions,respectively. Both encodings include hashing the input message m using a collision resistant hash function.For now,we assume the message encoding function EC()is determin-istic.A user(U i)generates a signature on a message m as follows:ACM Journal Name,Vol.V,No.N,Month20YY.·71.Preprocessing:U i sends the message m to the SEM.putation:–SEM checks that U i is not revoked and,if so,computes a partial signature P S sem=EC(m)d semi mod n i and replies with it to the client.This P S sem isthe token enabling signature generation on message m.–Concurrently,U i computes P S u=EC(m)d u i mod n i3.Output:U i receives P S sem and computes S i(m)=(P S sem∗P S u)mod n i.Itthen verifies S i(m)as a standard RSA signature.(This step also verifies the SEM’s computation.)If the signature is valid,U i outputs it.The algorithm is shown in Figure 2.Algorithm mRSA.sign(executed by User and SEM)(1)USER:Send m to SEM.(2)In parallel:2.1.SEM:(a)If USER revoked return(ERROR);(b)P S sem←EC(m)d semi mod n iwhere EC()is the EMSA-PKCS1-v15encoding function,recommendedin[18].(c)send P S sem to USERER:(a)P S u←EC(m)d u i mod n i(3)USER:S←P S sem∗P S u mod n i(4)USER:Verify that S is a valid signature on m under the public key(N,e i).Ifnot then return(ERROR)(5)USER:return(m,S)Fig.2.mRSA Signature AlgorithmWe observe that the resulting mRSA and RSA signatures are indistinguishablesince:w d u i∗w d semi=w d i mod n.Consequently,the mRSA signature i=w d u i+d semgeneration process is transparent to eventual signature verifiers,since both the verification process and the signature format are identical to those in standard RSA.Security.We briefly discuss the security of the signature scheme of Figure2.At a high level,we require two properties:(1)the user cannot generate signatures after being revoked,and(2)the SEM cannot generate signatures on behalf of the user. For both properties we require existential unforgeability under a chosen message attack.Precise security models for this scheme(used in a slightly different context of multicative version of mRSA)can be found in[4]where a proof of security is given.Randomized encodings.Note that,we assumed above that the encoding pro-cedure EC()is deterministic,as in EMSA-PKCS1-v15[18]encoding and Full Domain Hash(FDH)encoding[3].If EC()is a randomized encoding,such as EMSA-PSS[18],we have to make sure both the user and SEM use the same ran-domness so that the resulting signature is valid.At the same time,to prevent theACM Journal Name,Vol.V,No.N,Month20YY.8·user from generating signatures without its help,the SEM has to ensure that the random bits used for the encoding are chosen independently at random.Therefore, we cannot simply let the user choose the randomness for the encoding.Instead,the user and the SEM must engage in a two-party coinflipping protocol to generate the required shared randomness.Neither party can bias the resulting random bits. Consequently,these bits can be used as the randomness needed for the encoding function.However,when using deterministic encoding,such as EMSA-PKCS1-v15, there is no need for this step.We note that in the above protocol the user sends the entire message m to the SEM in step(1).For privacy reasons,one might instead consider sending the digest EC(m)the SEM.This would eliminate the difficulty with randomized encodings mentioned above.Unfortunately,the resulting system cannot be shown as secure as the underlying RSA signature scheme.Specifically,when only sending EC(m) to SEM,we are unable to prove that the user cannot generate signatures after being revoked.The problem is that,while the user is not revoked,the SEM functions as an unrestricted RSA inversion oracle for the user.For example,the user can use the attack of[11]to generate signatures after being revoked.A proof of security is still possible,using a strong assumption on RSA:a variant of the“One-more RSA Assumption”[4].Nevertheless,when using EMSA-PKCS1-v15[18]encoding, which is only heuristically secure,it might befine to send EC(m)to the SEM. 3.3mRSA DecryptionRecall that PKCS1[18]stipulates that an input message m must be OAEP-encoded before carrying out the actual RSA encryption.We use EC oaep()and DC oaep() to denote OAEP encoding and decoding functions,respectively.The encryption process is identical to standard RSA,where c=EC oaep(m)e i mod n i for each client U i.Decryption,on the other hand,is very similar to mRSA signature generation described above.1.U i obtains encrypted message c and forwards it to its SEM.–SEM checks that U i is not revoked and,if so,computes a partial clear-text P C sem=c d semi mod n i and replies to the client.–concurrently,U i computes P C u=c d u i mod n i.2.U i receives P C sem and computes c =P C sem∗P C u mod n i.If OAEP decodingof c succeeds,U i outputs the clear-text m=DC oaep(c ).Security.We now briefly discuss the security of the mRSA decryption scheme shown in Figure3.At a high level,we require two properties:(1)the user cannot decrypt ciphertexts encrypted with the user’s public key after being revoked,and (2)the SEM cannot decrypt messages encrypted using the user’s public key.For both properties we require semantic security under a chosen-ciphertext attack.Un-fortunately,we cannot quite claim that the scheme above satisfies both properties. OAEP and it variants are designed to provide chosen ciphertext security for RSA encryption in the random oracle model.The protocol above provides chosen cipher-text security against an attacker who is neither the SEM nor the user.However, OAEP does not necessarily satisfy properties(1)and(2)above.The problem is that the user can employ the SEM as an RSA inversion oracle until the user is revoked.There is no way for the SEM to check whether a partial decryption it gen-ACM Journal Name,Vol.V,No.N,Month20YY.·9Algorithm:mRSA.decryption(executed by User and SEM)(1)USER:c←encrypted message(2)USER:send c to SEM(3)In parallel:3.1.SEM:(a)If USER revoked return(ERROR)(b)P C sem←c d semi mod n i(c)Send P C sem to USER U iER←c d u i mod n i(a)P C ui(4)USER:w←(P C sem∗P C u)mod n i(5)USER:OAEP decode w.If success,output m=DC oaep(w).Fig.3.mRSA Decryption Algorithmerates corresponds to a well-formed plaintext.However,as in the previous section, security can be proven in a weaker model under a strong assumption on RSA.(A detailed proof will be available in the extended version of this paper.)We note that one way to make sure that the user cannot decrypt messages with-out the help of the SEM would be to use a Chosen Ciphertext Secure threshold cryptosystem[28;8].However,this would render the resulting scheme incompati-ble with currently deployed encryption systems(based on PKCS1).3.4Notable FeaturesAs mentioned earlier,mRSA is only a slight modification of the RSA cryptosystem. However,at a higher level,mRSA affords some interesting features.CA-based Key Generation.Recall that,in a normal PKI setting with RSA,a pri-vate/public key-pair is always generated by its intended owner.In mRSA,a client’s key-pair is instead generated by a CA or some other trusted entity.Nonetheless, a CA only generates client’s keys and does not need to keep them.In fact,a CA must erase them to assure that any successful future attack on the CA does not result in client’s keys being compromised.In spite of that,having a trusted entity that generates private keys for a multitude of clients can be viewed as a liability. If CA-based key generation is undesirable then one can use a protocol of[5]to dis-tributively generate an RSA key between the SEM and the user.The downside is that this requires more work than letting the CA generate the key and give shares to the user and SEM.We note that CA-based key generation enables key escrow (provided that clients’keys are not erased after their out-of-band distribution). For example,if Alice isfired,her organization can still access Alice’s encrypted work-related data by obtaining her private key from the CA.Fast Revocation.The main point of mRSA is that the revocation problem is greatly simplified.In order to revoke a client’s public key,it suffices to notify that client’s SEM.Each SEM merely maintains a list of revoked clients which is consulted upon every service request.Our implementation uses standard X.509Certificate Revocation Lists(CRL’s)for this purpose.ACM Journal Name,Vol.V,No.N,Month20YY.10·Transparency.mRSA is completely transparent to entities encrypting data for mRSA clients and those verifying signatures produced by mRSA clients.To them, mRSA appears indistinguishable from standard RSA.Furthermore,mRSA certifi-cates are identical to standard RSA certificates.Thus,the SEM architecture is completely backwards compatible for the signature verifier and message encryptor. Coexistence.mRSA’s built-in revocation approach can co-exist with the tradi-tional,explicit revocation approaches.For example,a CRL-or a CRT-based scheme can be used in conjunction with mRSA in order to accommodate existing imple-mentations that require verifiers(and encryptors)to perform certificate revocation checks.CA Communication.in mRSA,a CA remains an off-line entity.mRSA cer-tificates,along with private half-keys are distributed to the client and SEM-s in an off-line manner.This follows the common certificate issuance and distribution paradigm.In fact,in our implementation(Section6)there is no need for the CA and the SEM to ever communicate directly.SEM Communication.mRSA does not require explicit authentication between a SEM and its clients.A client implicitly authenticates a SEM by verifying its own signature(or decryption)as described in Sections3.2and3.3.These signature and encryption verification steps assure the client of the validity of SEM’s replies.Al-though authentication of a client to a SEM is not required for the security of mRSA itself,it is needed for protection against denial-of-service attacks on a SEM.This can be easily accomplished with the authentication protocol described in Section5. Semi-trusted SEM.The SEM cannot issue messages on behalf of unrevoked users nor can it decrypt messages intended for unrevoked users.The worst-case damage caused by a compromise at the SEM is that users who were previously revoked can become unrevoked.This is similar to a compromise at a standard Revocation Authority which would enable the attacker to unrevoke revoked users.4.ARCHITECTUREThe overall architecture is made up of three components:CA,SEM,and clients.A typical organizational setup involves one CA,a small set of SEM-s and a multitude of clients.A CA governs a small number of SEM-s.Each SEM,in turn,serves many clients.(In Section5we show how a single client can be supported by multiple SEM-s.)The assignment of clients to SEM-s is assumed to be handled off-line by a security administrator.The CA component is a simple add-on to the existing CA and is thus still consid-ered an off-line entity.For each client,the CA component takes care of generating an RSA public key,the corresponding certificate and a pair of half-keys(one for the client and one for the SEM)which,when combined,form the RSA private key. The respective half-keys are then delivered,out-of-band,to the interested parties. The client component consists of the client library that provides the mRSA sig-nature and mRSA decryption operations.It also handles the installation of the client’s credentials at the local host.The SEM component is the critical part of the architecture.Since a single ACM Journal Name,Vol.V,No.N,Month20YY.。

相关文档
最新文档