VS010 Product Description
产品承认书.8doc之英文版规格书
产品承认书SPECIFICATION FOR APPROVAL客户名称（CUSTOMER）：客户料号（PART NO.）：客户品名（DESCRIPTION）：U T 品名（DESCRIPTION）： UT-MD070080 V.2 日期（DATE）： 2011.7.1CONTENTS contents (2)Change description (3)1. Scope of application (3)2. Product Function Description (3)3. Standard Signal Input (3)4. Work Temp (3)5. Storage Temp (3)6. Operate Power Requirements (3)7. Specification (4)8. Power supply (9)9. Electrical parameters (9)10. LCD Specifications (9)11. Electrical circuit (10)12. Basic operating instructions (10)13. Testing equipment (12)14. Function test (12)15. Reliability test (14)16. Outgoing inspection standards (14)1. Scope of applicationThis standard applies to production for：AT080TN42.AT080TN01.AT080TN03.AT070TN83V.3.AT070TN82 V.1. AT102TN01.AT102TN03.A101VW01..AT080TN52.AT070TN92LCD display module driver board UT-MD070080 V.2 Inspection。
V500DJ4-QS1+Approval+SPEC+V0_0_M1_20150514_1
SIGNATURE
Please return 1 copy for your confirmation with your signature and comments.
Approved By Chao-Chun Hung
Checked By Carlos Lee
Prepared By WT Hsu
PRODUCT SPECIFICATION
□ Tentative Specification □ Preliminary Specification ■ Ap源自roval Specification
MODEL NO.: V500DJ4 SUFFIX: QS1
Revision : M1 Customer : APPROVED BY
5. INPUT TERMINAL PIN ASSIGNMENT .................................................................................................................... 12 5.1 TFT LCD OPEN CELL ....................................................................................................................................... 12 5.3 FLICKER (Vcom) ADJUSTMENT ..................................................................................................................... 17 5.2 COLOR DATA INUT ASSIGNMENT.................................................................................................................. 16
JBL Professional Control Contractor系列126W WT高级内墙扬声
Description:The Control 126W is a premium in-wall speaker within the JBL Professional Control Contractor line designed for applications such as foreground music, boardrooms, reception areas, airports, convention centers, cruise ships, retail outlets, restaurants, museums, surround locations, or any critical listening application where top performance from a loudspeaker with minimal visual impact is required.The high-performance woofer features a polymer-coated aluminum cone for high performance down to 38 Hz and pure butyl rubber surround for long life and high reliability along with extended-polepiece magnet design for long excursion and tight, low bass. The pure titanium dome high frequency driver is loaded with a built-in EOS™ (Elliptical Oblate Spheroidal) waveguide for low distortion and a smooth frequency response. A low-diffraction swivel-mounting system enables the user to direct high frequencies where required without the diffraction distortion inherent in other aimable tweeter designs. A high-slope crossover network maintains natural midrange sound and produces more even coverage throughout the listening area. The optional Control 126WT version includes a multi-tap transformer for 70V/100V systems.The Control 100 Series speakers are voiced similarly to other JBL Control Contractor models, allowing mixing with surface-mount and in-ceilingspeakers within a single listening space. The premium sound quality makes these loudspeakers ideal for critical listening environments, yet they are high power and rugged enough to handle venues requiring high SPL, heavy duty-cycle music.The speaker fits into the wall space of ordinary stud-wall construction. An optional rough-in frame is available for installing the speakers into standard stud walls in new construction projects. As is the case with all ControlContractor speakers, the baffles and grilles are paintable to match any décor.Key Features:•Components:•165 mm (6½ in) polymer-coated aluminum-cone woofer with pure butyl rubber surround•25 mm (1 in) low-diffraction, swivel-aimable, pure titanium-dome tweeter•High-slope crossover for natural midrange sound •Extended bandwidth performance of 38 Hz – 20 kHz•50W continuous (100W program, 200W peak) power handling (126W)Specifications:SystemFrequency Range (-10 dB)138 Hz – 20 kHz Continuous Power Capacity 2200W Peak100W Continuous Program 50W Continuous Pink Noise Sensitivity 388 dB SPL, 1W, 1 m (3.3 ft)Nominal Impedance (126W)8 ohmsTransformer Taps (126WT)70V: 30W, 15W, 7.5W & 3.7W taps 100V: 30W, 15W & 7.5W tapsTransducersLow Frequency165 mm (6.5 in) polymer-coated aluminum cone, pure butyl rubber surroundHigh Frequency25 mm (1 in) pure titanium dome with cloth suspension on low-diffraction swivel-mount with -10º aimabilityPhysicalTermination Screw-down Euroblock-type connector, max wire size 14 AWG (1.5 mm)2Crossover Network3rd order (18 dB/oct) low-pass to the woofer and 3rd order (18 dB/oct) high-pass to the tweeterOptimum Air Cavity Behind Speaker 20 to 40 liters (0.7 to 1.4 cu ft)Outside Dimensions (H x W x D)280 x 215 x 105 mm (11 x 8.5 x 4.1 in), 99 mm (3.8 in) front of wall to back of speakerCutout Size (H x W)246 x 181 mm (9.7 x 7.2 in), cutout template included Maximum Wall Thickness 32 mm (1.25 in)Net Weight (each)126W: 2.1 kg (4.5 lb)126WT: 2.7 kg (5.9 lb)Shipping Weight (pair)126W: 4.8 kg (10.5 lb)126WT: 6.2 kg (13.5 lb)Included Accessories»Cutout template »Paint shieldOptional Accessories»WB6 Rough-In Frame for newconstruction installation to wallstuds1 Half-space (mounted in-wall)2Continuous Pink Noise rating is IEC-shaped pink noise with a 6 dB crest factor 3Half-space (mounted in-wall), average 100 Hz to 10 kHzJBL continually engages in research related to product improvement. Somematerials, production methods and design refinements are introduced into existing products without notice as a routine expression of that philosophy. For this reason, any current JBL product may differ in some respect from its published description, but will always equal or exceed the original design specifications unless otherwise stated.Rear Air Cavity Considerations:The Control 126W is designed to function over a wide span of rear air cavity sizes within the wall. The optimum air cavity (sometimes called “loading volume”) for fullest low-frequency performance is between 20 to 40 liters (0.7 to 1.4 cu ft). In a wall with studs located 16-inches on-center, this approximately equals a 23-inch to 46-inch high space. It is recommended that the air cavity behind the speaker be sealed by the use of silicone sealant or similar material to help create an air-tight seal and minimize wall noise.Mounting Dimensions:Frequency Response:Normalized Horizontal Off-Axis:up up up up 0100°10°down0° 10°20°30° 40°S P L (d B )Measured on-axis with distance referenced to 1meter at 1 watt, half-space (126W)000100°10°down0° 10°up 20°up 30°up 40°up000010° 10°down Beamwidth vs. Frequency:Normalized Vertical Off-Axis (down):0100110100B e a m w i d t h (D e g r e e s )000100010010° 10°downup up up up 00010°10° down 20° down 30° down 40° down© 2020 Harman International. Issued: 3/2020。
MIP系列重型、媒介隔离压力传感器说明书
MIP SERIESHeavy Duty, Media-Isolated Pressure Transducers 1 bar to 60 bar | 15 psi to 870 psiDESCRIPTIONThe MIP Series offers a heavy duty,media-isolated pressure transducer in a compact, stainless steel construction for use with a wide range of media including aggressive fluids and water. The MIP Series provides a cost-competitive solution for wide-ranging potential applications in tough environments.VALUE TO CUSTOMERS•Total Error Band (TEB) ±0.75 %FSS (Full Scale Span) from -40°C to 125°C: Provides true measurement performance over the compensated temperature range; small error promotes system uptime and efficiency (see Figure 4).•EMC performance: Operates reliably in the presence of electromagnetic fields, such as wireless signals, RF communication, and electrical devices.• Hermetically welded design supports almost any media without the use of an internal seal. The sensors are designed to be used in harsh environments that see aggressive media. PORTFOLIOHoneywell offers a variety of heavy duty pressuretransducers for potential use in industrial and transportation applications. To view the entire product portfolio, click here.DIFFERENTIATION•Diagnostics: Beneficial in applications where the sensor functionality and the need to know internal or external failure modes is critical.•Great customer value: Multiple configuration possibilities provideflexibility of use in the application withno up front NRE or tooling charges.•Durable: Provides the toughenvironmental capabilities needed,including long-term stability, insulation resistance and dielectric strength,external freeze-thaw resistance and EMC performance.32346591Issue BFEATURES•Rugged, stainless steel construction • Ratiometric output: 0.5 Vdc to 4.5 Vdc • Operating temperature: -40°C to 125°C •Total Error Band up to ±0.75 %FSS (-40°C to 125°C)• Industry-leading accuracy: ±0.15%FSS BFSL• Long term stability: ±0.25 %FSS • Radiated immunity: 100 V/m• High burst pressure: 207 bar [3000 psi]• Drinking water approval: NSF /ANSI/CAN 61• CE, RoHS, REACH compliant • Mis-wiring protection•Over voltage protection ±40 VdcCertified to NSF/ANSI/CAN 6121range. Includes all errors due to offset, full scale span, pressure non-linearity, pressure hysteresis, pressure non-repeatability, thermal effect on offset, thermal effect on span, and thermal hysteresis (see Figure 4).2TEB: ±1.5 % FSS above 100°C [212°F] for pressure ratings less than 4 bar [58 psi].3Accuracy: The maximum deviation in output from a Best Fit Straight Line (BFSL) fitted to the output measured over the pressure range at 25°C [77°F]. Includes all errors due to pressure non-linearity, pressure hysteresis, and pressure non-repeatability.4Startup time:The time needed to receive valid output after power up.3Sensing and Internet of Things FIGURE 1. NOMENCLATURE AND ORDER GUIDE1For example, MIPAN1XX010BSAAX defines an MIP Series Heavy Duty, Media Isolated Pressure Transducer, Metri-Pack 150, standard (UL V-0) electrical connector type, 1/4-18 NPT pressure port type, 10 bar pressure range, sealed gage pressure reference, ratiometric: 5 Vs, 10% to 90% Vs output transfer functionCAUTIONPRODUCT DAMAGE DUE TO MISUSE• Ensure torque specifications are determined for the specific application. Values provided are for reference only. (Mating materials and thread sealants can result in significantly different torque values from one application to the next.)• Use appropriate tools (such as an open ended wrench or deep well socket) to install transducers.• Ensure that the proper mating electrical connector with a seal is used to connect the transducer. Improper or damaged seals can compromise ingress protection, leading to short circuits.• Ensure that filters are used upstream of the transducers to keep media flow free of large particulates and condensed moisture. MIP Series transducers are dead-end devices. Particulate accumulation may clog the port or damage the diaphragm.• Ensure the transducer is installed with the port facing downwards. Any particulates in the system are less likely to enter and settle within the transducer if it is in this position.• Ensure that the media does not create a residue when dried. Build-up of residue inside the transducer may affect transducer outputFailure to comply with these instructions may result in product damage.410Pressure (psi Absolute)O ut p u t (V )4FIGURE 3. ABSOLUTE VS SEALED GAGE Example shown is for 100 psi.FIGURE 2. ANALOG OUTPUT TRANSFER FUNCTION The transfer function shown here is applicable to a ratiometric output ranging between 10% V supply at null pressure to 90% V supply at full scale pressure.Total Error Bandmin.O u t p u t(% V s u p p l y )0.8 x V supplyOutput (V) =x (Pressure applied - P min.) + 0.10 x V supply Ideal max.P max.- P min.O u t p u t (V d c )Total Error Band (TEB) is a single specification that includes the major sources of sensor error. TEB should not be confused with accuracy, which is actually a component of TEB. TEB is the maximum error that the sensor could experience.Honeywell uses the TEB specification in its datasheet because it is the most comprehensive measurement of a sensor’s true accuracy. Honeywell also provides the accuracy specification in order to provide a common comparison with competitors’ literature that does not use the TEB specification.Many competitors do not use TEB—they simply specify the accuracy of their device. Their accuracy specification, however, may exclude certain parameters. On their datasheet, the errors are listed individually. When combined, the total error (or what would be TEB) could be significant.FIGURE 4. TEB COMPONENTS FOR THE MIP SERIES is returned to the operating pressure range. Exposure to higher pressures may cause permanent damage to the product.2Burst Pressure: The maximum pressure which may be applied without causing escape of pressure media. The product should not be expected to function after exposure to the burst pressure.5HEAVY DUTY, MEDIA-ISOLATED PRESSURE TRANSDUCERS, MIP SERIES FIGURE 5. MOUNTING DIMENSIONS (FOR REFERENCE ONLY. MM/[IN]) F1: 7/16-20 UNF 1/4 inch 45° Flare Female Schrader (SAE J512)Seal: 45° coneMating geometry: SAE J512Weight:G1: G1/4 A-G (ISO 1179-3)Seal: O-ring (included) and retaining ring ISO 1179-3-G1/4(not included)Seal:Weight:Weight:Product MarkingRatiometric Voltage Output Pin A = Ground Pin B = V+Pin C = Vout(Product marking)16-Digit product listing Pin BPin C[0.87](Productmarking)MIPXXXXXXXXXXXXX H YYMMDD XXXXX16-Digit product listing 5-Digit serial number 6-Digit dateHoneywelllogo CE MarkCEPin B32346591-B-EN | B | 01/20© 2020 Honeywell International Inc. All rights reserved.HoneywellSensing and Internet of Things 9680 Old Bailes Road Fort Mill, SC 29707www. WARRANTY/REMEDYHoneywell warrants goods of itsmanufacture as being free of defective materials and faulty workmanship during the applicable warranty period. Honeywell’s standard product warranty applies unless agreed to otherwise by Honeywell in writing; please refer to your order acknowledgment or consult your local sales office for specific warranty details. If warranted goods are returned to Honeywell during the period of coverage, Honeywell will repair or replace, at its option, without charge those items that Honeywell, in its sole discretion, finds defective. The foregoing is buyer’s sole remedy and is in lieu of all other warranties, expressed or implied, including those of merchantability and fitness for a particular purpose. In no event shall Honeywell be liable for consequential, special, or indirect damages.While Honeywell may provideapplication assistance personally, through our literature and the Honeywell web site, it is buyer’s sole responsibility to determine the suitability of the product in the application.Specifications may change without notice. The information we supply is believed to be accurate and reliable as of this writing. However, Honeywell assumes no responsibility for its use.m WARNINGPERSONAL INJURYDO NOT USE these products as safety or emergency stop devices or in any other application where failure of the product could result in personal injury.Failure to comply with theseinstructions could result in death or serious injury.ADDITIONAL MATERIALSThe following associated literature is available at :• Product range guide• Application-specific and technical information • CAD ModelsFOR MORE INFORMATIONHoneywell Sensing and Internet ofThings services its customers through a worldwide network of sales offices and distributors. For application assistance, current specifications, pricing or the nearest Authorized Distributor, visit or call:Asia Pacific +65 6355-2828Europe +44 1698 481481USA/Canada+1-302-613-4491Solstice® N40 is a registered trademark of Honeywell International Inc.。
Omron VSON封装微型电路板电路设计手册说明书
G 3V M 21U R 11I World's smallest New VSON Package with Low Output Capacitance and Low ON Resistance■Application Examples■Ordering InformationNote: When ordering tape packing, add "(TR05)" to the model number.Ask your OMRON representative for orders under 500 pcs. We can supply products with the tape already cut.Tape-cut VSONs are packaged without humidity resistance. Use manual soldering to mount them.Refer to common precautions.*The AC peak and DC value are given for the load voltage and continuous load current.■Absolute Maximum Ratings (Ta = 25°C)Note:1. The dielectric strength between the input and output was checked by applying voltage between all pins as a group on the LED sideand all pins as a group on the light-receiving side.Note: The actual product is marked differently from theimage shown here.RoHS CompliantRefer to "Common Precautions ".■Package(Unit : mm, Average)■Model Number LegendPackage type Contact formTerminalsLoad voltage (peak value) *Continuous load current (peak value) *Packing/Tape cut Packing/Tape & reel Model Minimum package quantityModelMinimum package quantity VSON41a(SPST-NO)Surface-mountingTerminals20V1,000mAG3VM-21UR11−G3VM-21UR11(TR05)500ItemSymbol G3VM-21UR11Unit Measurement conditionsI n p u tLED forward currentI F 30mALED forward current reduction rate ∆I F /°C −0.3mA/°C Ta ≥25°C LED reverse voltage V R 5 V Connection temperature T J 125 °C O u t p u tLoad voltage (AC peak/DC)V OFF 20V Continuous load current (AC peak/DC)I O 1,000mAON current reduction rate ∆I O /°C −10mA/°C Ta ≥25°C Pulse ON currentlop 3A t=100ms, Duty=1/10Connection temperatureT J 125°C Dielectric strength between I/O (See note 1.)V I-O 300Vrms AC for 1 minAmbient operating temperature Ta −40~+85°C With no icing or condensation Ambient storage temperature Tstg −40~+125°CSoldering temperature−260 °C10s•Semiconductor test equipment •Test & measurement equipment•Communication equipment •Data loggers2.451.451.3G3VM-@ @ @ @ @123451.Load Voltage 2: 20V2.Contact form 1: 1a (SPST -NO)5.Other informationsWhen specifications overlap, serial code is added in the recorded order.3.Package type U: VSON 4 pin4. Additional functions R: Low On-resistanceG3VM-21UR11MOS FET RelaysG 3V M 21U R 11I V S O N ■Electrical Characteristics (Ta = 25°C)Note:2. Turn-ON and Turn-OFF Times■Recommended Operating ConditionsFor usage with high reliability, Recommended Operation Conditions is a measure that takes into account the derating of Absolute Maximum Ratings and Electrical Characteristics.Each item on this list is an independent condition, so it is not simultaneously satisfy several conditions.ItemSymbolG3VM-21UR11Unit Measurement conditionsI np u tLED forward voltage V F Minimum1.1V I F =10mA Typical 1.27Maximum 1.4Reverse currentI R Maximum 10µA V R =5V Capacity between terminals C T Typical 30pF V=0, f=1MHz Trigger LED forward current I FT Maximum 3.0mA IO =100mA Release LED forward current I FC Minimum 0.1mA I OFF =10µA O u t p u tMaximum resistance with output ON R ON Typical 0.18ΩI F =5mA, t<1s, I O =1,000mAMaximum 0.22Current leakage when the relay is open I LEAK Maximum 1nA V OFF =20VCapacity between terminals C OFF Typical 40pF V=0, f=100MHz, t<1s Capacity between I/O terminalsC I-O Typical1pF f=1MHz, V S =0V Insulation resistance between I/O terminals R I-O Typical 108M ΩV I-O =500VDC, R O H ≤60%Turn-ON time t ON Maximum 2msI F =5mA, R L =200Ω,V DD =10V (See note 2.)Turn-OFF timet OFFMaximum1ItemSymbol G3VM-21UR11Unit Load voltage (AC peak/DC)V DD Maximum 16VOperating LED forward current I F Minimum 5mATypical 7.5Maximum 20Continuous load current (AC peak/DC)I O Maximum 1,000Ambient operating temperatureTaMinimum −20°C Maximum65V I DD OUTG3VM-21UR11MOS FET RelaysG 3V M 21U R 11I ■Engineering DataLED forward current vs.Ambient temperatureContinuous load current vs.Ambient temperatureLED forward current vs.LED forward voltageContinuous load current vs.On-state voltageOn-state resistance vs.Ambient temperatureTrigger LED forward current vs.Ambient temperatureTurn ON, Turn OFF time vs.LED forward currentTurn ON, Turn OFF time vs.Ambient temperatureCurrent leakage vs. Load voltageCurrent leakage vs. Ambient temperatureOutput terminal capacitance vs. Load voltageI F - TaAmbient temperature Ta (°C)L E D f o r w a r d c u r r e n t I F (m A )(Maximum value)05101520253035-40020-20406080100I O - Ta Ambient temperature Ta (°C)C o n t i n u o u s l o a d c u r r e n t I O (m A )(Maximum value)020040060080010001200-40-20020406080100I F - V FLED forward voltage V F (V)L E D f o r w a r d c u r r e n t I F (m A )0.11101000.81 1.2 1.4 1.6I O - V ONOn-state voltage V ON (V)C o n t i n u o u s l o a d c u r r e n t I O (A )-1.2-0.8-0.400.40.81.2-0.2-0.100.10.2R ON - Ta Ambient temperature Ta (°C)O n -s t a t e r e s i s t a n c e R O N (Ω)0.10.20.30.40.5I FT - Ta Ambient temperature Ta (°C)T r i g g e r L E D f o r w a r d c u r r e n t I F T (m A )0123-40-2020406080100t ON , t OFF - I FLED forward current I F (mA)T u r n O N , T u r n O F F t i m e t O N , t O F F (µs )101001000110100t ON , t OFF - TaAmbient temperature Ta (°C)T u r n O N , T u r n O F F t i m e t O N , t O F F (µs )101001000-40-20020406080100I LEAK - V OFFLoad voltage V OFF (V)C u r r e n t l e a k a g e I L E A K (p A )20406080I LEAK -TaAmbient temperature Ta (°C)C u r r e n t l e a k a g e I L E A K (p A )10100100010000C OFF - V OFFLoad voltage V OFF (V)O u t p u t t e r m i n a l c a p a c i t a n c e C O F F /C O F F (0V )00.20.40.60.811.205101520G 3V M 21U R 11I V S O N ■Dimensions(Unit: mm)■Approved StandardsApplying for UL recognition■Safety Precautions•Refer to "Common Precautions " for all G3VM models.Note: The actual product is marked differently from the image shown here.Actual Mounting Pad Dimensions(Recommended Value, Top View)0.8±0.1±0.1Surface-mounting TerminalsWeight: 0.01g• Application examples provided in this document are for reference only. In actual applications, confirm equipment functions and safety before using the product.OMRON CorporationElectronic and Mechanical Components CompanyContact: /ecbCat. No. K267-E1-010814(0814)(O)Note: Do not use this document to operate the Unit.• Consult your OMRON representative before using the product under conditions which are not described in the manual or applying the product to nuclear control systems, railroad systems, aviation systems, vehicles, combustion systems, medical equipment, amusement machines, safety equipment, and other systems or equipment that may have a serious influence on lives and property if used improperly. Make sure that the ratings and performance characteristics of the product provide a margin of safety for the system or equipment, and be sure to provide the system or equipment with double safety mechanism s.。
N76E003 NuTiny-SDK-N76E003 1T 8051 8-bit 微控制器 用户手册
1T 80518-bit MicrocontrollerNuvoton 1T 8051-based Microcontroller NuTiny-SDK-N76E003User ManualThe information described in this document is the exclusive intellectual property of Nuvoton Technology Corporation and shall not be reproduced without permission from Nuvoton. Nuvoton is providing this document only for reference purposes of NuMicro microcontroller based system design. Nuvoton assumes no responsibility for errors or omissions.All data and specifications are subject to change without notice.For additional information or questions, please contact: Nuvoton Technology Corporation.Table of Contents1OVERVIEW (3)2NUTINY-SDK-N76E003 INTRODUCTION (4)2.1Virtual COM Port Switch Description (4)NuTiny-SDK-N76E003 Power Setting and Connector (4)2.22.2.1Power Setting (4)2.2.2Debug Connector (5)2.2.3ICE USB Connector (5)2.2.4Extended Connector (5)2.2.5Reset Button (5)2.2.6Power Connector (5)2.2.7Virtual COM Port Function Switch (5)Pin Assignment for Extended Connector (6)2.32.4NuTiny-SDK- N76E003 PCB Placement (7)3How to Start NuTiny-SDK-N76E003 on the Keil C-51 μVision® IDE (8)Downloading and Installing Keil C-51 μVision® IDE Software (8)3.13.2Downloading and Installing Nuvoton Nu-Link Driver (8)3.3Hardware Setup (8)Example Program (8)3.44NuTiny-EVB-N76E003 Schematic (11)4.1Nu-Link-Me Schematic (11)NuTiny-SDK-N76E003 Schematic (12)4.25Downloading NuVOTON 8bit 8051 MCUs Related Files from Nuvoton Website (13)5.1Downloading Nuvoton Keil C-51 μVision® IDE Driver (13)Downloading Nuvoton 8bit 8051 MCUs N76E003 Series Sample Code (14)5.26REVISION HISTORY (15)1 OVERVIEWNuTiny-SDK-N76E003 is the specific development tool for 8-bit high performance 1T 8051-based microcontroller N76E003 series. User can use NuTiny-SDK-N76E003 to develop and verify the application program easily.NuTiny-SDK-N76E003 includes two portions. One is NuTiny-EVB-N76E003 and the other is Nu-Link-Me. NuTiny-EVB-N76E003 is the evaluation board and Nu-Link-Me is its Debug Adaptor.Thus, user does not need other additional ICE or debug equipment.The Nuvoton 1T 8051-based microcontroller N76E003 series is function compatible with the N76E616 and N76E885 series, the 8-bit high performance 1T 8051-based microcontroller. The instruction set is fully compatible with the standard 80C51 and performance enhanced. The N76E003 series can bridge the gap and replace the cost equivalent to traditional 4T, 6T and 12T 8-bit microcontroller by 1T 8-bit high performance and rich functions. With high performance CPU core and rich well-designed peripherals, the N76E003 benefits to meet a general purpose, home appliances, or motor control system accomplishment.The N76E003 series can run up to 16 MHz, and operate at a wide voltage range of 2.4V ~ 5.5V and temperature range of -40℃ ~ +105℃. For the N76E003 series, the embedded program flash size is up to 18 Kbytes, SRAM is 256 bytes, and 768 Bytes of auxiliary RAM (XRAM). The N76E003 series also offers size configurable 4K/3K/2K/1K/0K bytes flash of LDROM for the ISP, which provides flexibility to user developed Boot Code.The N76E003 series has many high-performance peripheral functions, such as 16 MHz high-speed internal RC oscillator (trimmed to ±1% when VDD 5.0V, ±2% in all conditions), I/O port with up to 18 pins, four 16-bit timers, two full-duplex UARTs ports with frame error detection and automatic address recognition, one SPI interface, one I2C interface, up to five enhanced 16-bit PWM output channels, 8 channels 12-bit ADC, Watchdog Timer, Self Wake-up Timer, and a Brown-out Detector. The peripherals are equipped with 18 sources with 4-level-priority interrupts capability. All these peripherals have been incorporated into the N76E003 series to reduce component count, board space and system cost.Additionally, the N76E003 series is equipped with ISP (In-System Programming) and ICP (In-Circuit Programming) functions, which allow the user to update the program memory without removing the chip from the actual end product. The N76E003 series also supports In-Application-Programming (IAP) function, user switches the code executing without the chip reset after the embedded flash updated.2 NUTINY-SDK-N76E003 INTRODUCTIONNuTiny-SDK-N76E003 uses the N76E003AT20 as the target microcontroller. Figure 2-1 is NuTiny-SDK-N76E003 for the N76E003 series, the left portion is called NuTiny-EVB-N76E003 and the right portion is Debug Adaptor called Nu-Link-Me.NuTiny-EVB-N76E003 is similar to other development boards. User can use it to develop and verify applications to emulate the real behavior. The on-board chip covers N76E003 series features. The NuTiny-EVB-N76E003 can be a real system controller to design user’s target systems.Nu-Link-Me is a Debug Adaptor. The Nu-Link-Me Debug Adaptor connects your PC's USB port to the user’s target system (via Serial Wired Debug Port) and allows user to program and debug embedded programs on the target hardware. To use Nu-Link-Me Debug adaptor with Keil, please refer to “Nuvoton Nu-Link debug adapter user manual” in detail. Th is document will be stored in the local hard disk when user installs each driver. Nu-Link-Me also supports virtual COM port function. User can use Nu-Link-Me as a USB to UART virtual COM port, which connects to on-board N76E003AT20 UART0.Figure 2-1 NuTiny-SDK-N76E003 (PCB Board)2.1Virtual COM Port Switch DescriptionThe switch in Nu-Link-Me, SW3, determines that the virtual COM port function is enabled or disabled. When user turns on all of the positions of switch, the virtual COM port function will be enabled. By using virtual COM port function, user can access the USB device in the same way as it would access a standard COM port to N76E003AT20 UART0. To use this function, user needs to install “VCOM Driver”at first. User can get “VCOM Driver”from NuMicroDVD \NuMicroDVD in folder “Software Utilities”.2.2NuTiny-SDK-N76E003 Power Setting and Connector2.2.1 Power Setting●J1: USB port in Nu-Link-Me●JP7 and JP9: VCC33 Voltage connector in NuTiny-EVB-N76E0032.2.2 Debug Connector●JP4: Connector in target board (NuTiny-EVB-N76E003) for connecting with Nuvoton ICEadaptor (Nu-Link-Me)●JP2: Connector in ICE adaptor (Nu-Link-Me) for connecting with a target board (forexample NuTiny-EVB-N76E003)2.2.3 ICE USB Connector●J1: Mini USB Connector in Nu-Link-Me connected to a PC USB port2.2.4 Extended Connector●JP5 and JP6: Show all chip pins in NuTiny-EVB-N76E0032.2.5 Reset Button●SW1: Reset button in NuTiny-EVB-N76E0032.2.6 Power Connector●JP7 and JP9: 3.3 VCC connector in NuTiny-EVB-N76E003●JP8 and JP10: GND connector in NuTiny-EVB-N76E0032.2.7 Virtual COM Port Function Switch●SW3: Switch ON/OFF to enable or disable Nu-Link-Me virtual COM port function.2.3Pin Assignment for Extended ConnectorNuTiny-EVB-N76E003 provides N76E003AT20 on board and the extended connector for TSSOP-20 pin. Table 2-1 is the pin assignment for N76E003AT20.Table 2-1 Pin Assignment for N76E003AT202.4NuTiny-SDK- N76E003 PCB PlacementUser can refer to Figure 2-2 for the NuTiny-SDK-N76E003 PCB placements.Figure 2-2 NuTiny-SDK-N76E003 PCB Placement3 HOW TO START NUTINY-SDK-N76E003 ON THE KEIL C-51 μVISION® IDE3.1Downloading and Installing Keil C-51 μVision® IDE SoftwarePlease connect to the Keil company website () to download the Keil C-51 μVision® IDE and install the RVMDK.3.2Downloading and Installing Nuvoton Nu-Link DriverPlease connect to Nuvoton 8bit 8051 MCUs website (/8bit-8051-mcus) to download the “Nuvoton 8051 Keil uVision Driver” file. Please refer to section 5.1 for the detailed download flow. After the Nu-Link driver is downloaded, please unzip the file and execute the “Nuvoton_8051_Keil_uVision_Driver_v1.08.zip” to install the driver.Hardware Setup3.3The hardware setup is shown as Figure 3-1Figure 3-1 NuTiny-SDK-N76E003 Hardware Setup3.4Example ProgramThis example demonstrates the ease of downloading and debugging an application on a NuTiny-SDK-N76E003 board. It can be found on Figure 3-2 list directory and downloaded from Nuvoton 8bit 8051 MCUs website.The example file can be found in the directory list shown in Figure 3-2.NUTINY-SDK-N76E003 USER MANUALFigure 3-2 Example DirectoryTo use this example:1. Open a project from the N76E003 sample code installation folder (default as C:\Nuvoton)using the following path ：\N76E003_SampleCode_Keil_C51_V1.0\Sample_Code\1.GPIO 2. Execute “GPIO.uvproj ”Enter compile mode interface3 453. Compiler4. Download the program code to Flash5. Enter / Exit Debug mode6Enter Debug mode interface6. Execute the program7. The I/O LED on the NuTiny-EVB-N76E003 board will be toggled on.4 NUTINY-EVB-N76E003 SCHEMATIC4.1Nu-Link-Me SchematicNUTINY-SDK-N76E003 USER MANUALNuTiny-SDK-N76E003 Schematic 4.2NUTINY-SDK-N76E003 USER MANUAL5 DOWNLOADING NUVOTON 8BIT 8051 MCUS RELATED FILES FROMNUVOTON WEBSITEDownloading Nuvoton Keil C-51 μVision ® IDE Driver5.1Step2Step33. Click here to downloadDownloading Nuvoton 8bit 8051 MCUs N76E003 Series Sample Code 5.2Step26 REVISION HISTORY2016.07.28 1.00 1. Preliminary version.Important NoticeNuvoton Products are neither intended nor warranted for usage in systems or equipment, any malfunction or failure of which may cause loss of human life, bodily injury or severe property damage. Such applications are deemed, “Insecure Usage”.Insecure usage includes, but is not limited to: equipment for surgical implementation, atomic energy control instruments, airplane or spaceship instruments, the control or operation of dynamic, brake or safety systems designed for vehicular use, traffic signal instruments, all types of safety devices, and other applications intended to support or sustain life.All Insecure Usage shall be made at customer’s risk, and in the event that third parties lay claims to Nuvoton as a result of customer’s Insecure Usage, customer shall indemnify the damages and liabilities thus incurred by Nuvoton.。
ARC安全气囊发生器
FM79630
Competition Sensitive
4
File Name
Automotive, Inc.
APH Performance Options
Automotive, Inc.
a unit of SEQUA Corporation
ARC Automotive Inc.
General Presentation
FM79630
October 2004
Competition Sensitive
1
File Name
Automotive, Inc.
Current Production
Advanced Hybrid Side (AHS25)
MY SOP: 2001 Location: Knoxville, TN & Colleferro, Italy Dimensions: 70mm x 35mm Weight: 450 g
Hybrid Curtain 38 (HC38)
FM79630
250
• Hybrid inflator containing non-azide,
Ambient
smokeless gas generant
Hot Cold
200
• Similar package size and weight as
Dual CADH inflator
150
Tank Pressure (kPa)
• Similar package size and weight as Single CADH inflator
华为CX912交换机模块V100R001C10白皮书第13版日期2017-06-08说明书
Huawei CX912 Switch Module V100R001C10White PaperIssue13Date2017-06-08Copyright © Huawei Technologies Co., Ltd. 2017. All rights reserved.No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd.Trademarks and Permissionsand other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.All other trademarks and trade names mentioned in this document are the property of their respective holders.NoticeThe purchased products, services and features are stipulated by the contract made between Huawei and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied.The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.Huawei Technologies Co., Ltd.Address:Huawei Industrial BaseBantian, LonggangShenzhen 518129People's Republic of ChinaWebsite:About This DocumentPurposeThis document describes the E9000 CX912 multi-plane switch module (CX912 for short) interms of its functions, advantages, appearance, specifications, internal networking, standardsand certifications. You can learn about the CX912 by reading this document.The product features and commands for the 10GE switching plane of the CX912 varyaccording to the software version. For details, see the documents listed in the following table.Intended AudienceThis document is intended for:l Huawei presales engineersl Channel partner presales engineersl Huawei enterprise presales engineersSymbol ConventionsThe symbols that may be found in this document are defined as follows.Change HistoryIssue 13 (2017-06-08)This issue is the thirteenth official release.Issue 12 (2017-03-27)This issue is the twelfth official release.This issue is the eleventh official release.Issue 10 (2016-11-22)This issue is the tenth official release.Issue 09 (2016-05-12)This issue is the ninth official release.Issue 08 (2015-07-17)This issue is the eighth official release.Issue 07 (2015-03-20)This issue is the seventh official release.This issue is the sixth official release.Issue 05 (2015-02-26)This issue is the fifth official release.Issue 04 (2014-09-15)This issue is the fourth official release.Issue 03 (2014-05-13)This issue is the third official release. Issue 02 (2014-04-08)This issue is the second official release. Issue 01 (2014-01-02)This issue is the first official release.White Paper ContentsContentsAbout This Document (ii)1 Overview (1)1.1 Functions (2)1.2 Advantages (10)1.3 Appearance (11)1.4 Ports (15)1.5 Indicators (20)1.6 Internal Chassis Networking (22)1.7 Software and Hardware Compatibility (24)1.8 Technical Specifications (26)2 Standards and Certifications (30)2.1 Standards Compliance (31)2.2 Certifications (33)1 Overview About This Chapter1.1 FunctionsThis topic describes the functions, supported protocols, and ports of the switching planes ofthe CX912 multi-plane switch module (CX912 for short).1.2 AdvantagesThe CX912 switch module provides high performance, high port density, and multipleswitching planes (GE/10GE/Fibre Channel(FC) switching), and supports large data centernetworks, high-performance stacking, on-demand configuration, flexible deployment, andrich data center features. In addition, the CX912 switch module is easy to deploy andmaintain.1.3 AppearanceThis topic describes the CX912 in terms of its appearance, panel, and installation positions inthe chassis.1.4 PortsThis topic describes the features, numbering rules, names, types, and quantities of the CX912ports.1.5 IndicatorsThis topic describes the indicators on the CX912.1.6 Internal Chassis NetworkingThis topic describes connection relationships between the CX912 and mezz modules oncompute nodes.1.7 Software and Hardware CompatibilityThis topic describes mezz modules that can work with the CX912 and pluggable modules andcables supported by ports on the CX912 panel.1.8 Technical SpecificationsThis topic describes the physical, environmental, power, and network switching specificationsof the CX912.1.1 FunctionsThis topic describes the functions, supported protocols, and ports of the switching planes ofthe CX912 multi-plane switch module (CX912 for short).CX912 is the switching control unit of a server. It provides data switching for compute nodesin the system and external management network ports and service ports. The CX912 providestwo independent planes, including the 10GE switching plane, and FC switching plane. Thetwo planes are physically isolated.The CX912 is installed in a rear slot of the E9000 chassis and is connected to compute nodes,storage nodes, and management modules through the midplane. It exchanges internal datapackets and control and management packets to ensure high-speed data transmission.For details about the functions provided by the 10GE switching plane, see Table 1-1. Fordetails about the functions provided by the FC switching plane, see Table 1-2.Table 1-1 10GE switching plane function descriptionTable 1-2 FC switching plane function description1.2 AdvantagesThe CX912 switch module provides high performance, high port density, and multipleswitching planes (GE/10GE/Fibre Channel(FC) switching), and supports large data centernetworks, high-performance stacking, on-demand configuration, flexible deployment, andrich data center features. In addition, the CX912 switch module is easy to deploy andmaintain.High Performance and High Port DensityUnderpinned by the leading hardware platform, the CX912 provides a high port density and aline-speed forwarding capability. It supports next-generation server applications that requiresuper high performance and density.The CX912 10GE switching plane provides sixteen 10GE SFP+ optical ports for connectingto upstream aggregation/core switches, forty 10GE electrical ports for interconnecting withhigh-performance compute nodes, eight 8G FC optical ports for connecting FC storage areanetworks (FC SANs), and two 40GE ports for interconnecting with switch modules.The CX912 10GE switching planes support low-latency forwarding, providing a switchingcapability of 1.28 Tbit/s (throughput) and line-speed forwarding for Ethernet frames. Theforwarding latency for layer 2 Ethernet frames in cut through mode is less than 1.5 us.The CX912 FC switching plane provides a line-speed switching capability of 192 Gbit/s (384Gbit/s throughput).Multiple Switching Planes and Support for Large Data Center NetworksThe CX912 provides table entries of high specifications: a maximum of 131,072 MACaddress entries and 16,384 forwarding information bases (FIBs) entries.High-Performance Stacking, Easy Deployment, and Simple MaintenanceThe CX912 supports a stacking system of four devices. It has the following advantages:l High performance: A single stacking system can provide more than thirty-two 10GEports.l High bandwidth: The stacking system supports 160Gbps stacking bandwidth.l Easy deployment and maintenance:–Pre-deployment and offline configuration are supported. The system can be pre-planned and pre-configured. Devices can be added as required, supporting plug-and-play.–The slot ID of a device is the ID in the stacking system, facilitating identificationand maintenance.–Indicators on the front panel indicate the role and status of a stacking system. Thestacking system can be maintained without a terminal.l Simple upgrade operations: The stacking system supports quick and automatic software upgrades, simplifying upgrade operations and reducing upgrade workload.–Rapid software upgrades: When two switch modules are stacked, the standbyswitch module is upgraded before the active switch module. This ensures that atleast one switch module is operating.–Automatic software upgrades: When two switch modules are stacked, the softwareversion is automatically synchronized from the active switch module to the standbyone.On-Demand Configuration and Flexible DeploymentThe FC switching plane of the CX912 provides eight 8G FC ports. Four of the ports areactivated by default, and the other four ports require licenses for activation, which addressesdiverse user needs.Rich Data Center Featuresl Supports virtualization/virtual machine (VM) access.–Supports server virtualization, improving data center utilization.–Supports virtual sensors. During migration of VMs, network policies can beautomatically migrated using virtual sensors so that network resources can beallocated as required. Working with the layer 2 network, VMs can be freelymigrated within the data center.l Supports the Transparent Interconnection of Lots of Links (TRILL) protocol.–Complying with the Internet Engineering Task Force (IETF) standard, the TRILLprotocol supports ultra-large networks and flexible networking modes.–The TRILL protocol supports load balancing between paths, so that traffic can beshared by multiple paths according to service requirements.–The TRILL protocol supports fast network convergence. Any changes on thenetwork can be quickly sensed and fast convergence is performed.1.3 AppearanceThis topic describes the CX912 in terms of its appearance, panel, and installation positions inthe chassis.AppearanceFigure 1-1 shows the CX912.Figure 1-1 CX912Installation PositionsThe CX912 can be installed in the four slots at the rear of the E9000 chassis. The four slots are 1E, 2X, 3X, and 4E, as shown in Figure 1-2.Figure 1-2 Installation positions and slotsPanelFigure 1-3 shows the CX912 panel.Figure 1-3 Panel1Product Model2Customization label (with an ESNlabel)3BMC serial port4Power indicator5Healthy indicator6Offline button/indicator7SYS serial port8GE electrical port (reserved)9Connection status indicator of the GEelectrical port 10Data transmission status indicator ofthe GE electrical port1110GE optical port12Connection status indicator of the10GE optical port13Data transmission status indicator of the10GE optical port148G FC optical port15Connection status indicator of the 8G FC optical port 16Diagnosis status indicator of the 8GFC optical portESNsAn Equipment Serial Number (ESN) is a string that uniquely identifies a server. An ESN is required when you apply for technical support from Huawei.Figure 1-4 shows the ESN format.Figure 1-4 ESN example1.4 PortsThis topic describes the features, numbering rules, names, types, and quantities of the CX912ports.The CX912 provides ports for users to operate and configure. The ports are used to send andreceive data.The CX912 ports are numbered in Slot number/Subcard number/Port number format.l Slot number: indicates the slot number of the current switch module. Its value rangesfrom 1 to 4, from left to right mapping to slot numbers 1E, 2X, 3X, and 4E.l Subcard number: indicates the number of a subcard supported by service ports. Thevalue ranges from 1 to 19.l Port number: indicates the sequence number of a port on a subcard.The FC optical ports on the CX912 panel are numbered from 1 to 8.For details about the value options, see Figure 1-5, Table 1-3, Table 1-5 and Table 1-6.For example, if the CX912 is in slot 2X, the first GE optical port on the upper right of thepanel is numbered GE 2/17/4, as shown in Figure 1-5.Figure 1-5 Port naming rulesTable 1-3 describes the ports on the CX912.Table 1-3 External portsTable 1-4 describes the internal ports on the onboard GE switching plane of the CX912. Table 1-4 Internal ports on the onboard GE switching planeTable 1-5 describes the internal ports on the CX912 10GE switching plane.Table 1-5 Internal ports on the 10GE switching planeTable 1-6 describes the internal ports on the CX912 FC switching plane.Table 1-6 Internal ports on the FC switching planeThe internal FC interface rate must be set to 8 Gbit/s.1.5 IndicatorsThis topic describes the indicators on the CX912.You can observe the indicators to determine the current operating status of the CX912. Table 1-7 describes the indicators on the CX912 panel.Table 1-7 Indicators1.6 Internal Chassis NetworkingThis topic describes connection relationships between the CX912 and mezz modules oncompute nodes.For details about the networking of the CX912 and mezzanine cards on compute nodes, seeE9000 Blade Server Mezz Module-Switch Module Interface Mapping Tool.Figure 1-6 shows the internal chassis networking for the CX912 and compute nodes. Ports oncompute nodes for connecting to the CX912 are provided by two mezz modules. Themapping between the CX912 and the NIC and mezz modules is described as follows:l Mezz 1 connects to the 10GE switching planes and FC switching planes of the CX912s in slots 2X and 3X.l Mezz 2 connects to the 10GE switching planes and FC switching planes of the CX912s in slots 1E and 4E.Figure 1-6 Mapping between the CX912 and mezz modules on compute nodesMapping between the CX912 and ports on the MZ912The two 10GE ports (ports 1 and 2) on the MZ910 map to the 10GE switching planes of the CX912s in slots 3X and 2X respectively, as shown in Figure 1-7.The8G FC ports (ports 3 and 4) on the MZ912 map to the FC switching planes of the CX912s in slots 3X and 2X respectively.Figure 1-7 Mapping between the CX912 and ports on the MZ9121.7 Software and Hardware CompatibilityThis topic describes mezz modules that can work with the CX912 and pluggable modules andcables supported by ports on the CX912 panel.For details about the software and hardware that are compatible with the CX912, see HuaweiServer Compatibility Checker.Supported Mezz ModulesThe CX912 connects to mezz modules of compute nodes. Table 1-8 describes models andspecifications of the supported mezz modules.Table 1-8 Supported mezz modulesSupported Pluggable Modules and CablesTable 1-9 Supported pluggable modules and cablesThe CX912 supports multiple pluggable optical modules, fibers, and network cables. You canchoose the modules and cables based on site requirements.l The CX912 provides the following functions for GE applications:–Provides RJ45 ports for connecting to twisted-pair cables.–Provides SFP+ optical ports that support single-mode and multi-mode SFP+ opticalmodules.–Supports SFP electrical modules.l The CX912 provides the following functions for 10GE applications:–Provides SFP+ optical ports and supports single-mode and multi-mode SFP+optical modules.–Supports 10GE DAC cables, which can be 7 m or 10 m active DAC cables or 1 m,3 m, or 5 m passive DAC cables.l The CX912 provides the following functions for FC applications: provides SFP+ optical ports; uses single-mode and multi-mode 8G SFP+ optical modules; supports 4 Gbit/s and8 Gbit/s.FC ports of the CX912 support only single-mode and multi-mode Brocade swappable optical modules.1.8 Technical SpecificationsThis topic describes the physical, environmental, power, and network switching specificationsof the CX912.Table 1-10 describes the technical parameters of the CX912, and Table 1-11 describes thenetwork switching specifications of the CX912.For details about the FC switching plane switching performance, see theMX210&MX220_Fabric_OS_Administrator_Guide.Table 1-10 Technical specificationsTable 1-11 Network switching specifications2 Standards and Certifications About This Chapter2.1 Standards ComplianceThis topic describes the international and industrial standards and communication protocolsthat the CX912 complies with.2.2 CertificationsThis topic describes the certifications that the E9000 has passed.2.1 Standards ComplianceThis topic describes the international and industrial standards and communication protocolsthat the CX912 complies with.International StandardsTable 2-1 lists the international standards.Table 2-1 Standards and protocol complianceIndustrial StandardsTable 2-2 lists the industrial standards.Table 2-2 Industrial standardsCommunication ProtocolsTable 2-3 lists the communication protocols.Table 2-3 Communication protocols2.2 CertificationsThis topic describes the certifications that the E9000 has passed.Table 2-4 lists the certifications.Table 2-4 CertificationsHuawei CX912 Switch ModuleWhite Paper 2 Standards and CertificationsIssue 13 (2017-06-08)Huawei Proprietary and ConfidentialCopyright © Huawei Technologies Co., Ltd.34。
_NCCP1H010_MoveAbsolute_REAL
NCCP1HMove Absolute (REAL): _NCCP1H010_MoveAbsolute_REAL 010■ Variable TableOutput Variables Name Variable name Data type Range DescriptionENO ENO BOOL 1(ON): FB operating normally0(OFF): FB not operating normallyPositioning completed Done BOOL 1 (ON) indicates that positioning is completed.Busy flag Busy BOOL 1 (ON) indicates that the FB is in pregress.Error flag Error BOOL 1 (ON) indicates that an error has occurred in the FB. Error code(May be omitted)ErrorIDWORDThe error code of the error occurred in the FB will be output. For details of the errors, refer to the sections of the manual listed in the Related manuals above. When Unit No. or Axis. No. is out of the range, #0000 will be output.Limitation of Function block by Combination of CPU type and Unit Version CPU Type Unit Version Axis No. Range of Frequency Description 1.1 &0 to &3 +1.0 to +100000.0 &0 to &1 +1.0 to +100000.0XA / X 1.0 &2 to &3 +1.0 to +30000.0Please use Function Block Version1.10 or higher whenyou set values that are larger than 30000.0Hz to Axis. No.2 or No.3. &0 to &1 +1.0 to +1000000.0 Y 1.1 &2 to &3 +1.0 to +100000.0Please use Function Block Version1.10 or higher forCP1H-Y20DT-D.■ Revision History Version Date Contents 1.10 2006.5. Addition of CP1H CPU Unit unit version 1.1 1.00 2005.9. Original productionNoteThis document explains the function of the function block.It does not provide information of restrictions on the use of Units and Components or combination of them. For actual applications, make sure to read the operation manuals of the applicable products.。
datasheet
Rynite® FR530NC010THERMOPLASTIC POLYESTER RESIN DuPont Performance PolymersTechnical Data1of 3Form No.TDS-5878-enLiterature 1•Processing -Injection Molding (English)Availability•Asia Pacific •Latin America•North AmericaFiller /Reinforcement •Glass Fiber,30%Filler by WeightAdditive •Mold Release Agency Ratings •UL Unspecified Rating Forms•PelletsProcessing Method •Injection MoldingMulti-Point Data•Isothermal Stress vs.Strain (ISO 11403-1)•Secant Modulus vs.Strain (ISO11403-1)Part Marking Code (ISO 11469)•>PET-GF30FR<Resin ID (ISO 1043)•PET-GF30FR(17)Melt Volume-Flow Rate (MVR)(280°C/2.16kg)0.366in³/10min6.00cm³/10minISO 1133Molding Shrinkage ISO 294-4Across Flow 0.80%0.80%Flow0.20%0.20%Water AbsorptionISO 6273°F (23°C),24hr,0.0787in (2.00mm)0.75%0.75%Equilibrium,73°F (23°C),0.0787in (2.00mm),0.15%0.15%Tensile Stress (Break)19600psi 135MPa ISO527-2Tensile Strain (Break) 2.0% 2.0%ISO 527-2Tensile Creep Modulus ISO 899-11hr 1.62E+6psi 11200MPa 1000hr1.41E+6psi 9700MPa -22°F (-30°C) 4.3ft·lb/in²9.0kJ/m²73°F (23°C)4.8ft·lb/in²10kJ/m²Charpy Unnotched Impact Strength ISO 179/1eU-22°F (-30°C)19ft·lb/in²40kJ/m²M-Scale 95 95 R-Scale1201202of 3Form No.TDS-5878-en66psi (0.45MPa),Unannealed 469°F 243°C ISO 75-2/B 264psi (1.8MPa),Unannealed 437°F 225°C ISO 75-2/A Vicat Softening Temperature428°F 220°C ISO 306/B50Melting Temperature 4486°F 252°C ISO 11357-3CLTE ISO 11359-2Flow1.1E-5in/in/°F 1.9E-5cm/cm/°C Flow :-40to 73°F (-40to 23°C) 1.2E-5in/in/°F2.2E-5cm/cm/°C Transverse5.1E-5in/in/°F 9.2E-5cm/cm/°C Transverse :-40to 73°F (-40to 23°C) 3.8E-5in/in/°F6.8E-5cm/cm/°CRTI ElecUL 7460.0157in (0.400mm)311°F 155°C 0.0295in (0.750mm)311°F 155°C Volume Resistivity 1.0E+15ohms·cm1.0E+15ohms·cmIEC 60093Electric Strength 840V/mil33kV/mmIEC 60243-1Dielectric Constant1kHz 3.80 3.80 ASTM D1501MHz 3.70 3.70 ASTM D150100Hz 4.80 4.80 IEC 602501MHz4.704.70IEC 60250Dissipation Factor1kHz 1.1E-6 1.1E-6 ASTM D1501MHz 1.8E-6 1.8E-6 ASTM D150100Hz 7.0E-3 7.0E-3 IEC 602501MHz0.010 0.010 IEC 60250Comparative Tracking Index (CTI)PLC 2 PLC 2 UL 746-200.0138in (0.350mm)V-0 V-0 0.0591in (1.50mm)•V-0•5VA •V-0•5VA Oxygen Index33%33%ASTM D2863ISO 4589-2Notes1 These links provide you with access to supplier literature.We work hard to keep them up to date;however you may find the most current literature from the supplier.2A UL Yellow Card contains UL-verified flammability and electrical characteristics.UL Prospector continually works to link Yellow Cards to individual plastic materials in Prospector,however this list may not include all of the appropriate links.It is important that you verify theassociation between these Yellow Cards and the plastic material found in Prospector.For a complete listing of Yellow Cards,visit the UL Yellow Card Search.3 Typical properties:these are not to be construed as specifications.410°C/minWhereto BuyTelephone:302-999-4592Web:/Biesterfeld Plastic GmbH is a Pan European distribution company.Contact Biesterfeld Plastic GmbH for availability of individual products by country.Telephone:+49-40-32008-0Web:/Availability:Algeria,Austria,Belgium,Bosnia and Herzegovina,Brazil,Bulgaria,Croatia,Cyprus,Czech Republic,Egypt,France,Germany, Greece,Hungary,Italy,Libyan Arab Jamahiriya,Luxembourg,Mauritania,Morocco,Netherlands,Poland,Portugal,Romania,Serbia,Slovakia,Slovenia,Spain,Switzerland,Tunisia,TurkeyPolyOne DistributionPolyOne Distribution is a global distribution company.Contact PolyOne Distribution for availability of individual products by country.Telephone:800-894-4266Web:/Availability:Global3of3Form No.TDS-5878-en。
智能融合2 MSS 嵌入式非易失性存储（eNVM）配置指南说明书
SmartFusion2 MSS Embedded Nonvolatile Memory (eNVM) ConfigurationSmartFusion2 MSS Embedded Nonvolatile Memory (eNVM) Configuration Table of ContentsIntroduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Important Information About eNVM Reserved Pages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31Creating Clients . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42Configuring a Data Storage Client . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 eNVM Content Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Use as ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53Memory File Formats. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 INTEL-HEX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 MOTOROLA S-record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Actel BINARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Actel-HEX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74Interpreting Memory Content . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Absolute vs. Relative Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Data Interpretation Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8A Product Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Customer Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Customer Technical Support Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Website . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contacting the Customer Technical Support Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 ITAR Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10IntroductionThe MSS Embedded Nonvolatile Memory (eNVM) configurator enables you to create memory regions(clients) that need to be programmed in the SmartFusion2 device eNVM block(s).In this document we describe in detail how to configure the eNVM block(s). For more details abouteNVM, refer to the Microsemi SmartFusion2 User's Guide.Important Information About eNVM Reserved PagesSome eNVM pages are reserved to store the HPMS configuration. These reserved pages are used bythe HPMS to store the Peripheral Initialization Configuration Data and the Certificate/Digest. Thesepages are located at the top of the eNVM address space. The total number of reserved pages in theeNVM is device-dependent, as shown in Table1.Table 1 • Device Type and eNVM Reserved PagesSmartFusion2 Device Reserved Pages for Certificate/DigestM2S005, M2S010, M2S025,M2S05016M2S090, M2S100, M2S15064Note:You application should not write into these reserved pages, as it will most likely cause a runtime failure for your design.The number of Available Pages displayed in the eNVM Configurator is the total number of pagesavailable to you after the Reserved Pages have been taken into account. For example. the M2S050device data sheet shows a total of 2048 pages in the eNVM, but the eNVM Configurator (Figure1-1)shows 2032 Available Pages, because 16 pages have been reserved by the HPMS and madeunavailable to the user.1 – Creating ClientsThe main page of the eNVM configurator enables you to add clients to your eNVM block.•Data Storage client - Use the data storage client to define a generic memory region in the eNVM block. This region can be used to hold your application code or any other data content that yourapplication may need.The main grid also displays characteristics of any configured clients. These characteristics are:•Client Type - Type of the client that is added to the system•Client Name - Name of the client. Must be unique across the system.•Start Address - Adresss in hex at which the client is located in eNVM. It must be on a page boundary. No overlapping addresses between different clients are allowed.•Word Size - Word size of the client in bits•Page Start - Page on which the start address begins.•Page End - Page on which the client memory region ends. It is automatically computed based on the start address, word size, and number of words for a client.•Initialization Order - This field is not used by the SmartFusion eNVM configurator.•Lock Start Address - Specify this option if you do not want the eNVM configurator to change your start address when clicking the Optimize button.Usage statistics are also reported:•Available Pages - Total number of pages available to create clients. The number of available pages may vary based on the selected die. This number is the total number of pages available toyou after the reserved pages have been taken into account.•Used Pages - Total number of pages used by the configured clients.•Free Pages - Total number of pages still available for configuring data storage and initialization clients.Use the Optimize feature to resolve the conflicts on overlapping base addresses for clients. Thisoperation does not modify the base addresses for any clients that have Lock Start Address checked.Figure1-1 • eNVM Configurator2 – Configuring a Data Storage ClientYou must specify the following options in the Client Configuration dialog.eNVM Content Description•Content - Specify the memory content that you want to program into eNVM. Choose one of the following options:–Memory File - You need to select a file on disk that matches one of the following memory file formats - Intel-Hex, Motorola-S, Actel-S or Actel-Binary - .–No content - The client is a place holder. You will be available to load a memory file using FlashPro/FlashPoint at programming time without having to go back to this configurator.•Use absolute addressing - Lets the memory content file dictate where the client is placed in the eNVM block. The addressing in the memory content file for the client becomes absolute to thewhole eNVM block. Once you choose the absolute addressing option, the software extracts thesmallest address from the memory content file and uses that address as the start address for theclient.•Start Address - The eNVM address where the content is programmed.•Size of Word - Word size, in bits, of the initialized client; can be either 8, 16 or 32.•Number of words - Number of words of the client.Use as ROMIf you select this option the data storage client content is protected and its content cannot be overwritten.Figure2-1 • Modify Data Storage Client Dialog Box3 – Memory File FormatsThe following memory file formats are available as input files into the eNVM Configurator:•INTEL-HEX•MOTOROLA S-record•Actel BINARY•ACTEL-HEXAn example of how to interpret the memory content is listed below.INTEL-HEXIndustry standard file. Extensions are HEX and IHX. For example, file2.hex or file3.ihx.A standard format created by Intel. Memory contents are stored in ASCII files using hexadecimalcharacters. Each file contains a series of records (lines of text) delimited by new line, ‘\n’, characters andeach record starts with a ‘:’ character. For more information regarding this format, refer to the Intel-HexRecord Format Specification document available on the web (search Intel Hexadecimal Object File forseveral examples).The Intel Hex Record is composed of five fields and arranged as follows::llaaaatt[dd...]ccWhere:•: is the start code of every Intel Hex record•ll is the byte count of the data field•aaaa is the 16-bit address of the beginning of the memory position for the data. Address is big endian.•tt is record type, defines the data field:–00 data record–01 end of file record–02 extended segment address record–03 start segment address record (ignored by Microsemi SoC tools)–04 extended linear address record–05 start linear address record (ignored by Microsemi SoC tools)•[dd...] is a sequence of n bytes of the data; n is equivalent to what was specified in the ll field•cc is a checksum of count, address, and dataExample Intel Hex Record::10000000112233445566778899FFFAWhere 11 is the LSB and FF is the MSB.MOTOROLA S-recordIndustry standard file. File extension is S, such as file4.sThis format uses ASCII files, hex characters, and records to specify memory content in much the sameway that Intel-Hex does. Refer to the Motorola S-record description document for more information onthis format (search Motorola S-record description for several examples). The RAM Content Manageruses only the S1 through S3 record types; the others are ignored.The major difference between Intel-Hex and Motorola S-record is the record formats, and some extraerror checking features that are incorporated into Motorola S.In both formats, memory content is specified by providing a starting address and a data set. The upperbits of the data set are loaded into the starting address and leftovers overflow into the adjacentaddresses until the entire data set has been used.The Motorola S-record is composed of 6 fields and arranged as follows:Stllaaaa[dd...]ccWhere:•S is the start code of every Motorola S-record•t is record type, defines the data field•ll is the byte count of the data field•aaaa is a 16-bit address of the beginning of the memory position for the data. Address is big endian.•[dd...] is a sequence of n bytes of the data; n is equivalent to what was specified in the ll field•cc is the checksum of count, address, and dataExample Motorola S-Record:S10a0000112233445566778899FFFAWhere 11 is the LSB and FF is the MSB.Actel BINARYThe simplest memory format. Each memfile contains as many rows as there are words. Each row is oneword, where the number of binary digits equals the word size in bits. This format has a very strict syntax.The word size and number of rows must match exactly. The file extension is MEM; for example,file1.mem.Example: Depth 6, Width is 8010100111111111101010101111000101010101011110000Actel-HEXA simple address/data pair format. All the addresses that have content are specified. Addresses with nocontent specified will be initialized to zeroes. The file extension is AHX, such as filex.ahx. The format is:AA:D0D1D2Where AA is the address location in hex. D0 is the MSB and D2 is the LSB.The data size must match the word size. Example: Depth 6, Width is 800:FF01:AB02:CD03:EF04:1205:BBAll other addresses will be zeroes.4 – Interpreting Memory ContentAbsolute vs. Relative AddressingIn Relative Addressing, the addresses in the memory content file did not determine where the client wasplaced in memory. You specify the location of the client by entering the start address. This becomes the 0address from the memory content file perspective and the client is populated accordingly.For example, if we place a client at 0x80 and the content of the memory file is as follows:Address: 0x0000 data: 0102030405060708Address: 0x0008 data: 090A0B0C0D0E0F10Then the first set of bytes of this data is written to address 0x80 + 0000 in the eNVM block. The secondset of bytes is written to address 0x80 + 0008 = 0x88, and so on.Thus the addresses in the memory content file are relative to the client itself. Where the client is placed inmemory is secondary.For absolute addressing, the memory content file dictates where the client is placed in the eNVM block.So the addressing in the memory content file for the client becomes absolute to the whole eNVM block.Once you enable absolute addressing option, the software extracts the smallest address from thememory content file and uses that address as the start address for the client.Data Interpretation ExampleThe following examples illustrate how the data is interpreted for various word sizes:For the given data:FF 11 EE 22 DD 33 CC 44 BB 55(where 55 is the MSB and FF is the LSB)For 32-bit word size:0x22EE11FF (address 0)0x44CC33DD (address 1)0x000055BB (address 2)For 16-bit word size:0x11FF (address 0)0x22EE (address 1)0x33DD (address 2)0x44CC (address 3)0x55BB (address 4)For 8-bit word size:0xFF (address 0)0x11 (address 1)0xEE (address 2)0x22 (address 3)0xDD (address 4)0x33 (address 5)0xCC (address 6)0x44 (address 7)0xBB (address 8)0x55 (address 9)A – Product SupportMicrosemi SoC Products Group backs its products with various support services, including CustomerService, Customer Technical Support Center, a website, electronic mail, and worldwide sales offices.This appendix contains information about contacting Microsemi SoC Products Group and using thesesupport services.Customer ServiceContact Customer Service for non-technical product support, such as product pricing, product upgrades,update information, order status, and authorization.From North America, call 800.262.1060From the rest of the world, call 650.318.4460Fax, from anywhere in the world, 408.643.6913Customer Technical Support CenterMicrosemi SoC Products Group staffs its Customer Technical Support Center with highly skilledengineers who can help answer your hardware, software, and design questions about Microsemi SoCProducts. The Customer Technical Support Center spends a great deal of time creating applicationnotes, answers to common design cycle questions, documentation of known issues, and various FAQs.So, before you contact us, please visit our online resources. It is very likely we have already answeredyour questions.Technical SupportVisit the Customer Support website (/soc/support/search/default.aspx) for moreinformation and support. Many answers available on the searchable web resource include diagrams,illustrations, and links to other resources on the website.WebsiteYou can browse a variety of technical and non-technical information on the SoC home page, at/soc.Contacting the Customer Technical Support CenterHighly skilled engineers staff the Technical Support Center. The Technical Support Center can becontacted by email or through the Microsemi SoC Products Group website.EmailYou can communicate your technical questions to our email address and receive answers back by email,fax, or phone. Also, if you have design problems, you can email your design files to receive assistance.We constantly monitor the email account throughout the day. When sending your request to us, pleasebe sure to include your full name, company name, and your contact information for efficient processing ofyour request.The technical support email address is **********************.© 2014 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif. Learn more at .Microsemi Corporate HeadquartersOne Enterprise, Aliso Viejo CA 92656 USAWithin the USA: +1 (949) 380-6100Sales: +1 (949) 380-6136Fax: +1 (949) 215-4996My CasesMicrosemi SoC Products Group customers may submit and track technical cases online by going to My Cases .Outside the U.S.Customers needing assistance outside the US time zones can either contact technical support via email (**********************) or contact a local sales office. Sales office listings can be found at /soc/company/contact/default.aspx.ITAR Technical SupportFor technical support on RH and RT FPGAs that are regulated by International Traffic in Arms Regulations (ITAR), contact us via ***************************. Alternatively, within My Cases , select Yes in the ITAR drop-down list. For a complete list of ITAR-regulated Microsemi FPGAs, visit the I TAR web page.。
DCP010512DBP-U中文资料
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of T exas Instrumentssemiconductor products and disclaimers thereto appears at the end of this data sheet.All trademarks are the property of their respective owners.元器件交易网DCP01B SERIESSBVS012B − DECEMBER 2000 − REVISED OCTOBER 20042This integrated circuit can be damaged by ESD. T exas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.ABSOLUTE MAXIMUM RATINGSover operating free-air temperature range unless otherwise noted (1)Stresses above these ratings may cause permanent damage.Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.SUPPLEMENTAL ORDERING INFORMATIONBasic Model Number:1W Product Voltage Input:5V InVoltage Output:Dual Output:Model Revision:Package Code:5V Out P =DIP −14P −U =SOP −14(Gullwing)DCP010505(D)(B)()(1)(1)All devices also available in tray quatities. For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet,or refer to our web site at .(2)Models with a (/) are available only in Tape and Reel in the quantities indicated (for example, /700 indicates 700 devices per reel). Ordering 700 pieces of“DCP010505BP −U/700” will get a single 700-piece Tape and Reel.(3)Single voltage versions have six active pins; dual voltage versions have seven active pins.(4)SOP package is gullwing surface-mount.元器件交易网DCP01B SERIESSBVS012B − DECEMBER 2000 − REVISED OCTOBER 20043ELECTRICAL CHARACTERISTICSAt T A = +25°C, V S = nominal, C IN = 2.2µF , and C OUT = 0.1µF , unless otherwise noted.(1)During UL1950 recognition tests only.(2)Line regulation is measured at constant load current. Line regulation = (V OUT at I OUT fixed)/V S . Variation % = V S min to V S typ, V S typ to V S max.ELECTRICAL CHARACTERISTICS PER DEVICEAt T A = +25°C, V S = nominal, C IN = 2.2µF , and C OUT = 0.1µF , unless otherwise noted.(3)100% load current = 1W/V S typical.(4)Load regulation = (V OUT at 10% load − V OUT at 100% load)/V OUT at 75% load.元器件交易网DCP01B SERIESSBVS012B − DECEMBER 2000 − REVISED OCTOBER 20044PIN ASSIGNMENTS (Single Voltage Version)NVA and DUA PACKAGES (TOP VIEW)DCP01B12567148V S 0V0V +V OUTNCSYNC IN SYNC OUTTerminal Functions (Single Voltage)NOTE :I = input and O = output.PIN ASSIGNMENTS (Dual Voltage Version)NVA and DUA PACKAGES (TOP VIEW)DCP01DB12567148V S 0V0V +V OUT −V OUTSYNC INSYNC OUTTerminal Functions (Dual Voltage)NOTE :I = input and O = output.元器件交易网DCP01B SERIESSBVS012B − DECEMBER 2000 − REVISED OCTOBER 20045TYPICAL CHARACTERISTICSAt T A = 25°C, unless otherwise noted.DCP010505BOUTPUT RIPPLE vs LOAD (20MHz BW)R i p p l e (m V P P )50454035302520151050DCP010505B V OUT vs V SLoad (%)V O U T (V )5.85.75.65.55.45.35.25.15.04.94.84.7100102030405060708090Load (%)100102030405060708090DCP010505DB V OUT vs LOADLoad (%)V O U T (V )5.85.75.65.55.45.35.25.15.04.94.84.7100102030405060708090DCP010505DB EFFICIENCY vs LOADLoad (%)100102030405060708090元器件交易网DCP01B SERIESSBVS012B − DECEMBER 2000 − REVISED OCTOBER 20046TYPICAL CHARACTERISTICS (continued)At T A = 25°C, unless otherwise noted.DCP010512B V OUT vs LOADLoad (%)V O U T (V )14.514.013.513.012.512.011.511.0100102030405060708090DCP010512B EFFICIENCY vs LOADLoad (%)E f f i c i e n c y (%)908580757065605550100102030405060708090DCP010512DB V OUT vs LOADLoad (%)V O UT (V )14.514.013.513.012.512.011.511.010.510.0203050706080901004010DCP010512DB EFFICIENCY vs LOADLoad(%)E f f i c i e n c y (%)8580757065605550203050706080901004010DCP010515B V OUT vs LOADLoad (%)V O U T (V )18.017.517.016.516.015.515.014.514.0100102030405060708090DCP010515B EFFICIENCY vs LOADLoad (%)E f f i c i e n c y (%)8580757065605550100102030405060708090元器件交易网DCP01B SERIESSBVS012B − DECEMBER 2000 − REVISED OCTOBER 20047TYPICAL CHARACTERISTICS (continued)At T A = 25°C, unless otherwise noted.DCP010515DB V OUT vs LOADLoad (%)V O U T (V )1817161514203050706080901004010DCP010515DB EFFICIENCY vs LOADLoad (%)E f f i c i e n c y (%)908580757065605550203050706080901004010DCP012405B V OUT vs LOADLoad (%)V O U T (V )5.605.505.405.305.205.105.004.904.802030605070801004010DCP012405B EFFICIENCY vs LOADLoad (%)E f f i c i e n c y (%)9080706050403020100203070608090100405010DCP010505BCONDUCTED EMISSIONS (125%Load)E m i s s i o n L e v e l ,P e a k (d B µA )Frequency (MHz)10.1510306050403020100−10−20DCP010505BCONDUCTED EMISSIONS (8%Load)E m i s s i o n L e v e l ,P e a k (d B µA )Frequency (MHz)10.1510306050403020100−10−20元器件交易网DCP01B SERIESSBVS012B − DECEMBER 2000 − REVISED OCTOBER 20048TYPICAL CHARACTERISTICS (continued)At T A = 25°C, unless otherwise noted.DCP011512DBP V OUT vs LOADV O U T (V )13.5013.0012.5012.0011.5011.0010.50DCP011512DBP EFFICIENCY vs LOADLoad (%)E f f i c i e n c y (%)90807060504030100102030405060708090Load (%)100102030405060708090DCP012415DBP EFFICIENCY vs LOADLoad (%)E f f i c i e n c y (%)9080706050403020100102030405060708090DCP012415DBP V OUT vs LOADLoad (%)V O U T (V )16.5016.0015.5015.0014.5014.0013.50100102030405060708090元器件交易网DCP01B SERIESSBVS012B − DECEMBER 2000 − REVISED OCTOBER 20049FUNCTIONAL DESCRIPTIONOVERVIEWThe DCP01B offers up to 1W of unregulated output power with a typical efficiency of up to 85%. This is achieved through highly integrated packaging technology and the implementation of a custom power stage and control IC.The circuit design uses an advanced BiCMOS/DMOS process. For additional information, refer to the application notes located in the DCP01B product folder at .POWER STAGEThis uses a push-pull, center-tapped topology switching at 400kHz (divide-by-2 from 800kHz oscillator).OSCILLATOR AND WATCHDOGThe onboard 800kHz oscillator generates the switching frequency via a divide-by-2 circuit. The oscillator can be synchronized to other DCP01B circuits or an external source, and is used to minimize system noise.A watchdog circuit checks the operation of the oscillator circuit. The oscillator can be stopped by pulling the SYNC pin low. The output pins will be tri-stated. This will occur in 2µs.THERMAL SHUTDOWNThe DCP01B is protected by a thermal shutdown circuit.If the on-chip temperature exceeds 150°C, the device will shut down. Once the temperature falls below 150°C,normal operation will resume. If the thermal condition continues, operation will randomly cycle on and off. This will continue until the temperature is reduced.SYNCHRONIZATIONIn the event that more than one DC/DC converter is needed onboard, beat frequencies and other electrical interference can be generated. This is due to the small variations in switching frequencies between the DC/DC converters.The DCP01B overcomes this by allowing devices to be synchronized to one another. Up to eight devices can be synchronized by connecting the SYNC IN pins together,taking care to minimize the stray capacitance. Stray capacitance (> 3pF) will have the effect of reducing the switching frequency, or even stopping the oscillator circuit.If synchronized devices are used, it should be noted that at startup, all devices will draw maximum current simultaneously. This can cause the input voltage to dip. If it dips below the minimum input voltage (4.5V), the devices may not start up. A 2.2µF capacitor should be connected close to the input pins.If more than eight devices are to be synchronized, it is recommended that the SYNC IN pins are driven by an external device. Details are contained in Application Report SBAA035, External Synchronization of the DCP01/02 Series of DC/DC Converters , available for download at .CONSTRUCTIONThe DCP01B basic construction is the same as standard ICs. There is no substrate within the molded package. The DCP01B is constructed using an IC, rectifier diodes, and a wound magnetic toroid on a leadframe. Since there is no solder within the package, the DCP01B does not require any special PCB assembly processing. This results in an isolated DC/DC converter with inherently high reliability.ADDITIONAL FUNCTIONSDISABLE/ENABLEThe DCP01B can be disabled or enabled by driving the SYNC pin using an open drain CMOS gate. If the SYNC IN pin is pulled low, the DCP01B will be disabled. The disable time depends upon the external loading; the internal disable function is implemented in 2µs. Removal of the pull-down will cause the DCP01B to be enabled.Capacitive loading on the SYNC IN pin should be minimized in order to prevent a reduction in the oscillator frequency.DECOUPLINGRipple ReductionA high switching frequency of 400kHz allows simple filtering. To reduce ripple, it is recommended that at least a 1µF capacitor is used on V OUT . Dual outputs should have both the positive and negative buses decoupled to V OUT ground (pin 5). The required 2.2µF low equivalent series resistance (ESR) ceramic capacitor on the input of the 5V to 15V versions, and the ≥ 0.47µF low-ESR ceramic capacitor on the 24V versions help reduce ripple and noise. See Application Bulletin SBVA012, DC-to-DC Converter Noise Reduction , available for download at .元器件交易网DCP01B SERIESSBVS012B − DECEMBER 2000 − REVISED OCTOBER 200410Connecting the DCP01B in SeriesMultiple DCP01B isolated 1W DC/DC converters can be connected in series to provide nonstandard voltage rails.This is possible by using the floating outputs provided by the DCP01B galvanic isolation.Connect the positive V OUT from one DCP01B to the negative V OUT (0V) of another, as shown in Figure 1. If the SYNC IN pins are tied together, the self-synchronization feature of the DCP01B will prevent beat frequencies on the voltage rails. The SYNC IN feature of the DCP01B allows easy connection in series, which reduces separate filtering components.The outputs on dual output DCP01B versions can also be connected in series to provide two times the magnitude of V OUT , as shown in Figure 2. For example, a dual 15V DCP01B could be connected to provide a 30V rail.Connecting the DCP01B in ParallelIf the output power from one DCP01B is not sufficient, it is possible to parallel the outputs of multiple DCP01B converters (see Figure 3). Again, the SYNC IN feature allows easy synchronization to prevent power-rail beat frequencies at no additional filtering cost.Figure 1. Connecting the DCP01B in SeriesFigure 2. Connecting Dual Outputs in SeriesFigure 3. Connecting Multiple DCP01Bs in Parallel元器件交易网DCP01B SERIESSBVS012B − DECEMBER 2000 − REVISED OCTOBER 2004 APPLICATION INFORMATIONThe DCP01B, DCV01, and DCP02 are three families of miniature DC/DC converters providing an isolated unregulated voltage output. All are fabricated using a CMOS/DMOS process with the DCP01B replacing the familiar DCP01 family that was fabricated from a bipolar process. The DCP02 is essentially an extension of the DCP01B family providing a higher power output with a significantly improved load regulation, and the DCV01 is tested to a higher isolation voltage. TRANSFORMER DRIVE CIRCUITTransformer drive transistors have a characteristically low value of transistor on resistance (R DS); thus, more power is transferred to the transformer. The transformer drive circuit is limited by the base current available to switch on the power transistors driving the transformer and their characteristic current gain (beta), resulting in a slower turn-on time. Consequently, more power is dissipated within the transistor. This results in a lower overall efficiency, particularly at higher output load currents. SELF-SYNCHRONIZATIONThe input synchronizations facility (SYNC IN), allows for easy synchronizing of multiple devices. If two to eight devices (maximum) have their respective SYNC IN pins connected together, then all devices will be synchronized. Each device has its own onboard oscillator. This is generated by charging a capacitor from a constant current and producing a ramp. When this ramp passes a threshold, an internal switch is activated that discharges the capacitor to a second threshold before the cycle is repeated.When several devices are connected together, all the internal capacitors are charged simultaneously.When one device passes its threshold during the charge cycle, it starts the discharge cycle. All the other devices sense this falling voltage and, likewise, initiate a discharge cycle so that all devices discharge together. A subsequent charge cycle is only restarted when the last device has finished its discharge cycle.OPTIMIZING PERFORMANCEOptimum performance can only be achieved if the device is correctly supported. By the very nature of a switching converter, it requires power to be instantly available when it switches on. If the converter has DMOS switching transistors, the fast edges will create a high current demand on the input supply. This transient load placed on the input is supplied by the external input decoupling capacitor, thus maintaining the input voltage. Therefore, the input supply does not see this transient (this is an analogy to high-speed digital circuits). The positioning of the capacitor is critical and must be placed as close as possible to the input pins and connected via a low-impedance path.The optimum performance is primarily dependent on two factors:1.Connection of the input and output circuits forminimal loss.2.The ability of the decoupling capacitors to maintainthe input and output voltages at a constant level. PCB DesignThe copper losses (resistance and inductance) can be minimized by the use of mutual ground and power planes (tracks) where possible. If that is not possible, use wide tracks to reduce the losses. If several devices are being powered from a common power source, a star-connected system for the track must be deployed; devices must not be connected in series, as this will cascade the resistive losses. The position of the decoupling capacitors is important. They must be as close to the devices as possible in order to reduce losses. See the PCB Layout section for more details.元器件交易网DCP01B SERIESSBVS012B − DECEMBER 2000 − REVISED OCTOBER 2004Decoupling Ceramic CapacitorsAll capacitors have losses due to their internal equivalent series resistance (ESR), and to a lesser degree their equivalent series inductance (ESL). Values for ESL are not always easy to obtain. However, some manufacturers provide graphs of Frequency versus Capacitor Impedance. These will show the capacitors’ impedance falling as frequency is increased (see Figure 4). As the frequency is increased, the impedance will stop decreasing and begin to rise. The point of minimum impedance indicates the capacitors’ resonant frequency. This frequency is where the components of capacitance and inductance reactance are of equal magnitude. Beyond this point, the capacitor is not effective as a capacitor.Figure 4. Capacitor Impedance vs FrequencyAt f O, X C = X L; however, there is a 180° phase difference resulting in cancellation of the imaginary component. The resulting effect is that the impedance at the resonant point is the real part of the complex impedance; namely, the value of the ESR. The resonant frequency must be well above the 800kHz switching frequency of the DCP and DCVs.The effect of the ESR is to cause a voltage drop within the capacitor. The value of this voltage drop is simply the product of the ESR and the transient load current, as shown in Equation (1):VIN+V PK*(ESR I TR)Where:V IN is the voltage at the device input.V PK is the maximum value of the voltage on the capacitor during charge.I TR is the transient load current.The other factor that affects the performance is the value of the capacitance. However, for the input and the full wave outputs (single-output voltage devices), the ESR is the dominant factor.Input Capacitor and the effects of ESRIf the input decoupling capacitor is not ceramic with < 20mΩ ESR, then at the instant the power transistors switch on, the voltage at the input pins will fall momentarily. Should the voltage fall below approximately 4V, the DCP will detect an under-voltage condition and switch the DCP drive circuits to the off state. This is carried out as a precaution against a genuine low input voltage condition that could slow down or even stop the internal circuits from operating correctly. This would result in the drive transistors being turned on too long, causing saturation of the transformer and destruction of the device. Following detection of a low input voltage condition, the device switches off the internal drive circuits until the input voltage returns to a safe value. Then the device tries to restart. If the input capacitor is still unable to maintain the input voltage, shutdown recurs. This process is repeated until the capacitor is charged sufficiently to start the device correctly. Otherwise, the device will be caught up in a loop. Normal startup should occur in approximately 1ms from power being applied to the device. If a considerably longer startup duration time is encountered, it is likely that either (or both) the input supply or the capacitors are not performing adequately.For 5V to 15V input devices, a 2.2µF low-ESR ceramic capacitor will ensure a good startup performance, and for the remaining input voltage ranges, 0.47µF ceramic capacitors are good. Tantalum capacitors are not recommended, since most do not have low-ESR values and will degrade performance. If tantalum capacitors must be used, close attention must be paid to both the ESR and voltage as derated by the vendor.Output Ripple Calculation ExampleDCP020505: Output voltage 5V, Output current 0.4A. At full output power, the load resistor is 12.5Ω. Output capacitor of 1µF, ESR of 0.1Ω. Capacitor discharge time 1% of 800kHz (ripple frequency):t DIS = 0.0125µst = C × R LOADt = 1 × 10−6× 12.5 = 12.5µsV DIS = V O(1 − EXP(−t DIS/τ))V DIS = 5mVBy contrast the voltage dropped due to the ESR: V ESR = I LOAD× ESRV ESR = 40mVRipple voltage = 45mVClearly, increasing the capacitance will have a much smaller effect on the output ripple voltage than reducing the value of the ESR for the filter capacitor.(1)元器件交易网DCP01B SERIESSBVS012B − DECEMBER 2000 − REVISED OCTOBER 2004 DUAL OUTPUT VOLTAGE DCP AND DCVs The voltage output for the dual DCPs is half wave rectified; therefore, the discharge time is 1.25µs. Repeating the above calculations using the 100% load resistance of 25Ω(0.2A per output), the results are shown below:τ= 25µsT DIS = 1.25µs.V DIS = 244mVV ESR = 20mVRipple Voltage = 266mVThis time, it is the capacitor discharging that is contributing to the largest component of ripple. Changing the output filter to 10µF, and repeating the calculations:Ripple Voltage = 45mV.This value is composed of almost equal components. The above calculations are given only as a guide. Capacitor parameters usually have large tolerances and can be susceptible to environmental conditions.PCB LAYOUTFigure 5 and Figure 6 illustrate a printed circuit board (PCB) layout for the two conventional (DCP01/02, DCV01), and two SO-28 surface-mount packages (DCP02U). Figure 7 shows the schematic.Input power and ground planes have been used, providing a low-impedance path for the input power. For the output, the common or 0V has been connected via a ground plane, while the connections for the positive and negative voltage outputs are conducted via wide traces in order to minimize losses.The location of the decoupling capacitors in close proximity to their respective pins ensures low losses due to the effects of stray inductance; thus, improving the ripple performance. This is of particular importance to the input decoupling capacitor as this supplies the transient current associated with the fast switching waveforms of the power drive circuits.The Sync pin, when not being used, is best left as a floating pad. A ground ring or annulus connected around the pin will prevent noise being conducted onto the pin. If the Sync pin is being connected to one or more Sync pins, then the linking trace should be narrow and must be kept short in length. In addition, no other trace should be in close proximity to this trace because that will increase the stray capacitance on this pin, and that will effect the performance of the oscillator.Ripple and NoiseCareful consideration should be given to the layout of the PCB, in order that the best results can be obtained.The DCP01B is a switching power supply and as such can place high peak current demands on the input supply. In order to avoid the supply falling momentarily during the fast switching pulses, ground and power planes should be used to connect the power to the input of DCP01B. If this is not possible, then the supplies must be connected in a star formation with the traces made as wide as possible. If the SYNC IN pin is being used, then the trace connection between device SYNC IN pins should be short to avoid stray capacitance. If the SYNC IN pin is not being used, it is advisable to place a guard ring (connected to input ground) around this pin to avoid any noise pick up.The output should be taken from the device using ground and power planes; this ensures minimum losses.A good quality low-ESR ceramic capacitor placed as close as practical across the input will reduce reflected ripple and ensure a smooth startup.A good quality low-ESR capacitor (ceramic preferred) placed as close as practical across the rectifier output terminal and output ground gives the best ripple and noise performance. See SBVA012 for more information on noise rejection.THERMAL MANAGEMENTDue to the high power density of this device, it is advisable to provide ground planes on the input and output.元器件交易网元器件交易网DCP01B SERIESSBVS012B − DECEMBER 2000 − REVISED OCTOBER 2004Figure 5. Example of PCB Layout, Component-Side View Array Figure 6. Example of PCB Layout, Non-component-Side View元器件交易网DCP01B SERIES SBVS012B − DECEMBER 2000 − REVISED OCTOBER 2004PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)DCP010505BP ACTIVE PDIP NVA725TBD CU SNPB Level-NA-NA-NA DCP010505BP-U ACTIVE SOP DUA725TBD CU SNPB Level-3-240C-168HR DCP010505BP-U/700ACTIVE SOP DUA7700TBD CU SNPB Level-3-240C-168HR DCP010505DBP ACTIVE PDIP NVA725TBD CU SNPB Level-NA-NA-NA DCP010505DBP-U ACTIVE SOP DUA725TBD CU SNPB Level-3-240C-168HR DCP010505DBP-U/700ACTIVE SOP DUA7700TBD CU SNPB Level-3-240C-168HR DCP010512BP ACTIVE PDIP NVA725TBD CU SNPB Level-NA-NA-NA DCP010512BP-U ACTIVE SOP DUA725TBD CU SNPB Level-3-240C-168HR DCP010512BP-U/700ACTIVE SOP DUA7700TBD CU SNPB Level-3-240C-168HR DCP010512DBP ACTIVE PDIP NVA725TBD CU SNPB Level-NA-NA-NA DCP010512DBP-U ACTIVE SOP DUA725TBD CU SNPB Level-3-240C-168HR DCP010512DBP-U/700ACTIVE SOP DUA7700TBD CU SNPB Level-3-240C-168HR DCP010515BP ACTIVE PDIP NVA725TBD CU SNPB Level-NA-NA-NA DCP010515BP-U ACTIVE SOP DUA725TBD CU SNPB Level-3-240C-168HR DCP010515BP-U/700ACTIVE SOP DUA7700TBD CU SNPB Level-3-240C-168HR DCP010515DBP ACTIVE PDIP NVA725TBD CU SNPB Level-NA-NA-NA DCP010515DBP-U ACTIVE SOP DUA725TBD CU SNPB Level-3-240C-168HR DCP010515DBP-U/700ACTIVE SOP DUA7700TBD CU SNPB Level-3-240C-168HR DCP011512DBP ACTIVE PDIP NVA725TBD CU SNPB Level-NA-NA-NA DCP011512DBP-U ACTIVE SOP DUA725TBD CU SNPB Level-3-240C-168HR DCP011512DBP-U/700ACTIVE SOP DUA7700TBD CU SNPB Level-3-240C-168HR DCP011515DBP ACTIVE PDIP NVA725TBD CU SNPB Level-NA-NA-NA DCP011515DBP-U ACTIVE SOP DUA725TBD CU SNPB Level-3-240C-168HR DCP011515DBP-U/700ACTIVE SOP DUA7700TBD CU SNPB Level-3-240C-168HR DCP012415DBP ACTIVE PDIP NVA725TBD CU SNPB Level-NA-NA-NA DCP012415DBP-U ACTIVE SOP DUA725TBD CU SNPB Level-3-240C-168HR DCP012415DBP-U/700ACTIVE SOP DUA7700TBD CU SNPB Level-3-240C-168HR (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.。
德州仪器ADS1231 24 位模数转换器 (ADC) 数据手册说明书
VREFP VREFN CAPDVDDGND AINP AINNAVDDSWCAPCLKINADS1231ZHCS312D –JULY 2009–REVISED OCTOBER 2013用于桥式传感器的24位模数转换器查询样片:ADS1231特性说明•针对桥式传感器的完整前端ADS1231是一款精密24位模数转换器(ADC)。
借助于板载低噪声放大器和振荡器，精密型三阶24位ΔΣ•内部放大器，128增益调制器以及桥式电源开关，ADS1231为包括衡器、应•内部振荡器力计和测压元件在内的桥式传感器应用提供一个完整的•针对桥式传感器的低侧电源开关前端解决方案。
•低噪声：35nVrms•可选数据速率：10SPS 或80SPS 此噪声放大器具有128的增益，从而支持±19.5mV 的•10SPS 时，同时50Hz 和60Hz 抑制满量程差分输入。
此ΔΣADC 具有24位分辨率，并•输入电磁干扰(EMI)滤波器且包含一个三阶调制器和四阶数字滤波器。
支持两个•针对比例式测量的高达5V 的外部电压基准数据速率：10SPS （具有50Hz 和60Hz 抑制）以及•简单、引脚驱动控制80SPS 。
ADS1231可被置于低功耗待机模式，或者在•两线制串行数字接口断电模式中完全关闭。
•电源范围：3V 至5.3VADS1231由专用引脚控制；没有编程用的数字寄存•封装：小外形尺寸集成电路(SOIC)-16器。
数据通过直接接至MSP430或其它微控制器的一•温度范围：-40°C 至+85°C个易于隔离的串行接口输出。
应用范围ADS1231采用小外形尺寸(SO)-16封装，额定温度范•衡器围-40°C 至+85°C 。
•应力计•测压元件•工业过程控制Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.All trademarks are the property of their respective owners.ADS1231ZHCS312D–JULY2009–REVISED This integrated circuit can be damaged by ESD.Texas Instruments recommends that all integrated circuits be handled withappropriate precautions.Failure to observe proper handling and installation procedures can cause damage.ESD damage can range from subtle performance degradation to complete device failure.Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.ORDERING INFORMATIONFor the most current package and ordering information,see the Package Option Addendum at the end of this document,or visit the device product folder at .ABSOLUTE MAXIMUM RATINGS(1)Over operating free-air temperature range,unless otherwise noted.ADS1231UNIT AVDD to GND–0.3to+6VDVDD to GND–0.3to+6V100,momentary mAInput current10,continuous mA Analog input voltage to GND–0.3to AVDD+0.3VDigital input voltage to GND–0.3to DVDD+0.3VHuman body model(HBM)±2000V JEDEC standard22,test method A114-C.01,all pinsESD(2)Charged device model(CDM)±500V JEDEC standard22,test method C101,all pinsMaximum junction temperature+150°C Operating temperature range–40to+85°C Storage temperature range–60to+150°C(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratingsonly,and functional operation of the device at these or any other conditions beyond those indicated is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)CAUTION:ESD sensitive device.Precaution should be used when handling the device in order to prevent permanent damage. THERMAL INFORMATIONADS1231THERMAL METRIC(1)SOIC(D)UNITS16PINSθJA Junction-to-ambient thermal resistance79.5θJCtop Junction-to-case(top)thermal resistance37.5θJB Junction-to-board thermal resistance37.1°C/WψJT Junction-to-top characterization parameter 5.6ψJB Junction-to-board characterization parameter36.7θJCbot Junction-to-case(bottom)thermal resistance n/a(1)有关传统和全新热度量的更多信息，请参阅IC封装热度量应用报告（文献号：ZHCA543）。
AD8512TRZ-EP JFET 操作放大器说明书
AD8512TRZ-EPPrecision, Very Low Noise, Low Input Bias Current,Wide Bandwidth JFET Operational AmplifierEnhanced ProductAD8512-EPRev. 0 Document FeedbackInformation furnished by Analog Devices is believed to be accurate and reliable. However , noresponsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners.One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2018 Analog Devices, Inc. All rights reserved. Technical Support FEATURESFast settling time: 500 ns to 0.1%Low offset voltage: 1.0 mV maximum at V S = ±15 V Low offset voltage drift: 1.7 µV/°C typicalLow input bias current: 25 pA typical at V S = ±15 V Dual-supply operation: ±5 V to ±15 VLow noise: 8.0 nV/√Hz typical at f = 1 kHz Low distortion: 0.0005% No phase reversal Unity gain stableENHANCED PRODUCT FEATURESSupports defense and aerospace applications (AQEC standard)Military temperature range (−55°C to +125°C) Controlled manufacturing baseline 1 assembly/test site 1 fabrication siteProduct change notificationQualification data available on requestAPPLICATIONSInstrumentation Multipole filtersPrecision current measurementPhotodiode amplifiers Military communication AvionicsPIN CONFIGURATION–IN A +IN A V –V+–IN B+IN B17170-002Figure 1.GENERAL DESCRIPTIONThe AD8512-EP is a dual-precision JFET amplifier that features low offset voltage, input bias current, input voltage noise, and input current noise.The combination of low offsets, low noise, and very low input bias currents makes these amplifiers especially suitable for high impedance sensor amplification and precise currentmeasurements using shunts. The combination of dc precision, low noise, and fast settling time results in superior accuracy in flight instruments, electronic measurement, and aviation equipment. Unlike many competitive amplifiers, the AD8512-EP maintains its fast settling performance even with substantial capacitive loads. Unlike many older JFET amplifiers, the AD8512-EP does not suffer from output phase reversal wheninput voltages exceed the maximum common-mode voltage range.Fast slew rate and great stability with capacitive loads make the AD8512-EP suitable for high performance filters. Low input bias currents, low offset, and low noise result in a wide dynamic range of photodiode amplifier circuits. Low noise and distortion, high output current, and excellent speed make the AD8512-EP a great choice for military communication applications. The AD8512-EP is available in an 8-lead narrow SOIC_N package. The AD8512-EP is specified over a military temperature range of −55°C to +125°C. Additional application and technical information can be found in the AD8512 data sheet.AD8512-EPEnhanced ProductRev. 0 | Page 2 of 7TABLE OF CONTENTSFeatures .............................................................................................. 1 Enhanced Product Features ............................................................ 1 Appl ications ....................................................................................... 1 Pin Configuration ............................................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3 Electrical Characteristics . (4)Absolute Maximum Ratings ............................................................5 Thermal Resistance .......................................................................5 ESD Caution...................................................................................5 Typical Performance Characteristics ..............................................6 Outline Dimensions ..........................................................................7 Ordering Guide .. (7)REVISION HISTORY8/2018—Revision 0: Initial VersionEnhanced Product AD8512-EP SPECIFICATIONSV S = ±5 V, V CM = 0 V, T A = 25°C, unless otherwise noted.Table 1.Parameter Symbol Test Conditions/Comments Min Typ Max Unit INPUT CHARACTERISTICSOffset Voltage V OS0.1 0.9 mV−55°C < T A < +125°C 1.8 mVInput Bias Current I B21 75 pA−55°C < T A < +85°C 0.7 nA−55°C < T A < +125°C 7.5 nAInput Offset Current I OS 5 50 pA−55°C < T A < +85°C 0.3 nA−55°C < T A < +125°C 0.5 nAInput CapacitanceDifferential 12.5 pF Common Mode 11.5 pFInput Voltage Range −2.0 +2.5 V Common-Mode Rejection Ratio CMRR V CM = −2.0 V to +2.5 V 86 100 dBLarge-Signal Voltage Gain A VO R L = 2 kΩ, V O = −3 V to +3 V 65 107 V/mV Offset Voltage Drift (T C V OS) ΔV OS/ΔT 1.7 12 µV/°C OUTPUT CHARACTERISTICSOutput Voltage High V OH R L = 10 kΩ 4.1 4.3 VR L = 2 kΩ 3.9 4.2 VR L = 600 Ω 3.7 4.1 VOutput Voltage Low V OL R L = 10 kΩ, −55°C < T A < +125°C −4.9 −4.7 VR L = 2 kΩ, −55°C < T A < +125°C −4.9 −4.5 VR L = 600 Ω, −55°C < T A < +125°C −4.8 −4.2 VOutput Current I OUT ±40 ±54 mA POWER SUPPLYPower Supply Rejection Ratio PSRR V S = ±4.5 V to ±18 V 86 130 dB Supply Current/Amplifier I SY V O = 0 V 2.0 2.3 mA−55°C < T A < +125°C 2.5 mA DYNAMIC PERFORMANCESlew Rate SR R L = 2 kΩ 20 V/µs Gain Bandwidth Product GBP 8 MHz Settling Time t S To 0.1%, 0 V to 4 V step, G = +1 0.4 µsTotal Harmonic Distortion (THD) + Noise THD + N 1 kHz, G = +1, R L = 2 kΩ 0.0005 % Phase Margin φM 44.5 Degrees NOISE PERFORMANCEVoltage Noise Density e n f = 10 Hz 34 nV/√Hzf = 100 Hz 12 nV/√Hzf = 1 kHz 8.0 10 nV/√Hzf = 10 kHz 7.6 nV/√Hz Peak-to-Peak Voltage Noise e n p-p 0.1 Hz to 10 Hz bandwidth 2.4 5.2 µV p-pRev. 0 | Page 3 of 7AD8512-EPEnhanced ProductRev. 0 | Page 4 of 7ELECTRICAL CHARACTERISTICSV S = ±15 V , V CM = 0 V , T A = 25°C, unless otherwise noted. Table 2.ParameterSymbol Test Conditions/Comments Min Typ Max Unit INPUT CHARACTERISTICS Offset Voltage V OS0.1 1.0 mV−55°C < T A < +125°C 1.8 mV Input Bias Current I B25 80 pA −55°C < T A < +85°C 0.7 nA−55°C < T A < +125°C 10 nA Input Offset Current I OS6 75 pA −55°C < T A < +85°C 0.3 nA−55°C < T A < +125°C 0.5 nA Input Capacitance Differential 12.5 pF Common Mode11.5pF Input Voltage Range−13.5 +13.0 V Common-Mode Rejection Ratio CMRR V CM = −12.5 V to +12.5 V 86 108 dB Large-Signal Voltage Gain A VO R L = 2 kΩ, V CM = 0 V, V O = −13.5 V to +13.5 V 115 196 V/mV Offset Voltage DriftΔV OS /ΔT 1.7 12 µV/°C OUTPUT CHARACTERISTICSOutput Voltage High V OH R L = 10 kΩ 14.0 14.2 V R L = 2 kΩ 13.8 14.1 V R L = 600 Ω13.5 13.9 VR L = 600 Ω, −55°C < T A < +125°C 11.4V Output Voltage Low V OL R L = 10 kΩ, −55°C < T A < +125°C −14.9 −14.6 V R L = 2 kΩ, −55°C < T A < +125°C –14.8 −14.5 V R L = 600 Ω−14.3 −13.8 VR L = 600 Ω, −55°C < T A < +125°C −12.1 V Output Current I OUT ±70 mA POWER SUPPLYPower Supply Rejection Ratio PSRR V S = ±4.5 V to ±18 V 86 dB Supply Current/Amplifier I SY V O = 0 V2.2 2.5 mA−55°C < T A < +125°C 2.6 mA DYNAMIC PERFORMANCESlew RateSR R L = 2 kΩ 20 V/µs Gain Bandwidth Product GBP8 MHz Settling Time t S To 0.1%, 0 V to 10 V step, G = +1 0.5 µsTo 0.01%, 0 V to 10 V step, G = +1 0.9 µs Total Harmonic Distortion (THD) + Noise THD + N 1 kHz, G = +1, R L = 2 kΩ 0.0005 %Phase MarginφM 52 Degrees NOISE PERFORMANCEVoltage Noise Density e n f = 10 Hz 34 nV/√Hz f = 100 Hz 12 nV/√Hz f = 1 kHz 8.0 10 nV/√Hzf = 10 kHz7.6 nV/√Hz Peak-to-Peak Voltage Noisee n p-p0.1 Hz to 10 Hz bandwidth2.45.2µV p-pEnhanced ProductAD8512-EPRev. 0 | Page 5 of 7ABSOLUTE MAXIMUM RATINGSTable 3.Parameter Rating Supply Voltage ±18 V Input Voltage ±V SPower DissipationSee Figure 2 Storage Temperature Range −65°C to +150°C Operating Temperature Range −55°C to +125°C Junction Temperature Range−65°C to +150°C Lead Temperature (Soldering, 10 sec) 300°C Electrostatic Discharge (Human Body Model)2000 VStresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.THERMAL RESISTANCEThermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required.θJA is the natural convection junction to ambient thermalresistance measured in a one cubic foot sealed enclosure. θJC is the junction to case thermal resistance. Table 4. Thermal ResistancePackage Type 1 θJA θJC Unit R-8158 43 °C/W1Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board. See JEDEC JESD-51.1.000.10.20.30.40.50.60.70.80.9–55–35–15525456585105125M A X I M U M P O W E R D I S SI P A T I O N (W )AMBIENT TEMPERATURE (°C)17170-040Figure 2. Maximum Power Dissipation vs. Ambient TemperatureESD CAUTIONAD8512-EPEnhanced ProductRev. 0 | Page 6 of 7TYPICAL PERFORMANCE CHARACTERISTICST C V OS (µV/°C )N U M B E R O F A M P L I F I E R S10151.032.03.04.05.00.5 1.5 2.5 3.5 4.5 5.56.017170-009Figure 3. T C V OS DistributionTEMPERATURE (°C )I N P U T B I AS C U R R E N T (p A )–551101001k–3510k100k–1552545658510512517170-010Figure 4. Input Bias Current vs. TemperatureTEMPERATURE (°C )I N P U T O FF S E T C U R R E N T (p A )–550.010.1110–351001k–1552545658510512517170-011Figure 5. Input Offset Current vs. TemperatureTEMPERATURE (°C )S U P P L Y CU R R E N T P E R A M P L I F I E R (m A )–551.00–352.502.252.001.751.501.25–1552545658510512517170-015Figure 6. Supply Current per Amplifier vs. TemperatureEnhanced ProductAD8512-EPRev. 0 | Page 7 of 7OUTLINE DIMENSIONSCONTROLLING DIMENSIONS ARE I N MILLIMETERS;INCH DIMENSIONS (IN PARENTHESES)ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.COMPLIANT TO JEDEC STANDARDS MS-012-AA012407-A0.25(0.0098)0.17(0.0067)0.40(0.0157)45°Figure 7. 8-Lead Standard Small Outline Package [SOIC_N]Narrow Body (R-8)Dimensions shown in millimeters and (inches)ORDERING GUIDEModel 1Temperature Range Package DescriptionPackage Option Marking Code AD8512TRZ-EP −55°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8 DNL AD8512TRZ-EP-R7−55°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8 DNL1Z = RoHS Compliant Part©2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D17170-0-8/18(0)AD8512TRZ-EP。
Valens' VS100 Product Family Datasheet V2.3
HD Source ( such us DVD, STB)
Video TMDS
DVD AV Decoder
Audio I C
2
HDMI Transmitter Ethernet Switch
I2 C CECMI RJ 45
Display( such as LCD, Projector)
Description
Valens Semiconductor has developed the VS100 product family to enable high quality, wired connectivity of uncompressed high-definition (HD), HDMI 1.4 compatible, multimedia content (audio and video) together with 100Mbps Ethernet data. The VS100 TM product family is based on the HDBaseT technology. This innovative patent-pending technology is the first to enable simplified, long-distance wired connectivity of uncompressed HD multimedia content over a single standard 100m/328ft Cat-5e/6 cable. The VS100 family consists of two devices, VS100TX and VS100RX, as follows:
1
VS100 Product Family Datasheet
UZ2085 友顺UTC 电子元器件芯片
UNISONIC TECHNOLOGIES CO., LTDUZ2085LINEAR INTEGRATED CIRCUIT3A ADJUSTABLE/FIXED LOW DROPOUT LINEAR REGULATOR⏹DESCRIPTIONThe UTC UZ2085 series are low dropout three-terminal regulators with 3A output current capability. These devices have been optimized for low voltage applications including VTT bus termination in which transient response and minimum input voltage are critical.Current limit is trimmed to ensure specified output current and controlled short-circuit current. On-chip thermal limitation provides protection against any combination of overload and ambient temperature that would create excessive junction temperature.⏹FEATURES*Fast transient response*Low dropout voltage at up to 3A *Load regulation: 0.05% typical *Trimmed current limit *On-chip thermal limiting*Ultra low current consumption (0.35mA typ.)*Ultra low Adjustment Current (7μA typ.)*Ultra low minimum Load (0.3mA typ.)*Stable with low ESR ceramic output capacitor (MLCC)⏹ORDERING INFORMATIONOrdering Number Package Pin AssignmentPackingLead Free Halogen Free 1 2 3 UZ2085L-xx-AA3-R UZ2085G-xx-AA3-R SOT-223 A/G O I TapeReel UZ2085L-xx-TN3-R UZ2085G-xx-TN3-R TO-252 A/G O I Tape Reel Notes: 1. xx: Output Voltage, refer to Marking Information.MARKING INFORMATIONBLOCK DIAGRAM⏹ABSOLUTE MAXIMUM RATINGSPARAMETER SYMBOL RATINGS UNIT Input Voltage V IN18V Power Dissipation P D InternallyLimited W Junction Temperature T J+150°C Operating Temperature T OPR-20 ~ +85°C Storage Temperature T STG-40 ~ +150°C Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.Absolute maximum ratings are stress ratings only and functional device operation is not implied.⏹THERMAL DATAPARAMETER SYMBOL RATINGS UNITJunction to Ambient SOT-223θJA170°C/WTO-252118°C/WJunction to Case SOT-223θJC20°C/WTO-25212°C/W⏹ELECTRICAL CHARACTERISTICS (T A=25°C, C OUT=22μF, unless otherwise specified.)For UZ2085-ADJ (Adjustable)PARAMETER SYMBOL TESTCONDITIONS MIN.TYP.MAX.UNITReference Voltage V REF 1.5V≤(V IN - V OUT) ≤8.25V10mA≤I OUT≤3A1.225 1.25 1.275VLine Regulation ∆V OUT (V OUT +1.5V)≤ V IN≤12V, I OUT=10mA0.0050.2%Load Regulation ∆V OUT (V IN-V OUT)=3V, 10mA ≤ I OUT≤3A0.050.5%Dropout Voltage V D∆V REF%=1%, l OUT=3A 1.21.40VCurrent Limit I LIMIT(V IN-V OUT)=2V 3.1 5.8AAdjust Pin Current I ADJ7 10 μAAdjust Pin Current Change ∆I ADJ (V OUT +1.5V)≤V IN≤12V, 10mA ≤ I OUT≤3A0.3 2 μAMinimum Load Current I O(MIN) (V OUT +1.5V) ≤ V IN≤ 12V 0.3 1 mARipple Rejection RR f=120Hz,Tantalum,(V IN-V OUT)=3V I OUT=3A75 dBThermal Regulation T A=25°C,30ms pulse 0.004 0.02%/WTemperature Stability ∆V OUT 0.5%Long-Term Stability ∆V OUT T A =125°C, 1000hr 0.03 1.0 %Output Noise(% of V OUT)e N T A =25°C,10Hz ≤ f ≤10kHz0.003%ThermalShutdown 150°CFor UZ2085-xx (Fixed Voltage)PARAMETER SYMBOL TESTCONDITIONS MIN.TYP.MAX.UNITOutput Voltage UZ2085-50 V OUT 6.5V≤V IN≤12V, 10mA≤I OUT≤3A 4.95.05.1VLine Regulation ∆V OUT (V OUT +1.5V)≤V IN≤12V, I OUT=10mA 0.005 0.2 %Load Regulation ∆V OUT (V IN -V OUT)=3V, 10Ma≤I OUT≤3A0.050.5%Dropout Voltage V D∆V REF%=1%, l OUT=3A 1.21.40VCurrent Limit I LIMIT(V IN-V OUT)=2V 3.1 5.8AMinimum Load Current I O(MIN) (V OUT +1.5V)≤V IN≤12V 1mAQuiescent Current I Q V IN=12V0.350.5mARipple Rejection RR f=120Hz, Tantalum,(V IN -V OUT)=3V,I OUT=3A75dBThermal Regulation T A=25°C,30ms pulse 0.004 0.02%/WTemperature Stability ∆V OUT T A=125°C, 1000hr 0.5 %Long-Term Stability ∆V OUT0.03 1.0 %Output Noise(% of V OUT)e N T A=25°C,10Hz≤f≤10kHz 0.003%Thermal shutdown 150 °CTYPICAL APPLICATION CIRCUITV IN =12V9V at 3AThe UTC UZ2085 also supports MLCC.V INV OUT ADJV IN =12VR11.2k R2 7.4k 9V at 3AOUT (1+R2/R1)+I ADJ*R2UZ2085-ADJTYPICAL CHARACTERISTICSMinmumLoadCurrent(mA)AdjustPinCurrent(µA)Short-Circuit Current vs.△V△V5678123456730209010100101k10k8070605040100kFrequency (Hz)Ripple Rejection vs.Frequency0.5021.51 3.0Output Current (A)Dropout Voltage vs.Output CurrentDropoutVoltage(V)2.50.50.60.70.80.91.01.11.21.31.41.5207060508090100110Power(W)Maximum Power DissipationCase Temperature (℃)12013014015015105TYPICAL CHARACTERISTICS (Cont.)Output Voltage vs.Output CurrentOutputVoltage(V)01234567812345Output Current (A)4Short-Circuit Current vs. TemperatureShort-CircuitCurrent(A)-50-252550125Junction Temperature (℃)56780751001.2501.2481.2461.2441.2421.240-250255075100125Junction Temperature (℃)Reference Voltage vs.TemperatureReferenceVoltage(V)1.2521.2545.105.055.004.954.904.85Junction Temperature (℃)Output Voltage vs.TemperatureOutputVoltage(V)OutputVoltageDeviation(%)。
SaatiFil Acoustex
PRECISION FABRICSFOR ACOUSTICAL APPLICATIONSSAATIFIL ACOUSTEX™Bringing sound to lifeSaatifil Acoustex ™Precision-woven fabrics for predictable acoustical performanceapplicationsmobile/cell phones PDAs MP3 players automotive home entertainment home video two-way radios headsetsprofessional microphones professional speakersfeaturesacoustically transparent screens acoustical damping screens moisture and dust barrier screens conductive screens – EMI/RFI shielding predictable sound transmission and damping regulates and controls airflowhigh mechanical strength and workability Hyphobe ™water repellent treatment optional special MET nickel coating optional available dyed to any colorw w w w w w w w w w w w w w w w w w w wwrequiring consistent performance and excellent dB levels. SaatifilAcoustex fabrics are precisely woven with monofilament fibers to produce uniform mesh openings, thereby creating consistent acoustical resistance*. The result: very predictable sound transmission and damping, even in humid conditions. Uniformity is maintained throughout the roll and from lot to lot.The performance of an acoustic fabric is a function of its airflow resistance, which is measured in MKS Rayls (See Definitions). An MKS Rayls value of 10 represents acoustical transparency: the higher the number, the greater the resistance. (See Table 1).* Typical dispersion of woven Saatifil Acoustex screens < 6%. Typical dispersion of nonwoven materials 10-30%.Saatifil Hyphobe Acoustex™wwdissipation, EMI/RFI shielding and metallic appearance requirements. (See Table 2).The main features of this high-tech product are:high electrical conductivity (typical surface resistivity ~0.1 Ohms)electromagnetic shielding (e-field shielding at 1 GHz >60 dB)ww wwFabricated acoustic parts and rollsindicative data onlyAirflow Resistance Testing ConditionswwDefinitionsw Conversion Factors:10 MKS Rayls1CGSacoustic ohm1 bar 100,000 Pa1 psi 6,894 Pa1 cm WG 98.06 Pa1" WG 249.1 PaThe diagram shows airflow passing through a screen fabric. The symbols denote: S [m2]AREAThe test area.T [ m ]THICKNESSThe thickness of the fabric in meters.∆P [ Pa ]PRESSURE DIFFERENCEThe change in pressure of air passing through the fabric.U [ m 3/s ]FLOW RATE OR VOLUME VELOCITYThe rate at which a volume of air flows through the fabricin a specific unit of time.u [ m/s ]LINEAR VELOCITY OF THE AIRFLOWThe flow rate or volume velocity divided by the test area.r Specific airflow resistance in MKS Rayls, (Pa s/m3), also called acoustic impedance.r = ∆P/u = ∆P/(U/S) = ∆P*S/U= R*SThe air pressure difference divided by the linear velocity of theairflow.Specific airflow resistance is a useful measurement tocompare materials as it is not dependent on the size of thearea but is a measurement of the material itself. Variations inthe thickness and pore size will vary the MKS Rayl value.LocationsUSA OFFICE:SaatiTech U.S.A.Division of Saati Americas 247 Route 100Somers, NY 10589 USA Phone:(+1) 914.767.0100Fax:(+1) E-mail:@ WORLD HEADQUARTERS:SaatiTech S.p.A.Via Como, 1422070 Veniano (CO) Italy Phone:+39.031.891333Fax:+39.031.890482E-mail:info.IT@ INTERNATIONAL LOCATIONS:SaatiTech FranceDivision de Saati France S.A.Route Nationale80360 Sailly Saillisel France Phone:(+33) 3 22857700Fax: (+33) 3 22853202E-mail:info.FR@SaatiTech Deutchland Division der Saati GmbH Benzstrasse 3370736 Fellbach bei Stuttgart Germany Phone:(+49) 0711 *******fax: (+49) 0711 *******E-mail: info.IT@ SaatiTech do BrasilDivision of Saati do Brasil Ltda.rua Flávio Beltrame,23513422-140 Bairro Unileste - Piracicaba - SP BrasilPhone: (+55) 19 34241442Fax: (+55) 19 34242594E-mail: info.BR@SaatiTech ChinaDivision of Shanghai Saati Fabrics Co. Ltd.Rm 47 bis. 4th floor, Lombardy Building No.999Ningqiao Rd.,201206 Pudong, Jinqiao,Shanghai, ChinaPhone: (+86) 21 58999113fax: (+86) 21 589998907E-mail: saatitechsh@wwRev 4-06。
Balluff DeviceNet系统组件说明说明书
24 V 7/8" 5-pin 7/8" 4-pin M12, A-Coded 200 mA 2A 9A 9A IP67 -5°C...+55°C GD-Zn nickel plated Yes Yes Yes PNP inputs / Sourcing outputs CE, ODVA, Shock and Vibration
Head 1/Head 2
Single-Ended
7/8" Thick DeviceNet Media
Head 1/Head 2
Single-Ended
Single-Ended
BCC 0000-0000-00-030-_S85N4-10X
7/8" Female Straight BCC A315-0000-10-030-_S85N4-_ _ _
7/8" Female Right Angle BCC A325-0000-10-030-_S85N4-_ _ _
IP67 Rotary Dials Protected switches allow you to easily set the communication baud rate as well as the node address of the block.
High Density I/O Each port of standard input and output blocks can be run with inputs and/or outputs on pin 2 and pin 4 allowing for multiple inputs/outputs per port.
Product Topology
法兰样本
The surface is treated with zinc plating and passivation, or as per require.
Fixing belts
The supplied belts are of high strength. Belts of property class 8.8 (as specified in ISO 898-1) are as standard. Belts of property class 10.9 can be supplied on request.
页次 / Page Ai Aiii A1 A2
Bi Biii B1 B2
Ci Ciii C1 C2
Di Diii D1 D1 D2 D2 D2 D4
SAE 法兰系列 / SAE-flange Series
SAE 法兰系列 SAE Flange Series
Ai
SAE 法兰系列 / SAE-flange Series 目录 / Content
Unifit SAE 法兰系列适用于液压系统及各种高压管系的安装连 接，产品符合标准 ISO 6162 及 SAE J 518。 各种型式的法兰连接件可按成套组件供货，也可单独提供零 件。
Introduction
The Unifit SAE flange connections are mainly used for pipe connecting of hydraulic systems and other high pressure pipe lines. The products are in accordance with the standards ISO 6162 and SAE J 518.
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confidential
2
Proposed Features List
Feature
Max Distance @ 1080p, 60Hz < 16bit Max Distance @ 1080p, 60Hz, 16bit Ethernet IR+RS232
VS010
70m 40m No Yes Yes
or
January for later orders
confidential
5
July 25, 2011
VS010 – Product Description
Announy to announce the availability of its new HDBaseT
chipset.
Based on the VS100 proven architecture the VS010 will insure the
Valens will provide dedicated firmware that can only be used with the
VS010, schematics and reference design will be available too.
For new designs, a manufacturing cost reduction of up to 60% can be
same quality and reliability.
VS010 targets applications that requires only 70m and don’t use the
Ethernet channel. VS010 has the same footprint thus it can be used as a drop-in replacement in designs that are based on the VS100.
VS100
100m 100m Yes Yes Yes
PoH
1. VS010 will have the same package and footprint as the VS100 2. Valens will provide a new firmware that will work only with the VS010 and will not work with VS100 3. The overall potential manufacturing cost reduction when using the VS010 is up to 60% comparing to the VS100, for selected ODM customers.
confidential
3
Availability
Reference design of basic HDMI over HDBaseT can
be sent End of July Samples can be shipped End of July EVK units- can be shipped End of august Mass production delivery September for orders received till the 1st week of Aug