moldflow改善产品变形问题
合集下载
相关主题
- 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。
•2006-06-26
•
•Fill Time
•case1
•case2
•The fill time result shows the position of the flow front at regular , as the cavity fills. Each color contour represent the parts of the mold Which were being filled at same time. •.The fill time is about 5.6 second in the model . No racetrack effect occur. Air trap appear on the last filled area. Do set enough vent over there.
•Mold Temperature:60/65℃ •Melt Temperature: 220℃ •Fill Time: automatic •Cooling time:60S •V/P switch-over: 99% of filled volume •pack
•case2
•80%V/P 10S
10. Mold Temperature Maximum 80deg.C
11. Maximum Shear Rate
50000 1/s
12. Maximum Shear Stress
0. 5 Mpa
13. Thermal conductivity
0.19(k)w/m.c
14. Measured MFR
•2006-06-26
•
•Air Trap
•case1
•case
2
•The air traps are show in pink node
•2006-06-26
3. Ejection Temperature
90 deg.C
4. Recommended Mold
60 deg.C
5. Recommended Melt Temperature 220deg.C
6. Filler
unfilled
7. Melt Temperature Minimum 200deg.C
3 g/10min(5kg/200.C))
•P-V-T
•2006-06-26
•Viscosity vs Shear rate
•
•Process setting
•case1
•Analysis purpose: •improve warpage •Analysis Project: •Cooling + flow + Warpage •Process setting
•80%X0.3+0X1.5+6X60%+12X100%S
•2006-06-26
•
•Part infomatiom
• Thickness distribution
•2006-06-26
•
•Cooling system design
•All case is base 2d mold design.
•case2 is reviser runner system (move gate )
•2006-06-26
•
•case2
•Fill Time
•cቤተ መጻሕፍቲ ባይዱse1
•case2
•The fill time result shows the position of the flow front at regular , as the cavity fills. Each color contour represent the parts of the mold Which were being filled at same time. •.The fill time is about 5.6 second in the model . No racetrack effect occur. Air trap appear on the last filled area. Do set enough vent over there.
•case1
•case2
•2006-06-26
•
•Material Property
ABS Polylac PA-737 Manufacturer : Chi Mei Corporation
1. Melt Density : 2. Solid Density :
0.96055g/cu.cm 8. Melt Temperature Maximum 240 deg.C 1.0494g/cu.cm 9. Mold Temperature Minimum 40deg.C
•2006-06-26
•
•Pressure at V/P switchover
•case1
•case2
•The result shows the pressure distribution through the flow path inside the mold at the Switchover point from velocity to pressure control.
•2006-06-26
•
•Runner system design
•case1
•Ø12mm
•Ø10~2.8mm
•Ø8mm
•Ø2.8~8mm
•Ø10mm
•Case1 is base 2d mold design ,
•2006-06-26
•
•Runner system design
•Move gate
moldflow改善产品变形 问题
2020年5月28日星期四
•Mold Flow Report
•Mold NO:B10274 •Prepared by: Bill.Bin •Cavity number:1*2 •Analysis purpose : • improve warpage。 •Analysis Project: •Cool +Fill +Pack + Warp •Case1 is the 3D design. Case2 is revise mold design and modified the process condition.