SMT新锡膏评估实例ppt课件
相关主题
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
Date
2
Solder Paste Evaluation
Samples
Corrent solder paste
Evaluating solder paste
Photo
Type
NC254
NC259
SA-M105-C-885EF305-21 EF105-21 LF-200TH-B
Supplier
AIM
Type 3
Type 3
Type 3
Type 3
Melting point 217-218℃ 227-228℃ 217-218℃ 217-218℃ 217-218℃ 217-218℃
Date
3
Solder Paste Evaluation
Content
Printability Viscosity
Slump Thickness Solderability
>Stencil:
0.12mm thickness special >Pad pattern: Width 3.0mm
>Printer:
MPM125
Length 20mm
>Print speed:
45mm/sec
Distance 0.5-2.0mm
Test method:
>To check the solder paste shape printed on board after several minutes if exist slump
Content
Printability Viscosity
Slump Thickness Solderability
X-ray Cross section Pull and push
Viscosity
Test parameters: > Equipment: MALCOM PCU 205 > Test temperature: 25℃ > Revolution: 10rpm > Mix time: 5min
Result
In spec Out of spec Out of spec Out of spec Out of spec
All the results are out of spec except AIM NC259, but the viscosity can be adjusted based on the product requirement.
NC259
SA-M105-C-885
EF305-21 EF105-21 LF-200TH-B
Measuring method
Temperature:26℃ Time:15min rpm:10 Temperature:26℃ Time:15min rpm:10 Temperature:26℃ Time:15min rpm:10 Temperature:26℃ Time:15min rpm:10 Temperature:26℃ Time:15min rpm:10
SPEC
Equipment
225+\- 10% pa.s PCU-205
160-220 pa.s PCU-205
175-225pa.s PCU-205
190-240pa.s PCU-205
150-200 kcps PCU-205
Test Value
211.2pa.s 136.9pa.s 145.9pa.s 167.0pa.s 147.3pa.s
Test Pattern: >Pad pattern: Width 3.0mm Length 20mm Distance 0.5-2.0mm
Score: 5-perfect, 4-good, 3-basic, 2-poor, 1-unallowable
Date
4
Solder Paste Evaluation
X-ray Cross section Pull and push
Printability
Print Parameters:
>Stencil:
0.12mm thickness special
>Printer:
MPM125
>Print speed:
45mm/sec
>Separation speed: 2.5m/sec
Date
5
Solder Paste Evaluation
Content
Printability Viscosity
Slump Thickness Solderability
X-ray Cross section Pull and push
Slump
Print Parameters:
Test Pattern:
Owner
Due Date
30-May 30-May
30-May
8-Jun 8-Jun 8-Jun 8-Jun 8-Jun 20-Jun 20-Jun 20-Jun
Status
Finished Finished
Finished
Finished Finished Finished Finished Finished Finished Finished Finished
AIM
TONGFANG INVENTEC INVENTEC HUAQING
PCBA quantity
20
20
20
20
20
20
Alloy
SAC 305 SN100C SAC 305 SAC 305 SAC 105 SAC 305
Specifications Particle size Type 3
Type 3
Solder Paste Evaluation
Solder Paste Evaluation
Solder Paste Test Plan
wenku.baidu.com
Phase
I Preparation
II Process Verification III Solder reliability Test
Item
Search the 2nd source Get all solder paste sample Get all solder paste document Printability Viscosity test Slump test Thickness Cpk analysis Solderability verification X-ray test Cross section verification Pull and push test